Leakage-proof module for preventing short circuit between circuit and panel

Abstract

The utility model discloses a leakage-proof module for preventing short circuit between a circuit and a panel. The leakage-proof module comprises a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly and a switch assembly, a first groove is formed in the panel, a first hole site is formed in the outer surface of the panel, and the first hole site is communicated with the first groove; the power interface assembly and the panel are installed in a sealing fit mode, the power interface assembly comprises a circuit board, the circuit board is embedded in the first groove, an insulating spacer is arranged between the circuit board and the inner wall of the first groove in a clamped mode, and a power interface is formed in the circuit board and located in the first hole site. The circuit board is embedded in the first groove, the insulating spacer is clamped between the circuit board and the inner wall of the first groove in a matched mode, and the circuit on the surface of the circuit board is isolated and separated from the panel through the insulating spacer, so that the short circuit phenomenon between the circuit board and the panel of the power interface assembly is effectively avoided, and potential safety hazards are completely eradicated; and convenience is brought to use of the product.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, and in particular to a leak-proof module for preventing short circuits between the circuit and the panel. Background Technology

[0002] A liquid-cooled chassis is a computer case that utilizes liquid cooling technology. Compared to traditional air cooling, liquid cooling offers higher heat dissipation efficiency and lower noise levels, making it widely used in high-performance computers, gaming PCs, and workstations. The core of a liquid-cooled chassis is the liquid cooling system, which typically consists of a radiator, tubing, a pump, a reservoir, and coolant. The coolant circulates between the radiator and water block within the chassis via the pump, absorbing and carrying away heat from components such as the CPU and GPU, before dissipating the heat into the air through the radiator.

[0003] Current liquid-cooled chassis mainly consist of a chassis shell, a PCB motherboard, and a front panel. The PCB motherboard is located inside the chassis shell, and the front panel seals over the opening of the chassis shell. This front panel houses components such as power interface assemblies, first I / O interface assemblies, second I / O interface assemblies, and switching assemblies. These components typically require cables to connect to the PCB motherboard. In existing technology, this front panel is usually made of metal, and the circuit board of the power interface assembly is mounted on the front panel and in direct contact with it. This makes the circuit board prone to short circuits with the front panel, posing a significant safety hazard. Therefore, it is necessary to research a solution to address these issues. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main purpose is to provide a leak-proof module to prevent short circuits between the circuit and the panel, which can effectively solve the problem that the circuit board of the power interface component in the existing liquid-cooled chassis is prone to short circuits with the panel.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A leakage prevention module for preventing short circuits between the circuit and the panel includes a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly, and a switch assembly. The panel has a first recess, and its outer surface has a first hole communicating with the first recess. The power interface assembly is sealed to the panel and includes a circuit board embedded in the first recess, with an insulating gasket sandwiched between the circuit board and the inner wall of the first recess. A power interface is provided on the circuit board, located in the first hole, and a first cable is connected to the circuit board. The first I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The second I / O interface assembly is sealed to the panel and exposed on the outer surface of the panel. The switch assembly is sealed to the panel and exposed on the outer surface of the panel.

[0007] As a preferred embodiment, a limiting baffle is provided between the circuit board and the inner wall of the first groove to prevent the circuit board from retracting.

[0008] As a preferred embodiment, the insulating pad and the limiting baffle are located on both sides of the circuit board.

[0009] As a preferred embodiment, a cavity is formed between the circuit board and the inner wall of the first groove, and the cavity is filled with adhesive to seal the assembly gap between the power interface assembly and the panel.

[0010] As a preferred embodiment, the insulating gasket is made of an elastic material and fits tightly between the circuit board and the panel, so that the power interface assembly and the panel can be sealed without the need for glue in the cavity.

[0011] As a preferred embodiment, the insulating pad has a slot, through which the power interface extends into the first hole, and the insulating pad is tightly fitted to the periphery of the inner opening of the first hole.

[0012] As a preferred embodiment, there are multiple first holes arranged on the outer peripheral side of the panel. Correspondingly, the circuit board has multiple power interfaces, which are located in the corresponding first holes to provide multiple power connections.

[0013] As a preferred embodiment, the circuit board includes a circuit layer and a surface layer, which are stacked on top of each other, and the insulating pad is sandwiched between the circuit layer and the inner wall of the first groove.

[0014] As a preferred embodiment, the circuit board includes a circuit layer and two surface layers, with the circuit layer sandwiched between the two surface layers, and the insulating pad sandwiched between one of the surface layers and the inner wall of the first groove to better prevent short circuits.

[0015] As a preferred embodiment, the panel is recessed with a second groove and a third groove, the first I / O interface component and the second I / O interface component are respectively embedded in the second groove and the third groove and fixed and sealed by potting glue, and the panel is provided with a second hole, the switch component is installed in the second hole and fixed by tightening with a nut.

