Diode rapid packaging processing equipment

Abstract

This utility model provides a dedicated equipment for rapid diode packaging, belonging to the technical field of packaging equipment. It addresses the problem that existing rapid diode packaging equipment typically requires manual cleaning of the packaged diodes after packaging before proceeding to the next packaging operation, impacting production efficiency. The equipment includes: a fixed support rod fixedly connected to the upper surface of the base; a drive motor fixedly mounted on the upper surface of the fixed support rod; a fixed base frame fixedly connected to the upper surface of the base; a fixed mold fixedly connected to the upper surface of the fixed base frame; a sliding mold slidably connected to the outside of the fixed support rod; and a dispensing component fixedly mounted on the upper surface of the sliding mold. This utility model optimizes the material output process and improves production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of packaging equipment technology, and more specifically, it relates to special equipment for rapid diode packaging. Background Technology

[0002] Diodes typically require dispensing encapsulation during the packaging process. Diode dispensing encapsulation involves precisely applying liquid encapsulation material around the diode chip or die using dispensing equipment, followed by curing to form a protective shell. Specialized equipment for rapid diode packaging is usually required during dispensing encapsulation to ensure packaging efficiency, accuracy, and consistency.

[0003] According to application number CN202323183068.1, a diode packaging device includes a mounting base and a diode. The mounting base has a clamping mechanism on its surface and inner wall. The clamping mechanism includes a hollow square block. The hollow square block is fixed to the left side of the mounting base, and its inner wall is threadedly connected to a screw. A piston square block is rotatably connected to the right side of the screw. This diode packaging device, through the clamping mechanism, allows rotation of the screw to move the piston square block closer to the diode. The piston square block compresses the air inside the hollow square block, and the air pushes the clamping block closer to the diode, thus clamping the diode. When the clamping force reaches a certain level, the air pressure inside the hollow square block pushes a disc block, preventing further increase in the air pressure inside the hollow square block and avoiding excessive clamping force on the diode.

[0004] Based on the above, existing diode rapid packaging equipment typically requires manual cleaning of the packaged diodes after packaging before the next packaging operation can be performed, which affects production efficiency. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model provides a dedicated equipment for rapid diode packaging, which solves the problem that existing rapid diode packaging equipment typically requires manual cleaning of the packaged diodes after packaging before proceeding to the next packaging operation, thus affecting production efficiency.

[0006] The purpose and effectiveness of this utility model's special equipment for rapid diode packaging are achieved through the following specific technical means:

[0007] A specialized equipment for rapid diode packaging includes a base, a fixed support, a drive motor, a fixed base frame, a fixed mold, a sliding mold, a dispensing component, an adjusting dispensing mechanism, and a discharge mechanism. The fixed support is fixedly connected to the upper surface of the base. The drive motor is fixedly mounted on the upper surface of the fixed support. The fixed base frame is fixedly connected to the upper surface of the base. The fixed mold is fixedly connected to the upper surface of the fixed base frame. The sliding mold is slidably connected to the outside of the fixed support. The dispensing component is fixedly mounted on the upper surface of the sliding mold. The adjusting dispensing mechanism is located on the upper surface of the base. The discharge mechanism is located on the outside of the fixed mold.

[0008] Furthermore, the adjusting dispensing mechanism includes: a threaded shaft and a connecting slider; the threaded shaft is fixedly connected to the outer side of the lower end of the drive motor; the connecting slider is fixedly connected to the outer side of the sliding mold, and the connecting slider is threadedly connected to the threaded shaft.

[0009] Furthermore, the adjusting dispensing mechanism also includes: a sealing groove, a sliding plate, a discharge column, a fixed column, and tension springs; multiple sealing grooves are provided, and all of the multiple sealing grooves are opened on the inner side of the fixed mold; the sliding plate is slidably connected to the inner side of the fixed base frame; multiple discharge columns are provided, and all of the multiple discharge columns are fixedly connected to the upper end face of the sliding plate; multiple fixed columns are provided, and all of the multiple fixed columns are fixedly connected to the upper end face of the sliding plate; multiple tension springs are provided, and the lower ends of the multiple tension springs are fixedly connected to the upper end face of the sliding plate, and the upper ends of the multiple tension springs are fixedly connected to the inner side of the fixed base frame.

[0010] Furthermore, the discharge mechanism includes: a discharge slider, a connecting column, a compression spring, and a discharge spring; the discharge slider is slidably connected to the inner side of the fixed mold; the connecting column is slidably connected to the inner side of the discharge slider; one end of the compression spring is fixedly connected to the inner side of the discharge slider, and the other end of the compression spring is fixedly connected to the outer side of the connecting column; one end of the discharge spring is fixedly connected to the outer side of the discharge slider, and the other end of the discharge spring is fixedly connected to the inner side of the fixed mold.

