A multi-media transmission device

Abstract

This utility model discloses a multi-media transmission device, including: a motherboard, an optical interface board, and further including: a wired remote transmission module, a VDSL2 high-speed remote transmission module, and an adapter board. The optical interface board, wired remote transmission module, and VDSL2 high-speed remote transmission module are all connected to the motherboard via inter-board connectors. The motherboard has multiple Ethernet interfaces, and both the wired remote transmission module and the VDSL2 high-speed remote transmission module have multiple multiplexed interfaces. The signal output interface of the adapter board is connected to the signal input interfaces of the wired remote transmission module and the VDSL2 high-speed remote transmission module, respectively. The adapter board includes a surge protection module. This utility model, through its multi-media convergence architecture, can transmit Ethernet services via optical fiber or multiplexed transmission, adapting to diverse service needs. Simultaneously, the inter-board connectors between the modules support plug-and-play functionality and enhance compatibility between modules.

Description

Technical Field

[0001] This utility model relates to the field of wired communication technology, specifically a multi-media transmission device. Background Technology

[0002] In traditional communication transmission systems, transmission equipment for different media is often deployed independently, resulting in high system complexity and low resource utilization. Especially in special scenarios such as military and emergency communications, existing equipment mostly uses a single transmission method (such as fiber optic, Ethernet, or VDSL), which is difficult to adapt to the needs of complex environments. For example: 1. Although fiber optic communication has high bandwidth, its deployment depends on fixed infrastructure, which cannot meet the rapid mobility requirements of field scenarios;

[0003] 2. Ethernet interfaces are limited to a transmission distance of 100 meters and are susceptible to electromagnetic interference;

[0004] 3. Traditional double-ended connections only support low-frequency electrical signal transmission, resulting in insufficient bandwidth and incompatibility with modern optical communication requirements. Furthermore, the connection between modules and the motherboard in existing devices typically involves cabling, which increases the complexity of maintenance and replacement later on. For example, the self-healing ring networking device based on double-ended connections disclosed in patent application number 201020673917.5 only has a double-ended connection plus an Ethernet interface, which is very limited and cannot meet the communication requirements of field training. Additionally, the cabling connection between the internal modules and the motherboard further complicates maintenance and replacement. Utility Model Content

[0005] One object of this invention is to solve at least the aforementioned problems and / or defects, and to provide at least the advantages described below.

[0006] To achieve these objectives and other advantages of this utility model, a multi-media transmission device is provided, comprising: a motherboard, an optical interface board, and further comprising: a wired remote transmission module, a VDSL2 high-speed remote transmission module, and an adapter board, wherein the optical interface board, the wired remote transmission module, the VDSL2 high-speed remote transmission module, and the adapter board are all connected to the motherboard via inter-board connectors.

[0007] The motherboard is equipped with multiple Ethernet interfaces, and both the wired remote transmission module and the VDSL2 high-speed remote transmission module are equipped with multiple duplicated interfaces. The signal output interface of the adapter board is connected to the signal input interface of the wired remote transmission module and the VDSL2 high-speed remote transmission module, respectively. The adapter board is equipped with a surge protection module.

[0008] Preferably, the motherboard includes: a power module, a DC / DC conversion module, a central processing unit (CPU), and an FPGA chip I;

[0009] The power supply module output is connected to the DC / DC conversion module input. The DC / DC conversion module is connected to the central processing unit (CPU) and FPGA chip I. The CPU output is connected to the FPGA chip I input. The FPGA chip I output is connected to the optical interface board, the wired remote transmission module, and the VDSL2 high-speed remote transmission module input.

[0010] Preferably, the optical interface board includes: an SDH synchronous digital system processing module, a clock chip, and a photoelectric conversion module;

[0011] The output of the SDH synchronous digital system processing module is connected to the clock chip and the photoelectric conversion module, respectively.

[0012] Preferably, the wired remote transmission module includes: FPGA chip II and transmission chip I;

[0013] Among them, FPGA chip II is connected to transmission chip I.

[0014] Preferably, the VDSL2 high-speed remote transmission module includes: FPGA chip III, AD / DA chip and transmission chip II;

[0015] The output of the FPGA chip III is connected to the AD / DA chip and the transmission chip II, respectively.

[0016] Preferably, it also includes a light panel for displaying the signal output status of the wired remote transmission module and the VDSL2 high-speed remote transmission module.

