Power supply equipment and power supply system

Abstract

This application provides a power supply device and a power supply system. The power supply device includes a motherboard module and a board module. The motherboard module includes a power module, a controller, and at least one first control signal connector mounted on the motherboard. The board module includes a voltage input connector, at least one second control signal connector, and at least one power module mounted on the board. The power module is connected to the input terminal of the at least one power module through the voltage input connector, and is used to provide power supply voltage to the at least one power module through the voltage input connector. The controller is connected to the at least one power module through at least one first control signal connector and at least one second control signal connector, and is used to input control signals to the at least one power module. The control signals are used to control the power module to output a preset value of output voltage. The structure of this application can provide voltage to the device to be powered.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and in particular to a power supply device and power supply system. Background Technology

[0002] As equipment performance demands increase, the power consumption required also increases, necessitating a larger load current to power the device. Many power supply devices utilize multiphase power supplies, which employ multiphase power controllers to manage multiple power stage circuits, thereby providing the driving load current and voltage for the equipment. However, as the load current required by the equipment increases, the number of phases in the power stage circuits of the multiphase power supply also increases, leading to a continuous increase in the area occupied by the multiphase power supply on the motherboard. In some scenarios, the motherboard for a multiphase power supply is limited to a fixed size, such as in server architectures where the form factor of the server chassis cannot change significantly, resulting in a limited motherboard area. This area-constrained motherboard may prevent the implementation of a reasonable circuit layout for the multiphase power supply. Utility Model Content

[0003] This application provides a power supply device and a power supply system for providing power.

[0004] In a first aspect, this application provides a power supply device, including a motherboard module and a circuit board module; wherein...

[0005] The motherboard module includes a power module, a controller, and at least one first control signal connector mounted on the motherboard.

[0006] The board module includes a voltage input connector, at least one second control signal connector, and at least one power module disposed on the board, wherein the second control signal connector corresponds one-to-one with the power module;

[0007] The power module is connected to the input terminal of the at least one power module via the voltage input connector, and is used to provide power supply voltage to the at least one power module via the voltage input connector;

[0008] The first control signal connector and the second control signal connector are in one-to-one correspondence. The controller is connected to the at least one power module through the at least one first control signal connector and the at least one second control signal connector, and is used to input control signals to the at least one power module. The control signals are used to control the power module to output a preset value of output voltage.

[0009] The output terminal of at least one power module is connected to the device to be powered, and is used to provide an output voltage to the device to be powered.

[0010] In one possible implementation, the board is disposed above the motherboard, with the voltage input connector and the at least one second control signal connector disposed on a first side of the board opposite to the motherboard, and the at least one power module disposed on a second side of the board opposite to the first side.

[0011] In one possible implementation, the motherboard module further includes at least one first load output connector disposed on the motherboard, and the board module further includes at least one second load output connector disposed on the board.

[0012] The power module corresponds one-to-one with the second load output connector, the first load output connector corresponds one-to-one with the second load output connector, the input end of the first load output connector is connected to the second load output connector respectively, and the output end of the at least one first load output connector is connected to the device to be powered.

[0013] In one possible implementation, the power module includes multiple power chips, and the second control signal connector is connected to the corresponding power chip.

[0014] In one possible implementation, the distance between two adjacent power chips located in different power modules is greater than the distance between adjacent related power chips located in the same power module.

[0015] In one possible implementation, the power module further includes a plurality of input capacitors connected to the voltage input connector, each input capacitor corresponding to a power chip.

[0016] In one possible implementation, the power module further includes a plurality of voltage regulator units, each corresponding to one of the power chips, with one end of each voltage regulator unit connected to the second load output connector and the other end connected to the power chip.

[0017] In one possible implementation, the control signal includes a modulation signal and a drive signal, and the controller includes a first port and a second port. The first port is connected to the first control signal connector and is used to send a modulation signal to the power chip through the first control signal connector and the second control signal connector. The second port is connected to the first control signal connector and is used to send a drive signal to the power chip through the first control signal connector and the second control signal connector.

[0018] In one possible implementation, the controller includes a third port and a fourth port. The third port is connected to the at least one first control signal connector for receiving a temperature monitoring signal emitted by the power chip through the second control signal connector and the first control signal connector. The fourth port is connected to the first control signal connector for receiving a current detection signal emitted by the power chip through the second control signal connector and the first control signal connector.

