Removal apparatus for removing material from a component carrier
By designing cleaning units, filtration units, and housing removal equipment, the problems of incomplete cleaning of component carriers and clogging of filtration devices were solved, achieving efficient cleaning and filtration, and improving production efficiency and cleanliness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AT & S CHINA
- Filing Date
- 2024-12-27
- Publication Date
- 2026-05-29
AI Technical Summary
In current semiconductor device manufacturing, incomplete cleaning of component carriers leads to residual surface contaminants, affecting product yield. Furthermore, clogging of filter devices is difficult to monitor in real time, reducing production efficiency.
Design a removal device comprising a cleaning unit, a filtering unit, and a housing. The cleaning unit provides cleaning liquid, the filtering unit filters the liquid, and the housing encloses the filtering unit and has an operating opening to allow real-time monitoring and replacement of the filtering unit, forming a cleaning loop to ensure cleaning effectiveness.
It achieves thorough cleaning of the surface of the component carrier, reduces pollutant residue, improves production efficiency, and allows for filter unit replacement without stopping the machine, thus avoiding water waste.
Smart Images

Figure CN224294108U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of semiconductor devices, and in particular to a removal device for removing material from a component carrier. Background Technology
[0002] In the field of semiconductor device technology, component carriers such as printed circuit boards (PCBs), which house one or more electronic components, are common carriers for the electrical connections of electronic devices. During their manufacturing process, a cleaning process must be performed to remove contaminants from the surface of the component carrier, thereby reducing the impact of contaminants on subsequent processing or use of the component carrier.
[0003] However, in existing production processes, component carriers are often contaminated with residues, such as dry film residue, after passing through the cleaning module due to incomplete filtration. These residues easily adhere to the surface of the component carriers, causing surface defects and increasing product defect rates. In some production lines, operators even use excessive water to clean the component carrier surface multiple times to remove residues. However, due to incomplete filtration, multiple rinsings may not only fail to remove existing surface contaminants but may also introduce new contaminants, failing to improve the surface cleanliness of the component carriers and even resulting in significant water waste.
[0004] Furthermore, most existing production equipment uses closed cleaning modules, making it impossible for operators to observe the cleaning status of the component carriers in real time. Only after the component carriers leave the cleaning module can operators determine if they are contaminated and whether further cleaning is necessary, which is both time-consuming and labor-intensive. Similarly, existing filtration devices are often integrated inside the production equipment. During operation, operators cannot observe whether the filters (such as screens) are clogged with contaminants. Only after contamination of the component carriers is determined that the production equipment must be shut down and the filters replaced, which also reduces production efficiency. Utility Model Content
[0005] The purpose of this invention is to provide a removal device for removing material from a component carrier, so as to at least solve the defects described above in the prior art.
[0006] According to an exemplary embodiment of the present invention, a removal device for removing material from a component carrier is provided, the removal device comprising:
[0007] The cleaning unit is configured to provide a liquid for removing material from the surface of the component carrier.
[0008] The filter unit, located below the cleaning unit, is configured to filter the liquid flowing out of the cleaning unit.
[0009] The housing is configured to enclose the filter unit and includes at least one opening for the filter unit to be operated by an operator.
[0010] In the context of this application, the term "removal equipment for removing material from a component carrier" can refer to equipment used in a component carrier production line to remove excess material from the surface of a component carrier. Such a production line mainly includes a series of processes such as developing, washing, etching, washing, film removal, and washing. Specifically, the washing process may include acid washing and / or alkaline washing. In particular, the removal equipment for removing material from a component carrier according to this application can be installed in the washing process after the film removal process, using a cleaning liquid to remove contaminants, such as residual unpeeled film, from the surface of the component carrier, thereby ensuring the surface cleanliness of the component carrier. The cleaning liquid is provided by a cleaning device and, according to the cleaning requirements of the production line, is provided at a specific pressure and at a specific angle to two opposite main surfaces of the component carrier, thereby achieving the cleaning operation.
[0011] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, a component carrier can be constructed as a mechanical and / or electronic carrier of a component. In particular, a component carrier can be one of a PCB (printed circuit board), an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different carriers of the above types of component carriers.
[0012] In the context of this application, the term "component carrier structure" may specifically refer to a prefabricated component carrier currently being manufactured. Specifically, a component carrier structure may include multiple component carriers or prefabricated components that remain integrally connected, and these component carriers or prefabricated components may be manufactured in a batch process prior to individualization. In particular, a component carrier structure may be a panel (e.g., having a size of 18 inches × 24 inches or larger) or an array (e.g., an array of six component carriers currently being manufactured). For example, the manufactured component carrier may be a printed circuit board or an IC substrate.
