PCB fully automatic gold finger bonding circuit board film application equipment

Abstract

This utility model belongs to the technical field of circuit board film application equipment, and discloses a fully automatic PCB gold finger film application equipment, including a frame. Feeding components are arranged on both sides inside the frame, and a positioning component and a vacuum stage are arranged between the feeding components inside the frame. This utility model is equipped with an unloading mechanism and a vacuum stage. When the left feeding component operates, it moves the circuit board to the outside of the positioning component. A drive component one then positions the circuit board by adsorbing it onto the top of the base plate. After positioning, it is transported onto a silicone plate, where a vacuum suction plate adsorbs and fixes the circuit board onto the silicone plate. The silicone plate is then moved to below the adhesive application mechanism for film application. After film application, a drive component two moves the circuit board to above the right feeding component for unloading, thus automating the gold finger film application process, improving work efficiency and reducing the workload of personnel.

Description

Technical Field

[0001] This utility model belongs to the technical field of circuit board film application equipment, specifically a fully automatic PCB gold finger application circuit board film application equipment. Background Technology

[0002] Gold fingers refer to printed circuit boards with gold fingers formed on the edge of the circuit board through a special process. They are composed of many golden conductive contacts and are connected to other electronic components on the circuit board through internal circuit traces to achieve signal transmission and electrical connection.

[0003] In the current technology, gold finger film application equipment is required when manufacturing circuit boards to apply film to the gold fingers on the circuit boards. However, the existing equipment requires manual assistance during use, which makes it impossible to automatically apply film to the gold fingers on the circuit boards. The operation is cumbersome and time-consuming, and it requires a lot of manpower, resulting in a heavy economic burden. This is not conducive to the needs of production and processing. Therefore, it is necessary to improve the equipment. Utility Model Content

[0004] To address the problems mentioned in the background art, this utility model provides a fully automatic PCB gold finger bonding circuit board film application device.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a fully automatic PCB gold finger bonding circuit board film application equipment, including a frame, feeding components are provided on both sides inside the frame, a positioning component and a vacuum stage are provided inside the frame between the feeding components, an unloading mechanism is provided on the inner wall of the frame above the positioning component and the vacuum stage, and an adhesive application mechanism is provided inside the frame behind the vacuum stage.

[0006] The loading and unloading mechanism includes a connecting frame, the outer side of which is connected to the inner wall of the frame. A drive assembly one and a drive assembly two are respectively provided on both sides of the inner cavity of the connecting frame. A cylinder is provided at the bottom of both drive assembly one and drive assembly two, and a magnetic suction plate is provided at the bottom of the cylinder.

[0007] The vacuum stage includes a slide rail, the bottom of which is connected to the inner wall of the frame. A vacuum suction plate is fitted on the outer surface of the slide rail, and a silicone plate is provided on the top of the vacuum suction plate. A movable component located below the vacuum suction plate is provided inside the frame, and the bottom of the vacuum suction plate is fitted onto the movable component.

[0008] Preferably, the feeding assembly includes a motor, the outer side of which is connected to the inner wall of the frame, and the motor is driven by a lead screw, which is threaded onto a support platform.

[0009] Preferably, the feeding assembly includes a guide frame, the outer side of which is connected to the inner wall of the frame, and the outer surface of which is movably connected to the inner wall of the support platform.

[0010] Preferably, there are two feeding components, which are located outside the positioning component and the vacuum stage, respectively.

[0011] Preferably, the positioning component includes a base plate, the bottom of which is connected to the inner wall of the frame, and a sliding groove is provided on the top of the base plate.

[0012] Preferably, a positioning block is provided on the top of the base plate, and a positioning plate is provided in the groove.

[0013] Preferably, the inner wall of the frame is provided with a pneumatic cylinder located below the base plate, and the outer side of the pneumatic cylinder is connected to the outer side of the positioning plate.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This utility model is equipped with a loading and unloading mechanism and a vacuum stage. When the left feeding component is running, it moves the circuit board to the outside of the positioning component. The first driving component picks up the circuit board and positions it on the top of the base plate. After positioning, it is transported to the silicone plate. Then, the vacuum suction plate picks up and fixes the circuit board on the silicone plate, and moves the silicone plate to the bottom of the adhesive application mechanism for film application. After the film application is completed, the second driving component moves the circuit board to the top of the right feeding component for unloading. This fully automates the gold finger film application process, improving work efficiency and reducing the workload of personnel. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the frame of this utility model;

[0018] Figure 3 This is a schematic diagram of the loading and unloading mechanism of this utility model;

[0019] Figure 4 This is a schematic diagram of the feeding assembly of this utility model;

[0020] Figure 5 This is a schematic diagram of the positioning component of this utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the vacuum stage of this utility model.

