An ultrasonic probe

Abstract

The utility model discloses an ultrasonic probe, include: shell, transducer is arranged in the shell, wherein, the transducer has lens layer, matching layer, piezoelectric layer, backing layer and flexible electronic circuit board, the part of opposite of backing layer side surface of flexible electronic circuit board with backing layer has the openwork structure, heat conduction component is arranged in the shell, wherein, heat conduction component passes through the openwork structure with the heat conduction connection of backing layer side surface, and is used to transfer heat to the shell, the utility model provides an ultrasonic probe, and the heat flow path of heat dissipation established in the ultrasonic probe is piezoelectric layer back backing layer heat conduction component shell environment, make the side surface of backing layer and heat conduction component direct heat conduction connection, effectively improved the heat conduction efficiency of backing layer to heat conduction component direction, effectively improved the heat dissipation capacity of ultrasonic probe.

Description

Technical Field

[0001] This utility model relates to the field of ultrasonic equipment technology, and in particular to an ultrasonic probe. Background Technology

[0002] During the use of an ultrasonic probe, the temperature of the ultrasonic transducer will rise, affecting the performance of the ultrasonic probe. In order to reduce the impact on the performance of the ultrasonic probe, it is necessary to dissipate heat from the ultrasonic transducer so that at least some of the heat from the ultrasonic transducer can be conducted to the outer shell of the ultrasonic probe and dissipated into the external environment.

[0003] like Figure 1 As shown, the current ultrasonic probe includes an ultrasonic transducer, a heat-conducting block 106, and a housing 107. The ultrasonic transducer includes a lens layer 101, a matching layer 102, a piezoelectric layer 103, a backing layer 104, and flexible electronic circuitry stacked sequentially. The flexible electronic circuitry is connected to the ultrasonic host via cables and includes a flexible integrated circuit board 105. The heat generated by the ultrasonic transducer (piezoelectric layer 103) is conducted to the housing 107 through the heat-conducting block 106.

[0004] Since the flexible electronic circuit 105 has a portion that shields the side of the backing layer 104, the heat dissipation path established in the ultrasonic probe is: piezoelectric layer 103 → backing layer 104 → gap → flexible integrated circuit board 105 (from the inside to the outside) → gap → heat-conducting block 106 → outer shell 107 → environment.

[0005] Because the flexible integrated circuit board 105 includes a metal layer and an insulating layer (such as polyimide), and the metal layer has a limited thickness, less heat is conducted inward through the flexible integrated circuit board 105, resulting in low heat dissipation efficiency. Furthermore, the insulating layer has a very low thermal conductivity, leading to low heat conduction efficiency from the inside to the outside of the flexible integrated circuit board 105. Additionally, gaps exist between the backing layer 104 and the flexible integrated circuit board 105, and between the flexible integrated circuit board 105 and the heat-conducting block 106, resulting in high thermal resistance. These features lead to low heat conduction efficiency of the backing layer 104 through the flexible integrated circuit board 105 to the heat-conducting block 106, resulting in low heat dissipation capacity of the ultrasonic probe.

[0006] Therefore, how to improve heat dissipation capacity is a problem that urgently needs to be solved by those in this technical field. Utility Model Content

[0007] In view of this, the present invention provides an ultrasonic probe to improve heat dissipation capacity.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] An ultrasonic probe, comprising:

[0010] shell;

[0011] A transducer is disposed within the housing, wherein the transducer has a lens layer, a matching layer, a piezoelectric layer, a backing layer, and a flexible electronic circuit board, and the portion of the flexible electronic circuit board opposite to the side of the backing layer of the backing layer has a hollow structure.

[0012] A heat-conducting component is disposed inside the housing, wherein the heat-conducting component passes through the perforated structure and is thermally connected to the side of the backing layer, and is used to transfer heat to the housing.

[0013] Optionally, the ultrasonic probe further includes a temperature equalization component, which is disposed inside the housing and thermally connected to the housing; the thermally connected component is connected between the side of the backing layer and the temperature equalization component.

[0014] Optionally, in the above-mentioned ultrasonic probe, the heat-conducting component is connected between the side of the backing layer and the outer shell.

[0015] Optionally, in the above-mentioned ultrasonic probe, the flexible electronic circuit board is a split electronic circuit board formed by combining the first part and the second part;

[0016] The first part is opposite to the top surface of the backing layer, and the second part is opposite to the side surface of the backing layer and has the hollow structure.

[0017] Optionally, the ultrasonic probe described above also includes a shielding component located on the side of the transducer facing the housing.

[0018] Optionally, in the above-mentioned ultrasonic probe, the shielding component at least partially covers the flexible electronic circuit board along the side of the backing layer toward the outer shell;

[0019] The shielding component has a hollow mating portion corresponding to the hollow structure, and the heat-conducting component passes through the hollow structure and the hollow mating portion.

[0020] Optionally, in the above-mentioned ultrasonic probe, both sides of the backing layer have the flexible electronic circuit board, and the portions of the flexible electronic circuit board opposite to the two sides of the backing layer have a hollow structure.