[0019] In a second aspect, a motherboard is provided, including a power supply device and a device to be powered as described in the first aspect, wherein the power supply device is connected to the device to be powered and is used to provide an output voltage to the device to be powered.

[0020] The power supply device and power supply system provided in this application, by setting a motherboard module and a board module, place the power modules of the multi-phase power supply on the board, which can avoid the problem that the limited area of ​​the motherboard prevents the setting of multiple power modules to drive the device to be powered that will generate a large load current. At the same time, by setting multiple connectors on the motherboard and the board, such as voltage input connectors, first control signal connectors and second control signal connectors, the structure in the motherboard and the board is connected by these connectors to realize the supply of output voltage to the device to be powered. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0022] Figure 1 This is a structural diagram of a power supply device shown in an exemplary embodiment of this application;

[0023] Figure 2 A plan view of the first surface shown in an exemplary embodiment of this application;

[0024] Figure 3 A plan view of the second surface shown in an exemplary embodiment of this application;

[0025] Figure 4 This is a structural diagram of a power supply device shown as another exemplary embodiment of this application.

[0026] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0027] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0028] Increased performance requirements lead to increased power consumption, which in turn increases the size of the power stage circuitry in the power supply unit. Since the power supply unit is usually integrated with the device on a motherboard, the volume of the housing that houses the motherboard is limited, and the area of ​​the motherboard cannot be increased indefinitely. This may result in the inability to integrate the structure on the motherboard when there are too many power stage circuits.

[0029] In the server field, for example, as server performance increases, the power consumption of data processing devices such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), and HDD (Hard Disk Drive) increases. The form factor of the server chassis has not changed significantly, which limits the motherboard area and makes it difficult to support the power supply circuits required by the devices inside the server.

[0030] Therefore, how to solve the circuit layout problem of large-scale power supply devices under the condition of limited motherboard space while ensuring the safety and stability of equipment operation has become an urgent problem to be solved.

[0031] Some power supply devices employ highly integrated modular technology, integrating power stage circuits into modules, thereby reducing the space occupied by components in the power supply device while maintaining the same functionality; other power supply devices use smaller components with unchanged performance, such as replacing larger chips with smaller ones, thereby increasing the number of components within the original motherboard space to improve the load current capacity that can be supported.

[0032] However, both of these solutions have certain drawbacks. The highly integrated modular technology relies on the R&D capabilities of component suppliers, resulting in long development cycles. Furthermore, the components integrated into the modules cannot be changed or updated. This technology is also not mature enough, posing certain application risks and potentially leading to server product quality issues. Both highly integrated modular technology and the technology of using smaller, unchanged-performance components can only add a limited number of required components within a limited scope, failing to completely resolve the contradiction between increased component power consumption and limited motherboard space. Moreover, both solutions have high development costs, low market demand, and limited application scenarios, which increases the R&D and production costs of server motherboards. The reduction in component size or increased integration in these two solutions leads to severe heat generation, placing more stringent requirements on the heat dissipation design of the power supply system.

[0033] Based on this, this application proposes a power supply device and power supply system to avoid the problem of the motherboard being unable to achieve integrated layout due to too many power stage circuits in the power supply device, and to solve the problem of severe heat generation of components caused by the large-scale integration of components on the motherboard in the power supply device.

[0034] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0035] refer to Figure 1 A power supply device is provided, comprising: a motherboard module 1 and a board module 2; wherein, the motherboard module 1 includes a power module 11, a controller 12 and at least one first control signal connector 13 disposed on the motherboard; the board module 2 includes a voltage input connector 21, at least one second control signal connector 22 and at least one power module 23 disposed on the board.

[0036] In some embodiments, the second control signal connector 22 corresponds one-to-one with the power module 23, such as... Figure 1 As shown, it illustrates two power modules 23. It is understood that in other embodiments, the number of power modules 23 may be one or more, and there is no limitation here.

[0037] In some embodiments, the number of power modules 23 and the number of second control signal connectors 22 in the power supply device are the same, and one power module 23 is connected to one second control signal connector 22.

[0038] The power module 11 is connected to the input terminal of at least one power module 23 via a voltage input connector 21, and is used to provide power supply voltage to at least one power module 23 via the voltage input connector 21.