[0022] In the diagram: 1. Frame; 2. Feeding assembly; 201. Motor; 202. Lead screw; 203. Support platform; 204. Guide frame; 3. Loading and unloading mechanism; 301. Connecting frame; 302. Drive assembly one; 303. Drive assembly two; 304. Cylinder; 305. Magnetic suction plate; 4. Positioning assembly; 401. Base plate; 402. Positioning plate; 5. Vacuum table; 501. Slide rail; 502. Vacuum suction plate; 503. Moving assembly; 504. Silicone plate; 6. Adhesive application mechanism. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example 1

[0025] like Figures 1 to 6 As shown, this is the first embodiment of the utility model, which provides a fully automatic PCB gold finger bonding circuit board film application equipment, including a frame 1. Feeding components 2 are provided on both sides inside the frame 1. Positioning components 4 and vacuum stage 5 are provided inside the frame 1 between the feeding components 2. Loading and unloading mechanism 3 is provided on the inner wall of the frame 1 above the positioning components 4 and vacuum stage 5. Adhesive application mechanism 6 is provided inside the frame 1 behind the vacuum stage 5.

[0026] The loading and unloading mechanism 3 includes a connecting frame 301. The outer side of the connecting frame 301 is connected to the inner wall of the frame 1. The inner sides of the connecting frame 301 are respectively provided with a first drive assembly 302 and a second drive assembly 303. The bottom of the first drive assembly 302 and the second drive assembly 303 are both provided with a cylinder 304. The bottom of the cylinder 304 is provided with a magnetic suction plate 305.

[0027] The vacuum stage 5 includes a slide rail 501, the bottom of which is connected to the inner wall of the frame 1. A vacuum suction plate 502 is fitted on the outer surface of the slide rail 501, and a silicone plate 504 is provided on the top of the vacuum suction plate 502. A moving component 503 located below the vacuum suction plate 502 is provided inside the frame 1, and the bottom of the vacuum suction plate 502 is fitted onto the moving component 503.

[0028] The feeding components 2 on both sides are used for loading and unloading circuit boards. When the circuit board to be processed is conveyed to the outside of the positioning component 4 by the left feeding component 2, the drive component 302 is activated to move the cylinder 304 and the magnetic suction plate 305 above the feeding component 2. The cylinder 304 drives the magnetic suction plate 305 to descend, and the magnetic suction plate 305 picks up the circuit board from the feeding component 2, making it transported to the top of the positioning component 4 for positioning. Then, the drive component 302 transfers the positioned circuit board to the top of the silicone plate 504, and the vacuum suction plate 502 lifts it up. The circuit board is attached to the outside of the silicone plate 504 for fixation. Then, the moving component 503 moves the vacuum suction plate 502, the silicone plate 504 and the circuit board to the underside of the adhesive application mechanism 6 to apply film to the gold fingers of the fixed circuit board. After the film application is completed, the moving component 503 resets the circuit board. At the same time, the driving component 303 drives the cylinder 304 and the magnetic suction plate 305 to move the processed circuit board from the vacuum stage 5 to the right feeding component 2 for unloading. This fully automates the film application process of the circuit board, reducing operator involvement and lowering production costs.

[0029] Example 2

[0030] like Figure 2 and Figure 4 As shown, this embodiment includes the features of embodiment 1. The distinguishing technical feature is that the feeding assembly 2 includes a motor 201. The outer side of the motor 201 is connected to the inner wall of the frame 1. The motor 201 is driven by a lead screw 202. The lead screw 202 is threadedly connected to a support platform 203.

[0031] By starting the motor 201, the lead screw 202 is driven to rotate, which in turn drives the entire support platform 203 to move, thereby adjusting the position of the circuit board on the top of the support platform 203, which facilitates the magnetic plate 305 to adsorb and transfer the circuit board.

[0032] Among them, the feeding component 2 includes a guide frame 204, the outer side of the guide frame 204 is connected to the inner wall of the frame 1, and the outer surface of the guide frame 204 is movably connected to the inner wall of the support table 203;

[0033] When the platform 203 moves, it moves on the outer surface of the guide frame 204, thereby limiting the platform 203 through the guide frame 204 to prevent it from shifting position and from exceeding the designed stroke range.

[0034] There are two feeding components 2, which are located on the outside of the positioning component 4 and the vacuum stage 5, respectively.

[0035] By setting two feeding components 2 on the outside of the positioning component 4 and the vacuum stage 5, respectively for loading and unloading the circuit board, the circuit board can be fully automated during the gold finger film application process, preventing safety hazards during manual operation and improving work efficiency.

[0036] Example 3

[0037] like Figure 5 As shown, this embodiment includes the features of embodiment 1. The distinguishing technical feature is that the positioning component 4 includes a base plate 401, the bottom of which is connected to the inner wall of the frame 1, and a sliding groove is provided on the top of the base plate 401.

[0038] The operation of the drive component 302 causes the adsorption to move the circuit board to the top of the base plate 401, which facilitates the subsequent positioning of the circuit board and prevents positional displacement during film application.

[0039] The bottom plate 401 is provided with a positioning block at the top, and the sliding groove is provided with a positioning plate 402.

