Radio frequency transmission assembly and electronic equipment

Abstract

The utility model provides a radio frequency transmission assembly and electronic equipment, and relates to the technical field of radio frequency transmission. The radio frequency transmission assembly comprises a first connecting part and a second connecting part; the first connecting part is used for connecting a radio frequency integrated circuit and is connected with a first antenna module; a non-connection state and a connection state which can be switched are arranged between the second connection part and the first connection part, in the non-connection state, the first connection part is used for testing multiple paths of signals of the radio frequency integrated circuit, and in the connection state, the second connection part is connected with the first connection part in an adaptive mode so that the radio frequency integrated circuit and the first antenna module can be at least partially conducted.

Description

Technical Field

[0001] This application relates to the field of radio frequency transmission technology, and in particular to a radio frequency transmission component and electronic device. Background Technology

[0002] With the development of 5G (5th Generation Mobile Networks) and the increase in mobile communication frequency bands, electronic devices are increasingly demanding radio frequency transmission.

[0003] To meet the performance requirements of radio frequency transmission, multiple radio frequency connectors are usually set up according to the number of radio frequency signal paths to realize the conduction calibration, testing and transmission of radio frequency signals. However, such a setup occupies a lot of space and is not conducive to the spatial layout of electronic devices. Utility Model Content

[0004] The purpose of this application is to provide a radio frequency transmission component and an electronic device, the technical solution of which is as follows:

[0005] The first aspect of this application provides a radio frequency transmission component, including:

[0006] The first connecting part is used to connect the radio frequency integrated circuit and is connected to the first antenna module;

[0007] The second connection part has a switchable non-connection state and a connection state with the first connection part. In the non-connection state, the first connection part is used for testing multiple signals of the radio frequency integrated circuit. In the connection state, the second connection part is adapted to connect with the first connection part so that the radio frequency integrated circuit and the first antenna module are at least partially connected.

[0008] In some embodiments, the aforementioned radio frequency transmission component includes a first connection portion comprising a plurality of first pins and at least one second pin. The plurality of first pins are used to connect to a radio frequency integrated circuit to form a plurality of first paths, and the at least one second pin is used to connect to a first antenna module to form at least one second path. In a non-connected state, the second connection portion is not adapted to connect with the first connection portion, and both the first path and the second path are in a disconnected state. In a connected state, the first path and the second path are at least partially connected under the action of the second connection portion to enable the radio frequency integrated circuit to communicate with the first antenna module.

[0009] In some embodiments, the aforementioned radio frequency transmission component includes a second connection portion with a first connector; in a connected state, the first connector connects a first path and a second path to enable the radio frequency integrated circuit to communicate with the first antenna module.

[0010] In some embodiments, the aforementioned radio frequency transmission component includes a third path between the first connector and the second antenna module. In the connected state, the first path and the third path are at least partially connected by the first connector to enable the radio frequency integrated circuit to communicate with the second antenna module. The first antenna module and the second antenna module are used to process signals of different frequency bands.

[0011] In some embodiments, the aforementioned radio frequency transmission component further includes a second connector in the second connection portion; in the connected state, the second connector connects to the first connector and the second antenna module respectively, so as to enable the radio frequency integrated circuit to communicate with the second antenna module.

[0012] In some embodiments, the aforementioned radio frequency transmission component includes a second connection portion having a first connection region and a second connection region, a first connector disposed in the first connection region, and a second connector disposed in the second connection region; in a connected state, a portion of the first path and the second path are connected in the first connection region, and a portion of the first path and the third path are connected in the second connection region.

[0013] In some embodiments, the aforementioned radio frequency transmission component, in a non-connected state, allows multiple first pins of the first connection portion to connect to radio frequency probes, and multiple test connectors corresponding to the radio frequency probes to be used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit; or, in a non-connected state, allows multiple first pins of the first connection portion to connect to an adapter board, and multiple test connectors corresponding to the adapter board to be used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit.

[0014] In some embodiments, the aforementioned radio frequency transmission component includes an antenna spring on the second path, with the two ends of the antenna spring connected to a second pin and a first antenna module, respectively.

