Dry cleaning device for semiconductor components

Abstract

The utility model discloses a kind of dry cleaning devices for semiconductor parts, more specifically in the technical field of semiconductor parts cleaning, including the cleaning tank with hinged sealing door, the inside of the cleaning tank is sequentially provided with liquid nitrogen cleaning assembly and blowing assembly.The utility model is by being provided with low-temperature cleaning assembly, so that the device has low-temperature cleaning function, utilize the low temperature and impact force of dry ice particles to remove the large particle pollutants on parts, reduce subsequent cleaning pressure, then use liquid nitrogen cooling to make microscopic pollutants brittle, adopt dry ice and the double medium collaborative cleaning mode of liquid nitrogen, not only can realize to semiconductor parts all-around, multilevel depth cleaning, more avoid the risk that single medium causes due to excessive effect and causes pollutant residual accumulation or aggravate with parts, while guaranteeing the integrity of parts surface material, provide more reliable, stable super-clean cleaning guarantee for semiconductor manufacturing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor component cleaning technology, and specifically to a dry-cold cleaning device for semiconductor components. Background Technology

[0002] Components used in the semiconductor technology field often have high requirements for cleanliness, surface uniformity, and process stability. Tiny impurities and dust, as well as uneven particle sizes, can affect the performance of semiconductors. Therefore, cleaning, polishing, and impurity removal are very important processes in the semiconductor field. Many processes require non-standard customization of existing equipment to meet their requirements. Traditional cleaning devices use organic chemical solvents or reagents to dissolve organic residues and then clean the semiconductor with water. Although this method can clean semiconductors, it may damage the surface coating of the components, causing damage to the semiconductor. Therefore, dry and cold cleaning devices are used to clean semiconductor components.

[0003] Application number 202221710629.1 discloses a dry-cooling cleaning device for semiconductor components, "including a cleaning device body, a temporary storage box fixedly connected to the top of the cleaning chamber of the cleaning device body, a liquid nitrogen tank and a blower box arranged on the top of the temporary storage box, and connecting pipes connected to the output ends of the liquid nitrogen tank and the blower box, with a solenoid valve arranged in the middle of the connecting pipe." In this method, the liquid nitrogen tank and the blower box work together to achieve the removal of contaminants through the alternating action of liquid nitrogen and hot air. However, most dry-cooling cleaning devices rely primarily on liquid nitrogen cooling, depending on the physical action of a single medium, lacking the synergistic effect of multiple cleaning methods. In actual cleaning processes... In the face of complex contaminants adhering to the surface of semiconductor components, such as stubborn metal oxides and high molecular organic residues, liquid nitrogen cooling alone can only cause some dust to fall off due to thermal expansion and contraction. It is difficult to deal with the differences in characteristics of different types of contaminants, and the cleaning efficiency and cleanliness cannot meet the stringent requirements of advanced semiconductor manufacturing. At the same time, the lack of a multi-media step-by-step cleaning process can easily lead to the accumulation of contaminant residues. In fact, in the extremely cold environment of liquid nitrogen, some contaminants are more tightly bound to the surface of components, which not only cannot be completely removed, but may also cause irreversible damage to the surface material of components, making it difficult to achieve fine and comprehensive cleaning of semiconductor components. Utility Model Content