[0016] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0017] By embedding the circuit board in the first groove and sandwiching an insulating pad between the circuit board and the inner wall of the first groove, the circuit on the surface of the circuit board is isolated from the panel by the insulating pad, which effectively avoids short circuit between the circuit board and the panel of the power interface assembly, eliminates safety hazards, and brings convenience to the use of the product.

[0018] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a three-dimensional assembly diagram of a preferred embodiment of the present invention;

[0020] Figure 2 This is a three-dimensional assembly schematic diagram of a preferred embodiment of the present invention from another angle;

[0021] Figure 3 This is an exploded view of a preferred embodiment of the present invention;

[0022] Figure 4 This is an exploded view from another angle of a preferred embodiment of the present invention;

[0023] Figure 5 This is a cross-sectional view of a preferred embodiment of the present invention;

[0024] Figure 6 yes Figure 5 A magnified view of a portion of the image;

[0025] Figure 7 This is a three-dimensional schematic diagram of the preferred embodiment of the present invention in its usage state.

[0026] Figure 8 This is an exploded view of the preferred embodiment of this utility model in its usage state;

[0027] Figure 9 This is an enlarged schematic diagram of the power interface assembly in a preferred embodiment of the present invention;

[0028] Figure 10This is an enlarged schematic diagram of the power interface assembly from another angle in a preferred embodiment of the present invention;

[0029] Figure 11 This is an exploded view of the power interface assembly in a preferred embodiment of the present invention;

[0030] Figure 12 This is an exploded view of the power interface assembly from another angle in a preferred embodiment of the present invention;

[0031] Figure 13 This is an enlarged schematic diagram of the panel in a preferred embodiment of the present invention;

[0032] Figure 14 This is an enlarged schematic diagram of the circuit board in a preferred embodiment of the present invention;

[0033] Figure 15 This is an enlarged schematic diagram of another circuit board in a preferred embodiment of this utility model.

[0034] Explanation of reference numerals in the attached diagram:

[0035] 10. Panel 11. First Groove

[0036] 12. First hole position; 13. Second groove

[0037] 14. Third groove 15. Second hole

[0038] 20. Power interface assembly; 21. Circuit board

[0039] 211. Line layer; 212. Surface layer

[0040] 22. Insulating gasket 23. Power interface

[0041] 24. First cable 25. Limiting baffle

[0042] 201. Circuit; 202. Cavity

[0043] 203, Slot 30, First I / O Interface Component

[0044] 31. Second cable; 40. Second I / O interface assembly

[0045] 50. Switch assembly; 51. Third cable

[0046] 52. Nut 61. Sealing ring

[0047] 62. Chassis 63. PCB Motherboard

[0048] 64. Connector. Detailed Implementation

[0049] Please refer to Figures 1 to 15 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a panel 10, a power interface assembly 20, a first I / O interface assembly 30, a second I / O interface assembly 40, and a switch assembly 50.

[0050] The panel 10 has a first groove 11 inside, and a first hole 12 is formed on the outer surface of the panel 10, which communicates with the first groove 11. In this embodiment, the panel 10 is made entirely of metal; there are multiple first holes 12 arranged on the outer peripheral side of the panel 10; the panel 10 has a second groove 13 and a third groove 14 recessed inside, and a second hole 15 is formed on the panel 10. In addition, a sealing ring 61 is provided around the periphery of the panel 10 for sealing installation with the chassis shell 62.

[0051] The power interface assembly 20 is sealed and fitted to the panel 10. Specifically, the power interface assembly 20 includes a circuit board 21, which is embedded in a first groove 11, and an insulating gasket 22 is sandwiched between the circuit board 21 and the inner wall of the first groove 11. A power interface 23 is provided on the circuit board 21, which is located in a first hole 12. A first cable 24 is connected to the circuit board 21. In this embodiment, as... Figure 14 As shown, the circuit board 21 includes a circuit layer 211 and a surface layer 212. The circuit layer 211 has a circuit 201. The surface layer 212 and the circuit layer 211 are stacked on top of each other. The insulating pad 22 is sandwiched between the circuit layer 211 and the inner wall of the first groove 11. Of course, as... Figure 15As shown, the circuit board 21 may also include a wiring layer 211 and two surface layers 212. The wiring layer 211 is sandwiched between the two surface layers 212. The insulating gasket 22 is sandwiched between one of the surface layers 212 and the inner wall of the first groove 11 to better prevent short circuits. A limiting baffle 25 is sandwiched between the circuit board 21 and the inner wall of the first groove 11 to prevent the circuit board 21 from retracting. Furthermore, the insulating gasket 22 and the limiting baffle 25 are located on both sides of the circuit board 21. In addition, a cavity 202 is formed between the circuit board 21 and the inner wall of the first groove 11. The cavity 202 is filled with glue (not shown in the figure), which seals the assembly gap between the power interface assembly 20 and the panel 10 to achieve good leakage prevention performance. Furthermore, the insulating gasket 22 can be made of an elastic material. It fits tightly between the circuit board 21 and the panel 10, achieving a seal between the power interface assembly 20 and the panel 10 without the need for glue in the cavity 202. Additionally, the insulating gasket 22 has a slot 203 through which the power interface 23 extends into the first hole 12. The insulating gasket 22 fits tightly against the periphery of the inner opening of the first hole 12 for a better seal. Moreover, the circuit board 21 has multiple power interfaces 23, each located in a corresponding first hole 12, providing multiple power connections.