[0011] Furthermore, the discharge mechanism also includes: a chute, a hinge plate, a discharge plate, and a sliding shaft; there are two chutes, both of which are slidably connected to the outside of the fixed mold; there are two hinge plates, each hinged to the inside of one of the two chutes, and a torsion spring is provided at the hinge point between the hinge plate and the chute; the discharge plate is slidably connected to the upper end of the fixed mold; there are two sliding shafts, both of which are fixedly connected to the inner side of the lower end of the discharge plate, and the sliding shafts are slidably connected to the chute.

[0012] Furthermore, the discharge mechanism also includes: a connecting pulley, a transfer pulley, and a connecting rope; there are two connecting pulleys, both of which are rotatably connected to the upper end of the base; the transfer pulley is rotatably connected to the outside of the fixed upright; one end of the connecting rope is fixedly connected to the outside of the connecting column, and the other end of the connecting rope is fixedly connected to the outside of the sliding mold, and the connecting rope covers the outside of the connecting pulley and the transfer pulley.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] This invention achieves diode encapsulation through adjusting the dispensing mechanism. The diode to be encapsulated is placed on the ejector post. When the drive motor starts, it rotates the threaded shaft. The threaded shaft, through its threaded engagement with the connecting slider, drives the sliding mold to move towards the fixed mold, completing mold closing. During mold closing, the sliding mold presses down on the sliding plate via the fixed post, causing the ejector post to move downwards and feed the diode into the encapsulation groove. The dispensing component then encapsulates the diode. After encapsulation, the sliding mold slides upwards, and the ejector post resets under the action of the tension spring, ejecting the encapsulated diode from the encapsulation groove, thus improving work efficiency. This design improves efficiency and reduces labor intensity. The discharge mechanism enables the discharge of diodes. When the sliding mold slides upwards, the connecting rope pulls the connecting column, causing the discharge plate to slide and remove the ejected diodes from the fixed mold. Through the coordinated design of the slide groove and hinge plate, the discharge plate slides upwards first during the reset process, avoiding the removal of unencapsulated diodes from the fixed mold, thus reducing operational steps and improving production efficiency. This mechanism not only achieves automated dispensing and encapsulation of diodes but also optimizes the discharge process, improves work efficiency, reduces labor intensity, minimizes manual intervention, and enhances overall production efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of the present invention.

[0016] Figure 2 This is a schematic diagram of the threaded shaft of this utility model.

[0017] Figure 3 This is a schematic diagram of the structure of the sliding plate of this utility model.

[0018] Figure 4 This is a structural schematic diagram of the connecting pulley of this utility model.

[0019] Figure 5 This is a cross-sectional structural diagram of the fixed mold of this utility model.

[0020] Figure 6 This is a schematic diagram of the material discharge plate of this utility model.

[0021] Figure 7 This is a utility model Figure 1 A magnified structural diagram of part A in the middle.

[0022] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0023] 1. Base; 2. Fixed upright; 3. Drive motor; 301. Threaded shaft; 4. Fixed base frame; 5. Fixed mold; 501. Sealing groove; 502. Slide groove; 503. Hinge plate; 6. Sliding mold; 601. Connecting slider; 7. Dispensing component; 8. Sliding plate; 801. Discharge column; 802. Fixed column; 803. Tension spring; 9. Discharge slider; 901. Connecting column; 902. Compression spring; 10. Discharge spring; 11. Discharge plate; 1101. Sliding shaft; 12. Connecting pulley; 13. Adapter pulley; 14. Connecting rope. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples.

[0025] Example 1:

[0026] As attached Figures 1-3 As shown:

[0027] This utility model provides a special equipment for rapid diode packaging, including a base 1, a fixed pole 2, a drive motor 3, a fixed base frame 4, a fixed mold 5, a sliding mold 6, a dispensing component 7, an adjusting dispensing mechanism, and a discharge mechanism. The fixed pole 2 is fixedly connected to the upper end face of the base 1; the drive motor 3 is fixedly installed on the upper end face of the fixed pole 2; the fixed base frame 4 is fixedly connected to the upper end face of the base 1; the fixed mold 5 is fixedly connected to the upper end face of the fixed base frame 4; the sliding mold 6 is slidably connected to the outside of the fixed pole 2; the dispensing component 7 is fixedly installed on the upper end face of the sliding mold 6; the adjusting dispensing mechanism is located on the upper end face of the base 1; and the discharge mechanism is located on the outside of the fixed mold 5.