[0004] The purpose of this invention is to provide a dry and cold cleaning device for semiconductor components to address the aforementioned shortcomings in the technology.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a dry-cooling cleaning device for semiconductor components, comprising a cleaning chamber hinged with a sealed door, wherein a liquid nitrogen cleaning assembly and a blowing assembly are sequentially arranged inside the cleaning chamber; the liquid nitrogen cleaning assembly includes a first fixed side plate fixedly connected to the inner wall of the cleaning chamber, a first temporary storage box connected to the upper end of the inner wall of the first fixed side plate, a first inlet pipe being connected through the upper end of the first temporary storage box, the inlet end of the first inlet pipe penetrating and extending to the outside of the cleaning chamber; the liquid nitrogen cleaning assembly is used to introduce liquid nitrogen to cool and clean the components; the blowing assembly is used to blow off residual dust on the surface of the components; and a perforated plate is fixedly connected to the inner wall of the cleaning chamber. The support plate has a receiving hopper at its lower end and inside the cleaning chamber. An exhaust pipe is connected through one side of the outer wall of the receiving hopper. The end of the exhaust pipe away from the receiving hopper extends through and to the outside of the cleaning chamber. A low-temperature cleaning component is provided on one side of the liquid nitrogen cleaning component. The low-temperature cleaning component is used to introduce dry ice particles to perform a low-temperature initial cleaning of the parts. The low-temperature cleaning component includes a second fixed side plate fixedly connected to the inner wall of the cleaning chamber. A second temporary storage box is connected to the upper end of the inner wall of the second fixed side plate. A second inlet pipe is connected through the upper end of the second temporary storage box. The inlet end of the second inlet pipe extends through and to the outside of the cleaning chamber. Solenoid valves are respectively installed on the outside of the first inlet pipe and the first inlet pipe.

[0006] Preferably, the upper end of the placement tray is provided with a plurality of clamping components. Each clamping component includes two fixing plates symmetrically and fixedly connected to the upper surface of the placement tray. A connecting plate is rotatably connected to the side wall of each fixing plate, and an elastic telescopic rod is connected to the side of the connecting plate away from the fixing plate.

[0007] Preferably, the free end of the elastic telescopic rod is connected to a clamping plate, and a polyurethane elastomer block is fixedly connected in a pre-reserved slot at the clamping end of the clamping plate.

[0008] Specifically, in use, the component is first clamped between the two clamping plates, with the polyurethane elastomer block in contact with the component. Utilizing the unique elasticity and adaptability of the polyurethane elastomer block, not only is a tight fit and fixation achieved, but hard damage to the component is also avoided. Then, the sealing door is closed, dry ice particles are introduced into the second inlet pipe, and liquid nitrogen is introduced into the first inlet pipe, so that the dry ice particles and liquid nitrogen are respectively input into the first temporary storage box and the second temporary storage box. Subsequently, they are discharged through the small hole at the bottom of the temporary storage box. The low temperature and impact force of the dry ice particles are used to initially remove large particulate contaminants on the component, reducing the pressure of subsequent cleaning. Then, liquid nitrogen is used to cool and embrittle micro-contaminants. Then, the blower of the blowing assembly is started, and cold air enters the air box through the air duct, and then blows onto the component through the air outlet, blowing off the dust remaining on the surface of the workpiece. The cleaned contaminants and dust fall into the receiving hopper through the perforated plate on the support plate. Finally, the exhaust fan at the exhaust pipe connection end (not shown in the figure) is started to extract and discharge the used liquid nitrogen and the cleaned dust.

[0009] Preferably, a partition is fixedly connected to the upper end of the inner wall of the cleaning tank.

[0010] Specifically, the partition can divide the cleaning chamber inside the cleaning box into different cleaning areas, avoiding mutual interference between the dry ice and liquid nitrogen cleaning stages.

[0011] Preferably, the upper end of the support plate is provided with a rotating structure, the rotating structure including a placement plate rotatably connected to the upper end surface of the support plate, the upper end surface of the placement plate having a plurality of through slots equidistantly and uniformly opened, and the outer side wall of the placement plate having a groove between two through slots.

[0012] Preferably, the rotating structure further includes a drive motor installed on the lower end face of the support plate. The output end of the drive motor passes through the support plate and is connected to a connecting seat. A rotating block is fixedly connected to the upper end face of the connecting seat. The rotating block is located on one side of the placement plate. A connecting horizontal bar is provided on the outer wall of the connecting seat. A protrusion that cooperates with the groove is fixedly connected to the upper end face of the connecting horizontal bar.