[0015] A second aspect of this application provides an electronic device, comprising:

[0016] Radio frequency integrated circuits;

[0017] case;

[0018] The first antenna module is located at the first position of the housing.

[0019] A radio frequency (RF) transmission component is connected between the RF integrated circuit and the first antenna module, wherein the RF transmission component includes:

[0020] The first connecting part is used to connect the radio frequency integrated circuit and is connected to the first antenna module;

[0021] The second connection part has a switchable non-connection state and a connection state with the first connection part. In the non-connection state, the first connection part is used for testing multiple signals of the radio frequency integrated circuit. In the connection state, the second connection part is adapted to connect with the first connection part so that the radio frequency integrated circuit and the first antenna module are at least partially connected.

[0022] In some embodiments, the aforementioned electronic device further includes: a second antenna module disposed at a second position of the housing, the second antenna module and the first antenna module being used to process signals of different frequency bands respectively; in the connected state, the second connection part is adapted to connect with the first connection part so that the radio frequency integrated circuit partially conducts the first antenna module and partially conducts the second antenna module.

[0023] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, the preferred embodiments of this application are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This schematic diagram illustrates a structure in which the second connection portion of a radio frequency transmission component of this application is in a non-connected state with the first connection portion;

[0026] Figure 2 This schematic diagram illustrates the structure of a radio frequency transmission component of the present application, showing the second connection portion and the first connection portion in a connected state.

[0027] Figure 3 A schematic diagram of the structure of the second connection part of a radio frequency transmission component of this application is shown.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. First connecting part; 11. First pin; 12. Second pin;

[0030] 2. Second connecting part; 21. First connector; 22. Second connector; 23. First connecting area; 24. Second connecting area;

[0031] 3. First pathway;

[0032] 4. Second path; 41. Antenna spring;

[0033] 5. Third pathway;

[0034] 6. Radio frequency integrated circuits;

[0035] 7. First antenna module. Detailed Implementation

[0036] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0037] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0038] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0039] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0040] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0041] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0042] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0043] Example 1

[0044] like Figure 1 and Figure 2 As shown, the first aspect of this application provides a radio frequency transmission component, including a first connection part 1 and a second connection part 2; the first connection part 1 is used to connect a radio frequency integrated circuit 6 and is connected to a first antenna module 7; the second connection part 2 and the first connection part 1 have a switchable non-connection state and a connection state. In the non-connection state, the first connection part 1 is used for testing multiple signals of the radio frequency integrated circuit 6. In the connection state, the second connection part 2 is adapted to connect with the first connection part 1 so that the radio frequency integrated circuit 6 and the first antenna module 7 are at least partially connected.

[0045] Specifically, in this application, the radio frequency integrated circuit 6 (RFIC) is an integrated circuit capable of processing radio frequency signals. It can amplify, modulate, demodulate, and filter radio frequency signals, and can generate radio frequency signals to be transmitted to the first antenna module 7, as well as receive radio frequency signals transmitted by the first antenna module 7. The first antenna module 7 can convert the electrical signals generated by the radio frequency integrated circuit 6 into electromagnetic waves for transmission, and can also convert the received electromagnetic waves into electrical signals for transmission to the radio frequency integrated circuit 6 for processing. This application does not limit the frequency band, bandwidth, or other parameters that the first antenna module 7 can process.

[0046] The radio frequency transmission component of this application is provided with a first connector 21 and a second connector 22 to meet the transmission and testing of multiple signals transmitted or received between the radio frequency integrated circuit 6 and the first antenna module 7. The first connection part 1 is used to connect the radio frequency integrated circuit 6 and the first antenna module 7. The first connection part 1 can be a multi-line connector or a board-to-board connector, etc., to connect the signal paths of multiple signals through the multiple pins of the multi-line connector or the board-to-board connector.