[0013] In alternative embodiments, the manufactured component carrier may include a stack of at least one electrically insulating layer structure and / or at least one conductive layer structure. For example, the component carrier may be a laminate of electrically insulating and conductive layer structures, particularly formed by applying mechanical pressure and / or heat. A “stack” can provide a plate-like component carrier that offers a large mounting surface for other components while remaining very thin and compact. The term “layer structure” may specifically refer to a continuous layer, a patterned layer, or multiple discontinuous islands within a common plane.
[0014] In an alternative implementation, the component carrier is shaped like a plate. This contributes to a compact design, where the component carrier still provides a large base for mounting components. Furthermore, particularly as a bare mold for embedded electronic components, its small thickness allows for easy embedding into thin plates, such as printed circuit boards.
[0015] In an alternative implementation, the component carrier is configured as one of a group consisting of a printed circuit board, a substrate (particularly an IC substrate), and an intermediate layer.
[0016] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a board-shaped component carrier formed by laminating several conductive layer structures with several electrically insulating layer structures, for example by applying pressure and / or by providing heat. As the preferred material for PCB technology, the conductive layer structures are made of copper, while the electrically insulating layer structures can consist of resin and / or glass fiber, i.e., so-called prepreg or FR4 material. Various conductive layer structures can be formed with through-holes in the laminate, for example by laser drilling or mechanical drilling, and connected to each other in the desired manner by filling them with a conductive material (particularly copper), thus forming through-hole connections. In addition to one or more components that can be embedded in the PCB, PCBs are generally constructed to accommodate one or more components on one or two opposing surfaces of the board-shaped PCB. They can be soldered to their respective main surfaces. The dielectric portion of the PCB can consist of resin and reinforcing fibers (such as glass fiber).
[0017] In the context of this application, the term "substrate" can specifically refer to a small component carrier. In the case of a PCB, a substrate can be a relatively small component carrier on which one or more components can be mounted, and can act as a connection medium between one or more chips and another PCB. For example, a substrate can have substantially the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of chip-scale packages (CSP)). More specifically, a substrate can be understood as a carrier of electrical connections or electrical networks, and a component carrier equivalent to a printed circuit board (PCB), but with a considerably high density of lateral and / or vertical interconnects. For example, lateral connections are conductive channels, while vertical connections may be drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide electrical, thermal, and / or mechanical connections between packaged or unpackaged components (such as bare molds), particularly IC chips, and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).
[0018] The substrate or interlayer may include or consist of at least one layer of glass, silicon (Si), or photo-imaging or dry-etching organic material such as epoxy-based stacked materials (e.g., epoxy-based stacked films) or polymer compounds such as polyimide, polybenzoxazole, or benzocyclobutene functionalized polymers.
[0019] In an alternative embodiment, the component carrier may be a laminated component carrier. In such an embodiment, the component carrier may be a multilayered compound that is stacked and connected together by applying pressure and / or heat.
[0020] Other example implementations of a removal device for removing material from a component carrier will be described below.
[0021] In an optional implementation, the filtration unit includes a first filter and a second filter. Liquid flowing from the cleaning unit passes sequentially through the first and second filters before returning to the cleaning unit, thus forming a cleaning loop. To ensure cleaning effectiveness, operators periodically test and assess the reusability of the liquid. If the test confirms that it can still be reused, the liquid continues to circulate in the loop. If it is determined that it cannot be reused, for example, if the impurity content in the liquid is too high and affects the cleaning effect, a portion of the liquid is discharged from the first and / or second filters and then replenished with clean cleaning liquid. For example, after three days, one week, or half a month since the last replacement or replenishment of cleaning liquid, operators can test the liquid and decide whether to replace / replenish it with new liquid, or they can directly replace / replenish it with new liquid. In this way, on the one hand, continuous cleaning operations are ensured without stopping the equipment, and on the other hand, the cleanliness of the liquid is ensured, thereby achieving better cleaning results.
[0022] In an optional embodiment, the first filtration device is configured to coarsely filter the liquid flowing out of the cleaning unit, and the second filtration device is configured to finely filter the liquid subsequently returned to the cleaning unit. The first filtration device may include, for example, a filter screen with a large pore size, and the coarsely filtered liquid flows into the second filtration device, which includes, for example, a filter screen with a smaller pore size, for fine filtration. Such staged filtration can improve filtration efficiency and reduce the possibility of the second filtration device being clogged by large particulate contaminants.
[0023] In an optional embodiment, the cleaning unit includes a cleaning device and a holding device configured to support the component carrier.
[0024] In an optional embodiment, the cleaning apparatus includes a first cleaning device and a second cleaning device. The first cleaning device is configured to provide liquid to a first primary surface of the component carrier, and the second cleaning device is configured to provide liquid to a second primary surface of the component carrier opposite to the first primary surface. This allows both primary surfaces of the component carrier to be thoroughly cleaned.