[0013] Through the above technical solution:

[0014] During the cleaning process, the drive motor drives the connecting seat to rotate. At this time, the protrusion on the connecting crossbar is embedded in and slides in the groove, thereby driving the placement plate to rotate. This allows the parts to move in an orderly manner through different cleaning areas, achieving a seamless connection from dry ice rough cleaning to liquid nitrogen fine cleaning. Multi-stage cleaning operations can be completed without manual intervention, greatly improving cleaning efficiency.

[0015] Preferably, the end of the connecting plate away from the elastic telescopic rod is connected to a connecting column, an electromagnetic coil is wound around the outside of the connecting column, and a protective cover is fitted around the electromagnetic coil.

[0016] Preferably, the inner walls of the first fixed side plate and the second fixed side plate are respectively equipped with permanent magnets that cooperate with the electromagnetic coil.

[0017] Through the above technical solution:

[0018] After the parts are moved to the corresponding cleaning area, the permanent magnet senses the energized electromagnetic coil. After being energized, the magnetic field generated by the electromagnetic coil interacts with the permanent magnet, instantly generating a driving force that drives the elastic telescopic rod and the clamping plate to rotate. This allows the parts to be flipped over, so that each surface of the parts is exposed to the cleaning medium in sequence. Compared with the traditional static cleaning method, this effectively avoids the problem of dirt residue caused by blind spots in local cleaning, ensuring the cleaning effect.

[0019] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0020] 1. By setting up a low-temperature cleaning component, the device is equipped with a low-temperature cleaning function. The low temperature and impact force of dry ice particles are used to initially remove large particulate contaminants on the components, reducing the pressure of subsequent cleaning. Then, liquid nitrogen is used to cool and embrittle micro-contaminants. The dual-media synergistic cleaning mode of dry ice and liquid nitrogen can not only achieve comprehensive and multi-layer deep cleaning of semiconductor components, but also avoid the risk of contaminant residue accumulation or aggravation of combination with components due to excessive action of a single medium. While ensuring the integrity of the surface material of the components, it provides a more reliable and stable ultra-clean cleaning guarantee for semiconductor manufacturing.

[0021] 2. By setting up a rotating structure, the parts can move orderly through different cleaning areas during the cleaning process, achieving a seamless connection from dry ice rough cleaning to liquid nitrogen fine cleaning. Multi-stage cleaning operations can be completed without manual intervention, greatly improving cleaning efficiency.

[0022] 3. By setting permanent magnets, connecting columns and electromagnetic coils, the parts can be flipped after being moved to the corresponding cleaning area, so that each surface of the parts is exposed to the cleaning medium in turn. Compared with the traditional static cleaning method, it effectively avoids the problem of dirt residue caused by local cleaning blind spots and ensures the cleaning effect. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0024] Figure 1 This is one of the overall structural schematic diagrams of this utility model;

[0025] Figure 2 This is the second schematic diagram of the overall structure of this utility model;

[0026] Figure 3 This is a schematic diagram showing the sealed door of this utility model when it is open;

[0027] Figure 4 This is one of the cross-sectional schematic diagrams of this utility model;

[0028] Figure 5 This is the second cross-sectional schematic diagram of the present invention;

[0029] Figure 6 This is a schematic diagram showing the connection between the rotating structure and the clamping assembly of this utility model;

[0030] Figure 7 This is a schematic diagram of the low-temperature cleaning component of this utility model;

[0031] Figure 8 This is one of the schematic diagrams of the rotating structure of this utility model;

[0032] Figure 9 This is the second schematic diagram of the rotating structure of this utility model;

[0033] Figure 10 This is an enlarged schematic diagram of the clamping component of this utility model.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1. Cleaning box; 2. Liquid nitrogen cleaning assembly; 21. First fixed side plate; 22. First temporary storage box; 23. First inlet pipe; 3. Blowing assembly; 4. Bearing plate; 5. Receiving hopper; 6. Partition plate; 7. Low temperature cleaning assembly; 71. Second fixed side plate; 72. Second temporary storage box; 73. Second inlet pipe; 8. Rotating structure; 81. Placement tray; 82. Through groove; 83. Groove; 84. Drive motor; 85. Connecting seat; 86. Rotating block; 87. Connecting crossbar; 88. Protrusion; 9. Clamping assembly; 91. Fixed plate; 92. Connecting plate; 93. Elastic telescopic rod; 94. Clamping plate; 95. Polyurethane elastomer block; 10. Permanent magnet; 11. Connecting column; 12. Electromagnetic coil; 13. Exhaust pipe. Detailed Implementation

