A steel strip for holding packaged chip strips
By using an insulator to wrap the steel strip and elastic clips in the electroplating equipment for packaged chip strips, and setting conductive contact points only at the bottom of the support, the problem of high power loss during the electroplating process is solved, and high efficiency and energy saving of the electroplating process are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN AOLIN TECH CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-05-26
AI Technical Summary
In the current electroplating process of packaged chip strips, the conductive structure of the steel strip and spring clips results in high electroplating current and high energy consumption. Furthermore, a large amount of stripping is required after the material is cut, which leads to problems of high energy loss and high chemical consumption.
Multiple conductive supports are set at the lower end of the steel strip body. A second insulator is injection molded on the outside of the conductive supports, and a first insulator is set at the clamping end of the elastic clip. Conductive contact points are only set at the bottom of the supports. The conductive contact points are covered by the packaged chip strip to avoid the elastic clip and supports being tin-plated and to reduce the exposure of the conductive contact points.
While ensuring stable power supply, it reduces power loss during the electroplating process and the stripping operation after material feeding, thereby reducing power consumption and chemical usage.
Smart Images
Figure CN224290600U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of electroplating technology, specifically relating to a steel strip for holding packaged chip strips. Background Technology
[0002] The chip packaging process consists of wafer fabrication, wafer testing, chip packaging, and post-packaging testing. After molding, a series of operations are performed, such as post-mold curing, plating, trimming and forming, and printing. A typical packaging process is as follows: dicing, die mounting, bonding, molding, deflashing, plating, printing, trimming and forming, visual inspection, finished product testing, packaging, and shipping.
[0003] During the electroplating process of packaged chip strips, the strips need to be immersed in a solution for tin plating. To ensure stable tin plating, the strips need to be clamped and fixed onto a steel strip in the electroplating equipment. Existing technology typically involves installing a spring clip at the lower end of the steel strip. One end of the spring clip is attached to the steel strip, while the other end presses the packaged chip strip against a conductive support at the lower end of the steel strip to fix it in place. Electroplating is then performed on the packaged chip strip through the conductivity of the steel strip or spring clip.
[0004] Currently, the steel strip structures used in electroplating equipment are generally divided into the following three types:
[0005] 1. The conductive support at the lower edge of the spring clip and the steel strip is made entirely of metal. The electroplating equipment conducts electricity through the steel strip to the packaged chip strip. In this case, when the packaged chip strip is electroplated, both the lower end of the steel strip and the clamping end of the spring clip will be conductive, so both will be tin-plated. The large surface area of the tin-plated metal results in a large electroplating current and high energy consumption. Moreover, after the material is cut, there is a large amount of tin on the lower end of the steel strip and the clamping end of the spring clip, so a stripping process is required. This stripping process has a large current and voltage, resulting in high energy loss and a large consumption of stripping solution.
[0006] 2. The steel strip is made entirely of metal. The other end of the spring clip holds the packaged chip strip with insulating material. The electroplating equipment conducts electricity through the steel strip to the packaged chip strip. In this case, when the packaged chip strip is electroplated, the entire steel strip is conductive for electroplating. Therefore, the lower end of the steel strip will be tin-plated, resulting in a large electroplating current and high energy consumption. Moreover, after feeding, there will be tin on the lower end of the steel strip, so it is necessary to perform stripping treatment. This stripping current and voltage are very large, resulting in high energy loss and high consumption of stripping solution.
[0007] 3. The lower edge of the steel strip is made of insulating material, while the spring clips are made of metal. The electroplating equipment conducts electricity to the packaged chip strip through the spring clips. In this case, during electroplating of the packaged chip strip, the spring clips become conductive, and the clamping ends of the spring clips are tin-plated. The electroplating current is relatively small, and the energy consumption is relatively low. When the spring clips need to be stripped after cutting, the stripping current and voltage are also small, resulting in low energy loss and low consumption of stripping chemicals. However, the method of conducting electricity through the spring clips may have the problem of poor conductivity at the contact point between the steel strip and the spring clips, meaning that this method carries the risk of substandard electroplating quality.
[0008] In summary, all three existing steel strip structures have different defects. Utility Model Content
[0009] The purpose of this invention is to provide a steel strip for holding packaged chip strips, in order to solve the above-mentioned problems existing in the prior art.