[0025] In an optional embodiment, the holding device includes a first holding device and a second holding device, which are respectively positioned to abut against two opposite main surfaces of the component carrier, thereby clamping the component carrier between the first and second holding devices. This allows the component carrier to remain in a stable position during cleaning, reducing the possibility of breakage. Specifically, the size and position of the first and second holding devices are configured to be adjustable, such that the contact area between each of the first and second holding devices and the component carrier to be cleaned is an area without a circuit board layout, ensuring that the surface of the component carrier is not damaged during cleaning.
[0026] In an optional embodiment, the cleaning device includes one or more nozzles angled relative to the main surface of the component carrier, thereby spraying liquid onto the main surface. In a preferred embodiment, the nozzles are positioned perpendicular to the main surface of the component carrier, which can improve cleaning efficiency.
[0027] In an optional embodiment, the holding device includes multiple rollers arranged side by side. This arrangement allows the holding device to be rotated by applying a driving force, thereby facilitating the transport of the component carrier and enabling rapid transfer of the component carrier before and after cleaning.
[0028] In an optional embodiment, at least one door is provided on at least one opening of the housing, the door including a transparent portion, so that the operator can view the operation of the filter unit enclosed by the housing in real time through the transparent portion, thereby deciding whether the filter unit needs to be replaced and cleaned in a timely manner.
[0029] In an alternative embodiment, the door is connected to the first filter device, allowing the first filter device to be removed from the removal device when the door is disassembled. This allows the first filter device, which is more prone to clogging by large particulate contaminants due to coarse filtration, to be easily removed from the removal device.
[0030] In an alternative embodiment, the door and the first filter device are either integrally connected or detachably connected.
[0031] In an alternative implementation, the door covers the opening in a sealed manner. This allows cleaning fluids to be contained inside the equipment during removal operations, preventing contamination of the external environment.
[0032] In an optional embodiment, the removal device further includes a storage tank for storing liquid, with a first filter device located at the inlet end of the tank and a second filter device located at the outlet end. The first filter device at the inlet end of the tank ensures that the liquid entering the tank has undergone coarse filtration, while the second filter device at the outlet end of the tank ensures that the liquid used for cleaning the component carrier has undergone fine filtration and is no longer contaminants, thereby ensuring cleaning efficiency.
[0033] In optional embodiments, the first and second filtration devices include filter screens, with the mesh size of the first filter screen being larger than that of the second filter screen. This staged filtration improves filtration efficiency and reduces the likelihood of the second filter device being clogged by large particles of contaminants. In some embodiments, at least one filter element may be disposed inside the first and / or second filtration devices. The shape of the filter element can be adapted to the shape of the first and / or second filtration devices, and in the case of multiple filter elements, the specific arrangement of the filter elements can be configured as required, such as being laid flat or overlapping inside the filtration device. The filter elements can be replaced periodically according to cleaning requirements. The materials forming the filter elements may include, but are not limited to, the following: quartz sand, PP cotton (polypropylene resin fiber), activated carbon, hollow fiber, etc.
[0034] In an alternative implementation, the door is provided with a handle to facilitate the operator in opening the door.
[0035] In an optional embodiment, the first filtration device is in the form of a filter plate. Since the filtration unit is located below the cleaning unit, the liquid, after cleaning the component carrier, comes into contact with the filter plate under the action of gravity and undergoes coarse filtration.
[0036] In an alternative embodiment, the housing is configured to also enclose the cleaning unit. This allows the cleaning fluid within the cleaning unit to be contained within the equipment during removal operation, preventing contamination of the external environment.
[0037] In an optional embodiment, the holding device is configured to be driven by a drive unit to transport the component carrier through the cleaning device. This ensures that the component carrier passes through the cleaning device at a uniform and controllable speed, thereby improving cleaning efficiency.
[0038] In an optional implementation, the drive unit is a motor.
[0039] In an optional embodiment, the spacing between the rollers arranged side by side is less than 1 cm. This allows only a small amount of liquid to flow directly out from the gap between the rollers during the cleaning process and flow into the first filter under gravity, thereby ensuring that the component carrier can be thoroughly cleaned.
[0040] In the context of this application, the statement "only a small amount of liquid flows directly from the gap between the rollers" specifically indicates that, on the one hand, in the removal equipment, the flow rate of liquid provided by each cleaning device is typically moderate or even small, thereby avoiding potential damage to the surface of the component carrier caused by excessive liquid flow. Furthermore, with a small flow rate, the replacement operation of the filter device will not result in untimely or insufficient filtration of the cleaning liquid, ensuring that the filter device can be replaced without interrupting the production line. Although the cleaning liquid flow rate is small, the component can achieve a good cleaning effect after passing through multiple cleaning devices. On the other hand, most of the cleaning liquid provided by the cleaning device is sprayed onto the surface of the component carrier, overflows from the surface of the component carrier to the rollers below after cleaning, and then flows through the gap between the rollers by gravity. Compared with the liquid flow rate used to clean the surface of the component carrier, only a very small amount of liquid does not contact the surface of the component carrier and flows directly from the gap between the rollers, ensuring the utilization rate of the cleaning liquid. Therefore, it is understood that those skilled in the art will not interpret this statement in a way that is detrimental to the cleaning purpose; rather, this statement indicates a good utilization rate of the cleaning liquid in the removal equipment of this application.