[0017] Preferably, the wired remote transmission module is configured with four output ports, and the VDSL2 high-speed remote transmission module is configured with two output ports.

[0018] Preferably, it also includes a chassis assembly adapted to the multi-media transmission equipment, the chassis assembly including: a chassis for mounting multiple multi-media transmission equipment, the chassis having a side door hinged thereon;

[0019] The side door is connected to the chassis via a spring hinge, and multiple magnetic suction parts are provided on the contact surface between the chassis and the side door.

[0020] This utility model has at least the following beneficial effects: through the multi-media convergence architecture, Ethernet services can be transmitted via optical fiber or multiplexed, adapting to diverse service needs. At the same time, each module is connected to the motherboard through inter-board connectors, supporting plug-and-play and enhancing compatibility between modules.

[0021] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0022] Figure 1 This is a schematic diagram showing the connection relationship between the modules of the transmission device of this utility model.

[0023] Figure 2 This is a schematic diagram of the chassis assembly structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the structure of various wiring terminals of this utility model.

[0025] Attached reference numerals: 1. Mainboard, 2. Optical interface board, 3. Wired remote transmission module, 4. VDSL2 high-speed remote transmission module, 5. Chassis, 6. Side door, 7. Groove, 8. Conductive rubber strip, 9. Heat dissipation hole, 10. Cooling fan, 11. Air inlet, 12. Wiring terminal. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description. It should be understood that terms such as "having," "comprising," and "including" as used herein do not exclude the presence or addition of one or more other elements or combinations thereof. It should be noted that in the description of the present invention, the terms indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, in this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Moreover, "above," "on top of," and "on top" can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] Figure 1 This invention illustrates a multi-media transmission device, comprising: a motherboard 1, an optical interface board 2, and further comprising: a wired remote transmission module 3, a VDSL2 high-speed remote transmission module 4, and an adapter board. The optical interface board 2, the wired remote transmission module 3, the VDSL2 high-speed remote transmission module 4, and the adapter board are all connected to the motherboard 1 via inter-board connectors.

[0028] The motherboard 1 is equipped with multiple Ethernet interfaces, and both the wired remote transmission module 3 and the VDSL2 high-speed remote transmission module 4 are equipped with multiple duplicated interfaces. The signal output interface of the adapter board is connected to the signal input interface of the wired remote transmission module 3 and the VDSL2 high-speed remote transmission module 4, respectively. The adapter board is equipped with a surge protection module.

[0029] Working principle:

[0030] Ethernet service signals generated by external devices (such as computers, servers, other network switches, etc.) are connected to the Ethernet interface of motherboard 1 via a network cable and enter the device. Optical interface board 2 receives Ethernet signals from motherboard 1. The optical module on the board converts the electrical signals into optical signals, and the converted optical signals are output through the fiber optic interface for long-distance, high-speed transmission via fiber optic lines.

[0031] Meanwhile, either the wired remote transmission module 3 or the VDSL2 high-speed remote transmission module obtains an Ethernet signal from the motherboard 1. These two modules can use a multi-line for signal transmission. The multi-line interface converts the Ethernet signal into a signal format suitable for transmission over the multi-line. After the signal is transmitted to the remote device via the multi-line, the remote device restores it to an Ethernet signal for use by the corresponding equipment.

[0032] The adapter board is used to convert fiber optic signals or Ethernet signals. The signal output interface of the adapter board is connected to their signal input interfaces to ensure signal transmission and interaction between the two modules.

[0033] The modular design of the inter-board connectors makes maintenance and upgrades more convenient, supports plug-and-play functionality, and enhances compatibility between modules. Simultaneously, the adapter board incorporates a surge protection module. This technical solution, by integrating a three-stage surge protection module (gas discharge tube + MOV + TVS) into the adapter board, forms a gradient protection architecture. Thanks to the surge protection module, in the event of a lightning strike, only the adapter board will be damaged, while the main board 1 will remain undamaged. Only the adapter board needs to be replaced to restore normal operation, significantly shortening repair time, reducing technical difficulty, and substantially decreasing maintenance costs and downtime losses.