[0021] The number of heat-conducting components is two, and they are respectively connected to the side of the backing layer through the two hollow structures.

[0022] Optionally, in the above-mentioned ultrasonic probe, one side of the backing layer has the flexible electronic circuit board;

[0023] The number of heat-conducting components is two. One heat-conducting component passes through the hollow structure and is thermally connected to the side of the backing layer, and the other heat-conducting component is thermally connected to the other side of the backing layer.

[0024] Optionally, in the ultrasonic probe described above, the projection area of ​​the heat-conducting component at least partially overlaps with the projection area of ​​the hollow structure along the side of the backing layer toward the outer shell.

[0025] Optionally, in the above-mentioned ultrasonic probe, the portion of the flexible electronic circuit board opposite to the side of the backing layer has an edge structure, and the edge structure corresponds to the edge of the side of the backing layer.

[0026] Optionally, the ultrasonic probe further includes a thermoelectric cooler, the cold end of which is thermally connected to the transducer, and the hot end of which is thermally connected to the temperature equalization component. The thermoelectric cooler has an operating state and a stopped state.

[0027] in,

[0028] When the thermoelectric cooler is in the stopped state, the transducer, the thermoelectric cooler, and the temperature equalization component form a passive heat conduction path;

[0029] When the thermoelectric cooler is in the operating state, the transducer, the thermoelectric cooler, and the temperature equalization component form an active heat conduction path.

[0030] Optionally, the ultrasonic probe further includes a phase change energy storage component, which is thermally connected to the temperature equalization component.

[0031] As can be seen from the above technical solution, the ultrasonic probe provided by this utility model, through the hollow structure of the flexible electronic circuit board, allows the heat-conducting component to pass through the hollow structure and directly connect with the side of the backing layer for heat conduction. Furthermore, the heat-conducting component, located inside the outer shell, can transfer heat to the outer shell, so that the heat dissipation path established in the ultrasonic probe is piezoelectric layer → backing layer → heat-conducting component → outer shell → environment. That is, it avoids the obstruction of heat conduction by the structural layers (metal layer and insulating layer) of the flexible electronic circuit board, avoids the influence of the gap between the backing layer and the flexible electronic circuit board on heat conduction, and allows the side of the backing layer to directly connect with the heat-conducting component for heat conduction, effectively improving the heat conduction efficiency of the backing layer in the direction of heat conduction to the heat-conducting component, and effectively improving the heat dissipation capacity of the ultrasonic probe. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic cross-sectional view of an ultrasonic probe in the prior art;

[0034] Figure 2 This is a schematic diagram of the first exploded structure of the ultrasonic probe provided in an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of a first partial structure of an ultrasonic probe provided in an embodiment of the present invention;

[0036] Figure 4 This is a schematic diagram of the second exploded structure of the ultrasonic probe provided in an embodiment of the present invention;

[0037] Figure 5 A schematic diagram of the third exploded structure of the ultrasonic probe provided in this embodiment of the present invention;

[0038] Figure 6 A fourth exploded structural diagram of the ultrasonic probe provided in this embodiment of the present invention;

[0039] Figure 7 A first data comparison diagram of the ultrasonic probe provided in this embodiment of the present invention with other solutions;

[0040] Figure 8 Other cross-sectional structural schematic diagrams of the ultrasonic probe provided in the embodiments of this utility model;

[0041] Figure 9 A second data comparison chart of the ultrasonic probe provided in this embodiment of the present invention and other solutions;

[0042] Figure 10 A third data comparison chart of the ultrasonic probe provided in this embodiment of the present invention with other solutions. Detailed Implementation

[0043] This utility model discloses an ultrasonic probe to improve heat dissipation capacity.

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0045] like Figure 2 and Figure 3 As shown, this embodiment of the present invention provides an ultrasonic probe, including: a housing 207, a transducer 201, and a heat-conducting component 203. The transducer 201 is disposed within the housing 207, wherein the transducer 201 has a lens layer 2011, a matching layer 2012, a piezoelectric layer 2013, a backing layer 2014, and a flexible electronic circuit board 2015. The portion of the flexible electronic circuit board 2015 opposite to the side of the backing layer 2014 has a hollow structure 20151. The heat-conducting component 203 is disposed within the housing 207, wherein the heat-conducting component 203 passes through the hollow structure 20151 and is thermally connected to the side of the backing layer, and is used to transfer heat to the housing 207.

[0046] The ultrasonic probe provided in this embodiment of the invention utilizes the hollow structure 20151 of the flexible electronic circuit board 2015 to allow the heat-conducting component 203 to pass through the hollow structure 20151 and directly connect with the side of the backing layer for thermal conductivity. Furthermore, the heat-conducting component 203, disposed within the outer shell 207, can transfer heat to the outer shell 207. This establishes a heat dissipation path in the ultrasonic probe as piezoelectric layer 2013 → backing layer 2014 → heat-conducting component 203 → outer shell 207 → environment. In other words, it avoids the obstruction of heat conduction by the structural layers (metal layer and insulating layer) of the flexible electronic circuit board 2015, avoids the influence of the gap between the backing layer 2014 and the flexible electronic circuit board 2015 on heat conduction, and allows the side of the backing layer 2014 to directly connect with the heat-conducting component 203 for thermal conductivity. This effectively improves the heat conduction efficiency of the backing layer 2014 towards the heat-conducting component 203, and effectively improves the heat dissipation capacity of the ultrasonic probe.

