A mobile device and polishing apparatus

Abstract

The utility model relates to the technical field of polishing, specifically disclose a kind of mobile device and polishing equipment, the mobile device includes swing subassembly, first drive mechanism and second drive mechanism;Swing subassembly includes support and swing arm, and one end of swing arm is rotatably sleeved in support;First drive mechanism includes support frame, first drive subassembly, transmission component and deceleration component, and support frame is located in swing arm, and first drive subassembly is arranged in support frame, and deceleration component is arranged in support;Second drive mechanism includes second drive subassembly and drive shaft component, and second drive subassembly is arranged in the other end of swing arm away from support, and the output end of second drive subassembly is connected in drive shaft component, and drive shaft component is connected in polishing head.The utility model's mobile device structure is simple, and heating position is less, avoid the problem that the swing arm swing precision reduces due to temperature rise, lead to the problem that the polishing precision of polishing head reduces, also avoid the control precision of pneumatic control element on swing arm is caused by temperature rise to influence.

Description

Technical Field

[0001] This utility model relates to the field of polishing technology, and in particular to a mobile device and polishing equipment. Background Technology

[0002] A chemical mechanical polishing (CMP) machine is a device that combines chemical etching with mechanical friction. It is mainly used for fine removal and planarization of semiconductor wafer surfaces. Its working principle is to soften the material to be removed on the semiconductor wafer surface through the chemical action of the polishing slurry, and then remove the softened material through the physical action of the polishing head and the polishing pad.

[0003] Currently, chemical mechanical polishing (CMP) machines use a polishing head to pick up wafers and press them onto a polishing pad on a polishing disc. However, in existing technologies, the mechanical design of the main arm on which the polishing head is mounted is complex, and it is easy to generate heat during use, which affects the movement accuracy of the main arm and thus reduces the polishing accuracy. Utility Model Content

[0004] The purpose of this utility model is to provide a moving device and polishing equipment to solve the problem that the mechanical design of the main arm on which the polishing head is installed is complicated in the prior art, which is prone to heat generation during use and affects the moving accuracy of the main arm, thus leading to a reduction in polishing accuracy.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] On the one hand, this utility model provides a moving device for moving a polishing head, the moving device comprising:

[0007] A swing assembly, the swing assembly including a support and a swing arm, one end of the swing arm being rotatably sleeved on the support;

[0008] A first driving mechanism includes a support frame, a first driving assembly, a transmission assembly, and a reduction assembly. The support frame is mounted on the swing arm, the first driving assembly is mounted on the support frame, and the reduction assembly is mounted on the support. The output end of the first driving assembly is connected to the input end of the reduction assembly via the transmission assembly, and the output end of the reduction assembly is connected to the swing arm. The first driving assembly is used to drive the swing arm to swing around the support.

[0009] The second drive mechanism includes a second drive component and a drive shaft assembly. The second drive component is located at the other end of the swing arm away from the support. The output end of the second drive component is connected to the drive shaft assembly, and the drive shaft assembly is connected to the polishing head. The second drive component is used to drive the polishing head to rotate.

[0010] As an alternative to the aforementioned mobile device, the deceleration assembly includes a drive shaft, a reducer, an annular mounting base, and a connecting assembly. The reducer is mounted on the support, and the drive assembly is connected to the input end of the reducer via the drive shaft. The annular mounting base is sleeved around the reducer and connected to the output end of the reducer. The connecting assembly connects the annular mounting base and the swing arm.

[0011] As an alternative to the aforementioned mobile device, the connecting assembly includes a connector and at least two clamps, with the at least two clamps surrounding the annular mounting base. The connector is used to connect the at least two clamps to clamp the annular mounting base; the clamps are connected to the swing arm.

[0012] As an alternative to the aforementioned mobile device, the deceleration assembly further includes a bearing housing and a first bearing assembly. The bearing housing covers the annular mounting base, the first bearing assembly is disposed within the bearing housing, and the drive shaft passes through the first bearing assembly.