[0034] In the above technical solution, the motherboard 1 includes: a power module, a DC / DC conversion module, a central processing unit (CPU), and an FPGA chip I;

[0035] In this configuration, the power supply module's output is connected to the input of a DC / DC conversion module. The DC / DC conversion module is connected to the central processing unit (CPU) and FPGA chip I. The CPU's output is connected to the input of FPGA chip I. The output of FPGA chip I is connected to the inputs of the optical interface board 2, the wired remote transmission module 3, and the VDSL2 high-speed remote transmission module 4. Using this technical solution, the power supply module is connected to a DC / DC conversion module that converts the external +28V DC power supply into the operating voltage. The DC / DC conversion module converts the +12V voltage into the various voltages required by the motherboard 1. The CPU can perform data protocol parsing, routing calculations, configuration management, and other operations. Simultaneously, the CPU transmits the processed data or control commands to FPGA chip I.

[0036] FPGA chip I, FPGA chip II, and FPGA chip III enable bidirectional conversion between fiber optic data, multiplexed data, and Ethernet data. The signal input from the service port is distributed into 6 data streams through tag identification and sent to optical interface board 2 and wired remote transmission module 3 or VDSL2 high-speed remote transmission module 4. Conversely, the 6 data streams from optical interface board 2 and wired remote transmission module 3 or VDSL2 high-speed remote transmission module 4 are aggregated into 1 data stream according to the configuration rules and sent to the service port.

[0037] Among them, the motherboard 1 is connected to the optical interface board 2 through one SPI interface to realize the configuration management and status query of the optical interface board 2; the motherboard 1 is connected to the wired remote transmission module 3 through one serial port to realize the configuration management and status query of the wired remote transmission module 3; and the motherboard 1 is connected to the high-speed VDSL2 high-speed remote transmission module 4 through one serial port to realize the configuration management and status query of the high-speed VDSL2 high-speed remote transmission module 4.

[0038] Meanwhile, the FPGA chip I inside the motherboard 1 is connected to the optical interface board 2 via the SGMII interface to realize the data conversion from Ethernet data to fiber optic data; it is connected to the four-channel wired remote transmission module 3 via the TDM interface to realize the conversion from Ethernet data to multiplexed data; and it is connected to the dual-channel VDSL2 high-speed remote transmission module 4 via the MII interface to realize the conversion from Ethernet data to multiplexed data. Furthermore, the fiber optic transmission mode is configurable, and the speed supports STM-1 / 4 / 16; the multiplexed transmission rate is configurable, supporting adaptive and manual configuration; it connects to the clock chip via SPI to realize communication with the clock chip and complete the configuration of the clock chip; simultaneously, the motherboard 1 can manage the configuration and monitor the status of the optical interface board 2.

[0039] The transmission chip I uses the model JFMK50T4FCFBGA484.

[0040] The above technical solution also includes a light board for displaying the signal output status of the optical interface board 2, the wired remote transmission module 3, and the VDSL2 high-speed remote transmission module 4. Using this technical solution, the light board visually presents the signal output status of the optical interface board 2, the wired remote transmission module 3, and the VDSL2 high-speed remote transmission module 4 through indicator lights of different colors and flashing frequencies. When a transmission abnormality occurs, the light board can assist technicians in quickly locating the fault.

[0041] In the above technical solution, the wired remote transmission module 3 is configured with four output ports, and the VDSL2 high-speed remote transmission module 4 is configured with two output ports. Using this technical solution, the wired remote transmission module 3, with its four output ports, can simultaneously connect to four multiplexed transmission links. Compared to single or dual outputs, it can transmit more data in parallel, significantly improving data transmission capacity. For example, in emergency communication scenarios in the field, it can simultaneously transmit multiple services such as voice, video, and data without interference, greatly improving transmission efficiency.

[0042] In the above technical solution, the adapter board is connected to the mainboard 1 via a cable; wherein, the adapter board is equipped with a surge protection module. This technical solution integrates a three-level surge protection module (gas discharge tube + MOV + TVS) into the adapter board, forming a gradient protection architecture. Through the surge protection module, when a lightning strike occurs, only the adapter board will be damaged, while the mainboard 1 will not be damaged. Only the adapter board needs to be replaced to restore normal operation, significantly shortening repair time, reducing repair technical difficulty, and greatly reducing maintenance costs and downtime losses.