[0047] The heat-conducting component 203 can be thermally coupled to the side of the backing layer 2014, thus avoiding the situation where the gap between the heat-conducting component 203 and the backing layer 2014 affects the heat conduction efficiency.

[0048] The backing layer 2014 may include a backing support base, and the side of the backing layer 2014 may be the side of the backing support base. The side of the backing layer 2014 may also be the side of the overall structure of the backing layer 2014. In some embodiments where the thermal conductivity of the backing layer 2014 is greater than 1 W / m / K, in addition to including a sound attenuation layer, the backing layer 2014 may also include a backing support base, which may be made of aluminum or an aluminum alloy.

[0049] To improve the thermal uniformity of the outer casing 207 and prevent excessively high local temperatures that could affect the user experience, in some embodiments, the ultrasonic probe may further include a temperature equalization component 208. The temperature equalization component 208 is disposed within the outer casing 207 and is thermally connected to it; a heat-conducting component 203 is connected between the side of the backing layer and the temperature equalization component 208. In this embodiment, the heat dissipation path established in the ultrasonic probe is: piezoelectric layer 2013 → backing layer 2014 → heat-conducting component 203 → temperature equalization component 208 → outer casing 207 → environment.

[0050] The temperature equalization component 208 can be thermally connected to the inner surface of the outer casing 207, that is, the temperature equalization component 208 is thermally coupled to the inner surface of the outer casing 207.

[0051] The aforementioned thermal coupling refers to achieving surface contact through methods with low thermal resistance, including filling with thermally conductive interface materials (such as thermally conductive adhesives, thermally conductive gels, thermally conductive grease, graphite sheets, etc.), bonding, welding, or mechanical fixing (such as threaded connections, riveting, etc.).

[0052] In some specific embodiments, the temperature equalization component 208 has a high thermal conductivity. For example, in embodiments where the thermal conductivity of the temperature equalization component 208 is greater than 10 W / m / K, the temperature equalization component 208 includes an artificial graphite film or copper foil, etc. In embodiments where the thermal conductivity of the temperature equalization component 208 is greater than 1 W / m / K, the temperature equalization component 208 includes a thermally conductive silicone pad or thermally conductive gel, etc.

[0053] like Figure 7 As shown, the conventional approach on a 23°C phantom (such as...) Figure 1 The temperature rise of the lens layer (shown) in this embodiment is compared with that of the lens layer in the present invention. The lens layer 2011 of this embodiment has a lower temperature than that of the lens layer in the conventional solution. That is, without exceeding the temperature limit of the lens layer 2011, the ultrasonic probe provided by this embodiment can be used normally for a longer period of time.

[0054] In other embodiments, the thermally conductive component 203 is connected between the side of the backing layer and the outer shell 207. This allows the thermally conductive component 203 to be directly thermally coupled to the inner surface of the outer shell 207, meaning that heat transferred to the thermally conductive component 203 can be directly transferred to the outer shell 207. Specifically, the heat dissipation path established in the ultrasonic probe is: piezoelectric layer 2013 → backing layer 2014 → thermally conductive component 203 → outer shell 207 → environment.

[0055] like Figure 4 As shown, the flexible electronic circuit board 2015 is a split electronic circuit board formed by combining a first part 201501 and a second part 201502. The first part 201501 and the second part 201502 can be processed separately and then soldered to achieve circuit conductivity, or they can be connected by other conductive connectors. The first part 201501 faces the top surface of the backing layer 2014, and the second part 201502 faces the side surface of the backing layer and has a cutout structure 20151. This design facilitates the processing of the flexible electronic circuit board 2015 and also makes it easier to provide the cutout structure 20151 in the second part 201502, thereby improving the assemblability of the flexible electronic circuit board 2015 and reducing costs.

[0056] Alternatively, the flexible electronic circuit board 2015 can be a monolithic electronic circuit board. That is, even if the flexible electronic circuit board 2015 has a portion opposite to the top surface of the backing layer 2014 and a portion opposite to the side surface of the backing layer, the different portions of the flexible electronic circuit board 2015 correspond to different positions (top surface and side surface) of the backing layer 2014 during installation. Alternatively, the flexible electronic circuit board 2015 can simply be positioned so that only the side surface of the backing layer is opposite to the backing layer.

[0057] The ultrasonic probe provided in this embodiment of the invention also includes a shielding component 210, which is located on the side of the transducer 201 facing the housing 207. The added shielding component 210 improves the ultrasonic probe's anti-interference capability and helps to increase the signal-to-noise ratio.