[0041] In an optional embodiment, liquid flows from the cleaning unit into the first filtration device by gravity, then into a storage tank, and is pumped to the second filtration device before finally being recycled back to the cleaning unit. In another optional embodiment, the liquid, after undergoing two stages of filtration by the first and second filtration devices, can be manually or automatically inspected before being recycled back to the cleaning unit to determine if it meets the standards for continued reuse. Once the standards are met, the liquid can be recycled back to the cleaning unit.
[0042] In an optional implementation, the first filter is configured to be replaced without stopping the removal equipment. Since only a small amount of liquid flows directly from the gaps between the rollers during the cleaning process and then flows into the first filter under gravity, the operator can simultaneously observe the operation of the filter unit enclosed by the housing through a transparent section on the door. When the operator determines that the filter unit needs to be replaced, they can open the door and remove the first filter without stopping the removal equipment.
[0043] In an optional embodiment, the filtration unit includes multiple sets of first and second filter devices, each set of which is associated with a door. Multiple sets of first and second filter devices are installed along the path of the component carrier transport through the removal equipment, ensuring thorough filtration of liquids along this path and improving filtration efficiency. Furthermore, even when an operator replaces one of the first filter devices, the remaining first and second filter devices ensure the normal operation of the filtration unit.
[0044] A removal device for removing material from a component carrier according to an embodiment of this application includes: a cleaning unit configured to provide a liquid for removing material from the surface of the component carrier; a filtering unit located below the cleaning unit configured to filter the liquid flowing out of the cleaning unit; and a housing configured to enclose the filtering unit, the housing including at least one opening for operator manipulation of the filtering unit. This removal device forms a cleaning loop through the cleaning unit and the filtering unit, thereby thoroughly cleaning the component carrier passing through the cleaning loop, removing surface contaminants, and ensuring the surface cleanliness of the component carrier. Simultaneously, the housing also has an opening through which the operator can not only conveniently manipulate the filtering unit but also observe the filtration status inside the device in real time, thereby promptly cleaning and replacing the filtering unit, which can be replaced without stopping the removal device. Attached Figure Description
[0045] The above-defined aspects and other aspects of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings. The present invention will be described below with reference to the embodiments, but the present invention is not limited to the described embodiments. In the accompanying drawings:
[0046] Figure 1 This is a schematic diagram of an assembly line used to produce component carriers;
[0047] Figure 2 This is a schematic diagram of a removal device for removing material from a component carrier according to an embodiment of the present invention;
[0048] Figure 3 This is a schematic diagram of the cleaning unit used in the removal device according to an embodiment of the present invention;
[0049] Figure 4 This is a schematic diagram of the housing of a removal device according to an embodiment of the present invention; and
[0050] Figure 5 yes Figure 4The diagram shows a detailed view of the housing, schematically illustrating the operation of removing the filter unit inside the device with the door open. Detailed Implementation
[0051] The illustrations in the accompanying drawings are schematic. It should be noted that in different drawings, similar or identical elements or features are given the same reference numerals or reference numerals that differ only in the first digit. To avoid unnecessary repetition, elements or features already described with respect to the foregoing embodiments will not be described again in subsequent descriptions.
[0052] Furthermore, spatially related terms, such as "front" and "back," "up" and "down," "left" and "right," are used to describe the relationship between one element and another as shown in the figures. Thus, spatially related terms can be applied to orientations in use that differ from those illustrated in the figures. Clearly, all such spatially related terms refer only to the orientations shown in the figures for ease of description and are not necessarily limiting, as the device according to the embodiments of this invention may be assumed to have orientations different from those illustrated in the figures during use. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0053] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0054] Figure 1 A schematic diagram of a production line for manufacturing component carriers, such as PCBs, equipped with one or more electronic components. The production line mainly includes a series of processes for processing the component carriers, such as developing, washing, etching, washing, film removal, and washing. Specifically, the washing process may include acid washing and / or alkaline washing. The removal device 1 for removing material from the component carrier according to this application is indicated herein by reference numeral 1. This removal device 1 can be arranged in the washing process after the film removal process, using a cleaning liquid to remove contaminants, such as residual unpeeled film, from the surface of the component carrier, thereby ensuring the surface cleanliness of the component carrier.