[0013] As an optional embodiment of the aforementioned mobile device, the support includes a base, an inner pressure plate, an outer ring pressure plate, and a second bearing assembly. The inner pressure plate is connected to the base and is used to press a portion of the second bearing assembly between the base and the inner pressure plate. The outer ring pressure plate is sleeved outside the base and connected to the swing arm, and is used to press another portion of the second bearing assembly between the outer ring pressure plate and the swing arm. The deceleration assembly is disposed on the inner pressure plate.

[0014] As an alternative to the aforementioned mobile device, the transmission assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt body. The first synchronous pulley is connected to the output end of the first drive assembly, the second synchronous pulley is connected to the input end of the reduction assembly, and the synchronous belt body is sleeved on the first synchronous pulley and the second synchronous pulley.

[0015] As an alternative to the aforementioned mobile device, the mobile device further includes a sensor disposed on the swing arm for measuring the rotation angle of the swing arm.

[0016] As an alternative to the aforementioned mobile device, the mobile device further includes a mounting frame and a corrugated pipe. The mounting frame is mounted on the swing arm, and one end of the corrugated pipe is connected to the mounting frame. Cables can be connected to the first drive assembly and the second drive assembly via the corrugated pipe.

[0017] As an alternative to the aforementioned mobile device, the first driving component is a servo motor, and the second driving component is a direct drive motor.

[0018] On the other hand, the present invention provides a polishing device, including the moving device as described above. The polishing device further includes a polishing head, a polishing frame, a feeding platform assembly, a polishing disc assembly, a dressing assembly, and a polishing slurry spraying assembly. The moving device, the feeding platform assembly, the polishing disc assembly, the dressing assembly, and the polishing slurry spraying assembly are all mounted on the polishing frame, and the polishing head is located at the output end of the moving device.

[0019] The beneficial effects of this utility model are as follows:

[0020] The mobile device includes a swing assembly, a first drive mechanism, and a second drive mechanism. The swing assembly includes a support and a swing arm, with one end of the swing arm rotatably mounted on the support, allowing the swing arm to swing around the support as an axis. The first drive mechanism includes a support frame, a first drive assembly, a transmission assembly, and a reduction assembly. The support frame is mounted on the swing arm, the first drive assembly is mounted on the support frame, and the reduction assembly is mounted on the support. Thus, the first drive assembly is spaced apart from the swing arm by the support frame and is also separated from the reduction assembly. Simultaneously, the output end of the first drive assembly is connected to the input end of the reduction assembly via the transmission assembly, and the output end of the reduction assembly is connected to the swing arm. Under the transmission of the transmission assembly and the reduction assembly, the first drive assembly drives the swing arm to swing around the support. During this process, the temperature rise of the first drive assembly is not transferred to the swing arm and the reduction assembly, therefore it does not affect the swing accuracy of the swing arm. Meanwhile, the second drive mechanism includes a second drive assembly and a drive shaft assembly. The second drive assembly is located at the end of the swing arm away from the support, and its output end is connected to the drive shaft assembly, which is connected to the polishing head. The second drive assembly drives the polishing head to rotate. During this process, the rotational accuracy of the polishing head can be directly controlled through the second drive assembly to improve the polishing uniformity of the wafer. This moving device has a simple structure and fewer heating components. The swing arm can drive the polishing head to perform arc-shaped translation, which facilitates the polishing head to match the surface contour of the wafer, achieving a more uniform polishing pressure distribution. This avoids the pressure unevenness or missed polishing problems caused by linear translation. Furthermore, the transmission assembly separates the first drive assembly and the reduction assembly, preventing the temperature rise of the first drive assembly from affecting the performance and service life of the reduction assembly. This, in turn, avoids the problem of reduced swing accuracy of the swing arm leading to reduced polishing accuracy of the polishing head. It also prevents the temperature rise from affecting the control accuracy of the pneumatic control components on the swing arm. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the mobile device provided in an embodiment of the present utility model;

[0022] Figure 2 This is a disassembly diagram of the mobile device provided in an embodiment of the present utility model;

[0023] Figure 3A cross-sectional view of the mobile device provided in an embodiment of this utility model;

[0024] Figure 4 This is a schematic diagram of the polishing equipment provided in an embodiment of the present utility model.

