A ceramic package card
By using an integrated ceramic substrate and an antenna unit with built-in high-temperature resistant conductive material, the problems of traditional smart cards such as easy wear and deformation, poor high-temperature resistance, and limited anti-counterfeiting methods have been solved, resulting in a highly reliable and multifunctional integrated ceramic packaged card.
CN224287526UActive Publication Date: 2026-05-26许贵贤
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 许贵贤
- Filing Date
- 2025-05-08
- Publication Date
- 2026-05-26
Smart Images
Figure CN224287526U_ABST
Abstract
This utility model discloses a ceramic encapsulation card to solve the problems of existing cards being easily worn, deformed, having poor high-temperature / corrosion resistance, low security level, easy tampering, signal interference, and low functional integration. The ceramic encapsulation card in this disclosure uses a sintered integrated ceramic substrate, which can avoid the risk of detachment from separate adhesives and reduce the risk of breakage caused by external forces. At the same time, due to its own ceramic material, it is more suitable for high-temperature and high-corrosion scenarios than ordinary plastic cards. Furthermore, the surface of the ceramic substrate is an electroplated layer, a printed layer, or a laser engraved layer, thereby matching different customer-ordered appearances and anti-counterfeiting requirements.
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