[0036] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0037] This utility model provides, for example Figures 1-7 A dry-cold cleaning apparatus for semiconductor components is shown, comprising:

[0038] A cleaning chamber 1 with a hinged, sealed door is provided. Inside the cleaning chamber 1, a liquid nitrogen cleaning assembly 2 and a blower assembly 3 are arranged sequentially. The liquid nitrogen cleaning assembly 2 includes a first fixed side plate 21 fixedly connected to the inner wall of the cleaning chamber 1. A first temporary storage box 22 is connected to the upper end of the inner wall of the first fixed side plate 21. A first inlet pipe 23 is connected to the upper end of the first temporary storage box 22. The inlet end of the first inlet pipe 23 passes through and extends to the outside of the cleaning chamber 1. The liquid nitrogen cleaning assembly 2 is used to introduce liquid nitrogen to cool and clean the parts. The blower assembly 3 is used to blow off the dust remaining on the surface of the parts. A support plate 4 with a perforated plate is fixedly connected to the inner wall of the cleaning chamber 1. The lower end of the support plate 4, located inside the cleaning chamber 1, is provided with a... The hopper 5 has an exhaust pipe 13 connected through one side of its outer wall. The end of the exhaust pipe 13 away from the hopper 5 extends through and to the outside of the cleaning chamber 1. A low-temperature cleaning component 7 is provided on one side of the liquid nitrogen cleaning component 2. The low-temperature cleaning component 7 is used to introduce dry ice particles to perform a low-temperature initial cleaning of the parts. The low-temperature cleaning component 7 includes a second fixed side plate 71 fixedly connected to the inner wall of the cleaning chamber 1. A second temporary storage box 72 is connected to the upper end of the inner wall of the second fixed side plate 71. A second inlet pipe 73 is connected through to the upper end of the second temporary storage box 72. The inlet end of the second inlet pipe 73 extends through and to the outside of the cleaning chamber 1. A solenoid valve is installed on the outside of the first inlet pipe 23.

[0039] Further, see Figure 7 As shown, a plurality of clamping components 9 are evenly provided on the upper end of the placement tray 81. Each clamping component 9 includes two fixing plates 91 symmetrically fixedly connected to the upper end face of the placement tray 81. A connecting plate 92 is rotatably connected to the side wall of each fixing plate 91. An elastic telescopic rod 93 is connected to the side of the connecting plate 92 away from the fixing plate 91.

[0040] The free end of the elastic telescopic rod 93 is connected to a clamping plate 94, and a polyurethane elastomer block 95 is fixedly connected in a pre-drilled slot at the clamping end of the clamping plate 94.

[0041] Specifically, in use, the component is first clamped between two clamping plates 94, with the polyurethane elastomer block 95 in contact with the component. Utilizing the unique elasticity and adaptability of the polyurethane elastomer block 95, not only is a tight fit and fixation achieved, but also hard damage to the component is avoided. Then, the sealing door is closed, dry ice particles are introduced into the second inlet pipe 73, and liquid nitrogen is introduced into the first inlet pipe 23, allowing the dry ice particles and liquid nitrogen to be respectively input into the first temporary storage box 22 and the second temporary storage box 72. Subsequently, they are discharged through the small hole at the bottom of the temporary storage box. The dry ice particles are then used... The low temperature and impact force initially remove large particulate contaminants from the parts, reducing the pressure of subsequent cleaning. Then, liquid nitrogen is used to cool and embrittle micro-contaminants. The blower of the blowing assembly 3 is then started, and cold air enters the air box through the air duct and is then blown onto the parts through the air outlet, blowing off the dust remaining on the surface of the workpiece. The cleaned contaminants and dust fall into the receiving hopper 5 through the perforated plate on the support plate 4. Finally, the exhaust fan at the connection end of the exhaust pipe 13 (not shown in the figure) is started to extract and discharge the used liquid nitrogen and the cleaned dust.