[0039] In some embodiments, the power module 11 outputs a supply voltage, and the voltage input connector 21 can be a connector mounted on a board. The power module 23 can receive the same supply voltage from the power module 11 by connecting to the voltage input connector.

[0040] In some embodiments, the power module 11 can be a connection structure mounted on the motherboard, which does not actively output power supply voltage, but instead introduces the power supply voltage output by other modules on the motherboard into the power module through a voltage input connector.

[0041] In one embodiment, the motherboard is provided with an external power supply voltage, and a power supply voltage several times that provided by the motherboard is connected to the power module 11. The power module 11 then introduces the power supply voltage from the motherboard to the power module on the board.

[0042] In some embodiments, the power module 11 may include a voltage output connector and a power supply unit, the voltage output connector and the power supply unit are connected, the power supply unit outputs a power supply voltage, the voltage output connector and the voltage input connector 21 are connected, and the power supply unit outputs a power supply voltage to the power module 23 through the voltage output connector and the current output connector.

[0043] In this embodiment, a voltage output connector and a voltage input connector 21 are provided to connect the board to the motherboard, thereby supplying power to the power module 23 in the board.

[0044] In some embodiments, the power module 23 is a power stage circuit used to convert the supply voltage into an output voltage, thereby supplying power to the device to be powered.

[0045] This output voltage is the operating voltage required by the power supply equipment.

[0046] The first control signal connector 13 and the second control signal connector 22 correspond one-to-one. The controller 12 is connected to at least one power module 23 through at least one first control signal connector 13 and at least one second control signal connector 22, and is used to input control signals to at least one power module 23. The control signals are used to control the power module 23 to output a preset value of output voltage.

[0047] In some embodiments, the number of the first control signal connector 13, the second control signal connector 22, and the power signal are the same, and each corresponds to one other, that is, one first control signal connector 13 is connected to one second control signal connector 22, and one second control signal connector 22 is connected to the power module 23.

[0048] The controller 12 sends a control signal, which is transmitted to the power module 23 through the first control signal connector 13 and the second control signal connector 22. The power module 23 outputs voltage according to the control signal and the power supply voltage.

[0049] In some embodiments, the control signals corresponding to different power modules 23 may be the same or different. The control signal may include a modulation signal PWM and a drive signal. The modulation signal is used to control the magnitude of the output voltage of the corresponding power module 23, and the drive signal is used to control the power module 23 to work. Different control signals can make the corresponding power module 23 output different magnitudes of output voltage.

[0050] In some embodiments, the amount of load current required to drive the device to be powered can determine the number of power modules 23. In some embodiments, the output voltage values ​​of different power modules 23 are the same, and the load current generated inside the power modules 23 when they are running is also the same. When the load current flowing in one power module 23 cannot meet the load current required for the operation of the power supply device, multiple power modules 23 can be set up. The sum of the load currents inside the multiple power modules 23 is greater than the load current required to drive the device to be powered. At this time, the power supply device can supply power to the device to be powered.

[0051] In one embodiment, a power module 23 generates a load current of 30A (amperes). When driving a device to be powered, the load current generated by the device to be powered is 70A. At this time, a power module 23 cannot drive the device to be powered that generates a large load current. Three power modules 23 can be set up. The sum of the load currents generated by the three power modules 23 is greater than 70A. At this time, the three power modules can drive the device to be powered that generates a large load current.

[0052] At least one power module 23 has its output terminal connected to the device to be powered, and is used to provide load current to the device to be powered.

[0053] In some embodiments, the device to be powered is a device that needs to be powered. The device to be powered may be one or more, which receives the output voltage from one or more power modules 23. For a device to be powered, the sum of the load currents generated by one or more power modules 23 is greater than or equal to the load current generated by the device to be powered, and the device to be powered can operate.

[0054] This application provides a power supply device. By setting a motherboard module 1 and a board module 2, the power module 23 of the multi-phase power supply is set on the board. This avoids the problem that the limited area of ​​the motherboard prevents the setting of multiple power modules 23, thus making it impossible to drive the device to be powered that generates a large load current. At the same time, by setting multiple connectors on the motherboard and the board, such as a voltage input connector 21, a first control signal connector 13 and a second control signal connector 22, the structure in the motherboard and the board is connected by the connectors to realize the supply of output voltage to the device to be powered.