[0010] To achieve the above objectives, the present invention adopts the following technical solution:
[0011] A steel strip for holding packaged chip strips includes a steel strip body and elastic clips. The lower end of the steel strip body has multiple conductive supports evenly distributed along its length. Each conductive support corresponds to an elastic clip. The upper end of the elastic clip is connected to the steel strip body above the conductive support. The lower end of the elastic clip is a clamping end that cooperates with the conductive support to clamp the packaged chip strip. The clamping end of the elastic clip is provided with a first insulator that has been injection molded. A second insulator is injection molded onto the conductive support. One side of the bottom of the conductive support is provided with a conductive contact point for conducting electricity to the packaged chip strip. The conductive contact point cooperates with the lower end of the first insulator to clamp the packaged chip strip. When the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact point.
[0012] As a preferred technical solution of this utility model, the conductive contact point is a conductive protrusion protruding from the second insulator. The end of the conductive protrusion is a conductive contact surface that contacts the surface of the packaged chip strip. When the conductive contact point abuts against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact surface.
[0013] As a preferred technical solution of this utility model, the conductive bracket is provided with a first insulator adjustment hole in the middle, the upper end of the elastic clip is connected to the back of the steel strip body, and the lower end of the first insulator passes through the first insulator adjustment hole and is inclined towards the conductive contact port. When the lower end of the first insulator cooperates with the conductive contact point to clamp the packaged chip strip, the lower end of the first insulator contacts the surface of the packaged chip strip.
[0014] As a preferred technical solution of this utility model, the elastic clip includes a torsion spring and a first insulator as the clamping end. One end of the torsion spring is connected to the back of the steel strip body, and the upper end of the first insulator is connected to the other end of the steel strip body.
[0015] As a preferred technical solution of this utility model, the elastic clip further includes a connector, which is vertically connected to the back of the steel strip body, and one end of the torsion spring is connected to the end of the connector away from the steel strip body.
[0016] As a preferred technical solution of this utility model, the other end of the connector is provided with a rotating shaft, and the torsion spring is rotatably connected to the rotating shaft.
[0017] As a preferred technical solution of this utility model, a limiting ring is provided at the upper end of the first insulator, and the limiting ring is sleeved on the outside of the rotating shaft.
[0018] As a preferred technical solution of this utility model, both the first insulator and the second insulator are made of corrosion-resistant and non-conductive materials.
[0019] Beneficial effects: The elastic clip of this invention has a first insulator molded on its clamping end, allowing the elastic clip to hold the packaged chip strip using the first insulator, thus preventing the elastic clip from being tinned during electroplating. The conductive support is molded with a second insulator, which encapsulates the conductive support and prevents it from being electroplated. Only one conductive contact point is provided on the bottom side of the conductive support, without affecting the electroplating equipment's ability to conduct electricity to the packaged chip strip through the steel strip body. This ensures conductivity to the packaged chip strip while reducing the exposure of metal on the conductive support. The conductive contact point engages with the lower end of the first insulator to clamp the packaged chip strip, ensuring the stability of the packaged chip strip while utilizing the coverage of the packaged chip strip... By covering the conductive contact points, only a very small number of conductive contact points are electroplated, or even none at all. When some conductive contact points are not used to clamp the packaged chip strip, and the conductive contact points abut against the lower end of the first insulator, the lower end of the first insulator covers the conductive contact points, which again ensures that only a very small number of conductive contact points are electroplated, or even none at all. In this way, when electroplating is performed in the electroplating equipment, tin plating on the conductive support can be avoided as much as possible while ensuring stable power supply. This minimizes or avoids the loss of electrical energy during the electroplating of the clamping steel strip, and also minimizes or avoids the operation of removing the plating after unloading. Attached Figure Description
[0020] Figure 1 This is a front perspective view of the steel strip clamped in Embodiment 1 of this utility model;
[0021] Figure 2 This is a perspective view of the back of the steel strip clamped in Embodiment 1 of this utility model;
[0022] Figure 3 This is a front perspective view of the steel strip clamped in Embodiment 2 of this utility model;
[0023] Figure 4 This is a perspective view of the back of the steel strip being clamped in Embodiment 2 of this utility model;
[0024] Figure 5 This is a front perspective view of another assembly configuration in Embodiment 1 of this utility model;
[0025] Figure 6 This is a rear perspective view of another assembly configuration in Embodiment 1 of this utility model.