[0058] In this embodiment, the shielding component 210 is a shielding layer. Along the arrangement direction of the transducer 201 and the housing 207, the projection area of ​​the shielding component 210 at least partially overlaps with the projection area of ​​the transducer 201. That is, along the direction from the side of the backing layer towards the housing 207, the shielding component 210 at least partially covers the flexible electronic circuit board 2015. In order not to affect the heat conduction efficiency, the shielding component 210 has a hollow mating part 211 corresponding to the hollow structure 20151. The heat-conducting component 203 passes through the hollow structure 20151 and the hollow mating part 211. That is, the heat-conducting component 203 passes through the hollow structure 20151 and the hollow mating part 211 to connect the side of the backing layer 2014 and the housing 207 (temperature equalization component 208). That is, the heat dissipation path established in the ultrasonic probe is piezoelectric layer 2013 → backing layer 2014 → heat-conducting component 203 → (temperature equalization component 208) → housing 207 → environment.

[0059] like Figure 2 , Figure 4 and Figure 5 As shown, in some embodiments, both sides of the backing layer 2014 have flexible electronic circuit boards 2015, and the portions of the flexible electronic circuit boards 2015 opposite to the two backing layer sides have perforated structures 20151; the number of heat-conducting components 203 is two, and they respectively pass through the two perforated structures 20151 and are thermally connected to the backing layer sides. With the above configuration, two heat dissipation paths are established in the ultrasonic probe and are symmetrically arranged on both sides of the backing layer 2014. The two heat dissipation paths can be the same or different. Taking the two heat dissipation paths being the same as an example, it can be piezoelectric layer 2013 → backing layer 2014 → heat-conducting component 203 → temperature equalization component 208 → outer shell 207 → environment, or it can be piezoelectric layer 2013 → backing layer 2014 → heat-conducting component 203 → outer shell 207 → environment.

[0060] In other embodiments, one side of the backing layer 2014 has a flexible electronic circuit board 2015; there are two heat-conducting components 203, one of which passes through the perforated structure 20151 and is thermally connected to the side of the backing layer, and the other is thermally connected to the other side of the backing layer 2014. That is, there are two heat dissipation paths established in the ultrasonic probe, and the two heat dissipation paths are located on both sides of the backing layer 2014. The two heat dissipation paths can be the same or different. In one heat dissipation path, the heat-conducting component 203 passes through the perforated structure 20151 of the flexible electronic circuit board 2015; in the other heat dissipation path, since there is no flexible electronic circuit board 2015, the heat-conducting component 203 can be directly connected to the other side of the backing layer 2014.

[0061] like Figure 3As shown, along the side of the backing layer towards the outer shell 207, the projected area of ​​the heat-conducting component 203 at least partially overlaps with the projected area of ​​the hollow structure 20151. In an embodiment where the projected area of ​​the heat-conducting component 203 completely overlaps with the projected area of ​​the hollow structure 20151, the heat-conducting component 203 passes entirely through the hollow structure 20151. Alternatively, the projected area of ​​the heat-conducting component 203 may partially overlap with the projected area of ​​the hollow structure 20151, and the overlapping portion of the heat-conducting component 203 can pass through the hollow structure 20151. That is, the heat-conducting component 203 can at least partially pass through the hollow structure 20151. In other words, there may be portions of the heat-conducting component 203 that cannot pass through the hollow structure 20151.

[0062] To improve assembly stability, the flexible electronic circuit board 2015 has an edge structure on the part opposite to the side of the backing layer, and the edge structure corresponds to the edge of the side of the backing layer.

[0063] The ultrasonic probe provided in this embodiment of the present invention also includes a thermoelectric cooler 204. The cold end of the thermoelectric cooler 204 is thermally connected to the transducer 201, and the hot end of the thermoelectric cooler 204 is thermally connected to the temperature equalization component 208. The thermoelectric cooler 204 has a working state and a stopped state.

[0064] in,

[0065] When the thermoelectric cooler 204 is in a stopped state, the transducer 201, the thermoelectric cooler 204 and the temperature equalization component 208 form a passive heat conduction path.

[0066] When the thermoelectric cooler 204 is in operation, the transducer 201, the thermoelectric cooler 204, and the temperature equalization component 208 form an active heat conduction path.

[0067] The thermoelectric cooler 204 can be used as a heat-conducting component 203, or the heat-conducting component 203 can be made relatively independent of the thermoelectric cooler 204.

[0068] The ultrasonic probe provided in this embodiment of the present invention also includes a phase change energy storage component 209, which is thermally connected to a temperature equalization component 208.

[0069] The housing 207 has an area for contact with the operator, that is, the operator can hold the housing 207 of the ultrasound probe so that the heat of the housing 207 can be exchanged with the operator through the area in contact with the operator.

[0070] The transducer 201 and the temperature equalization component 208 are disposed inside the housing 207. The cold end of the thermoelectric cooler 204 is thermally connected to the transducer 201, and the hot end of the thermoelectric cooler 204 is thermally connected to the temperature equalization component 208. The phase change energy storage component 209 is thermally connected to the temperature equalization component 208.