[0043] It also includes: a chassis 5 for installing multi-media transmission equipment, the chassis 5 being hinged to a side door 6, the side door 6 being connected to the chassis 5 via spring hinges; multiple magnetic suction parts are provided on the contact surface between the chassis 5 and the side door 6. With this technical solution, the spring hinges provide a restoring force, ensuring that the side door 6 automatically closes when no external force is applied, improving operational convenience. In existing technologies, the side door 6 is usually connected by snap-fit ​​or bolts, which requires removing the side door 6 during equipment maintenance, which is very inconvenient. Furthermore, existing hinges usually do not provide support for opening the side door 6, causing it to close due to external factors during maintenance, interfering with the worker's work. The spring hinges support the open door, avoiding this problem. Simultaneously, when the side door 6 is closed, the magnetic suction parts ensure a tight fit between the side door 6 and the contact surface of the chassis 5, reducing gaps.

[0044] A groove 7 is provided on the contact surface between the chassis 5 and the side door 6. A conductive rubber strip 8 is provided in the groove 7. The groove 7 and the conductive rubber strip 8 can shield external electromagnetic signals and avoid interference with internal signals.

[0045] It also includes: a heat dissipation hole 9 on the top of the chassis 5, where a cooling fan 10 is installed; and an air intake hole 11 on the bottom of the chassis 5, where a dust filter is installed. Cool air is drawn in through the bottom air intake hole 11, flows through heat-generating components such as the motherboard 1 and the optical interface board 2, absorbs heat, and is then exhausted from the top fan, forming a vertical airflow channel of "bottom in, top out". The dust filter of the bottom air intake hole 11 can be removed and cleaned periodically (e.g., by clip-on fixing or magnetic installation) to prevent dust accumulation from reducing the air intake and affecting the normal operation of the equipment.

[0046] The chassis 5 has snap-fit ​​slots on both sides that mate with the sides of the multi-media transmission device, and the rear panel of the chassis 5 has various wiring terminals 12.

[0047] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A multi-media transmission device, comprising: The motherboard and optical interface board are characterized by further including: a wired remote transmission module, a VDSL2 high-speed remote transmission module, and an adapter board, wherein the optical interface board, the wired remote transmission module, and the VDSL2 high-speed remote transmission module are all connected to the motherboard through inter-board connectors. The motherboard is equipped with multiple Ethernet interfaces, and both the wired remote transmission module and the VDSL2 high-speed remote transmission module are equipped with multiple duplicated interfaces. The signal output interface of the adapter board is connected to the signal input interface of the wired remote transmission module and the VDSL2 high-speed remote transmission module, respectively. The adapter board is equipped with a surge protection module.

2. The multi-media transmission device according to claim 1, characterized in that, The motherboard includes: a power module, a DC / DC conversion module, a central processing unit (CPU), and an FPGA chip I; The power supply module output is connected to the DC / DC conversion module input. The DC / DC conversion module is connected to the central processing unit (CPU) and FPGA chip I. The CPU output is connected to the FPGA chip I input. The FPGA chip I output is connected to the optical interface board, the wired remote transmission module, and the VDSL2 high-speed remote transmission module input.

3. The multi-media transmission device according to claim 1, characterized in that, The optical interface board includes: an SDH synchronous digital system processing module, a clock chip, and a photoelectric conversion module; The output of the SDH synchronous digital system processing module is connected to the clock chip and the photoelectric conversion module, respectively.

4. The multi-media transmission device according to claim 1, characterized in that, The wired remote transmission module includes: FPGA chip II and transmission chip I; Among them, FPGA chip II is connected to transmission chip I.

5. The multi-media transmission device according to claim 1, characterized in that, The VDSL2 high-speed remote transmission module includes: FPGA chip III, AD / DA chip and transmission chip II; The output of the FPGA chip III is connected to the AD / DA chip and the transmission chip II, respectively.

6. The multi-media transmission device according to claim 1, characterized in that, Also includes: A light board used to display the signal output status of the optical interface board, wired remote transmission module, and VDSL2 high-speed remote transmission module.

7. The multi-media transmission device according to claim 1, characterized in that, The wired remote transmission module is configured with four output ports, and the VDSL2 high-speed remote transmission module is configured with two output ports.

8. The multi-media transmission device according to claim 1, characterized in that, It also includes a chassis assembly adapted to the multi-media transmission equipment, the chassis assembly comprising: a chassis for mounting multiple multi-media transmission equipment, the chassis having a side door hinged thereon; The side door is connected to the chassis via a spring hinge, and multiple magnetic suction parts are provided on the contact surface between the chassis and the side door.

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