Circuit boards, antenna devices and electronic equipment

Abstract

This utility model discloses a circuit board, an antenna device, and an electronic device. The circuit board includes a substrate, a first radiating arm, a second radiating arm, and a first ground layer. The substrate includes a first clearance area and a second clearance area spaced apart along a first direction. The first radiating arm is disposed in the first clearance area and has a first ground portion. The second radiating arm is disposed in the second clearance area and has a second ground portion. The first ground layer is disposed on the substrate and offset from the first and second clearance areas. At least a portion of the first ground layer is disposed between the first and second clearance areas to separate the first and second radiating arms. The first ground layer is grounded to both the first ground portion and the second ground portion. This circuit board can meet the isolation requirements of adjacent antennas, facilitating the integration of the radiating arms of the antenna device onto the circuit board, thereby contributing to the miniaturization of electronic devices.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and in particular to a circuit board, an antenna device, and an electronic device. Background Technology

[0002] Mobile phones, tablets, smart TVs, smart speakers, TV boxes, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment. Electronic devices typically have built-in antennas to achieve communication capabilities.

[0003] In related technologies, some antennas are mounted on circuit boards to save internal space in electronic devices, which is beneficial for miniaturization. Isolation between antennas is typically improved by increasing the distance between them. However, space on circuit boards is limited, making it difficult to increase antenna distance to improve isolation. This restricts the integration of antennas onto circuit boards and hinders the miniaturization of electronic devices. Utility Model Content

[0004] This disclosure provides a circuit board, an antenna device, and an electronic device. The circuit board can meet the isolation requirements of adjacent antennas, and facilitates the integration of the radiating arms of the antenna device onto the circuit board, thereby contributing to the miniaturization of the electronic device.

[0005] The technical solution is as follows:

[0006] According to a first aspect of the present disclosure, a circuit board is provided, including a substrate, a first radiating arm, a second radiating arm, and a first ground layer. The substrate includes a first clearance area and a second clearance area spaced apart along a first direction. The first radiating arm is disposed in the first clearance area and has a first ground portion. The second radiating arm is disposed in the second clearance area and has a second ground portion. The first ground layer is disposed on the substrate and offset from the first clearance area and the second clearance area. At least a portion of the first ground layer is disposed between the first clearance area and the second clearance area to separate the first radiating arm and the second radiating arm. The first ground layer is grounded to both the first ground portion and the second ground portion.

[0007] The technical solution of this disclosure will be further explained below:

[0008] In one embodiment, the substrate is polygonal.

[0009] The first clearance area is located at one corner of the substrate. And / or, the second clearance area is located at the other corner of the substrate.

[0010] In one embodiment, the second radiating arm includes a first arm body for operating in a first radiation frequency band and a second arm body for operating in a second radiation frequency band. The first arm body and the second arm body are electrically connected to a second grounding portion, and the first radiation frequency band and the second radiation frequency band are different.

[0011] In one embodiment, the circuit board includes a first conductive layer. The first conductive layer is disposed on a substrate and is used to form a first radiating arm, a second radiating arm, and a first ground layer.

[0012] In one embodiment, the substrate includes a first plate surface and a second plate surface spaced apart from the first plate surface along the thickness direction of the substrate. A first radiating arm, a second radiating arm, and a first ground layer are disposed on the first plate surface. The first and second radiating arms are capable of operating in a first radiation frequency band. The circuit board also includes a second ground layer and a first isolation vibrator operating in the first radiation frequency band. The second ground layer and the first isolation vibrator are disposed on the second plate surface, and the first isolation vibrator is grounded in conjunction with the second ground layer.

[0013] In one embodiment, the first radiating arm, the second radiating arm, and the first isolation oscillator are arranged sequentially along the edge of the substrate.

[0014] In one embodiment, the circuit board further includes a third radiating arm capable of operating in the first radiating frequency band. The third radiating arm is disposed on the second board surface and grounded in conjunction with the second ground layer. A first isolation vibrator is disposed between the third radiating arm and the second radiating arm.