[0026] In the figure: 1-steel strip body; 101-conductive support; 1011-conductive protrusion; 102-second insulator; 2-elastic clip; 201-first insulator; 202-torsion spring; 203-connector; 204-rotating shaft. Detailed Implementation
[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the present utility model will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is used to help understand this utility model, but does not constitute a limitation on this utility model.
[0028] Example 1:
[0029] like Figure 1 and Figure 2As shown, this embodiment provides a steel strip for holding packaged chip strips, including a steel strip body 1 and elastic clips 2. The lower end of the steel strip body 1 is provided with multiple conductive supports 101 evenly distributed along its length. Each conductive support 101 corresponds to an elastic clip 2. The upper end of the elastic clip 2 is connected to the steel strip body 1 above the conductive support 101, and the lower end of the elastic clip 2 is the clamping end that cooperates with the conductive support 101 to clamp the packaged chip strip. The packaged chip strip is clamped onto the multiple conductive supports 101 by the multiple elastic clips 2, thereby achieving clamping of the packaged chip strip at the lower end of the steel strip body 1. The clamping end of the elastic clip 2 is provided with an injection-molded first insulator 201, so that the elastic clip 2 uses the first insulator 201 to clamp the packaged chip strip, thereby preventing the elastic clip 2 from being tin-plated during electroplating. A second insulator 102 is injection-molded onto the conductive support 101, and the second insulator 102 wraps around the conductive support 101 to prevent it from being electroplated. One side of the bottom of the conductive support 101 is provided with conductive contact points 1011 for conducting electricity to the packaged chip strip. This does not affect the electroplating equipment's conduction of electricity to the packaged chip strip through the steel strip body 1. While ensuring the conductivity of the packaged chip strip, it reduces the exposure of metal on the conductive support 101. The conductive contact points 1011 cooperate with the lower end of the first insulator 201 to clamp the packaged chip strip. This ensures the stability of the packaged chip strip while the packaged chip strip covers the conductive contact points 1011 it contacts. As a result, only a very small number of conductive contact points 1011 are electroplated, or even none of them are electroplated. When some conductive contact points 1011 are not used to clamp the packaged chip strip, and the conductive contact points 1011 abut against the lower end of the first insulator 201, the lower end of the first insulator 201 covers the conductive contact points 1011. Similarly, only a very small number of conductive contact points 1011 are electroplated, or even none of them are electroplated.
[0030] The elastic clip 2 of this invention has a first insulator 201 injection-molded on its clamping end. This allows the elastic clip 2 to clamp the packaged chip strip using the first insulator 201, thus preventing the elastic clip 2 from being tin-plated during electroplating. The conductive support 101 has a second insulator 102 injection-molded on its exterior. The second insulator 102 encapsulates the conductive support 101, preventing it from being electroplated. Only one conductive contact point 1011 is provided on the bottom side of the conductive support 101, without affecting the electroplating equipment's conduction of the packaged chip strip through the steel strip body 1. This ensures conductivity for the packaged chip strip while reducing the exposure of metal on the conductive support 101. The conductive contact point 1011 engages with the lower end of the first insulator 201 to clamp the packaged chip strip, ensuring the stability of the packaged chip strip while simultaneously covering it. The conductive contact points 1011 are in contact, so that only a very small number of conductive contact points 1011 are electroplated, or even none of them are electroplated. When some conductive contact points 1011 are not used to clamp the packaged chip strip, when the conductive contact points 1011 abut against the lower end of the first insulator 201, the lower end of the first insulator 201 covers the conductive contact points 1011, which also ensures that only a very small number of conductive contact points 1011 are electroplated, or even none of them are electroplated. In this way, when electroplating is performed in the electroplating equipment, tin plating on the conductive support 101 can be avoided as much as possible while ensuring stable power supply. This minimizes or avoids the loss of electrical energy during the electroplating of the clamping steel strip, and also minimizes or avoids the operation of removing the plating after unloading.
[0031] As a preferred embodiment of this invention, it should be further explained that the conductive contact point 1011 is a conductive protrusion protruding from the second insulator 102. The end of the conductive protrusion is a conductive contact surface that contacts the surface of the packaged chip strip. In this way, the conductive contact point 1011 can stably conduct electricity to the packaged chip strip by protruding slightly from the second insulator 102. Moreover, the packaged chip strip can maximize the coverage of the conductive contact point 1011. When the conductive contact point 1011 abuts against the lower end of the first insulator 201, the lower end of the first insulator 201 covers the conductive contact surface, so that only a very small number of conductive contact points 1011 are electroplated, or even the conductive contact points 1011 are not electroplated at all.