[0055] In some implementations, such as Figure 2The removal device 1 shown, for removing material from a component carrier, may include: a cleaning unit 2 configured to provide a liquid for removing material from the surface of the component carrier; a filter unit 3 located below the cleaning unit 2 configured to filter the liquid flowing out of the cleaning unit 2; and a housing 4 configured to enclose the filter unit 3, the housing 4 including at least one opening 42 for allowing the filter unit 3 to be manipulated by an operator (see [reference]). Figure 5 ).
[0056] In some implementations, such as Figure 2 and Figure 3 As shown, the cleaning unit 2 may include a cleaning device 22 and a holding device 24, which may be configured to support the component carrier.
[0057] In some embodiments, the retaining device 24 may include a first retaining device 242 and a second retaining device 244. The first retaining device 242 and the second retaining device 244 may be configured to abut against opposite main surfaces of the plate-shaped component carrier, thereby clamping the plate-shaped component carrier between the first retaining device 242 and the second retaining device 244, such as... Figure 3 As shown in the diagram, the first holding device 242 and the second holding device 244 can be driven by a drive unit to transport the component carrier through the cleaning device 22.
[0058] In some embodiments, the holding device 24 may include a plurality of rollers arranged side by side. For example, Figure 3 As shown, the holding device 24 may include two rows of rollers, one above the other, with the number of rollers in each row being the same or slightly different. Preferably, multiple rollers in each row of the two rows are arranged at equal intervals. The two rows of rollers can be arranged in a one-to-one correspondence (see [reference]). Figure 3 Alternatively, staggered spacing can be used (not shown in the figure) to achieve stable clamping of the component carrier.
[0059] In some embodiments, the distance between the upper and lower rows of rollers can be less than or equal to 1 cm, for example, it can be 0.9 cm, 0.8 cm, 0.7 cm, 0.6 cm, 0.5 cm, etc. It is understood that the distance between the two rows of rollers described herein refers to the distance between the two rows of rollers measured along a direction perpendicular to the main surface of the component carrier and perpendicular to the transport direction of the component carrier.
[0060] In some embodiments, the drive unit is an independent motor for synchronously driving the first holding device 242 and the second holding device 244, so that the first holding device 242 and the second holding device 244 stably transport the component carrier held therein.
[0061] Furthermore, it is understood that the first holding device 242 and the second holding device 244 shown in the figure are merely schematic. This holding device can also be configured in other ways to provide stable support for the component carrier and allow liquid from the cleaning device 22 to pass through the holding device 24 to clean the component carrier, before flowing smoothly to the filter unit 3 under gravity. For example, in an embodiment not shown, the holding device 24 can be a single-row holding device, such as a roller, on which the component carrier is placed directly, or the component carrier can be stabilized on the holding device by an auxiliary stabilizing device and transported through the cleaning device 22. Alternatively, the holding device 24 can also be a perforated conveyor belt to carry and transport the component carrier. In other embodiments, the holding device can also be configured as a robotic arm or a vacuum platform. For example, a robotic arm can carry the component and transport it through the cleaning device, or a vacuum platform can be provided on a conveyor belt to stably adsorb the component onto the platform by vacuum, and the platform transports the component through the cleaning device, thereby achieving cleaning of the surface of the component carrier.
[0062] In some embodiments, the cleaning device 22 may include a first cleaning device 222 and a second cleaning device 224. The first cleaning device 222 may be configured to supply liquid to a first primary surface of the component carrier held by the holding device 24, and the second cleaning device 224 may be configured to supply liquid to a second primary surface of the component carrier opposite to the first primary surface. Figure 3 As shown, the first cleaning device 222 may be disposed above the first holding device 242, while the second cleaning device 224 may be disposed below the second holding device 244.
[0063] In some embodiments, the first cleaning device 222 and the second cleaning device 224 may include one or more nozzles, which may be angled relative to the main surface of the component carrier to spray liquid onto the main surface. Preferably, the nozzles are pressurized nozzles, so that the pressurized cleaning liquid impacts the surface of the component carrier. In optional embodiments, the nozzles, preferably the nozzles of the first cleaning device 222, may also be ordinary water outlets, without pressurizing the cleaning liquid, and the cleaning is completed by the liquid impacting the surface of the component carrier solely by gravity.
[0064] In some embodiments, the first cleaning device 222 and / or the second cleaning device 224 may be arranged at an angle perpendicular to the main surface of the component carrier, or may be arranged at an angle relative to the main surface of the component carrier. For example, the included angle formed by the first cleaning device 222 and / or the second cleaning device 224 relative to the main surface of the component carrier may be 80°, 70°, 60°, 50°, 40°, 30°, etc., so that the cleaning liquid sprayed from the first cleaning device 222 and the second cleaning device 224 can effectively clean contaminants on the surface of the component carrier.