[0015] In one embodiment, the second radiating arm includes a first arm body for operating in a first radiation frequency band and a second arm body for operating in a second radiation frequency band. The first arm body and the second arm body are electrically connected to the second connecting portion. The first radiation frequency band and the second radiation frequency band are different.

[0016] The third radiating arm includes a third arm body for operating in the first radiating frequency band and a fourth arm body for operating in the second radiating frequency band. The third arm body and the fourth arm body are respectively grounded and connected to the second grounding layer.

[0017] The circuit board also includes a second isolation element that operates in the second radiation frequency band. The second isolation element is disposed on the second board surface and is grounded in conjunction with the second grounding layer.

[0018] In one embodiment, the second radiation frequency band is higher than the first radiation frequency band. The fourth arm is disposed facing the second isolation vibrator and between the third arm and the first isolation vibrator. The third arm is disposed away from the first isolation vibrator.

[0019] In one embodiment, the circuit board includes a second conductive layer. The second conductive layer is disposed on a second board surface and is used to form a third radiating arm, a first isolating element, a second isolating element, and a second ground layer.

[0020] And / or, the third radiating arm, the first isolating vibrator, and the second isolating vibrator are spaced apart on the second plate surface along the second direction, the second direction intersecting the first direction.

[0021] And / or, the third radiating arm includes a third grounding portion connected to the second grounding layer, and the third arm body and the fourth arm body are respectively connected to the third grounding portion.

[0022] And / or, the circuit board includes a fourth grounding portion connected to the second ground layer, and a first isolation vibrator and a second isolation vibrator are respectively connected to the fourth grounding portion.

[0023] And / or, the second radiating arm includes a first power supply section, and the first arm body and the second arm body are respectively connected to the first power supply section.

[0024] And / or, the third radiating arm includes a second feed section, and the third arm body and the fourth arm body are respectively connected to the second feed section.

[0025] According to a second aspect of the present disclosure, an antenna device is also provided, including a radio frequency module and a circuit board as described in any of the above embodiments. The radio frequency module is disposed on the circuit board and is fed in cooperation with a first radiating arm and a second radiating arm, respectively.

[0026] The technical solution of this disclosure will be further explained below:

[0027] In one embodiment, the first radiating arm is a BT antenna. The second radiating arm is a WiFi antenna.

[0028] According to a third aspect of the present disclosure, an electronic device is also provided, including a housing assembly and an antenna device as described in any of the above embodiments, the antenna device being disposed on the housing assembly.

[0029] The technical solutions provided by the embodiments of this disclosure have at least the following beneficial effects:

[0030] This circuit board achieves a certain distance between the first and second radiating arms by placing a first radiating arm in a first clearance area and a second radiating arm in a second clearance area. Simultaneously, at least a portion of a first ground layer is disposed between the first and second clearance areas to further separate the first and second radiating arms. Furthermore, the first ground layer is grounded to both a first grounding portion and a second grounding portion, ensuring good isolation between the first and second radiating arms, reducing mutual interference, and improving the radiation performance of the antenna device. Compared to conventional technologies, this design reduces the spacing between adjacent radiating arms while maintaining their radiation performance. Thus, this circuit board meets the isolation requirements of adjacent antennas, facilitating the integration of the antenna device's radiating arms onto the circuit board, thereby contributing to the miniaturization of electronic devices.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0032] The accompanying drawings, which form part of this disclosure, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure.

[0033] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of an electronic device shown in one embodiment.

[0035] Figure 2 for Figure 1 The front view of the antenna device shown.

[0036] Figure 3 for Figure 2 The rear view of the antenna assembly shown.

[0037] Figure 4 for Figure 2 The diagram shows the isolation test between the first and second radiating arms.

[0038] Figure 5 for Figure 2 The diagram shows the isolation test between the first and third radiating arms.