[0047] To enable switching between testing and actual use within the same component and meet the needs of signal testing, conduction calibration, and transmission, the second connection part 2 of this application can be an FPC (Flexible Printed Circuit), a coaxial connector, a Pogo Pin connector, a metal guide strip, etc. The second connection part 2 and the first connection part 1 have switchable non-connected and connected states, such as... Figure 1 As shown, the second connecting part 2 and the first connecting part 1 are in a non-connected state. The radio frequency integrated circuit 6 and the first antenna module 7 are respectively connected to the pins of the first connecting part, but the radio frequency integrated circuit and the first antenna module 7 are not conductive. Figure 2 As shown, the second connecting part 2 and the first connecting part 1 are in a connected state. In the connected state, the radio frequency integrated circuit 6 and the first antenna module 7 can be connected through corresponding pins. The second connecting part 2 can be adapted to the first connecting part 1 by means of plugging, snapping, crimping, etc., to realize the switching from non-connected state to connected state. It can also be disconnected from the first connecting part 1 by means of pulling out, unsnap, decompressing, etc., to realize the switching from connected state to non-connected state.

[0048] In the non-connected state, the first connection part 1 is used for testing multiple signals of the RF integrated circuit 6. It can be connected to external test instruments such as vector network analyzers, spectrum analyzers, and signal generators via RF probes, adapter boards, etc., to calibrate acquired signal parameters such as signal power level, frequency response, and phase noise. Feedback from the test and evaluation results allows for optimization and adjustment of path parameters, the layout of the RF integrated circuit 6, and the first connection part 1. In the connected state, the second connection part 2 is adapted to the first connection part 1 through plug-in, snap-fit, or crimping methods to ensure that the RF integrated circuit 6 and the first antenna module 7 are at least partially connected, forming a conductive signal transmission path to meet the communication requirements of the electronic device.

[0049] In one embodiment, the first connection part 1 is a Multi-Line Connector and the second connection part 2 is an FPC. In the non-connected state, the testing and conduction calibration of multiple signals are realized through multiple pins of the Multi-Line Connector. In the connected state, the FPC is inserted into the Multi-Line Connector to form a mechanical and electrical adaptation connection. The signal is transmitted between the radio frequency integrated circuit 6 and the first antenna module 7 to meet the communication requirements of the electronic device.

[0050] This application provides a radio frequency (RF) transmission component, including a first connecting part 1 and a second connecting part 2. The first connecting part 1 is used to connect an RF integrated circuit 6 and is connected to a first antenna module 7. The second connecting part 2 has a switchable non-connected state and a connected state with the first connecting part 1. In the non-connected state, the first connecting part 1 is used for testing multiple signals of the RF integrated circuit 6. In the connected state, the second connecting part 2 is adapted to the first connecting part 1 to enable at least partial conduction between the RF integrated circuit 6 and the first antenna module 7. This application, by switching between the non-connected and connected states of the first connecting part 1 and the second connecting part 2 of the RF transmission component, achieves switching between testing and actual use within the same component, compared to setting multiple independent RF connectors. This satisfies the needs of signal testing, conduction calibration, and transmission, reduces space occupation, and simplifies the spatial layout within electronic devices. Through the application of this application, the technical problem of traditionally setting multiple RF connectors according to the number of RF signal paths to achieve conduction calibration, testing, and transmission of RF signals, which occupies a large space and is detrimental to the spatial layout of electronic devices, is solved.

[0051] like Figure 1 and Figure 2 As shown, in some embodiments, the first connection part 1 includes a plurality of first pins 11 and at least one second pin 12. The plurality of first pins 11 are used to connect to the radio frequency integrated circuit 6 to form a plurality of first paths 3, and the at least one second pin 12 is used to connect to the first antenna module 7 to form at least one second path 4. In the non-connected state, the second connection part 2 is not adapted to connect with the first connection part 1, and both the first path 3 and the second path 4 are in the disconnected state. In the connected state, the first path 3 and the second path 4 are at least partially connected under the action of the second connection part 2 so that the radio frequency integrated circuit 6 can communicate with the first antenna module 7.