[0065] Understandable, Figure 2 and Figure 3 The arrangement of the first cleaning device 222 and the second cleaning device 224 shown is merely illustrative. The cleaning device 22 may include a single row of cleaning devices, preferably arranged on the upper main surface of the component carrier, such as... Figure 3 The cleaning device 222 shown above can pressurize the cleaning liquid and supply it to the upper surface of the component carrier, or allow the cleaning liquid to flow to the upper surface of the component carrier by gravity alone, thereby completing the cleaning action.
[0066] like Figure 2 As shown schematically, the production line includes four cleaning units 2. Figure 3 As shown schematically, each cleaning unit 2 is equipped with five first cleaning devices 222 and five second cleaning devices 224 arranged perpendicular to the transport direction of the component carrier. A first cleaning device 222 and a second cleaning device 224 are aligned vertically to form a pair of cleaning devices. It is understood that the number and arrangement of cleaning units, cleaning devices, etc., in the figure are only illustrative; the specific number can be adjusted according to the production line's output requirements. For example, more cleaning devices can be set on each side, such as 7, 8, 9, or 10. The number of cleaning devices set on the two main surfaces of the component carrier can also be different; for example, a staggered arrangement can be used, with 5 cleaning devices on one side and 6 cleaning devices on the other. Furthermore, the distance between two adjacent cleaning devices in the transport direction can be adjusted according to the coverage area of the liquid provided by each cleaning device and / or the vertical distance of the cleaning device from the surface of the component carrier. The larger the coverage area of the cleaning liquid, the sparser the cleaning devices can be arranged, i.e., the greater the distance between adjacent cleaning devices, and vice versa. The closer the cleaning device is to the surface of the component carrier, the more closely the cleaning devices can be arranged, that is, the smaller the distance between adjacent cleaning devices, and vice versa.
[0067] In some embodiments, the cleaning device 22 may also include multiple sets of cleaning devices, which may be arranged facing the two main surfaces of the component carrier. By arranging the multiple sets of cleaning devices in an alternating manner, the entire main surface can be cleaned more comprehensively. Preferably, the multiple sets of cleaning devices may also be arranged around the transport path of the component carrier. For example, one or more sets of cleaning devices may be arranged facing the two main surfaces and side surfaces of the component carrier, so that liquid can be directly supplied to each surface to achieve more efficient cleaning.
[0068] Of course, those skilled in the art will understand that while arranging the cleaning device around the component carrier is more efficient, as... Figure 3 The two rows of cleaning devices shown in the embodiment are sufficient because the component carrier is in the form of a thin plate, and the area of the side surface is very small compared to the main surface. The splashing of liquid provided to the main surface by the two rows of cleaning devices and the inclined liquid provided by the peripherally inclined cleaning devices are sufficient to clean the side surface of the component carrier.
[0069] In some embodiments, the cleaning device 22 can be kept continuously to effectively clean the component carrier. Furthermore, since the cleaning liquid is filtered multiple times and repeatedly by the filtration unit 3, it can be reused, preventing water waste.
[0070] In some implementations, such as Figure 2 As shown, the filter unit 3 may include a first filter device 32 and a second filter device 34. Liquid flowing out of the cleaning unit 2 passes sequentially through the first filter device 32 and the second filter device 34, and then returns to the cleaning unit 2, thereby forming a cleaning loop. Optionally, the filter unit 3 may be removably connected to the door 44.
[0071] The first filter device 32 can be configured to coarsely filter the liquid flowing out of the cleaning unit 2, and the second filter device 34 can be configured to finely filter the liquid subsequently returned to the cleaning unit 2. The first filter device 32 and the second filter device 34 may include filter screens, with the mesh size of the filter screen of the first filter device 32 being larger than that of the filter screen of the second filter device 34.
[0072] In some embodiments, at least one filter element may be disposed inside the first filter device 32 and / or the second filter device 34. The shape of the filter element may be adapted to the shape of the first filter device 32 and / or the second filter device 34, and in the case of multiple filter elements, the specific arrangement of the filter elements can be set as required, such as being laid flat or overlapping inside the filter device. The filter elements may be replaced periodically according to cleaning requirements. The materials forming the filter elements may include, but are not limited to, the following: quartz sand, PP cotton (polypropylene resin fiber), activated carbon, hollow fiber, etc.
[0073] In some embodiments, the first filter device 32 may be disposed below the cleaning unit 2 and enclosed by the housing 4. Optionally, the second filter device 34 may be disposed outside the housing 4 or disposed inside the housing 4 and enclosed by the housing 4, such that in the cleaning circuit, the second filter device 34 is located after the first filter device 32 to perform fine filtration of the cleaning liquid.
[0074] In some embodiments, the first filtering device 32 may be in the form of a filter plate.