[0032] As a preferred embodiment of this invention, it should be further explained that the conductive support 101 is provided with a first insulator adjustment hole in the middle, which is the same as the prior art. The upper end of the elastic clip 2 is connected to the back of the steel strip body 1 to ensure the stability of the elastic clip 2. The lower end of the first insulator 201 extends to the front of the steel strip body 1 after passing through the first insulator adjustment hole. After passing through the front of the steel strip body 1, it is inclined towards the conductive contact port. When the lower end of the first insulator 201 cooperates with the conductive contact point 1011 to clamp the packaged chip strip, the lower end of the first insulator 201 contacts the surface of the packaged chip strip, thereby ensuring the best clamping effect.
[0033] As a preferred embodiment of this invention, it should be further explained that the elastic clip 2 includes a torsion spring 202 and a first insulator 201 as the clamping end. One end of the torsion spring 202 is connected to the back side of the steel strip body 1. This connection can be either direct or achieved through other components. Figure 1 and Figure 2 As shown, the connection here can be a fixed connection or a snap-fit connection that is easy to disassemble. There are no specific restrictions, as long as the stability of one end of the torsion spring 202 is guaranteed. The upper end of the first insulator 201 is connected to the other end of the steel strip body 1. The connection here can be a fixed connection achieved directly through the injection molding of the first insulator 201, or the first insulator 201 can be a separate entity. The upper end of the first insulator 201 is fixedly connected to or pressed against the other end of the steel strip body 1 to ensure that the first insulator 201 can be subjected to the spring force of the torsion spring 202, so that it can cooperate with the second insulator 102 to clamp the packaged chip strip in a natural state.
[0034] It should be noted here that, depending on the changes in torsion spring 202 and the installation method, the overall installation structure can be adjusted slightly, such as... Figure 5 and Figure 6 As shown, this is another assembly configuration in this embodiment.
[0035] As a preferred embodiment of this invention, it should be further explained that the elastic clip 2 also includes a connector 203. The connector 203 is vertically connected to the back of the steel strip body 1. Here, the connector 203 and the back of the steel strip body 1 can be fixedly connected or snap-fitted, without specific limitations. One end of the torsion spring 202 is connected to the end of the connector 203 away from the steel strip body 1. When the connector 203 is snap-fitted to the steel strip body 1, a strip hole can be provided on the steel strip body 1. A snap-fit plate is vertically provided at the end of the connector 203. After the snap-fit plate passes through the strip hole, it fits against the front surface of the steel strip body 1. Figure 1 and Figure 2 As shown, the stability of the connector 203 can be ensured by the action of the torsion spring 202 and the first insulator 201.
[0036] It should be noted that the preferred option, such as... Figure 3 As shown, a plug hole can be provided at one end of the connector 203, and one end of the torsion spring 202 can be directly plugged into the plug hole. The stability of the torsion spring 202 can be guaranteed by the cooperation between the first insulator 201 and the second insulator 102 at the other end of the torsion spring 202.
[0037] As a preferred embodiment of this example, it should be further noted that both the first insulator 201 and the second insulator 102 are made of corrosion-resistant and non-conductive materials. In this example, corrosion-resistant plastic is preferred to ensure that the first insulator 201 and the second insulator 102 are not easily corroded or damaged by electroplating chemicals after long-term use. At the same time, the corrosion-resistant and non-conductive materials also have a certain strength to ensure that they can be properly clamped and packaged as chip strips.
[0038] Example 2:
[0039] like Figure 3 and Figure 4 As shown, this embodiment is a further improvement based on Embodiment 1. The specific differences between this embodiment and Embodiment 1 are as follows:
[0040] As a preferred embodiment of this utility model, it should be further noted that the other end of the connector 203 is provided with a rotating shaft 204, as shown below. Figure 4 As shown, the torsion spring 202 is rotatably connected to the rotating shaft 204. In this way, one end of the torsion spring 202 no longer needs to be directly connected to the connector 203, but only one end of the torsion spring 202 needs to abut against the connector 203, which makes the assembly of the structure easier.