[0028] The dispensing mechanism includes: a threaded shaft 301, a sealing groove 501, a connecting slider 601, a sliding plate 8, a discharge column 801, a fixed column 802, and a tension spring 803. The threaded shaft 301 is fixedly connected to the outer side of the lower end of the drive motor 3. Multiple sealing grooves 501 are provided, and all of them are located inside the fixed mold 5. The connecting slider 601 is fixedly connected to the outer side of the sliding mold 6, and the connecting slider 601 is threadedly connected to the threaded shaft 301. The sliding plate 8 is slidably connected to the inner side of the fixed base frame 4. Multiple discharge columns 801 are provided, and all of them are fixedly connected to the upper end face of the sliding plate 8. Multiple fixed columns 802 are provided, and all of them are fixedly connected to the upper end face of the sliding plate 8. Multiple tension springs 803 are provided, and the lower ends of all of them are fixedly connected to the upper end face of the sliding plate 8, while the upper ends of all of them are fixedly connected to the inner side of the fixed base frame 4.

[0029] The specific usage and function of this embodiment are as follows: The diode to be encapsulated is placed on the discharge column 801. When the drive motor 3 starts, the drive motor 3 will drive the threaded shaft 301 to rotate. The rotation of the threaded shaft 301 will drive the sliding mold 6 to slide under the action of the threaded connection with the connecting slider 601, so that the sliding mold 6 and the fixed mold 5 are closed. When the mold is closed, the sliding mold 6 will press down the sliding plate 8 through the fixed column 802. At this time, the discharge column 801 moves downward, and the diode will enter the encapsulation groove 501. Then, the diode is encapsulated by the dispensing component 7. After the encapsulation is completed, when the sliding mold 6 slides upward, the discharge column 801 will slide upward under the action of the tension spring 803, and push out the encapsulated diode in the encapsulation groove 501.

[0030] Example 2:

[0031] Based on Example 1, such as Figures 4-7As shown, the discharge mechanism includes: a slide 502, a hinge plate 503, a discharge slider 9, a connecting column 901, a compression spring 902, a discharge spring 10, a discharge plate 11, a sliding shaft 1101, a connecting pulley 12, a transfer pulley 13, and a connecting rope 14; two slides 502 are provided, and both slides 502 are slidably connected to the outside of the fixed mold 5; two hinge plates 503 are provided, and the two hinge plates 503 are respectively hinged to the inside of the two slides 502, and a torsion spring is provided at the hinge point between the hinge plate 503 and the slide 502; the discharge slider 9 is slidably connected to the inside of the fixed mold 5; the connecting column 901 is slidably connected to the inside of the discharge slider 9; one end of the compression spring 902 is fixedly connected to the inside of the discharge slider 9, and the other end of the compression spring 902 is fixedly connected to the connecting column 901. The outer side of the connecting column 901; one end of the discharge spring 10 is fixedly connected to the outer side of the discharge slider 9, and the other end of the discharge spring 10 is fixedly connected to the inner side of the fixed mold 5; the discharge plate 11 is slidably connected to the upper end of the fixed mold 5; there are two sliding shafts 1101, both of which are fixedly connected to the inner side of the lower end of the discharge plate 11, and the sliding shafts 1101 are slidably connected to the slide groove 502; there are two connecting pulleys 12, both of which are rotatably connected to the upper end of the base 1; the adapter pulley 13 is rotatably connected to the outer side of the fixed column 2; one end of the connecting rope 14 is fixedly connected to the outer side of the connecting column 901, and the other end of the connecting rope 14 is fixedly connected to the outer side of the sliding mold 6, and the connecting rope 14 covers the outer side of the connecting pulley 12 and the adapter pulley 13.

[0032] The specific usage and function of this embodiment are as follows: After the encapsulation is completed, when the sliding mold 6 slides upward, the sliding mold 6 will pull the connecting post 901 through the connecting rope 14. After the sliding mold 6 slides upward a certain distance, the continued sliding of the sliding mold 6 will drive the ejector plate 11 to slide through the connecting rope 14 and the connecting post 901. The sliding of the ejector plate 11 will clear the ejected diode away from the fixed mold 5. Through the setting of the slide groove 502 and the hinge plate 503, when the ejector plate 11 is in the reset position, the ejector plate 11 will first slide upward under the action of the sliding shaft 1101 and the slide groove 502 sliding connection, and then reset, to prevent the ejector plate 11 from cleaning the unencapsulated diode on the upper surface of the fixed mold 5 when it resets.