[0040] When the positioning plate 402 moves, it squeezes and causes the circuit board to fit against the positioning block, thereby limiting the circuit board on the base plate 401, which facilitates the positioning of the circuit board.

[0041] Among them, the inner wall of the frame 1 is provided with a pneumatic cylinder located below the base plate 401, and the outer side of the pneumatic cylinder is connected to the outer side of the positioning plate 402.

[0042] The drive component 302 moves the circuit board to the top of the base plate 401, and then the pneumatic cylinder is activated to move the positioning plate 402 in the slide groove. The positioning plate 402 pushes the circuit board to the outside of the positioning block, so that the circuit board is positioned by the positioning block and the positioning plate 402 to avoid positional displacement and facilitate subsequent film application.

[0043] Working principle and usage process of this utility model:

[0044] First, when applying a film to the gold fingers of the circuit board, the circuit board to be filmed is placed on the right-side support 203. The motor 201 is started, and the lead screw 202 moves the support 203 along the outer surface of the guide frame 204, moving the circuit board above the support 203 to the outside of the base plate 401. Then, the drive assembly 302 is activated, moving the magnetic suction plate 305 above the circuit board. The cylinder 304 then moves the magnetic suction plate 305 onto the circuit board, attracting it. The drive assembly 302 then resets, placing the circuit board on the base plate 401. The pneumatic cylinder moves the positioning plate 402 against the outside of the circuit board. The positioning block and the positioning plate 402 limit the positioning of the circuit board. The circuit board is positioned, and then the drive component 1 302 moves the positioned circuit board above the silicone plate 504. The vacuum suction plate 502 attaches the circuit board to the silicone plate 504 to prevent positional displacement. Then, the moving component 503 moves the silicone plate 504 and the circuit board to below the adhesive applicator 6. The adhesive applicator 6 applies a film to the gold fingers on the circuit board. After the gold fingers are applied, the silicone plate 504 and the circuit board are reset. The drive component 2 303 moves the magnetic suction plate 305 to move the circuit board from above the silicone plate 504 to the top of the right moving component 503, thus completing the automatic application of film to the gold fingers of the circuit board. This improves the efficiency of gold finger application and brings convenience to the operator.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A full-automatic gold finger circuit board film pasting equipment for PCB, comprising a rack (1), characterized in that: Feeding components (2) are provided on both sides inside the frame (1). A positioning component (4) and a vacuum table (5) are provided inside the frame (1) between the feeding components (2). A loading and unloading mechanism (3) is provided on the inner wall of the frame (1) above the positioning component (4) and the vacuum table (5). An adhesive applicator (6) is provided inside the frame (1) behind the vacuum table (5). The loading and unloading mechanism (3) includes a connecting frame (301), the outer side of which is connected to the inner wall of the frame (1), and a drive assembly one (302) and a drive assembly two (303) are respectively provided on both sides of the inner cavity of the connecting frame (301). A cylinder (304) is provided at the bottom of both the drive assembly one (302) and the drive assembly two (303), and a magnetic suction plate (305) is provided at the bottom of the cylinder (304). The vacuum stage (5) includes a slide rail (501), the bottom of which is connected to the inner wall of the frame (1). A vacuum suction plate (502) is fitted on the outer surface of the slide rail (501), and a silicone plate (504) is provided on the top of the vacuum suction plate (502). A moving component (503) located below the vacuum suction plate (502) is provided inside the frame (1), and the bottom of the vacuum suction plate (502) is fitted onto the moving component (503).

2. The PCB automatic finger circuit board film pasting equipment of claim 1, wherein: The feeding assembly (2) includes a motor (201), the outer side of which is connected to the inner wall of the frame (1), and the motor (201) is driven by a lead screw (202), which is threaded onto a support plate (203). 3.The full-automatic gold finger circuit board film pasting device according to claim 2, characterized in that: The feeding assembly (2) includes a guide frame (204), the outer side of which is connected to the inner wall of the frame (1), and the outer surface of the guide frame (204) is movably connected to the inner wall of the support platform (203).

4. The PCB automatic finger circuit board film pasting device of claim 1, wherein: There are two feeding components (2), which are located outside the positioning component (4) and the vacuum stage (5), respectively.

5. The PCB fully automatic gold finger bonding circuit board film application equipment according to claim 1, characterized in that: The positioning component (4) includes a base plate (401), the bottom of which is connected to the inner wall of the frame (1), and a sliding groove is provided on the top of the base plate (401).

6. The PCB fully automatic gold finger bonding circuit board film application equipment according to claim 5, characterized in that: A positioning block is provided on the top of the base plate (401), and a positioning plate (402) is provided in the groove.

7. The PCB fully automatic gold finger bonding circuit board film application equipment according to claim 6, characterized in that: The inner wall of the frame (1) is provided with a pneumatic cylinder located below the base plate (401), and the outer side of the pneumatic cylinder is connected to the outer side of the positioning plate (402).

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