[0025] In the picture:

[0026] 1. Swing assembly; 11. Support; 111. Base; 112. Inner pressure plate; 113. Outer ring pressure plate; 114. Second bearing assembly; 12. Swing arm;

[0027] 2. First drive mechanism; 21. Support frame; 22. First drive assembly; 23. Transmission assembly; 231. First synchronous pulley; 232. Second synchronous pulley; 233. Synchronous belt body; 24. Reduction assembly; 241. Reducer; 242. Annular mounting base; 243. Connecting assembly; 2431. Connector; 2432. Clamp; 244. Bearing housing; 245. First bearing assembly;

[0028] 3. Second drive mechanism; 31. Second drive assembly; 32. Drive shaft assembly;

[0029] 4. Sensor; 5. Mounting bracket; 6. Corrugated pipe;

[0030] 100. Polishing head; 200. Polishing frame; 300. Feeding platform assembly; 400. Polishing disc assembly; 500. Dresser assembly; 600. Grinding fluid spraying assembly. Detailed Implementation

[0031] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] Example 1

[0036] like Figures 1-4 As shown, this embodiment provides a moving device for moving the polishing head 100.

[0037] The moving device includes a swing assembly 1, a first drive mechanism 2, and a second drive mechanism 3. The swing assembly 1 includes a support 11 and a swing arm 12. One end of the swing arm 12 is rotatably sleeved on the support 11, so that the swing arm 12 can swing about the support 11 as an axis. The first drive mechanism 2 includes a support frame 21, a first drive assembly 22, a transmission assembly 23, and a reduction assembly 24. The support frame 21 is located on the swing arm 12, the first drive assembly 22 is located on the support frame 21, and the reduction assembly 24 is located on the support 11. Thus, the first drive assembly 22 is spaced apart from the swing arm 12 by the support frame 21 and is separated from the reduction assembly 24. At the same time, the output end of the first drive assembly 22 is connected to the input end of the reduction assembly 24 through the transmission assembly 23. The output end of the reduction assembly 24 is connected to the swing arm 12. Under the transmission of the transmission assembly 23 and the reduction assembly 24, the first drive assembly 22 is used to drive the swing arm 12 to swing around the support 11. During this process, the temperature rise of the first drive assembly 22 will not be transferred to the swing arm 12 and the reduction assembly 24, so it will not affect the swing accuracy of the swing arm 12.

[0038] Meanwhile, the second drive mechanism 3 includes a second drive assembly 31 and a drive shaft assembly 32. The second drive assembly 31 is located at the other end of the swing arm 12 away from the support 11. The output end of the second drive assembly 31 is connected to the drive shaft assembly 32, which is connected to the polishing head 100. The second drive assembly 31 is used to drive the polishing head 100 to rotate. During this process, the rotational accuracy of the polishing head 100 can be directly controlled through the second drive assembly 31 to improve the polishing uniformity of the wafer. Optionally, the first drive assembly 22 is a servo motor, and the second drive assembly 31 is a direct drive motor. The servo motor can improve the swing accuracy of the swing arm 12 through high-precision positioning and control capabilities, thereby improving the polishing accuracy of the polishing head 100. The direct drive motor directly drives the polishing head 100 to rotate through the drive shaft assembly 32. It has high transmission accuracy and can accurately control the rotational speed of the polishing head 100, thereby improving the polishing uniformity of the wafer. Alternatively, the moving device may further include a sensor 4, which is disposed on the swing arm 12 and is used to measure the rotation angle of the swing arm 12. Thus, the sensor 4 cooperates with the first drive mechanism 2 to further improve the swing accuracy of the swing arm 12.