[0055] This power supply device mounts components on the motherboard and the expansion card, respectively. The power modules are mounted on the expansion card, avoiding the limitations of motherboard area. Multiple power modules can be installed, thus preventing the inability to power devices that generate large load currents due to motherboard space constraints. Furthermore, the connectors between the motherboard and the expansion card allow them to work together to power devices that generate large load currents. In this structure, the power module 23, which generates significant heat, is mounted on the expansion card, improving heat dissipation efficiency. The controller 12 is mounted on the motherboard, and it typically receives signals from other components on the motherboard to output control signals to the power module 23. Mounting the controller 12 on the motherboard facilitates signal interaction between it and other components. Compared to mounting the controller 12 on the expansion card, this reduces the wiring length between the controller 12 and other devices, minimizing signal losses from other devices.

[0056] In some embodiments, the board is disposed above the motherboard, and a voltage input connector 21 and at least one second control signal connector 22 are disposed on the first side of the board opposite to the motherboard, and at least one power module 23 is disposed on the second side of the board opposite to the first side.

[0057] In some embodiments, the motherboard and the circuit board are arranged opposite each other, with the circuit board positioned above the motherboard and the power module 23 positioned on the circuit board, which can improve the heat dissipation effect of the power module 23.

[0058] In other embodiments, a connector is provided on the side of the board opposite to the motherboard, thereby facilitating the connection between the board and the motherboard.

[0059] like Figure 2 The diagram shows a plan view of the first side of the board. A voltage input connector 21 and at least one second control signal connector 22 are provided on the first side. The first side is opposite to the motherboard, which can reduce the length of the connection line between the voltage input connector 21 and the power module 11, and reduce the length of the connection line between the second control signal connector 22 and the first control signal connector 13.

[0060] Understandable. Figure 2 Although the voltage regulator unit 233 and input capacitor 232 in the power module 23 are shown, they are only used to illustrate the relative positions of the devices in the power module on the second side corresponding to the first side, with respect to the voltage input connector 21 and at least one second control signal connector 22. The voltage regulator unit 233 and input capacitor 232 in the power module 23 may be located on the second side.

[0061] In some embodiments, a power module 11, a controller 12, and at least one first control signal connector 13 are disposed on the side of the motherboard opposite to the board.

[0062] In some embodiments, the motherboard module 1 further includes at least one first load output connector 14 disposed on the motherboard, and the board module 2 further includes at least one second load output connector 24 disposed on the board.

[0063] The power module 23 corresponds one-to-one with the second load output connector 24, the first load output connector 14 corresponds one-to-one with the second load output connector 24, the input end of the first load output connector 14 is connected to the second load output connector 24 respectively, and the output end of at least one first load output connector 14 is connected to the device to be powered.

[0064] In some embodiments, the connection between the power module 23 and the device to be powered can also be achieved through the first load output connector 14 and the second load output connector 24. The connection between the power module 23 and the device to be powered is achieved through the first load output connector 14 and the second load output connector 24, thereby safely and reliably supplying power to the device to be powered.

[0065] In some embodiments, the number of power modules 23 is the same as the number of second load output connectors, the number of second load output connectors is the same as the number of first load output connectors, one power module 23 is connected to one second load output connector, and one second load output connector is connected to one first load output connector.

[0066] In some embodiments, such as Figure 2 As shown, the second load output connector 24 is also located on the first side of the board, which facilitates connection with the first load output connector.

[0067] In other embodiments, the first side of the plate may also include a grounding connector, to which the power module 23 can be connected to achieve grounding.

[0068] In some embodiments, the power module 23 includes a plurality of power chips 231, and the second control signal connector 22 is connected to the corresponding power chip 231.

[0069] In some embodiments, the power chip 231 performs load power conversion, such as step-down or step-up functions, and the power module 23 converts the supply voltage into the output voltage through the power chip 231.

[0070] The power chip 231 is the power chip 231 in the power stage circuit.

[0071] In some embodiments, the second control signal connector 22 is connected to the power chip 231 to control the power chip 231 to perform power supply voltage conversion, thereby the power module 23 outputs voltage.

[0072] In some embodiments, the distance between two adjacent power chips 231 located in different power modules 23 is greater than the distance between adjacent related power chips 231 located in the same power module 23. In some embodiments, a board is provided with multiple power modules 23, each power module 23 has multiple power chips 231, and the multiple power chips 231 in each power module 23 are connected in parallel.