[0042] Further, see Figure 3 , Figure 4 and Figure 6 As shown, a partition 6 is fixedly connected to the upper end of the inner wall of the cleaning tank 1.

[0043] Specifically, the partition 6 can divide the cleaning chamber inside the cleaning box 1 into different cleaning areas, avoiding mutual interference between the dry ice and liquid nitrogen cleaning stages.

[0044] This utility model provides, for example Figures 3-6 , Figure 8 and Figure 9 The present invention relates to a dry and cold cleaning device for semiconductor components, wherein a rotating structure 8 is provided on the upper end of a support plate 4, the rotating structure 8 including a placement plate 81 rotatably connected to the upper end surface of the support plate 4, the upper end surface of the placement plate 81 having a plurality of through slots 82 equidistantly and uniformly opened, and a groove 83 being opened on the outer side wall of the placement plate 81 between two through slots 82.

[0045] The rotating structure 8 also includes a drive motor 84 mounted on the lower end face of the support plate 4. The output end of the drive motor 84 passes through the support plate 4 and is connected to a connecting seat 85. A rotating block 86 is fixedly connected to the upper end face of the connecting seat 85. The rotating block 86 is located on one side of the placement plate 81. A connecting crossbar 87 is provided on the outer wall of the connecting seat 85. A protrusion 88 that cooperates with the groove 83 is fixedly connected to the upper end face of the connecting crossbar 87.

[0046] Through the above technical solution:

[0047] During the cleaning process, the drive motor 84 drives the connecting seat 85 to rotate. At this time, the protrusion 88 on the connecting crossbar 87 is embedded in and slides in the groove 83, thereby driving the placement tray 81 to rotate, so that the parts can move in an orderly manner through different cleaning areas. This achieves a seamless connection from dry ice rough cleaning to liquid nitrogen fine cleaning, and can complete multi-stage cleaning operations without manual intervention, greatly improving cleaning efficiency.

[0048] This utility model provides, for example Figure 7 and Figure 10 The device shown is a dry and cold cleaning apparatus for semiconductor components. The end of the connecting plate 92 away from the elastic telescopic rod 93 is connected to a connecting post 11. An electromagnetic coil 12 is wound around the outside of the connecting post 11, and a protective cover is fitted around the electromagnetic coil 12.

[0049] The inner walls of the first fixed side plate 21 and the second fixed side plate 71 are respectively equipped with permanent magnets 10 that cooperate with electromagnetic coils 12.

[0050] Through the above technical solution:

[0051] After the parts are moved to the corresponding cleaning area, the permanent magnet 10 senses the energized electromagnetic coil 12. After being energized, the magnetic field generated by the electromagnetic coil 12 interacts with the permanent magnet 10, instantly generating a driving force that drives the elastic telescopic rod 93 and the clamping plate 94 to rotate. This allows the parts to be flipped over, so that each surface of the parts is exposed to the cleaning medium in sequence. Compared with the traditional static cleaning method, this effectively avoids the problem of dirt residue caused by blind spots in local cleaning, ensuring the cleaning effect.

[0052] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A dry-cold cleaning apparatus for semiconductor components, characterized in that, include: A cleaning box (1) with a hinged sealed door is provided inside the cleaning box (1) with a liquid nitrogen cleaning assembly (2) and a blower assembly (3) in sequence. The liquid nitrogen cleaning assembly (2) is used to introduce liquid nitrogen to cool and clean the parts, and the blower assembly (3) is used to blow off the dust remaining on the surface of the parts. A support plate (4) with a hollow plate is fixedly connected to the inner wall of the cleaning box (1). A low-temperature cleaning component (7) is provided on one side of the liquid nitrogen cleaning component (2). The low-temperature cleaning component (7) is used to introduce dry ice particles to perform a low-temperature initial cleaning of the parts. The low-temperature cleaning component (7) includes a second fixed side plate (71) fixedly connected to the inner wall of the cleaning box (1). A second temporary storage box (72) is connected to the upper end of the inner wall of the second fixed side plate (71). A second inlet pipe (73) is connected to the upper end of the second temporary storage box (72). The inlet end of the second inlet pipe (73) extends through and extends to the outside of the cleaning box (1). A partition plate (6) is fixedly connected to the upper end of the inner wall of the cleaning box (1).