[0052] The first I / O interface assembly 30 is sealed and installed with the panel 10 and exposed on the outer surface of the panel 10. In this embodiment, the first I / O interface assembly 30 is embedded in the second groove 13 and fixed and sealed by potting adhesive. The first I / O interface assembly 30 has a second cable 31.

[0053] The second I / O interface assembly 40 is installed in a sealed fit with the panel 10 and protrudes from the outer surface of the panel 10. In this embodiment, the second I / O interface assembly is embedded in the third groove 14 and fixed and sealed by potting adhesive.

[0054] The switch assembly 50 is installed in a sealed fit with the panel 10 and protrudes from the outer surface of the panel. In this embodiment, the switch assembly 50 has a third cable 51, and the switch assembly 50 is inserted into the second hole 15 and tightened and secured by a nut 52.

[0055] The assembly process of this embodiment is described in detail below:

[0056] First, the switch assembly 50 is installed into the second hole 15 and tightened with the nut 52. Next, the first I / O interface assembly 30 is embedded in the second groove 13 and fixed and sealed with glue. Then, the second I / O interface assembly 40 is embedded in the third groove 14 and fixed and sealed with glue. Next, the power interface assembly 20 is embedded in the first groove 11 and fixed and sealed with glue. Finally, the sealing ring 61 is fixed to the periphery of the panel 10, thus completing the assembly of the module.

[0057] In use, first connect the plugs of the power interface assembly 20, the first I / O interface assembly 30, the second I / O interface assembly 40, and the switch assembly 50 to the corresponding interfaces of the PCB motherboard 63. Then, seal the panel 10 on the chassis 62 to isolate the internal space of the chassis 62 from the outside. Finally, inject coolant into the chassis 62 through the connector 64.

[0058] The key design feature of this invention is that by embedding the circuit board in the first groove and sandwiching an insulating pad between the circuit board and the inner wall of the first groove, the circuit on the surface of the circuit board is isolated from the panel by the insulating pad, which effectively prevents short circuits between the circuit board and the panel of the power interface assembly, eliminates safety hazards, and brings convenience to the use of the product.

[0059] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A leakage prevention module for preventing short circuits between the circuit and the panel, characterized in that: The device includes a panel, a power interface assembly, a first I / O interface assembly, a second I / O interface assembly, and a switch assembly. The panel has a first recess, and its outer surface has a first hole communicating with the first recess. The power interface assembly is sealed to the panel and includes a circuit board embedded in the first recess, with an insulating gasket sandwiched between the circuit board and the inner wall of the first recess. A power interface is located on the circuit board within the first hole, and a first cable is connected to the circuit board. The first I / O interface assembly is sealed to the panel and protrudes from the outer surface of the panel. The second I / O interface assembly is sealed to the panel and protrudes from the outer surface of the panel. The switch assembly is sealed to the panel and protrudes from the outer surface of the panel.

2. The leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: A limiting baffle is sandwiched between the circuit board and the inner wall of the first groove.

3. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 2, characterized in that: The insulating pad and the limiting baffle are located on both sides of the circuit board.

4. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: A cavity is formed between the circuit board and the inner wall of the first groove. The cavity is filled with glue, which seals the assembly gap between the power interface assembly and the panel.

5. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: The insulating pad is made of elastic material and is tightly attached between the circuit board and the panel.

6. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: The insulating pad has a slot, through which the power interface extends into the first hole, and the insulating pad is tightly fitted to the periphery of the inner opening of the first hole.

7. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: There are multiple first holes, which are arranged on the outer peripheral side of the panel. Correspondingly, the circuit board has multiple power interfaces, which are located in the corresponding first holes.

8. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: The circuit board includes a circuit layer and a surface layer, which are stacked on top of each other, and the insulating pad is sandwiched between the circuit layer and the inner wall of the first groove.

9. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: The circuit board includes a circuit layer and two surface layers, with the circuit layer sandwiched between the two surface layers, and an insulating pad sandwiched between one of the surface layers and the inner wall of the first groove.

10. A leakage prevention module for preventing short circuits between the circuit and the panel according to claim 1, characterized in that: The panel has a second groove and a third groove, and the first I / O interface component and the second I / O interface component are respectively embedded in the second groove and the third groove and fixed and sealed by potting glue. The panel also has a second hole, and the switch component is installed in the second hole and fixed by tightening the nut.

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