A cleaning device for wafer packaging boxes
By combining a heated ultrasonic cleaning frame and a pure water overflow rinsing unit, the problem of difficult particle removal from the surface of wafer packaging boxes is solved, achieving efficient cleaning and ensuring the high cleanliness of the wafer packaging boxes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHAO YANG TONGMEI XTAL TECHNOLOGY CO LTD
- Filing Date
- 2025-04-09
- Publication Date
- 2026-05-29
Smart Images
Figure CN224294128U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging box cleaning technology, and in particular to a cleaning device for wafer packaging boxes. Background Technology
[0002] Semiconductor wafers mainly refer to high-value-added products in the form of sheets (round or square) made from semiconductor materials. They are commonly called wafers, such as Si wafers, GaAs wafers, and Ge wafers, and are widely used in the semiconductor industry.
[0003] In semiconductor wafer factories, wafers that have undergone multiple processing steps and cleaning have highly clean surfaces. They need to be packed in specific boxes, then vacuum-packed with nitrogen, and delivered to customers.
[0004] Before leaving the supplier's factory, the packaging boxes of the chips undergo surface treatment and cleaning. In the existing technology, cleaning machines are widely used to directly clean the packaging boxes in batches. However, the particles on the surface of the packaging boxes are not easy to remove by cleaning, resulting in poor cleaning effect and failure to meet the requirements of the chip factory. Utility Model Content
[0005] In view of the above, this utility model provides a cleaning device for wafer packaging boxes to solve the problems mentioned in the background art, and specifically discloses the following:
[0006] A cleaning device for a wafer packaging box includes a cleaning box, wherein a first cleaning tank and a second cleaning tank are sequentially arranged inside the cleaning box, a heatable ultrasonic cleaning frame is provided in the first cleaning tank, and an overflow rinsing unit is provided in the second cleaning tank.
[0007] The outer wall of the heatable ultrasonic cleaning frame is equipped with multiple ultrasonic transducers.
[0008] The heated ultrasonic cleaning frame is equipped with a temperature control mechanism.
[0009] The overflow rinsing unit is provided with a water inlet at the bottom and is connected to an external pure water source, while the second cleaning tank is provided with a drain outlet at the bottom.
[0010] Furthermore, the temperature control mechanism includes an electric heating rod and a temperature control device, wherein the temperature control device is electrically connected to the electric heating rod.
[0011] Furthermore, the first cleaning tank is filled with pure water and surfactant, and the ratio of pure water to surfactant is 1:200-5000.
[0012] Furthermore, the overflow rinsing unit includes a first overflow rinsing frame and a second overflow rinsing frame sequentially disposed within the second cleaning tank;
[0013] Both the first overflow rinsing frame and the second overflow rinsing frame are equipped with water inlets at the bottom and are connected to an external pure water source.
[0014] Furthermore, multiple ultrasonic transducers are provided on the outer walls of both the first overflow rinsing frame and the second overflow rinsing frame.
[0015] The beneficial effects of this utility model are as follows:
[0016] In this invention, ultrasonic vibration is used to clean the wafer packaging box inside the heatable ultrasonic cleaning frame. The temperature of the liquid inside the heatable ultrasonic cleaning frame is adjusted by a temperature control mechanism, which can more effectively clean the particles and dirt on the wafer packaging box. The overflow rinsing unit uses pure water overflow to clean the wafer packaging box, which can ensure that the wafer packaging box is cleaner and free of pollution. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of a cleaning device for a wafer packaging box according to the present invention.
[0019] In the figure:
[0020] 1-Cleaning tank; 11-First cleaning tank; 12-Second cleaning tank; 2-Heated ultrasonic cleaning frame; 3-First overflow rinsing frame; 4-Second overflow rinsing frame; 5-Ultrasonic transducer. Detailed Implementation
[0021] The technical solutions in the embodiments of this utility model are described clearly and completely below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or components is not necessarily limited to those steps or components explicitly listed, but may include other steps or components not explicitly listed or inherent to such processes, methods, products, or devices.
[0023] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0024] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0025] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0026] See appendix Figure 1 This utility model discloses a cleaning device for a chip packaging box, including a cleaning box 1. The cleaning box 1 is provided with a first cleaning tank 11 and a second cleaning tank 12 in sequence. The first cleaning tank 11 is provided with a heatable ultrasonic cleaning frame 2, and the second cleaning tank 12 is provided with an overflow rinsing unit.
[0027] Multiple ultrasonic transducers 5 are provided on the outer wall of the heatable ultrasonic cleaning frame 2;
[0028] The heated ultrasonic cleaning frame 2 is equipped with a temperature control mechanism.