[0075] In some embodiments, at least one door 44 may be provided on at least one opening 42 of the housing 4. The door 44 may include a transparent portion to allow the operator to view the operation of the filter unit 3 enclosed by the housing 4 in real time through the transparent portion. In particular, the transparent portion is made of glass.
[0076] In some embodiments, the door 44 may be connected to the first filter device 32, allowing the first filter device 32 to be removed from the removal device 1 when the door 44 is disassembled. Optionally, the door 44 and the first filter device 32 may be integrally connected or may be detachably connected.
[0077] In an optional embodiment, a handle is provided on the door 44 to facilitate the operator in opening the door 44. Optionally, a gripping element may also be provided on the first filter device 32 to facilitate the operator in pulling the first filter device 32 out of the housing 4. When the door 44 is connected to the first filter device 32, the operator can grasp the handle on the door 44 and pull the door 44 outward horizontally to move the first filter device 32 away from the housing 4, thereby replacing the first filter device 32.
[0078] The door 44 and the first filter device 32 can also be separate structures. The door 44 can be connected to one side of the opening 42, for example, by hinge. When the operator grasps the handle on the door 44, the door 44 pivots around the connected side to expose the opening 42. The operator then grasps the first filter device 32, for example, by grasping the grip, and removes the first filter device 32 from the housing 4, thereby replacing the first filter device 32.
[0079] In some implementations, door 44 may cover opening 42 in a sealed manner.
[0080] In some implementations, such as Figure 2 , Figure 4 and Figure 5As shown, the filter unit 3 may include multiple sets of first filter devices 32 and second filter devices 34, wherein each set of first filter devices 32 may be associated with a door 44, allowing the multiple sets of first filter devices 32 to be replaced independently of each other. Furthermore, the first filter devices 32 may be configured to be replaced without stopping the removal device 1. Optionally, the filter unit 3 may also include a single first filter device 32 in the form of a plate with a larger area.
[0081] In some embodiments, the removal device 1 may further include a storage tank 5 for storing liquid, which may be configured to store cleaning liquid. A first filter device 32 may be located at the inlet of the storage tank 5, and a second filter device 34 may be located at the outlet of the storage tank 5.
[0082] In some embodiments, the top surface of the housing 4 may also include a transparent portion, such as a transparent portion formed of glass, to facilitate the operator's observation from above of the conveying of the component carrier and the operation of the cleaning unit 2.
[0083] Combination Figures 2 to 5 The operating principle of the removal device for removing material from a component carrier provided in the embodiment shown in this utility model is as follows: Cleaning liquid is supplied to the surface of the component carrier by gravity and / or by the pressurization of the cleaning device 22. After the liquid washes the surface of the component carrier, it falls into the first filter device 32 below. The first filter device 32 performs coarse filtration on the liquid. The coarsely filtered liquid flows into the storage tank 5 through the water inlet end of the storage tank 5. Since the pollutants with larger particle sizes are blocked above the upper surface of the first filter device 32, they cannot cause any pollution to the liquid in the storage tank 5. Then, the liquid in the storage tank 5 is transported through the water outlet end of the storage tank 5 by a suction device or a pumping device, and then transported to the second filter device 34. The mesh size of the filter screen of the second filter device 34 is smaller than that of the filter screen of the first filter device 32, thereby performing further fine filtration on the liquid, so that all the pollutants in the liquid are filtered out. The finely filtered liquid is transported back to the cleaning device 22 of the cleaning unit 2, thereby forming a cleaning loop. Understandably, although the cleaning fluid is filtered repeatedly, the operator can also replenish or replace the cleaning fluid in tank 5 periodically in order to better clean the components and carriers, for example, once every half month or once a month, and the replacement frequency can be determined according to the specific production situation.
[0084] Therefore, the removal device for removing material from a component carrier provided by the embodiments of this utility model can not only efficiently clean the component carrier and effectively filter the cleaning liquid, so that the residue will not contaminate the surface of the cleaned component carrier and will not accumulate in the liquid storage tank, but also allow real-time viewing of the cleaning situation inside the housing 4 through the opening on the side of the housing 4 or the transparent glass window on the top, and adjust the operation of each component of the removal device 1 according to the specific cleaning situation, such as deciding to increase or decrease the flow rate of the liquid supplied by the cleaning device 22, increase or decrease the speed at which the holding device 24 transports the component carrier, or the frequency of replacing the filter unit 3, etc.
[0085] List of reference numerals in the attached diagram:
[0086] 1. Remove the device
[0087] 2 Cleaning Unit
[0088] 22 Cleaning device
[0089] 222 First Cleaning Device
[0090] 224 Second Cleaning Device
[0091] 24 Holding device
[0092] 242 First Holding Device
[0093] 244 Second Holding Device
[0094] 3 Filter Units
[0095] 32 First Filtering Device
[0096] 34 Second filtration device
[0097] 4. Shell
[0098] 42 Opening
[0099] 44 doors
[0100] 5. Storage tanks.