[0071] Through the above configuration, the heat absorbed by the transducer 201 through the thermoelectric cooler 204 in the temperature equalization component 208 can be transferred to the outer casing 207 and the phase change energy storage component 209. That is, of the total heat transferred from the transducer 201 to the temperature equalization component 208 through the thermoelectric cooler 204, a portion of the heat transferred to the outer casing 207 can be dissipated into the external environment, while the other portion of the heat transferred to the phase change energy storage component 209 can be stored. Since the heat transferred to the outer casing 207 can affect its temperature and thus impact the operator, storing the other portion of the heat transferred to the phase change energy storage component 209 effectively reduces the amount of heat transferred to the outer casing 207 (a portion of the heat) while keeping the total heat constant. This effectively prevents the outer casing 207 from becoming too hot (e.g., causing operator discomfort or exceeding relevant regulatory limits), thus meeting the heat dissipation requirements of the transducer 201 and ensuring the performance of the ultrasonic probe.

[0072] In some embodiments, the thermoelectric cooler 204 has an operating state and a stopped state;

[0073] When the thermoelectric cooler 204 is in a stopped state, the transducer 201, the thermoelectric cooler 204 and the temperature equalization component 208 form a passive heat conduction path.

[0074] When the thermoelectric cooler 204 is in operation, the transducer 201, the thermoelectric cooler 204, and the temperature equalization component 208 form an active heat conduction path.

[0075] When a current (such as direct current) is applied to the thermoelectric cooler 204, due to the Peltier effect (the inverse of the Seebeck effect, where one junction absorbs heat and the other releases heat when current passes through the contact point of two different materials (such as metal or semiconductor), one side of the thermoelectric cooler 204 heats up, called the hot end, while the other side cools down, called the cold end. That is, when a current (direct current) is applied to the thermoelectric cooler 204, the thermoelectric cooler 204 is in operation, and the temperature of the cold end, which is thermally connected to the transducer 201, decreases, thereby suppressing the temperature rise of the transducer 201. A portion of the heat discharged from the hot end of the thermoelectric cooler 204 is diffused to the inner surface of the outer casing 207 through the temperature equalization component 208. The temperature equalization effect of the temperature equalization component 208 prevents the generation of local hot spots in the outer casing 207, and this portion of heat can be dissipated to the environment through the outer casing 207. Another portion of the heat is diffused to the phase change energy storage component 209 through the temperature equalization component 208 and absorbed, thereby suppressing the temperature rise of the temperature equalization component 208 and the outer casing 207.

[0076] Therefore, when the thermoelectric cooler 204 is in a stopped state, that is, no current is applied to the thermoelectric cooler 204, the heat from the transducer 201 can be transferred to the heat spreader 208 due to the thermal conductivity of the thermoelectric cooler 204 itself, so that the transducer 201, the thermoelectric cooler 204 and the heat spreader 208 form a passive heat conduction path.

[0077] When the thermoelectric cooler 204 is in operation, that is, when current is applied to the thermoelectric cooler 204, the hot end of the thermoelectric cooler 204 can release heat and its cold end can absorb heat. Combined with the thermal conductivity of the thermoelectric cooler 204 itself, the transducer 201, the thermoelectric cooler 204 and the temperature equalization component 208 form an active heat conduction path.

[0078] Given that the transducer 201, thermoelectric cooler 204 and temperature equalization component 208 have the same structure and the temperature difference between the transducer 201 and the temperature equalization component 208 is constant, the amount of heat transferred from the thermoelectric cooler 204 to the temperature equalization component 208 varies depending on whether the thermoelectric cooler 204 is in a working state or a stopped state.

[0079] With the above settings, the heat transferred to the housing 207 can be further adjusted according to the actual situation while meeting the heat dissipation requirements of the transducer 201, thereby improving the flexibility of the heat dissipation method and making it easier to further optimize the heat dissipation method to adapt to actual needs.

[0080] Furthermore, while the temperature of the housing 207 does not exceed the limit, the thermoelectric cooler 204 is fully utilized to cool and dissipate heat from the transducer 201, thereby allowing the transducer 201 to operate with greater power consumption, which is beneficial to improving the signal-to-noise ratio and image quality of the ultrasonic signal.

[0081] like Figure 9 and Figure 10 As shown, conventional embodiment 1 is an ultrasonic probe that includes only a transducer and a housing, without a thermoelectric cooler and a phase change energy storage component. Conventional embodiment 2 is an ultrasonic probe that includes only a transducer, a housing, and a thermoelectric cooler, without a phase change energy storage component. The embodiments are embodiments of this utility model.

[0082] like Figure 9 The diagram shows a comparison of transducer lens temperature rise on a phantom at 33°C. Under the same transducer power consumption, the ultrasonic probe provided in this embodiment of the invention has the lowest lens temperature rise. That is, under the same lens temperature rise, the ultrasonic probe provided in this embodiment of the invention allows the highest ultrasonic transducer power consumption.