[0029] The overflow rinsing unit has a water inlet at the bottom, which is connected to an external pure water source, and the second cleaning tank 12 has a drain outlet at the bottom.
[0030] In this embodiment, an external pure water source flows into the overflow rinsing unit through the inlet under the action of a water pump, and overflows from the top of the overflow rinsing unit into the second cleaning tank 12. The second cleaning tank 12 discharges the overflowed water through the drain outlet, forming a pure water overflow cleaning method.
[0031] The temperature control mechanism includes an electric heating rod and a temperature control device, with the temperature control device electrically connected to the electric heating rod.
[0032] In this embodiment, the electric heating rod and temperature control device are both existing technologies and will not be described in detail here.
[0033] The first cleaning tank 11 is filled with pure water and surfactant, with a ratio of pure water to surfactant of 1:200-5000.
[0034] The overflow rinsing unit includes a first overflow rinsing frame 3 and a second overflow rinsing frame 4, which are sequentially arranged in the second cleaning tank 12.
[0035] Both the first overflow rinsing frame 3 and the second overflow rinsing frame 4 are equipped with water inlets at the bottom and are connected to an external pure water source.
[0036] Multiple ultrasonic transducers 5 are provided on the outer walls of both the first overflow rinsing frame 3 and the second overflow rinsing frame 4.
[0037] How to use:
[0038] S1: Unpack the chip packaging boxes and sort them.
[0039] S2: Pour pure water into the heatable ultrasonic cleaning frame 2 and add surfactant at a ratio of 1:200-5000.
[0040] S3: Increase the water temperature inside the heated ultrasonic cleaning frame 2 to a specific temperature (20-80 degrees Celsius).
[0041] S4: Place the chip packaging box inside the heatable ultrasonic cleaning frame 2, and make sure the pure water inside completely covers the chip packaging box.
[0042] S5: Turn on the ultrasonic transducer 5 on the heated ultrasonic cleaning frame 2 and vibrate the wafer packaging box inside the heated ultrasonic cleaning frame 2 for 10-60 minutes.
[0043] S6: External pure water source is injected into the first overflow rinsing frame 3 and the second overflow rinsing frame 4 under the action of water pump, so that it reaches the overflow state and is maintained in the overflow state. The ultrasonic transducer 5 on the first overflow rinsing frame 3 and the second overflow rinsing frame 4 is turned on to maintain ultrasonic oscillation of the pure water in the first overflow rinsing frame 3 and the second overflow rinsing frame 4.
[0044] S7: Take out the chip packaging box that has been cleaned by ultrasonic vibration from the heatable ultrasonic cleaning frame 2, and put it into the first overflow rinsing frame 3 and the second overflow rinsing frame 4 in sequence, and vibrate and clean it in each overflow rinsing frame for 10-60 minutes.
[0045] S8: After cleaning, remove the wafer packaging box, dry it with hot nitrogen gas, and store it for later use.
[0046] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A cleaning device for a wafer packaging box, characterized in that, The system includes a cleaning tank (1), in which a first cleaning tank (11) and a second cleaning tank (12) are arranged in sequence. The first cleaning tank (11) is provided with a heatable ultrasonic cleaning frame (2), and the second cleaning tank (12) is provided with an overflow rinsing unit. The outer wall of the heatable ultrasonic cleaning frame (2) is provided with multiple ultrasonic transducers (5); The heated ultrasonic cleaning frame (2) is equipped with a temperature control mechanism. The overflow rinsing unit is provided with a water inlet at the bottom and is connected to an external pure water source, and the second cleaning tank (12) is provided with a drain outlet at the bottom.
2. The cleaning device for a wafer packaging box according to claim 1, characterized in that, The temperature control mechanism includes an electric heating rod and a temperature control device, wherein the temperature control device is electrically connected to the electric heating rod.
3. The cleaning device for a wafer packaging box according to claim 1, characterized in that, The first cleaning tank (11) is filled with pure water and surfactant, and the ratio of pure water to surfactant is 1:200-5000.
4. The cleaning device for a wafer packaging box according to claim 1, characterized in that, The overflow rinsing unit includes a first overflow rinsing frame (3) and a second overflow rinsing frame (4) sequentially disposed in the second cleaning tank (12); Both the first overflow rinsing frame (3) and the second overflow rinsing frame (4) are provided with water inlets at the bottom and are connected to an external pure water source.
5. The cleaning apparatus for a wafer packaging box according to claim 4, characterized in that, Multiple ultrasonic transducers (5) are provided on the outer walls of the first overflow rinsing frame (3) and the second overflow rinsing frame (4).