[0073] There is a certain spacing between multiple power modules 23, and there is a certain spacing between the power chips 231 of each power module 23, which can improve the heat dissipation capacity of the power modules 23 and the power chips 231.

[0074] Meanwhile, the distance between two adjacent power chips 231 located in different power modules 23 is greater than the distance between adjacent related power chips 231 located in the same power module 23, which can greatly reduce the magnetic flux leakage phenomenon between adjacent power modules 23 and improve the reliability of power modules 23.

[0075] In some embodiments, such as Figure 3 The diagram shows the layout of the second side of the board. The power modules 23 are neatly arranged along the length of the board. Figure 3 The output has two power modules 23, each of which contains two power chips 231. There is a certain distance between the two power chips 231 in a power module 23, and the distance between two adjacent power chips 231 in adjacent power modules 23 is greater than the distance between two adjacent power chips 231 in the same power module 23.

[0076] In some embodiments, the distance between adjacent related chips in the same power module 23 may be the same or different, and the distance between two adjacent power modules 23 may be the same or different.

[0077] In some embodiments, the power module 23 further includes a plurality of input capacitors 232, which are connected to the voltage input connector 21 and correspond one-to-one with the power chip 231.

[0078] In some embodiments, the power module 23 may include an input capacitor 232 at the input terminal, such as... Figure 3 As shown, in a power module 23, the number of input capacitors 232 can be the same as the number of power chips 231. Each input capacitor 232 is connected to a power chip 231 and to a voltage input connector 21. The power supply voltage output by the voltage input connector 21 reaches the power chip 231 through the input capacitor 232.

[0079] The input capacitor 232 can reduce the noise of the power module 23, so that the power chip 231 can better receive the noise-reduced voltage and process it accordingly.

[0080] In some embodiments, the input capacitor 232 may include one or more capacitors. When one input capacitor 232 corresponds to multiple capacitors, the multiple capacitors are connected in parallel and / or in series for noise reduction.

[0081] In some embodiments, the power module 23 further includes a plurality of voltage regulator units 233, each corresponding to a power chip 231. One end of each voltage regulator unit 233 is connected to the second load output connector 24 and the other end is connected to the power chip 231.

[0082] like Figure 3 As shown, the number of voltage regulator units 233 is the same as that of power chips 231. One voltage regulator unit 233 is connected to one power chip 231, and one voltage regulator unit 233 is connected to the second load output connector 24 corresponding to the power module 23. The voltage regulator unit 233 performs voltage regulation and filtering of the output current of the corresponding power chip 231, thereby outputting load current to the second load output connector 24.

[0083] In some embodiments, the voltage regulator unit 233 may include one or more power inductors and one or more output capacitors, with the power inductors and output capacitors connected in series and / or in parallel to achieve functions such as converting square waves to DC levels, voltage regulation, and filtering.

[0084] In some embodiments, the control signal includes a modulation signal and a drive signal. The controller 12 includes a first port and a second port. The first port is connected to a first control signal connector 13 and is used to send a modulation signal to the power chip 231 through the first control signal connector 13 and the second control signal connector 22. The second port is connected to the first control signal connector 13 and is used to send a drive signal to the power chip 231 through the first control signal connector 13 and the second control signal connector 22.

[0085] In some embodiments, the modulation signal controls the output voltage by adjusting the duty cycle, and the drive signal drives the gate of the power chip 231 to achieve fast switching. The power chip 231 can output a corresponding value of output voltage through the modulation signal and the drive signal.

[0086] In some embodiments, a first port outputs a modulation signal of a power module 23, and a second port outputs a drive signal of a power module 23. The controller 12 may include the same number of first ports and second ports as the power modules 23, thereby outputting corresponding modulation signals and drive signals through different first ports and second ports.

[0087] In some embodiments, the number of controllers 12 of the power supply device may be one or more. If there is one controller 12, the controller 12 includes the same number of first ports and second ports as the number of power modules 23. If there are multiple controllers 12, the sum of the first ports of the multiple controllers 12 is equal to the number of power modules 23, and the sum of the second ports is equal to the number of power modules 23.