[0039] Figure 6 for Figure 2 The diagram shows the isolation test between the second and third radiating arms.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10. Electronic device; 11. Housing assembly; 12. Antenna device; 100. Radio frequency module; 200. Circuit board; 210. Substrate; 211. First clearance area; 212. Second clearance area; 213. First board surface; 214. Second board surface; 220. First radiating arm; 221. First grounding part; 230. Second radiating arm; 231. Second grounding part; 232. First arm body; 233. Second arm body; 234. First feed part; 240. First grounding layer; 250. Second grounding layer; 260. First isolation vibrator; 270. Third radiating arm; 271. Third arm body; 272. Fourth arm body; 273. Third grounding part; 274. Second feed part; 280. Second isolation vibrator; 290. Fourth grounding part. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and do not limit the scope of protection of this disclosure.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0044] Mobile phones, tablets, smart TVs, smart speakers, TV boxes, and other electronic devices have become indispensable technological products in people's lives, studies, and entertainment, bringing them numerous conveniences and enjoyment. With the diversification of electronic device functions, there are now many types and brands available, offering consumers a wide range of choices. Simply improving the functional characteristics of electronic devices is no longer sufficient to meet people's demands.

[0045] With the development of communication technology, electronic devices are integrating more and more antenna frequency bands and having built-in antennas. Sufficient isolation is needed between adjacent antennas to maintain antenna performance, which requires electronic devices to become increasingly larger. However, among electronic devices with similar performance, those with better communication performance and a smaller size are more attractive to consumers.

[0046] In related technologies, some antennas are mounted on circuit boards to save internal space in electronic devices, which is beneficial for miniaturization. Isolation between antennas is typically improved by increasing the distance between them. However, space on circuit boards is limited, making it difficult to increase antenna distance to improve isolation. This restricts the integration of antennas onto circuit boards and hinders the miniaturization of electronic devices.

[0047] Based on this, the present disclosure provides a circuit board. This circuit board can meet the isolation requirements of adjacent antennas, and facilitates the integration of the radiating arms of the antenna device onto the circuit board, thereby contributing to the miniaturization of electronic devices.

[0048] To better understand the circuit board of this disclosure, it is illustrated by an electronic device using the circuit board.

[0049] like Figure 1 As shown, an electronic device 10 is provided, including a housing assembly 11 and an antenna device 12 as described in any of the above embodiments, wherein the antenna device 12 is disposed on the housing assembly 11.

[0050] like Figure 2 As shown, the antenna device 12 includes a radio frequency module 100 and a circuit board 200. The radio frequency module 100 is disposed on the circuit board 200 and is fed in conjunction with the first radiating arm 220 and the second radiating arm 230 respectively.

[0051] The circuit board 200 includes a substrate 210, a first radiating arm 220, a second radiating arm 230, and a first ground layer 240. The substrate 210 includes a first clearance area 211 and a second clearance area 212 spaced apart along a first direction. The first radiating arm 220 is disposed in the first clearance area 211 and has a first ground portion 221. The second radiating arm 230 is disposed in the second clearance area 212 and has a second ground portion 231. The first ground layer 240 is disposed on the substrate 210 and offset from the first clearance area 211 and the second clearance area 212. At least a portion of the first ground layer 240 is disposed between the first clearance area 211 and the second clearance area 212 to separate the first radiating arm 220 and the second radiating arm 230. The first ground layer 240 is grounded to both the first ground portion 221 and the second ground portion 231.

[0052] The circuit board 200 places the first radiating arm 220 in the first clearance area 211 and the second radiating arm 230 in the second clearance area 212, thus maintaining a certain distance between the two radiating arms. Simultaneously, a portion of the first ground layer 240 is positioned between the first clearance area 211 and the second clearance area 212 to separate the first radiating arm 220 and the second radiating arm 230. Furthermore, the first ground layer 240 is grounded to both the first grounding portion 221 and the second grounding portion 231, providing good isolation between the first radiating arm 220 and the second radiating arm 230, reducing mutual interference between them, and improving the radiation performance of the antenna device 12. Compared to conventional technologies, this method can reduce the spacing between adjacent radiating arms while maintaining their radiation performance. Thus, the circuit board 200 can meet the isolation requirements of adjacent antennas, making it easy to integrate the radiating arm of the antenna device 12 onto the circuit board 200, which is beneficial to the miniaturization of the electronic device 10.