[0052] Specifically, to achieve flexible switching between testing and use, the first connection part 1 of this application includes a first pin 11 and at least one second pin 12. The multiple first pins 11 are used to connect to the RF integrated circuit 6 to form multiple first paths 3, and the at least one second pin 12 is used to connect to the first antenna module 7 to form at least one second path 4. In the non-connected state, the second connection part 2 is not adapted to connect with the first connection part 1, and both the first path 3 and the second path 4 are in a disconnected state. The signal between the RF integrated circuit 6 and the first antenna module 7 is not conducted. Multiple signal tests and conduction calibrations can be performed through the multiple first pins 11 exposed by the first connection part 1. The first pins 11 can be directly connected and accessed through RF probes or adapter boards to obtain the required signal parameters for subsequent analysis and debugging. In the connected state, the first path 3 and the second path 4 are at least partially conducted under the action of the second connection part 2. The RF integrated circuit 6 and the first antenna module 7 form a complete signal transmission path through the conducted first path 3 and the second path 4, realizing signal conduction.

[0053] like Figure 3 As shown, in some embodiments, the second connection part 2 is provided with a first connector 21; in the connected state, the first connector 21 connects the first path 3 and the second path 4 to enable the radio frequency integrated circuit 6 to communicate with the first antenna module 7.

[0054] Specifically, in order to enable the first path 3 and the second path 4 to conduct in the connected state, thereby enabling the radio frequency integrated circuit 6 to communicate with the first antenna module 7, this application provides a first connector 21 in the second connection part 2. In one embodiment, the first connector 21 can be a Mainboard Connector. Through the multiple pins provided by the Mainboard Connector, one first path 3 can be connected to one second path 4, or multiple first paths 3 can be connected to multiple second paths 4, thereby realizing the one or more signal transmission requirements between the radio frequency integrated circuit 6 and one or more antenna elements of the first antenna module 7. The first connector 21 can also be a ZIF (Zero Insertion Force) connector, which realizes zero insertion force insertion and removal, extends service life, and meets the connection requirements of one or more first paths 3 and second paths 4.

[0055] like Figure 3 As shown, in some embodiments, the first connector 21 has a third path 5 between it and the second antenna module. In the connected state, the first path 3 and the third path 5 are at least partially connected under the action of the first connector 21 so that the radio frequency integrated circuit 6 can communicate with the second antenna module. The first antenna module 7 and the second antenna module are used to process signals of different frequency bands.

[0056] Specifically, to improve the multi-band processing capability of the RF transmission component of this application, a third path 5 is provided between the first connector 21 and the second antenna module (not shown in the figure). When the second connection part 2 and the first connection part 1 are connected, the first path 3 and the third path 5 are at least partially connected under the action of the first connector 21, enabling the RF integrated circuit 6 to communicate with the second antenna module. Then, according to signal transmission requirements, the RF integrated circuit 6 can communicate with the first antenna module 7, or communicate with the second antenna module, or simultaneously communicate with both the first antenna module 7 and the second antenna module. This allows users to flexibly switch the communication connection between the RF integrated circuit 6 and different antenna modules as needed, adapting to different communication application scenarios of the electronic device and improving the user experience. Furthermore, this application integrates the conduction functions of the first path 3, the second path 4, and the third path 5 through the first connector 21, avoiding the use of multiple independent connectors and further reducing the number of components used for signal transmission and the space occupied by the electronic device.

[0057] The first antenna module 7 and the second antenna module are used to process signals of different frequency bands, thereby enabling the radio frequency transmission components to cover a wider frequency range to meet signal transmission requirements. In some embodiments, the electronic device is a candybar phone or a foldable phone. The first antenna module 7 can be the antenna on the upper frame of the phone, and the second antenna module can be the antenna board set at the bottom of the phone. Considering that the user has a large contact area and a long contact time with the bottom of the phone during use, the first antenna module 7 can be set as an antenna element that can process higher frequency signals, and the second antenna module can be set as an antenna element that can process lower frequency signals, so as to reduce interference in the transmission of higher frequency signals and ensure the transmission quality of higher frequency signals.

[0058] like Figure 3 As shown, in some embodiments, the second connection part 2 is further provided with a second connector 22; in the connected state, the second connector 22 connects to the first connector 21 and the second antenna module respectively, so that the radio frequency integrated circuit 6 can communicate with the second antenna module.