[0083] like Figure 10 As shown, the ultrasonic probe housing temperature rise is compared in an air environment of 30°C. The ultrasonic probe provided in this embodiment of the present invention has a moderate housing temperature rise value of 207.

[0084] The transducer 201 includes a lens layer 2011, a matching layer 2012, a piezoelectric layer 2013, a backing layer 2014, and necessary electronic circuitry (including a flexible electronic circuit board 2015) stacked sequentially. The piezoelectric layer 2013 serves as the lens layer 2011 for contact with the patient.

[0085] In some embodiments, the heat spreader 208 is thermally connected to the housing 207. That is, the heat spreader 208 and the housing 207 are thermally coupled. It is understood that thermal coupling refers to achieving surface contact using methods with low thermal resistance, including filling with thermally conductive interface materials (such as thermally conductive adhesive, thermally conductive gel, thermally conductive silicone grease, graphite sheets, etc.), bonding, welding, mechanical fixing (such as threaded connections, riveting, etc.). By thermally connecting the heat spreader 208 to the housing 207, the arrangement of the heat spreader 208 within the housing 207 is facilitated, and the heat from the heat spreader 208 is also facilitated to be conducted to the housing 207.

[0086] Alternatively, the temperature equalization component 208 can be connected to the outer casing 207 via a heat-conducting component; or, the temperature equalization component 208 and the outer casing 207 can be spaced apart, and relative heat conduction can be achieved through the filling medium (such as air or heat exchange fluid) inside the outer casing 207.

[0087] Since the temperature equalization component 208 is thermally connected to the outer casing 207, in order to optimize the spatial layout, the phase change energy storage component 209 is thermally connected to the side of the temperature equalization component 208 facing away from the outer casing 207. That is, both sides of the temperature equalization component 208 are connected to the outer casing 207 and the phase change energy storage component 209 respectively, so as to achieve thermal coupling between the temperature equalization component 208 and both the outer casing 207 and the phase change energy storage component 209.

[0088] To prevent heat from the high-temperature phase change energy storage component 209 from being transferred to the lower-temperature transducer 201 via thermal conduction, radiation, or convection, the phase change energy storage component 209 has a first side facing the transducer 201, and a heat insulation component is provided on the first side. The heat insulation component can have a low thermal conductivity (e.g., less than 0.2 W / m / K), thereby reducing the efficiency of heat conduction from the first side of the phase change energy storage component 209 to the transducer 201, and minimizing the transfer of heat from the phase change energy storage component 209 to the transducer 201, thus preventing any impact on the transducer 201. The shielding component 210 can serve as the heat insulation component, or the heat insulation component and the shielding component 210 can be two relatively independent components.

[0089] Specifically, the insulation components can be plastic components, rubber components, aerogel structures, vacuum insulation panels, or foamed plastic structures, etc.

[0090] In some specific embodiments, the thermal coupling method between the temperature equalization component 208 and the housing 207 is pressure-sensitive adhesive bonding, that is, the temperature equalization component 208 and the housing 207 are bonded together by pressure-sensitive adhesive to achieve thermally conductive connection.

[0091] Thermoelectric cooler 204 may have a ceramic substrate and bismuth telluride thermoelectric arms. Due to the Peltier effect, it can have a hot end and a cold end. Of course, thermoelectric cooler 204 may also have a substrate and thermoelectric arms made of other materials; no specific limitations are imposed here, and all are within the scope of protection.

[0092] To achieve the desired temperature uniformity, the temperature uniformity component 208 can be made of metals (such as aluminum and aluminum alloys, copper and copper alloys, magnesium and magnesium alloys, etc.), non-metals (such as graphite, graphene, boron nitride, etc.), ceramics (such as alumina ceramics, aluminum nitride ceramics, etc.), or other materials. Preferably, the temperature uniformity component 208 is made of graphite sheets to avoid risks such as electrical conductivity.

[0093] The temperature equalization component 208 may also include vacuum cavity devices (such as heat pipes, flattened heat pipes, vacuum cavity temperature equalization plates, etc.) to further improve the temperature equalization effect.

[0094] To ensure temperature uniformity, the temperature uniform component 208 has a high thermal conductivity (e.g., greater than 1 W / m / K) and at least covers part of the inner surface of the outer casing.

[0095] The thermoelectric cooler 204 is thermally connected to the transducer 201 via a first thermally conductive pad, and the thermoelectric cooler 204 is thermally connected to the temperature equalization component 208 via a second thermally conductive pad. That is, the cold end of the thermoelectric cooler 204 is thermally connected to the transducer 201 via the first thermally conductive pad to improve the heat transfer between the cold end of the thermoelectric cooler 204 and the transducer 201. The hot end of the thermoelectric cooler 204 is thermally connected to the transducer 201 via the second thermally conductive pad to improve the heat transfer between the hot end of the thermoelectric cooler 204 and the temperature equalization component 208.