[0053] This electronic device includes, but is not limited to, mobile phones, tablets, smart TVs, smart speakers, and TV boxes.

[0054] It should be noted that "at least a portion of the first grounding layer is disposed between the first clearance area and the second clearance area" includes disposing the entire first grounding layer between the first clearance area and the second clearance area, as well as disposing a portion of the first grounding layer between the first clearance area and the second clearance area.

[0055] like Figure 2 As shown, in one example, the first ground layer 240 covers most of the area of ​​the substrate 210, and the area not covered by the first ground layer 240 is used to form a first clearance area 211 and a second clearance area 212.

[0056] In some embodiments, the first radiating arm 220 is a BT antenna, and the second radiating arm is a WiFi antenna. Thus, the circuit board can integrate both a BT antenna and a WiFi antenna, with high isolation between them, reduced mutual interference, and improved antenna radiation efficiency, thereby providing users with a better communication experience.

[0057] In one example, based on the above embodiments, the electronic device is a TV box. Thus, this TV box has good BT antenna radiation performance and WiFi antenna radiation performance, resulting in good communication quality and an improved television viewing experience.

[0058] It should be noted that BT (Bluetooth) antennas are used for wireless transmission. Bluetooth antennas are mainly used for short-range wireless communication, supporting data transmission and audio streaming between devices.

[0059] Furthermore, WiFi antennas are a key component in wireless local area network (WLAN) communication systems, used to transmit and receive radio waves in the 2.4 GHz and / or 5 GHz frequency bands. The design and performance of WiFi antennas directly affect the coverage, transmission speed, and stability of the wireless network.

[0060] In some embodiments, the substrate is polygonal, including but not limited to triangles, quadrilaterals, pentagons, hexagons, etc., so that the circuit board can be flexibly arranged according to the internal space of the electronic device.

[0061] The first direction includes the side length direction of the substrate. For example... Figure 2 As shown, the first direction is the X-axis direction.

[0062] In some embodiments, the first clearance area is located at one of the corners of the substrate. This fully utilizes the corner of the substrate to create the first clearance area, making it easier to utilize irregular spaces to accommodate the first radiating arm, reducing the difficulty of circuit board layout, and minimizing the adverse effects of other electronic components on the first radiating arm.

[0063] In some embodiments, the second clearance area is located at another corner of the substrate. This fully utilizes the corner of the substrate to create the second clearance area, making it easier to utilize irregular spaces to accommodate the first radiating arm, reducing the difficulty of circuit board layout, and minimizing the adverse effects of other electronic components on the first radiating arm.

[0064] Combination Figure 2 It is known that the first clearance area 211 is located at one corner of the substrate 210, and the second clearance area 212 is located at the other corner of the substrate 210. In this way, the space of the circuit board 200 in the first direction can be fully utilized to arrange the first radiating arm 220 and the second radiating arm 230, so that the two have sufficient spacing, which is beneficial to ensuring their isolation.

[0065] like Figure 2 As shown, in some embodiments, the second radiating arm 230 includes a first arm body 232 for operating in a first radiation frequency band and a second arm body 233 for operating in a second radiation frequency band. The first arm body 232 and the second arm body 233 are electrically connected to a second grounding portion 231, and the first and second radiation frequency bands are different. Thus, the first arm body 232 and the second arm body 233 share the second grounding portion 231, facilitating a conductive connection between the second grounding portion 231 and the first grounding layer 240, thereby improving the radiation performance of the first arm body 232 and the second arm body 233.

[0066] In one embodiment, the second radiating arm is a WiFi antenna. The first radiating frequency band is 2400MHz to 2483.5MHz. The second radiating frequency band is 5150MHz to 5850MHz. That is, the second radiating arm can be used to transmit and receive radio waves in the 2.4 GHz and / or 5 GHz frequency bands.