[0059] Specifically, this application further includes a second connector 22 for the second connection part 2. The second connector 22 and the first connector 21 are integrated within the second connection part 2. This allows for simple installation of the second antenna module by simply inserting it into the second connector 22 to meet the communication connection requirements of the RF integrated circuit 6, thus simplifying the wiring between the second antenna module and the RF transmission components. Furthermore, when the second antenna module needs to be replaced or upgraded, it can be operated simply by disconnecting it from the second connector 22, improving the maintainability of the electronic equipment.

[0060] In one embodiment, the second connector 22 can be a Subboard Connector, which can achieve communication connection with the first connector 21 through multiple pins, thereby enabling one or more third paths 5 to be connected to the first path 3; the second connector 22 can also be a ZIF (Zero Insertion Force) connector or a Pogo Pin connector, etc., to meet the connection requirements of one or more third paths 5 and the second path 4, and the specific design is not limited.

[0061] In some embodiments, the first connector 21 is a Mainboard Connector, and the second connector 22 is a Subboard Connector. The first connector 21 has multiple third pins corresponding to the multiple first pins 11 of the first connection part 1, and multiple fourth pins corresponding to the multiple second pins 12. Target pins among the third pins, which have the same number as the fourth pins, are shorted to corresponding fourth pins to enable the RF integrated circuit 6 to communicate with the first antenna module 7. Non-target pins among the multiple third pins, excluding the target pins, are connected to the second connector 22 to enable the RF integrated circuit 6 to communicate with the second antenna module. In one embodiment, the first connection part 1 includes four first pins 11 and two second pins 12. The first connector 21 has four third pins and two fourth pins. The four third pins include two target pins and two non-target pins. The two target pins are shorted to corresponding four fourth pins, and the two non-target pins are connected to the second connector 22.

[0062] like Figure 3 As shown, in some embodiments, the second connecting part 2 has a first connecting region 23 and a second connecting region 24, a first connector 21 is disposed in the first connecting region 23, and a second connector 22 is disposed in the second connecting region 24; in the connected state, part of the first passage 3 and the second passage 4 are connected in the first connecting region 23, and part of the first passage 3 and the third passage 5 are connected in the second connecting region 24.

[0063] Specifically, this application provides independent and clear transmission paths for signal transmission between the RF integrated circuit 6 and different antenna modules by setting a first connection area 23 and a second connection area 24 for the second connection part 2, and setting the first connector 21 in the first connection area 23 and the second connector 22 in the second connection area 24, thereby reducing cross-interference between different signals. Furthermore, the first connector 21 and the second connector 22 can be configured with impedance parameters matching different signals, and shielding and frequency isolation designs can be adopted to improve signal transmission quality. Simultaneously, the partitioned arrangement helps simplify wiring in the second connection part 2, enabling modular wiring design within the second connection part 2, facilitating replacement, maintenance, or expansion as needed, effectively utilizing space within the electronic device, and improving space utilization.

[0064] In some embodiments, in the non-connected state, the plurality of first pins 11 of the first connection part 1 can be connected to radio frequency probes, and the plurality of test connectors corresponding to the radio frequency probes are used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit 6; or, in the non-connected state, the plurality of first pins 11 of the first connection part 1 can be connected to an adapter board, and the plurality of test connectors corresponding to the adapter board are used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit 6.

[0065] Specifically, in order to test and evaluate the performance of the radio frequency transmission component in signal transmission and ensure the signal transmission quality and reliability of the radio frequency transmission component in electronic devices, this application allows testing and conduction calibration of multiple signals of the radio frequency integrated signal through the first connection part 1 when the second connection part 2 and the first connection part 1 are in a non-connected state. This enables the acquisition of performance data such as signal power, frequency range, bandwidth, and noise figure. Furthermore, through the feedback of the test and evaluation results, the path parameters, the layout of the radio frequency integrated circuit 6, the first connection part 1, etc., can be optimized and adjusted.