[0041] As a preferred embodiment of this invention, it should be further explained that the first insulator 201 is an injection-molded independent unit and is detachably connected to the torsion spring 202. A limiting ring is provided at the upper end of the first insulator 201, and the limiting ring is sleeved on the outside of the rotating shaft 204. This can ensure the stability of the first insulator 201. At the same time, by using the other end of the torsion spring 202 to abut against the first insulator 201, the first insulator 201 can cooperate with the second insulator 102 to clamp the packaged chip strip under the action of the torsion spring 202.
[0042] Example 3:
[0043] This embodiment is a further improvement based on Embodiment 1 or Embodiment 2. The specific differences between this embodiment and Embodiment 1 or Embodiment 2 are as follows:
[0044] As a preferred embodiment of this utility model, it should be further explained that the side of the first insulator 201 that holds the packaged chip strip is a flexible surface that can completely cover the end of the conductive protrusion 1011. In this way, when the first insulator 201 and the second insulator 102 cooperate to clamp the packaged chip strip, the flexible surface can be appropriately deformed, thereby better covering the entire conductive protrusion 1011 and minimizing the possibility of the conductive protrusion 1011 being tinned.
[0045] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. A steel band for clamping encapsulated chip strip, comprising a steel band body (1) and elastic clamps (2), the lower end of the steel band body (1) is provided with a plurality of conductive supports (101) uniformly distributed along the length direction thereof, each of the conductive supports (101) is correspondingly provided with an elastic clamp (2), the upper end of the elastic clamp (2) is connected to the steel band body (1) above the conductive support (101), and the lower end of the elastic clamp (2) is a clamping end for clamping the encapsulated chip strip in cooperation with the conductive support (101), characterized in that, The clamping end of the elastic clip (2) is provided with a first insulator (201) injection molded on it, and the conductive bracket (101) is provided with a second insulator (102) injection molded on it. One side of the bottom of the conductive bracket (101) is provided with a conductive contact point (1011) for conducting electricity to the packaged chip strip. The conductive contact point (1011) cooperates with the lower end of the first insulator (201) to clamp the packaged chip strip. When the conductive contact point (1011) abuts against the lower end of the first insulator (201), the lower end of the first insulator (201) covers the conductive contact point (1011).
2. A chip encapsulation strip clamping steel band according to claim 1, characterized in that, The conductive contact point (1011) is a conductive protrusion protruding from the second insulator (102). The end of the conductive protrusion is a conductive contact surface that contacts the surface of the packaged chip strip. When the conductive contact point (1011) abuts against the lower end of the first insulator (201), the lower end of the first insulator (201) covers the conductive contact surface.
3. A chip encapsulation strip clamping steel band according to claim 1 or 2, characterized in that The conductive support (101) is provided with a first insulator adjustment hole in the middle. The upper end of the elastic clip (2) is connected to the back of the steel strip body (1). The lower end of the first insulator (201) passes through the first insulator adjustment hole and is inclined towards the conductive contact port. When the lower end of the first insulator (201) cooperates with the conductive contact point (1011) to clamp the packaged chip strip, the lower end of the first insulator (201) contacts the surface of the packaged chip strip.
4. The encapsulated chip ribbon clamp steel tape of claim 3, wherein, The elastic clip (2) includes a torsion spring (202) and a first insulator (201) as the clamping end. One end of the torsion spring (202) is connected to the back of the steel strip body (1), and the upper end of the first insulator (201) is connected to the other end of the steel strip body (1).
5. A chip encapsulation strip holding steel band according to claim 4, characterized in that The elastic clip (2) also includes a connector (203), which is vertically connected to the back of the steel strip body (1), and one end of the torsion spring (202) is connected to the end of the connector (203) away from the steel strip body (1).
6. The steel strip for holding packaged chip strips according to claim 5, characterized in that, The other end of the connector (203) is provided with a rotating shaft (204), and the torsion spring (202) is rotatably connected to the rotating shaft (204).
7. The steel strip for holding packaged chip strips according to claim 6, characterized in that, A limiting ring is provided at the upper end of the first insulator (201), and the limiting ring is sleeved on the outside of the rotating shaft (204).
8. A steel strip for holding packaged chip strips according to claim 1, 2, or 7, characterized in that, Both the first insulator (201) and the second insulator (102) are made of corrosion-resistant, non-conductive material.