[0067] In some embodiments, the circuit board includes a first conductive layer. The first conductive layer is disposed on a substrate and is used to form a first radiating arm, a second radiating arm, and a first ground layer. This facilitates the etching of the first radiating arm, the second radiating arm, and the first ground layer onto the first conductive layer using patterning techniques, reducing assembly steps and improving the production efficiency of the circuit board.

[0068] like Figure 2 as well as Figure 3 As shown, in some embodiments, the substrate 210 includes a first plate surface 213 and a second plate surface 214 spaced apart from the first plate surface 213 along the thickness direction of the substrate 210. A first radiating arm 220, a second radiating arm 230, and a first ground layer 240 are disposed on the first plate surface 213. The first radiating arm 220 and the second radiating arm 230 are capable of operating in a first radiation frequency band. The circuit board 200 also includes a second ground layer 250 and a first isolating vibrator 260 operating in the first radiation frequency band. The second ground layer 250 and the first isolating vibrator 260 are disposed on the second plate surface 214, and the first isolating vibrator 260 is grounded in conjunction with the second ground layer 250. Thus, by utilizing the grounding connection between the first isolating vibrator 260 and the second ground layer 250, the isolation between the first radiating arm 220 and the second radiating arm 230 when operating in the first radiation frequency band can be improved, mutual interference can be reduced, and the radiation efficiency of each radiating arm can be improved.

[0069] like Figure 2 as well as Figure 3 As shown, in some embodiments, the first radiating arm 220, the second radiating arm 230, and the first isolating element 260 are sequentially arranged along the edge of the substrate 210. This facilitates full utilization of the edge space of the substrate 210 to increase the spacing between the first radiating arm 220 and the second radiating arm 230, thereby achieving good isolation between them. Simultaneously, the first isolating element 260 further enhances the isolation between the first radiating arm 220 and the second radiating arm 230, reducing mutual interference and thus improving the radiation efficiency of each radiating arm.

[0070] like Figure 3As shown, in some embodiments, the circuit board 200 further includes a third radiating arm 270 capable of operating in the first radiation frequency band. The third radiating arm 270 is disposed on the second board surface 214 and grounded in conjunction with the second ground layer 250. A first isolating element 260 is disposed between the third radiating arm 270 and the second radiating arm 230. Thus, the first isolating element 260 can improve the isolation between the second radiating arm 230 and the third radiating arm 270, reduce mutual interference, and thereby improve the radiation efficiency of each radiating arm.

[0071] Furthermore, it is understandable that the third radiating arm 270 is disposed on the second plate surface 214, and the first radiating arm 220 and the second radiating arm 230 are disposed on the first plate surface 213, so as to make full use of the thickness space of the substrate 210 to increase the isolation between the third radiating arm 270 and the first radiating arm 220 and the second radiating arm 230, thereby improving the radiation efficiency of each radiating arm.

[0072] like Figure 2 as well as Figure 3 As shown, in some embodiments, the second radiating arm 230 includes a first arm body 232 for operating in a first radiation frequency band and a second arm body 233 for operating in a second radiation frequency band. The first arm body 232 and the second arm body 233 are electrically connected to the second grounding portion 231, respectively. The first radiation frequency band and the second radiation frequency band are different. The third radiating arm 270 includes a third arm body 271 for operating in the first radiation frequency band and a fourth arm body 272 for operating in the second radiation frequency band. The third arm body 271 and the fourth arm body 272 are grounded to the second grounding layer 250, respectively. The circuit board 200 also includes a second isolation vibrator 280 operating in the second radiation frequency band. The second isolation vibrator 280 is disposed on the second board surface 214 and grounded to the second grounding layer 250. Thus, the isolation between the first radiating arm 220 and the first arm body 232 and the third arm body 271 is improved by using the first isolation vibrator 260, thereby improving the radiation efficiency of each radiating arm in the first radiation frequency band. At the same time, the isolation between the second arm body 233 and the fourth arm body 272 is improved by using the second isolation oscillator 280, thereby improving the radiation efficiency of each radiating arm in the second radiation frequency band.