[0096] The phase change energy storage component 209 has a phase change point. When the temperature rises above the phase change point, at least a portion of the phase change energy storage component 209 changes from one phase structure to another phase structure, while absorbing a large amount of heat (e.g., phase change enthalpy > 80 J / g).

[0097] The phase transition point can be set according to the actual usage requirements of the ultrasonic probe, and can be any value between 20 and 50°C.

[0098] The phase change energy storage component 209 can have a solid-solid or solid-liquid structure before and after the phase change.

[0099] The phase change energy storage material used to fabricate the phase change energy storage component 209 can have a high thermal conductivity (e.g., greater than 1 W / m / K), and the phase change energy storage material used to fabricate the phase change energy storage component 209 can be interwoven or wrapped by structures with a high thermal conductivity (e.g., greater than 1 W / m / K). The structure interwoven or wrapped by the phase change energy storage material of the phase change energy storage component 209 can be one or more of expanded graphite, graphite sheets, metal fins, foamed metal, or metal cavities.

[0100] Optionally, the temperature-equalizing component 208 can be an outer shell 207 or a part of the outer shell 207. For example, the ultrasonic probe may have an outer shell 207 made of metal, and at least a portion of the outer shell 207 made of metal may be the temperature-equalizing component 208. Alternatively, the outer shell 207 may be formed by secondary injection molding of plastic, in which case the metal component serves as the temperature-equalizing component 208.

[0101] In some embodiments, the phase change energy storage component 209 can be a solid-solid phase change energy storage component. The phase change energy storage component 209 may contain sulfidated fossil wax capable of solid-solid phase change. The phase change point of the sulfidated fossil wax is approximately 35°C, meaning that when the temperature rises above 35°C, at least a portion of the sulfidated fossil wax in the phase change energy storage component 209 transforms from one phase structure to another to achieve energy storage.

[0102] In other embodiments, the phase change energy storage component 209 can be a solid-liquid phase change energy storage component. Specific details are not provided here, and all are within the scope of protection.

[0103] Furthermore, a temperature sensor is installed inside the housing 207, and the temperature sensor is communicatively connected to the thermoelectric cooler 204 or the transducer 201.

[0104] The temperature sensor can be connected to the processor via electronic circuitry or wireless communication. The processor receives the temperature data collected by the temperature sensor and can control the thermoelectric cooler 204 or the transducer 201 based on the temperature data, thereby realizing the communication connection between the temperature sensor and the thermoelectric cooler 204 or the transducer 201.

[0105] Taking the communication connection between the temperature sensor and the thermoelectric cooler 204 as an example, the temperature data collected by the temperature sensor can be used as a parameter to control the operation of the thermoelectric cooler 204 (such as the working state and the stop state). The collected temperature data can be used to calculate the temperature of the outer surface of the housing 207. Based on the temperature value, the processor adjusts the operation of the thermoelectric cooler 204, such as whether to input current to switch the thermoelectric cooler 204 between the working state and the stop state; or, adjust the magnitude of the current input to the thermoelectric cooler 204 to adjust the heat transfer efficiency between the transducer 201 and the temperature equalization component 208, etc.

[0106] Alternatively, the temperature sensor can be connected to the transducer 201 via communication. The temperature data collected by the temperature sensor can be used as a parameter to control the operation of the transducer 201. The collected temperature data can be used to calculate the temperature of the outer surface of the housing 207. Based on the temperature value, the processor adjusts the operation of the transducer 201, such as adjusting the transmission voltage of the transducer 201 to adjust its heat dissipation.

[0107] The above settings can effectively prevent the temperature of the housing 207 from becoming too high, which could cause discomfort to the operator or exceed relevant regulatory limits.

[0108] The ultrasonic probe provided in this embodiment of the invention includes a specific ultrasonic probe thermal control method as follows:

[0109] First, the ultrasonic probe is powered on or connected to the ultrasonic system host and operates normally. At this time, transducer 201 has a non-zero input power (P1≠0), and thermoelectric cooler 204 has a non-zero input power (P2≠0). That is, both transducer 201 and thermoelectric cooler 204 are in a conductive state, making thermoelectric cooler 204 operational. The cold end of thermoelectric cooler 204 cools transducer 201, suppressing the temperature rise of transducer 201; and the temperature of the hot end of thermoelectric cooler 204 rises, causing the temperature of the outer casing 207 to rise, and the temperature value collected by the temperature sensor also increases.

[0110] Then, the temperature sensor collects the temperature. Tsensor It also sends temperature data back to the processor. Temperature acquisition. Tsensor This represents the actual temperature around the temperature sensor.

[0111] Then, the processor calculates the estimated surface temperature of the casing 207 using methods such as calculation or table lookup. Tcasing Among them, the temperature was collected. Tsensor It can be used to calculate and estimate surface temperature. Tcasing The parameters, namely, the temperature of the sampled sample. Tsensor With the calculated surface temperature Tcasing Related.