[0088] In some embodiments, the first control signal connector 13 and the second control signal connector 22 include a modulation signal input port for applying an input modulation signal and a modulation signal port for outputting a modulation signal. For example, in some embodiments, a first port of the controller 12 is connected to the modulation signal input port of the first control signal connector 13 to input a modulation signal into the first control signal connector 13. The first control signal connector 13 is connected to the modulation signal input port of the second control signal connector 22 through a modulation signal output port to input a modulation signal into the second control signal connector 22. The first control signal connector 13 is connected to the power chip 231 in the power module 23 through a modulation signal output port to input a modulation signal into the power chip 231.

[0089] In some embodiments, the first control signal connector 13 and the second control signal connector 22 include a drive signal input port for applying input drive signals and a drive signal port for outputting drive signals. For example, in some embodiments, a first port of the controller 12 is connected to the drive signal input port of the first control signal connector 13 to input drive signals into the first control signal connector 13. The first control signal connector 13 is connected to the drive signal input port of the second control signal connector 22 through a drive signal output port to input drive signals into the second control signal connector 22. The first control signal connector 13 is connected to the power chip 231 in the power module 23 through a drive signal output port to input drive signals into the power chip 231.

[0090] In some embodiments, the controller 12 includes a third port and a fourth port. The third port is connected to at least one first control signal connector 13 for receiving temperature monitoring signals emitted by the power chip 231 through the second control signal connector 22 and the first control signal connector 13. The fourth port is connected to the first control signal connector 13 for receiving current detection signals emitted by the power chip 231 through the second control signal connector 22 and the first control signal connector 13.

[0091] In some embodiments, the number of third ports is the same as the number of power modules 23, and the number of fourth ports is the same as the number of power modules 23. Similarly, the number of controllers 12 of the power supply device can be one or more. If there is one controller 12, the controller 12 includes the same number of third ports and fourth ports as the number of power modules 23. If there are multiple controllers 12, the sum of the third ports of the multiple controllers 12 is equal to the number of power modules 23, and the sum of the fourth ports is equal to the number of power modules 23.

[0092] In some embodiments, a power module 23 is connected to a third port via a first control signal connector 13 and a second control signal connector 22 to send a temperature monitoring signal to the controller 12. The temperature monitoring signal is used to detect the temperature in the power module 23 to prevent the power module 23 from overheating and causing damage to the power supply device. The temperature monitoring signal can be sent by the power chip 231.

[0093] In some embodiments, a power module 23 is connected to a fourth port via a first control signal connector 13 and a second control signal connector 22 to send a temperature monitoring signal to the controller 12. The current detection signal is used to detect the current in the power module 23 to prevent the power module 23 from being damaged by excessive current. The current detection signal can be sent by the power chip 231.

[0094] In some embodiments, the first control signal connector 13 and the second control signal connector 22 include corresponding temperature monitoring signal input ports for inputting temperature monitoring signals and temperature monitoring signal ports for outputting temperature monitoring signals. For example, in some embodiments, the power chip 231 is connected to the temperature monitoring signal input port of the second control signal connector 22 to output a temperature monitoring signal to the second control signal connector 22, the temperature monitoring signal output port of the second control signal connector 22 is connected to the temperature monitoring signal input port of the first control signal connector 13 to output a temperature monitoring signal to the first control signal connector 13, and the temperature monitoring signal input port of the first control signal connector 13 is connected to a third port to output a temperature monitoring signal to the controller 12.

[0095] In some embodiments, the first control signal connector 13 and the second control signal connector 22 include corresponding ports for inputting current detection signals and outputting current detection signals. For example, in some embodiments, the power chip 231 is connected to the current detection signal input port of the second control signal connector 22 to output a current detection signal to the second control signal connector 22, the current detection signal output port of the second control signal connector 22 is connected to the current detection signal input port of the first control signal connector 13 to output a current detection signal to the first control signal connector 13, and the current detection signal input port of the first control signal connector 13 is connected to a third port to output a current detection signal to the controller 12.

[0096] In some embodiments, such as Figure 4 The schematic diagram of the power supply device shown includes a motherboard module 1 and a board module 2. The motherboard module 1 includes a controller 12, and the number of controllers 12 can be one or more. Figure 4 The circuit outputs two controllers 12, each controller 12 including at least one first port, at least one second port, at least one third port, and at least one fourth port. One first port, one second port, one third port, and one fourth port are all connected to a power module 23. The first port and the second port are connected to the power chip 231 in the power module 23 of the circuit board through the first control signal connector 13 and the second control signal connector 22, for outputting modulation signals and drive signals respectively. The third port and the fourth port are connected to the power chip 231 in the power module 23 of the circuit board through the first control signal connector 13 and the second control signal connector 22, for receiving temperature monitoring signals and current detection signals respectively.