[0066] In one embodiment, the multiple first pins 11 of the first connection portion 1 of this application can be connected to radio frequency (RF) probes, and multiple test connectors corresponding to the RF probes are used for testing and conducting calibration of multiple signals of the RF integrated circuit 6. The RF probes are made of high-precision, low-loss materials, with a small and robust probe head at one end. A corresponding number of probe heads can be set for the RF probes to detect multiple signal paths at once, improving testing efficiency. The probe head of the RF probe is pressed onto the corresponding first pin 11, forming a stable electrical connection with the first pin 11 through mechanical pressure. The other end of the RF probe has a test connector. During testing, the signal is transmitted from the probe head to the test connector through the conductive path inside the RF probe. The test connector can be connected to external test instruments such as vector network analyzers, spectrum analyzers, and signal generators to obtain test and evaluation results.

[0067] In another embodiment, the multiple first pins 11 of the first connection part 1 of this application can be connected to an adapter board, and multiple test connectors corresponding to the adapter board are used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit 6. The adapter board, as a small circuit board, includes interfaces or sockets that match the first pins 11 of the first connection part 1. When the adapter board is connected to the first connection part 1, the corresponding interfaces or sockets are mated with the first pins 11 by plugging or crimping to achieve electrical contact connection. The adapter board can also have multiple test connectors corresponding to it. During testing, signals are transmitted to the corresponding test connectors through the conductive paths inside the adapter board. The test connectors can be connected to external testing instruments such as vector network analyzers, spectrum analyzers, and signal generators to obtain test and evaluation results.

[0068] like Figure 1 and Figure 2 As shown, in some embodiments, an antenna spring 41 is provided on the second path 4, and the two ends of the antenna spring 41 are respectively connected to the second pin 12 and the first antenna module 7.

[0069] Specifically, to improve signal transmission performance and ensure the reliability of electrical connections, this application provides antenna springs 41 on the second path 4. The number of antenna springs 41 corresponds to the number of antenna elements in the first antenna module 7 and the number of second paths 4. The two ends of the antenna springs 41 are connected to the second pin 12 and the first antenna module 7, respectively. When the first connection part 1 and the second connection part 2 are connected, the good conductivity of the antenna springs 41 and stable mechanical pressure provide continuous and stable electrical contact, achieving impedance matching between the antenna and the RF integrated circuit 6, reducing reflections and interference, and withstanding minor vibrations and impacts experienced by the RF transmission components during operation. This improves signal transmission quality and performance, ensuring the stability and reliability of the electrical connection.

[0070] Example 2

[0071] A second aspect of this application provides an electronic device, including a radio frequency integrated circuit 6, a housing, a first antenna module 7, and a radio frequency transmission component; the first antenna module 7 is disposed at a first position in the housing; the radio frequency transmission component is connected between the radio frequency integrated circuit 6 and the first antenna module 7, wherein the radio frequency transmission component includes: a first connecting part 1 and a second connecting part 2; the first connecting part 1 is used to connect the radio frequency integrated circuit 6 and is connected to the first antenna module 7; the second connecting part 2 and the first connecting part 1 have a switchable non-connection state and a connection state, in the non-connection state, the first connecting part 1 is used for testing multiple signals of the radio frequency integrated circuit 6, and in the connection state, the second connecting part 2 is adapted to connect with the first connecting part 1 so that the radio frequency integrated circuit 6 and the first antenna module 7 are at least partially connected.

[0072] For details on the specific structure of the radio frequency transmission component, please refer to Implementation 1; it will not be repeated here.

[0073] The radio frequency integrated circuit 6 (RFIC) is an integrated circuit that can process radio frequency signals. It can amplify, modulate, demodulate, and filter radio frequency signals, and can generate radio frequency signals to be transmitted to the first antenna module 7, and can also receive radio frequency signals transmitted by the first antenna module 7.

[0074] The electronic device provided in this application can be a candybar or foldable smartphone, tablet, wearable device, IoT device, vehicle communication device, etc., and is not specifically limited. The electronic device has a housing, and the radio frequency integrated circuit 6 and the radio frequency transmission components can both be disposed within the accommodating space provided by the housing. The first antenna module 7 is also disposed in the housing, and is disposed at a first position in the housing. The first position in the housing can be the top or bottom edge, side edge, back panel, etc. of the housing, and is not specifically limited, as long as there is enough space to place the first antenna module 7.