[0112] The processor compares and calculates the surface temperature. Tcasing The relationship between the value of the first defined temperature T1 and the temperature of comfort for the operator (e.g., 43°C). When calculating the surface temperature... Tcasing When T1 is less than or equal to 1, the temperature sensor can continue to collect temperature data. Tsensor And the operation of feeding back temperature data to the processor; when calculating the surface temperature Tcasing When the value is greater than T1, further adjustments can be made.

[0113] During subsequent adjustments, the processor controls the operation of the thermoelectric cooler 204. The input power of the thermoelectric cooler 204 can be zero (i.e., P2=0), causing the thermoelectric cooler 204 to be in a stopped state to prevent the heat transferred from the hot end of the thermoelectric cooler 204 from causing further temperature rise in the outer casing 207. At this time, the heat generated by the transducer 201 is transferred to the temperature equalization component 208 and the outer casing 207 via the thermoelectric cooler 103 in the form of passive heat conduction, and then dissipated to the environment through the outer casing 207.

[0114] The processor compares and calculates the surface temperature. Tcasing The relationship between the second limiting temperature T2 and T1, where T2 > T1. T2 can be set as the upper temperature limit of the enclosure 207 as restricted by regulations (e.g., 48°C). When calculating the surface temperature... Tcasing When T2 is less than or equal to 2, the temperature sensor can continue to collect temperature data. Tsensor And the operation of feeding back temperature data to the processor; when calculating the surface temperature Tcasing When the time reaches T2, subsequent operations can be performed.

[0115] In subsequent operations, the processor controls the operation of transducer 201. The input power of transducer 201 can be zero (i.e., P1=0), so that transducer 201 stops working to prevent the heat generated by transducer 201 from causing further temperature rise of casing 207.

[0116] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0117] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An ultrasonic probe, characterized in that, include: shell; A transducer is disposed within the housing, wherein the transducer has a lens layer, a matching layer, a piezoelectric layer, a backing layer, and a flexible electronic circuit board, and the portion of the flexible electronic circuit board opposite to the side of the backing layer of the backing layer has a hollow structure. A heat-conducting component is disposed inside the housing, wherein the heat-conducting component passes through the perforated structure and is thermally connected to the side of the backing layer, and is used to transfer heat to the housing.

2. The ultrasonic probe as described in claim 1, characterized in that, It also includes a temperature equalization component, which is disposed inside the housing and is thermally connected to the housing; the thermally connected component is connected between the side of the backing layer and the temperature equalization component.

3. The ultrasonic probe as described in claim 1, characterized in that, The thermally conductive component is connected between the side of the backing layer and the outer shell.

4. The ultrasonic probe as described in claim 1, characterized in that, The flexible electronic circuit board is a split electronic circuit board formed by combining a first part and a second part. The first part is opposite to the top surface of the backing layer, and the second part is opposite to the side surface of the backing layer and has the hollow structure.

5. The ultrasonic probe as described in claim 1, characterized in that, It also includes a shielding component located on the side of the transducer facing the housing.

6. The ultrasonic probe as described in claim 5, characterized in that, Along the side of the backing layer toward the housing, the shielding component at least partially covers the flexible electronic circuit board; The shielding component has a hollow mating portion corresponding to the hollow structure, and the heat-conducting component passes through the hollow structure and the hollow mating portion.

7. The ultrasonic probe as described in claim 1, characterized in that, The flexible electronic circuit board is provided on both sides of the backing layer, and the portion of the flexible electronic circuit board opposite to the two sides of the backing layer has a hollow structure. The number of heat-conducting components is two, and they are respectively connected to the side of the backing layer through the two hollow structures.

8. The ultrasonic probe as described in claim 1, characterized in that, The flexible electronic circuit board is present on one side of the backing layer; The number of heat-conducting components is two. One heat-conducting component passes through the hollow structure and is thermally connected to the side of the backing layer, and the other heat-conducting component is thermally connected to the other side of the backing layer.

9. The ultrasonic probe as described in claim 1, characterized in that, Along the side of the backing layer toward the outer shell, the projection area of ​​the heat-conducting component at least partially overlaps with the projection area of ​​the hollow structure.

10. The ultrasonic probe according to any one of claims 1-9, characterized in that, The portion of the flexible electronic circuit board opposite to the side of the backing layer has an edge structure, and the edge structure corresponds to the edge of the side of the backing layer.

11. The ultrasonic probe as described in claim 2, characterized in that, It also includes a thermoelectric cooler, the cold end of which is thermally connected to the transducer, and the hot end of which is thermally connected to the temperature equalization component. The thermoelectric cooler has an operating state and a stopped state. in, When the thermoelectric cooler is in the stopped state, the transducer, the thermoelectric cooler, and the temperature equalization component form a passive heat conduction path; When the thermoelectric cooler is in the operating state, the transducer, the thermoelectric cooler, and the temperature equalization component form an active heat conduction path.

12. The ultrasonic probe as described in claim 11, characterized in that, It also includes a phase change energy storage component, which is thermally connected to the temperature equalization component.

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