2. The dry cooling cleaning apparatus for semiconductor components according to claim 1, characterized in that: The upper end of the support plate (4) is provided with a rotating structure (8). The rotating structure (8) includes a placement plate (81) rotatably connected to the upper end surface of the support plate (4). The upper end surface of the placement plate (81) is provided with multiple through slots (82) that are equidistant and uniformly opened. The outer side wall of the placement plate (81) is provided with a groove (83) located between two through slots (82).

3. The dry-cold cleaning apparatus for semiconductor components according to claim 2, characterized in that: The rotating structure (8) also includes a drive motor (84) installed on the lower end face of the support plate (4). The output end of the drive motor (84) passes through the support plate (4) and is connected to a connecting seat (85). A rotating block (86) is fixedly connected to the upper end face of the connecting seat (85). The rotating block (86) is located on one side of the placement plate (81). A connecting horizontal bar (87) is provided on the outer wall of the connecting seat (85). A protrusion (88) that cooperates with the groove (83) is fixedly connected to the upper end face of the connecting horizontal bar (87).

4. The dry-cold cleaning apparatus for semiconductor components according to claim 3, characterized in that: The upper end of the placement tray (81) is uniformly provided with a plurality of clamping components (9). Each clamping component (9) includes two fixing plates (91) symmetrically fixedly connected to the upper surface of the placement tray (81). Each fixing plate (91) has a connecting plate (92) rotatably connected to its side wall. An elastic telescopic rod (93) is connected to the side of the connecting plate (92) away from the fixing plate (91).

5. A dry-cold cleaning apparatus for semiconductor components according to claim 4, characterized in that: The free end of the elastic telescopic rod (93) is connected to a clamping plate (94), and a polyurethane elastomer block (95) is fixedly connected in a pre-drilled slot at the clamping end of the clamping plate (94).

6. The dry cooling cleaning apparatus for semiconductor components according to claim 1, characterized in that: The liquid nitrogen cleaning assembly (2) includes a first fixed side plate (21) fixedly connected to the inner wall of the cleaning tank (1). The upper end of the inner wall of the first fixed side plate (21) is connected to a first temporary storage box (22). The upper end of the first temporary storage box (22) is connected to a first inlet pipe (23). The inlet end of the first inlet pipe (23) extends through and to the outside of the cleaning tank (1). Solenoid valves are respectively installed on the outside of the first inlet pipe (23) and the first inlet pipe (23).

7. A dry-cold cleaning apparatus for semiconductor components according to claim 5, characterized in that: The end of the connecting plate (92) away from the elastic telescopic rod (93) is connected to a connecting post (11), and an electromagnetic coil (12) is wound around the outside of the connecting post (11), and a protective cover is fitted around the outside of the electromagnetic coil (12).

8. A dry-cold cleaning apparatus for semiconductor components according to claim 6, characterized in that: The inner walls of the first fixed side plate (21) and the second fixed side plate (71) are respectively equipped with permanent magnets (10) that cooperate with the electromagnetic coil (12).

9. A dry-cold cleaning apparatus for semiconductor components according to claim 1, characterized in that: A receiving hopper (5) is provided at the lower end of the bearing plate (4) and inside the cleaning box (1). An exhaust pipe (13) is connected through one side of the outer wall of the receiving hopper (5). The end of the exhaust pipe (13) away from the receiving hopper (5) extends through and to the outside of the cleaning box (1).

Images