[0073] In some embodiments, the second radiation frequency band is higher than the first radiation frequency band. The fourth arm is disposed facing the second isolation vibrator and between the third arm and the first isolation vibrator. The third arm is disposed away from the first isolation vibrator.

[0074] In some embodiments, the circuit board includes a second conductive layer. The second conductive layer is disposed on a second board surface and is used to form a third radiating arm, a first isolating element, a second isolating element, and a second ground layer. This facilitates the etching of the third radiating arm, the first isolating element, the second isolating element, and the second ground layer onto the second conductive layer using patterning techniques, reducing assembly steps and improving the production efficiency of the circuit board.

[0075] like Figure 3 As shown, in some embodiments, the third radiating arm 270, the first isolating vibrator 260, and the second isolating vibrator 280 are spaced apart on the second plate surface 214 along a second direction, which intersects the first direction. This allows for full utilization of the space in the circuit board 200 along the second direction to position the third radiating arm 270, the first isolating vibrator 260, and the second isolating vibrator 280, ensuring the third radiating arm 270 is positioned away from the first radiating arm 220, thus reducing interference between them. Simultaneously, the first isolating vibrator 260 improves the isolation between the first radiating arm 220 and the second radiating arm 230 and the third radiating arm 270, thereby improving the radiation efficiency of each radiating arm. The first isolating vibrator 260 improves the isolation between the first arm body 232 and the third arm body 271, and the second isolating vibrator 280 improves the isolation between the second arm body 233 and the fourth arm body 272, further improving the radiation efficiency of each radiating arm.

[0076] The second direction intersects the first direction at an acute angle, an obtuse angle, or perpendicular to each other.

[0077] The first direction includes the side length direction of the substrate 210, and the second direction includes the other side length direction of the substrate 210. For example... Figure 1 As shown, the first direction is the X-axis direction. The second direction is the Y-axis direction.

[0078] like Figure 3 As shown, in some embodiments, the third radiating arm 270 includes a third grounding portion 273 that is grounded to the second grounding layer 250, and the third arm body 271 and the fourth arm body 272 are respectively connected to the third grounding portion 273. Thus, the third arm body 271 and the fourth arm body 272 share the third grounding portion 273, facilitating a conductive connection between the third grounding portion 273 and the second grounding layer 250, thereby improving the radiation performance of the third arm body 271 and the fourth arm body 272.

[0079] like Figure 3As shown, in some embodiments, the circuit board 200 includes a fourth ground portion 290 that is grounded to the second ground layer 250, and a first isolating element 260 and a second isolating element 280 are respectively connected to the fourth ground portion 290. Thus, the first isolating element 260 and the second isolating element 280 share the fourth ground portion 290, facilitating conductive connection between the fourth ground portion 290 and the second ground layer 250, thereby improving assembly efficiency.

[0080] See you later Figure 2 As shown, in some embodiments, the second radiating arm 230 includes a first power supply section 234, and the first arm body 232 and the second arm body 233 are respectively connected to the first power supply section 234. In this way, the first arm body 232 and the second arm body 233 share the first power supply section 234, which facilitates the connection between the first power supply section 234 and the power supply module, thereby improving assembly efficiency.

[0081] Optionally, the second arm 233 is fed through the first arm 232 and the first power supply section 234.

[0082] like Figure 3 As shown, in some embodiments, the third radiating arm 270 includes a second power supply section 274, and the third arm body 271 and the fourth arm body 272 are respectively connected to the second power supply section 274. In this way, the third arm body 271 and the fourth arm body 272 share the second power supply section 274, which facilitates the connection of the second power supply section 274 with the power supply module and improves assembly efficiency.

[0083] Optionally, the fourth arm 272 is fed through the third arm 271 coupled to the second power supply section 274.