[0097] The motherboard module 1 also includes a power supply module 11, which is used to output power supply voltage.

[0098] The board module 2 includes a voltage input connector 21, which is connected to the power module 11 and the input capacitor 232 in the power module 23, for inputting power supply voltage to the power module 23.

[0099] like Figure 4 The diagram shows three power modules 23, each power module 23 including two power chips 231, each input capacitor 232 connected to one power chip 231, and one power chip 231 also connected to a voltage regulator unit 233. The voltage regulator unit 233 is connected to a second load output connector 24, and the second load output unit connector is connected to the first load unit output connector in the main board module 1 for outputting voltage.

[0100] In some embodiments, based on the power supply device of the above embodiments, a power supply system is also proposed, which includes the power supply device of the above embodiments, the power supply device being connected to the device to be powered, and is used to provide an output voltage to the device to be powered.

[0101] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0102] It should be noted that the embodiments referred to in the specification, such as "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments," may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0103] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0104] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0105] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A power supply device, characterized in that, Includes motherboard modules and expansion card modules; among which, The motherboard module includes a power module, a controller, and at least one first control signal connector mounted on the motherboard. The board module includes a voltage input connector, at least one second control signal connector, and at least one power module disposed on the board, wherein the second control signal connector corresponds one-to-one with the power module; The power module is connected to the input terminal of the at least one power module via the voltage input connector, and is used to provide power supply voltage to the at least one power module via the voltage input connector; The first control signal connector and the second control signal connector are in one-to-one correspondence. The controller is connected to the at least one power module through the at least one first control signal connector and the at least one second control signal connector, and is used to input control signals to the at least one power module. The control signals are used to control the power module to output a preset value of output voltage. The output terminal of at least one power module is connected to the device to be powered, and is used to provide an output voltage to the device to be powered.

2. The power supply device according to claim 1, characterized in that, The board is positioned above the motherboard. The voltage input connector and the at least one second control signal connector are disposed on the first side of the board opposite to the motherboard, and the at least one power module is disposed on the second side of the board opposite to the first side.

3. The power supply device according to claim 1, characterized in that, The motherboard module further includes at least one first load output connector disposed on the motherboard, and the board module further includes at least one second load output connector disposed on the board. The power module corresponds one-to-one with the second load output connector, the first load output connector corresponds one-to-one with the second load output connector, the input end of the first load output connector is connected to the second load output connector respectively, and the output end of the at least one first load output connector is connected to the device to be powered.

4. The power supply device according to claim 3, characterized in that, The power module includes multiple power chips, and the second control signal connector is connected to the corresponding power chip.

5. The power supply device according to claim 4, characterized in that, The distance between two adjacent power chips located in different power modules is greater than the distance between adjacent related power chips located in the same power module.

6. The power supply device according to claim 4, characterized in that, The power module also includes multiple input capacitors, which are connected to the voltage input connector and correspond one-to-one with the power chip.

7. The power supply device according to claim 4, characterized in that, The power module also includes multiple voltage regulator units, each corresponding to a power chip. One end of each voltage regulator unit is connected to the second load output connector and the other end is connected to the power chip.

8. The power supply device according to claim 4, characterized in that, The control signal includes a modulation signal and a drive signal. The controller includes a first port and a second port. The first port is connected to the first control signal connector and is used to send a modulation signal to the power chip through the first control signal connector and the second control signal connector. The second port is connected to the first control signal connector and is used to send a drive signal to the power chip through the first control signal connector and the second control signal connector.

9. The power supply device according to claim 4, characterized in that, The controller includes a third port and a fourth port. The third port is connected to the at least one first control signal connector and is used to receive temperature monitoring signals emitted by the power chip through the second control signal connector and the first control signal connector. The fourth port is connected to the first control signal connector and is used to receive current detection signals emitted by the power chip through the second control signal connector and the first control signal connector.

10. A power supply system, characterized in that, It includes a power supply device and a device to be powered as described in any one of claims 1-9, wherein the power supply device is connected to the device to be powered and is used to provide an output voltage to the device to be powered.

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