[0075] A second aspect of this application provides an electronic device including a radio frequency integrated circuit (RF integrated circuit) 6, a housing, a first antenna module 7, and an RF transmission component. The first antenna module 7 is disposed at a first position in the housing. The RF transmission component is connected between the RF integrated circuit 6 and the first antenna module 7. The RF transmission component includes a first connecting part 1 and a second connecting part 2. The first connecting part 1 is used to connect the RF integrated circuit 6 and is connected to the first antenna module 7. The second connecting part 2 has a switchable non-connection state and a connection state with the first connecting part 1. In the non-connection state, the first connecting part 1 is used for testing multiple signals of the RF integrated circuit 6. In the connection state, the second connecting part 2 is adapted to the first connecting part 1 to enable at least partial conduction between the RF integrated circuit 6 and the first antenna module 7. This application achieves the switching between testing and actual use within the same component by allowing the first connecting part 1 and the second connecting part 2 of the RF transmission component to switch between the non-connection state and the connection state. Compared with setting multiple independent RF connectors, this allows for switching between testing and actual use within the same component, meeting the needs of signal testing, conduction calibration, and transmission, reducing space occupation, and simplifying the spatial layout within the electronic device. The application of this application solves the technical problem that the traditional method of setting up multiple RF connectors according to the number of RF signal paths to achieve RF signal conduction calibration, testing and transmission occupies a large space and is not conducive to the spatial layout of electronic devices.

[0076] In some embodiments, it further includes: a second antenna module (not shown in the figure), the second antenna module is disposed at a second position of the housing, the second antenna module and the first antenna module 7 are respectively used to process signals of different frequency bands; in the connected state, the second connection part 2 is adapted to the first connection part 1 to enable the radio frequency integrated circuit 6 to partially conduct the first antenna module 7 and partially conduct the second antenna module.

[0077] Specifically, to enable the electronic device to support a wider frequency band coverage during use, the electronic device of this application is also equipped with a second antenna module. The first antenna module 7 and the second antenna module are used to process signals of different frequency bands, thereby enabling the radio frequency transmission components to cover a wider frequency band range to meet signal transmission requirements. In some embodiments, for 5G (5th Generation Mobile Networks) communication, in electronic devices capable of 5G communication, the first antenna module 7 and the second antenna module can respectively support millimeter wave and Sub-6GHz (frequency below 6GHz) frequency bands to provide faster transmission rates and wider coverage. Furthermore, the setting of the second antenna module allows users to adjust the communication connection between the radio frequency integrated circuit 6 and the first antenna module 7 and the second antenna module according to their needs. In different application scenarios, it is possible to achieve only the communication between the radio frequency integrated circuit 6 and the first antenna module 7, or only the communication between the radio frequency integrated circuit 6 and the second antenna module, or to enable the radio frequency integrated circuit 6 to communicate with the first antenna module 7 and the second antenna module simultaneously, thereby achieving flexible data transmission switching.

[0078] The second antenna module is located at a second position on the housing. As described above, the first position on the housing can be the top or bottom edge, side edge, back panel, etc., and the second position can be located at a different position relative to the first position on the housing; the specific location is not limited. In some embodiments, the electronic device is a candybar phone or a foldable phone. The first position is the upper edge of the phone housing, and the second position is the lower part of the phone housing. The first antenna module 7 can be the antenna on the upper edge of the phone, and the second antenna module can be the antenna board located at the lower part of the phone. Considering that the user has a large contact area and a long contact time with the lower part of the phone during use, the first antenna module 7 can be configured as an antenna element capable of handling higher frequency signals, and the second antenna module can be configured as an antenna element capable of handling lower frequency signals. This reduces interference during the transmission of higher frequency signals and ensures the transmission quality of higher frequency signals.