[0084] Optionally, the second power supply unit is electrically connected to the power supply module via a microstrip line and a metal via.

[0085] The first radiating arm is a BT antenna. The second and third radiating arms are WiFi antennas. Thus, the technology of this application can improve the radiation performance of electronic devices in both the BT and WiFi bands, thereby enhancing the communication quality of the electronic devices.

[0086] Further integration Figures 4 to 6 As shown, where, Figure 4 for Figure 2 The diagram shows the isolation test between the first and second radiating arms. Figure 5 for Figure 2 The diagram shows the isolation test between the first and third radiating arms. Figure 6 for Figure 2The diagram shows the isolation test results between the second and third radiating arms. The first radiating arm operates in λ / 4 mode, radiating and receiving electromagnetic waves from 2400MHz to 2483.5MHz. The first arm body operates in λ / 4 mode, radiating and receiving electromagnetic waves from 2400MHz to 2483.5MHz. The second arm body operates in λ / 4 mode, radiating and receiving electromagnetic waves from 5150MHz to 5850MHz. The third arm body operates in λ / 4 mode, radiating and receiving electromagnetic waves from 2400MHz to 2483.5MHz. The fourth arm body operates in λ / 4 mode, radiating and receiving electromagnetic waves from 5150MHz to 5850MHz. The first isolating element isolates the 2.4GHz frequency band. The isolation principle is: the first isolating element operates in λ / 4 mode, responsible for coupling and absorbing electromagnetic waves from the surrounding 2.4GHz frequency band. The second isolating element isolates the 5GHz operating frequency band. Isolation principle: The second isolation oscillator operates in λ / 4 mode and is responsible for coupling and absorbing electromagnetic waves in the surrounding 5.1GHz to 5.8GHz frequency band.

[0087] Combination Figure 4 as well as Figure 6 As shown in the table below, the technical solution disclosed herein can reduce the mutual interference between multiple surrounding antennas, resulting in good isolation between each radiating arm.

[0088]

[0089] The table below shows the passive test data of the electronic device. It can be seen from the table that the radiation efficiency of the first radiating arm, which is a BT antenna, is greater than 30%, the radiation efficiency of the second radiating arm, which is a WiFi A antenna, is greater than 30%, and the radiation efficiency of the third radiating arm, which is a WiFi B antenna, is also greater than 30%. This enables the electronic device disclosed in this invention to have good Bluetooth communication quality and WiFi communication quality.

[0090]

[0091] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0092] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0093] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0094] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0095] It should be noted that when a component is referred to as "fixed to," "set on," "fixed to," or "mounted on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component. Furthermore, when a component is considered to be "fixed transmission connection" to another component, the two can be fixed in a detachable or non-detachable manner, as long as power transmission can be achieved. Methods such as socketing, snap-fitting, integral molding, and welding are feasible in conventional technologies and will not be elaborated upon here. When a component is perpendicular or approximately perpendicular to another component, it means that the ideal state is perpendicularity, but due to manufacturing and assembly factors, a certain degree of perpendicularity error may exist. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only and do not represent the only possible implementation.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above embodiments are merely illustrative of several implementation methods of this disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept of this disclosure, and these modifications and improvements all fall within the protection scope of this disclosure.

Claims

1. A circuit board, characterized in that, include: The substrate includes a first clearance area and a second clearance area spaced apart along a first direction; The first radial arm is located in the first clearance area, and the first radial arm is provided with a first grounding part; The second radial arm is located in the second clearance area, and the second radial arm is provided with a second grounding part; as well as A first grounding layer is disposed on the substrate and offset from the first clearance area and the second clearance area. At least a portion of the first grounding layer is disposed between the first clearance area and the second clearance area to separate the first radiating arm and the second radiating arm. The first grounding layer is grounded and connected to the first grounding portion and the second grounding portion respectively. The substrate further includes a first plate surface having a first clearance area and a second clearance area, and a second plate surface being spaced apart from the first plate surface along the thickness direction of the substrate. The first radiating arm, the second radiating arm, and the first ground layer are disposed on the first plate surface. The first radiating arm and the second radiating arm are capable of operating in the first radiating frequency band; the circuit board also includes a second grounding layer and a first isolation vibrator operating in the first radiating frequency band, the second grounding layer and the first isolation vibrator are disposed on the second board surface, and the first isolation vibrator is grounded in conjunction with the second grounding layer.