Claims
1. A removal device for removing material from a component carrier, characterized in that, The removal device (1) includes: A cleaning unit (2) is configured to provide a liquid for removing material from the surface of the component carrier, and the cleaning unit (2) includes a cleaning device (22) and a holding device (24) configured to support the component carrier. The filter unit (3) located below the cleaning unit (2) is configured to filter the liquid flowing out of the cleaning unit (2). The housing (4) is configured to enclose the filter unit (3) and includes at least one opening (42) for the filter unit (3) to be manipulated by an operator.
2. The removal device for removing material from a component carrier according to claim 1, characterized in that, The filtration unit (3) includes a first filtration device (32) and a second filtration device (34). The liquid flowing out of the cleaning unit (2) passes through the first filtration device (32) and the second filtration device (34) in sequence, and then returns to the cleaning unit (2), thereby forming a cleaning loop.
3. The removal device for removing material from a component carrier according to claim 2, characterized in that, The first filtration device (32) is configured to coarsely filter the liquid flowing out of the cleaning unit (2), and the second filtration device (34) is configured to finely filter the liquid that subsequently returns to the cleaning unit (2).
4. The removal device for removing material from a component carrier according to claim 1, characterized in that, The cleaning device (22) includes a first cleaning device (222) and a second cleaning device (224), the first cleaning device (222) being configured to provide liquid to a first main surface of the component carrier, and the second cleaning device (224) being configured to provide liquid to a second main surface of the component carrier opposite to the first main surface.
5. The removal device for removing material from a component carrier according to claim 1, characterized in that, The retaining device (24) includes a first retaining device (242) and a second retaining device (244), which are respectively positioned to abut against two opposite main surfaces of the component carrier, thereby clamping the component carrier between the first retaining device (242) and the second retaining device (244).
6. The removal device for removing material from a component carrier according to any one of claims 1, 4, and 5, characterized in that, The cleaning device (22) includes one or more nozzles that are angled relative to the main surface of the component carrier, thereby spraying liquid onto the main surface.
7. The removal device for removing material from a component carrier according to any one of claims 1, 4, and 5, characterized in that, The holding device (24) includes multiple rollers arranged side by side.
8. The removal device for removing material from a component carrier according to claim 2 or 3, characterized in that, At least one door (44) is provided on at least one opening (42) of the housing (4), the door (44) including a transparent portion so that the operator can view the operation of the filter unit (3) enclosed by the housing (4) in real time through the transparent portion.
9. The removal device for removing material from a component carrier according to claim 8, characterized in that, The door (44) is connected to the first filter device (32) so that the first filter device (32) can be removed from the removal device (1) when the door (44) is disassembled.
10. The removal device for removing material from a component carrier according to claim 9, characterized in that, The door (44) is integrally connected to the first filter device (32) or is detachably connected.
11. The removal device for removing material from a component carrier according to claim 8, characterized in that, The door (44) covers the opening (42) in a sealed manner.
12. The removal device for removing material from a component carrier according to claim 2 or 3, characterized in that, The removal device (1) also includes a storage tank (5) for storing the liquid, with the first filter (32) disposed at the inlet end of the storage tank (5) and the second filter (34) disposed at the outlet end of the storage tank (5).
13. The removal device for removing material from a component carrier according to claim 2 or 3, characterized in that, The first filter device (32) and the second filter device (34) include filter screens, and the mesh size of the filter screen of the first filter device (32) is larger than the mesh size of the filter screen of the second filter device (34).
14. The removal device for removing material from a component carrier according to claim 8, characterized in that, The door (44) is provided with a handle so that the operator can open the door (44).
15. The removal device for removing material from a component carrier according to claim 2 or 3, characterized in that, The first filter device (32) is in the form of a filter plate.
16. The removal device for removing material from a component carrier according to claim 1, characterized in that, The housing (4) is configured to also enclose the cleaning unit (2).
17. The removal device for removing material from a component carrier according to claim 1, characterized in that, The holding device (24) is configured to be driven by a drive unit to transport the component carrier through the cleaning device (22).
18. The removal device for removing material from a component carrier according to claim 17, characterized in that, The drive unit is a motor.
19. The removal device for removing material from a component carrier according to claim 7, characterized in that, The distance between the rollers arranged side by side is less than 1 cm.
20. The removal device for removing material from a component carrier according to claim 2 or 3, characterized in that, The first filter device (32) is configured to be replaced without the removal device (1) stopping operation.
21. The removal device for removing material from a component carrier according to claim 8, characterized in that, The filter unit (3) includes multiple sets of first filter devices (32) and second filter devices (34), each set of first filter devices (32) and second filter devices (34) being associated with a door (44).