[0079] In some embodiments, the first antenna module 7 may further include multiple first antenna elements processing different frequency bands to form different paths with the first connection part 1. When the second connection part 2 is connected to the first connection part 1, different paths are opened as needed to enable the radio frequency integrated circuit 6 to communicate with the corresponding required first antenna element. The second antenna module may also include multiple second antenna elements processing different frequency bands. Similar to the first antenna module 7, different paths are opened as needed to enable the radio frequency integrated circuit 6 to communicate with the corresponding required second antenna element. This increases the flexibility of signal transmission in electronic devices, allowing electronic devices to adaptively allocate signal transmission in different application scenarios, ensuring signal transmission quality in different frequency bands, and improving the user experience.

[0080] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0081] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A radio frequency transmission component, characterized in that, include: The first connecting part is used to connect to the radio frequency integrated circuit and is connected to the first antenna module; The second connection part has a switchable non-connection state and a connection state with the first connection part. In the non-connection state, the first connection part is used for testing multiple signals of the radio frequency integrated circuit. In the connection state, the second connection part is adapted to the first connection part to enable the radio frequency integrated circuit to at least partially conduct with the first antenna module.

2. The radio frequency transmission component according to claim 1, characterized in that, The first connection portion includes a plurality of first pins and at least one second pin. The plurality of first pins are used to connect to the radio frequency integrated circuit to form a plurality of first paths, and the at least one second pin is used to connect to the first antenna module to form at least one second path. In the non-connected state, the second connection part is not adapted to be connected with the first connection part, and both the first passage and the second passage are in a disconnected state; In the connected state, the first path and the second path are at least partially connected under the action of the second connection part so that the radio frequency integrated circuit can communicate with the first antenna module.

3. The radio frequency transmission component according to claim 2, characterized in that, The second connecting part is provided with a first connector; In the connected state, the first connector connects the first path and the second path to enable the radio frequency integrated circuit to communicate with the first antenna module.

4. The radio frequency transmission component according to claim 3, characterized in that, The first connector has a third path between itself and the second antenna module. In the connected state, the first path and the third path are at least partially connected under the action of the first connector to enable the radio frequency integrated circuit to communicate with the second antenna module. The first antenna module and the second antenna module are used to process signals in different frequency bands.

5. The radio frequency transmission component according to claim 4, characterized in that, The second connecting part is also provided with a second connector; In the connected state, the second connector connects the first connector and the second antenna module respectively, so that the radio frequency integrated circuit can communicate with the second antenna module.

6. The radio frequency transmission component according to claim 5, characterized in that, The second connecting portion has a first connecting area and a second connecting area, the first connector is disposed in the first connecting area, and the second connector is disposed in the second connecting area; In the connected state, a portion of the first path and the second path are connected in the first connection region, and a portion of the first path and the third path are connected in the second connection region.

7. The radio frequency transmission component according to claim 2, characterized in that, In the non-connected state, the multiple first pins of the first connection part can be connected to radio frequency probes, and the multiple test connectors corresponding to the radio frequency probes can be used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit. or, In the non-connected state, the multiple first pins of the first connection part can be connected to the adapter board, and the multiple test connectors corresponding to the adapter board can be used for testing and conducting calibration of multiple signals of the radio frequency integrated circuit.

8. The radio frequency transmission component according to claim 2, characterized in that, An antenna spring is provided on the second path, and the two ends of the antenna spring are respectively connected to the second pin and the first antenna module.

9. An electronic device, characterized in that, include: Radio frequency integrated circuits; case; A first antenna module is disposed at a first position of the housing; A radio frequency (RF) transmission component, connected between the RF integrated circuit and the first antenna module, wherein the RF transmission component includes: The first connecting part is used to connect to the radio frequency integrated circuit and is connected to the first antenna module; The second connection part has a switchable non-connection state and a connection state with the first connection part. In the non-connection state, the first connection part is used for testing multiple signals of the radio frequency integrated circuit. In the connection state, the second connection part is adapted to the first connection part to enable the radio frequency integrated circuit to at least partially conduct with the first antenna module.

10. The electronic device according to claim 9, characterized in that, Also includes: The second antenna module is disposed at a second position of the housing, and the second antenna module and the first antenna module are respectively used to process signals of different frequency bands; In the connected state, the second connection part is adapted to connect with the first connection part so that the radio frequency integrated circuit partially turns on the first antenna module and partially turns on the second antenna module.

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