2. The circuit board according to claim 1, characterized in that, The substrate is polygonal in shape; The first clearance area is located at one corner of the substrate; and / or, the second clearance area is located at the other corner of the substrate.

3. The circuit board according to claim 1, characterized in that, The second radiating arm includes a first arm body for operating in a first radiating frequency band and a second arm body for operating in a second radiating frequency band. The first arm body and the second arm body are respectively electrically connected to the second grounding part. The first radiating frequency band and the second radiating frequency band are different.

4. The circuit board according to claim 1, characterized in that, The circuit board includes a first conductive layer disposed on the substrate for forming the first radiating arm, the second radiating arm, and the first ground layer.

5. The circuit board according to claim 1, characterized in that, The first radiating arm, the second radiating arm, and the first isolation oscillator are arranged sequentially along the edge of the substrate.

6. The circuit board according to claim 1, characterized in that, The circuit board also includes a third radiating arm capable of operating in the first radiating frequency band. The third radiating arm is disposed on the second board surface and grounded in conjunction with the second grounding layer. The first isolation vibrator is disposed between the third radiating arm and the second radiating arm.

7. The circuit board according to claim 6, characterized in that, The second radiating arm includes a first arm body for operating in the first radiating frequency band and a second arm body for operating in the second radiating frequency band. The first arm body and the second arm body are respectively electrically connected to the second grounding part. The first radiating frequency band and the second radiating frequency band are different. The third radiating arm includes a third arm body for operating in the first radiating frequency band and a fourth arm body for operating in the second radiating frequency band, wherein the third arm body and the fourth arm body are respectively grounded and cooperate with the second grounding layer. The circuit board also includes a second isolation vibrator operating in the second radiation frequency band. The second isolation vibrator is disposed on the second board surface and is grounded in conjunction with the second grounding layer.

8. The circuit board according to claim 7, characterized in that, The second radiation frequency band is higher than the first radiation frequency band. The fourth arm is arranged facing the second isolation vibrator and is located between the third arm and the first isolation vibrator. The third arm is arranged opposite to the first isolation vibrator.

9. The circuit board according to claim 7, characterized in that, The circuit board includes a second conductive layer disposed on the second board surface, which is used to form the third radiating arm, the first isolation vibrator, the second isolation vibrator, and the second grounding layer; And / or, the third radiating arm is disposed on the second plate surface at a distance from the first isolation vibrator and the second isolation vibrator along a second direction, the second direction intersecting the first direction; And / or, the third radiating arm includes a third grounding portion connected to the second grounding layer, and the third arm body and the fourth arm body are respectively connected to the third grounding portion; And / or, the circuit board includes a fourth grounding portion connected to the second ground layer, and the first isolation vibrator and the second isolation vibrator are respectively connected to the fourth grounding portion; And / or, the second radiating arm includes a first feed section, and the first arm body and the second arm body are respectively connected to the first feed section; And / or, the third radiating arm includes a second power supply section, and the third arm body and the fourth arm body are respectively connected to the second power supply section.

10. An antenna device, characterized in that, It includes a radio frequency module and a circuit board as described in any one of claims 1 to 9, wherein the radio frequency module is disposed on the circuit board and is fed in cooperation with the first radiating arm and the second radiating arm respectively.

11. The antenna device according to claim 10, characterized in that, The first radiating arm is a BT antenna; the second radiating arm is a WiFi antenna.

12. An electronic device, characterized in that, It includes a housing assembly and the antenna device as described in claim 10 or 11, the antenna device being disposed on the housing assembly.

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