[0033] The following points should be noted in this article:

[0034] 1. The accompanying drawings of the embodiments disclosed herein only relate to the structures involved in the embodiments disclosed herein; other structures can be referred to in general design.

[0035] 2. Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0036] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. Diode rapid packaging processing special equipment, including base (1), fixed vertical rod (2), drive motor (3), fixed chassis (4), fixed mold (5), sliding mold (6), point glue piece (7), adjust point glue mechanism and discharge mechanism; The fixed vertical rod (2) is fixedly connected to the upper end face of the base (1); The drive motor (3) is fixedly installed on the upper end face of the fixed vertical rod (2); Characterized in that: The fixed base frame (4) is fixedly connected to the upper end face of the base (1); the fixed mold (5) is fixedly connected to the upper end face of the fixed base frame (4); the sliding mold (6) is slidably connected to the outside of the fixed upright (2); the dispensing component (7) is fixedly installed on the upper end face of the sliding mold (6); the adjusting dispensing mechanism is set on the upper end face of the base (1); and the discharging mechanism is set on the outside of the fixed mold (5).

2. The dedicated equipment for rapid diode packaging as described in claim 1, characterized in that: The adjusting dispensing mechanism includes a threaded shaft (301) and a connecting slider (601); the threaded shaft (301) is fixedly connected to the outer side of the lower end of the drive motor (3); the connecting slider (601) is fixedly connected to the outer side of the sliding mold (6), and the connecting slider (601) is threadedly connected to the threaded shaft (301).

3. The dedicated equipment for rapid diode packaging as described in claim 2, characterized in that: The adjusting dispensing mechanism further includes: a sealing groove (501), a sliding plate (8), a discharge column (801), a fixed column (802), and a tension spring (803); multiple sealing grooves (501) are provided, and multiple sealing grooves (501) are opened on the inner side of the fixed mold (5); the sliding plate (8) is slidably connected to the inner side of the fixed base frame (4); multiple discharge columns (801) are provided, and multiple discharge columns (801) are fixedly connected to the upper end face of the sliding plate (8); multiple fixed columns (802) are provided, and multiple fixed columns (802) are fixedly connected to the upper end face of the sliding plate (8); multiple tension springs (803) are provided, and the lower end of multiple tension springs (803) is fixedly connected to the upper end face of the sliding plate (8), and the upper end of multiple tension springs (803) is fixedly connected to the inner side of the fixed base frame (4).

4. The dedicated equipment for rapid diode packaging as described in claim 1, characterized in that: The discharge mechanism includes: a discharge slider (9), a connecting column (901), a compression spring (902), and a discharge spring (10); the discharge slider (9) is slidably connected to the inner side of the fixed mold (5); the connecting column (901) is slidably connected to the inner side of the discharge slider (9); one end of the compression spring (902) is fixedly connected to the inner side of the discharge slider (9), and the other end of the compression spring (902) is fixedly connected to the outer side of the connecting column (901); one end of the discharge spring (10) is fixedly connected to the outer side of the discharge slider (9), and the other end of the discharge spring (10) is fixedly connected to the inner side of the fixed mold (5).

5. The dedicated equipment for rapid diode packaging as described in claim 4, characterized in that: The discharge mechanism further includes: a chute (502), a hinge plate (503), a discharge plate (11), and a sliding shaft (1101); there are two chutes (502), both of which are slidably connected to the outside of the fixed mold (5); there are two hinge plates (503), which are respectively hinged to the inside of the two chutes (502), and a torsion spring is provided at the hinge point between the hinge plate (503) and the chute (502); the discharge plate (11) is slidably connected to the upper end of the fixed mold (5); there are two sliding shafts (1101), both of which are fixedly connected to the inside of the lower end of the discharge plate (11), and the sliding shafts (1101) are slidably connected to the chute (502).

6. The dedicated equipment for rapid diode packaging as described in claim 5, characterized in that: The discharge mechanism further includes: a connecting pulley (12), a transfer pulley (13), and a connecting rope (14); there are two connecting pulleys (12), both of which are rotatably connected to the upper end of the base (1); the transfer pulley (13) is rotatably connected to the outside of the fixed upright (2); one end of the connecting rope (14) is fixedly connected to the outside of the connecting column (901), and the other end of the connecting rope (14) is fixedly connected to the outside of the sliding mold (6), and the connecting rope (14) covers the outside of the connecting pulley (12) and the transfer pulley (13).

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