[0039] The mobile device has a simple structure and few heating components. The swing arm 12 can drive the polishing head 100 to perform arc-shaped translation, which makes it easier for the polishing head 100 to match the surface contour of the wafer and achieve a more uniform polishing pressure distribution. This avoids the problem of uneven pressure or missed polishing caused by linear translation. Furthermore, the transmission component 23 separates the first drive component 22 and the reduction component 24, preventing the temperature rise of the first drive component 22 from affecting the performance and service life of the reduction component 24. This also avoids the problem of reduced swing accuracy of the swing arm 12, which would lead to reduced polishing accuracy of the polishing head 100. At the same time, it also avoids the temperature rise from affecting the control accuracy of the pneumatic control components on the swing arm 12.

[0040] like Figure 2 and Figure 3 As shown, the reduction assembly 24 includes a drive shaft, a reducer 241, an annular mounting base 242, and a connecting assembly 243. The reducer 241 is mounted on the support 11, ensuring that the reducer 241 is fixed to the support 11 and will not wobble during operation, thus achieving high transmission accuracy. The transmission assembly 23 is connected to the input end of the reducer 241 via the drive shaft. The annular mounting base 242 is fitted around the reducer 241 and connected to its output end. The connecting assembly 243 connects the annular mounting base 242 and the swing arm 12. Thus, the first drive assembly 22 can drive the drive shaft to rotate via the transmission assembly 23. The drive shaft, via the reducer 241, drives the annular mounting base 242 to rotate. Finally, the annular mounting base 242 drives the swing arm 12 to swing via the connecting assembly 243.

[0041] Specifically, the connecting assembly 243 includes a connector 2431 and at least two clamping members 2432. The at least two clamping members 2432 surround the annular mounting base 242. The connector 2431 is used to connect the at least two clamping members 2432 to clamp the annular mounting base 242, so that the clamping members 2432 are fixed to the annular mounting base 242 and connected to the swing arm 12. Thus, when the annular mounting base 242 rotates, it can drive the at least two clamping members 2432, and the at least two clamping members 2432 can drive the swing arm 12 to swing. By surrounding the annular mounting base 242 with the at least two clamping members 2432, the coaxiality between the swing arm 12 and the annular mounting base 242 during the swing can be ensured, and the installation of the entire deceleration assembly 24 on the support 11 and the swing arm 12 is convenient.

[0042] Furthermore, the deceleration assembly 24 also includes a bearing housing 244 and a first bearing assembly 245. The bearing housing 244 is covered by the annular mounting base 242, and the first bearing assembly 245 is disposed inside the bearing housing 244. The drive shaft passes through the first bearing assembly 245. By setting the bearing housing 244 and the first bearing assembly 245, the stability of the drive shaft during rotation can be improved, and vibration of the drive shaft can be avoided, which would affect the swing accuracy of the swing arm 12.

[0043] Furthermore, the support 11 includes a base 111, an inner pressure plate 112, an outer ring pressure plate 113, and a second bearing assembly 114. The inner pressure plate 112 is connected to the base 111 and is used to press a part of the second bearing assembly 114 between the base 111 and the inner pressure plate 112. The outer ring pressure plate 113 is sleeved on the outside of the base 111 and connected to the swing arm 12. It is used to press another part of the second bearing assembly 114 between the outer ring pressure plate 113 and the swing arm 12. The deceleration assembly 24 is disposed on the inner pressure plate 112. Thus, the base 111, the inner pressure plate 112, the swing arm 12, and the outer ring pressure plate 113 can surround the second bearing assembly 114. Since the deceleration assembly 24, the inner pressure plate 112, and the base 111 are fixed as one unit, and the output end of the deceleration assembly 24, the swing arm 12, and the outer ring pressure plate 113 are fixed as one unit, the stability of the swing arm 12 during the swing process can be improved by the second bearing assembly 114, and the swing arm 12 can be reduced in difficulty.

[0044] Furthermore, the transmission assembly 23 includes a first synchronous pulley 231, a second synchronous pulley 232, and a synchronous belt body 233. The first synchronous pulley 231 is connected to the output end of the first drive assembly 22, the second synchronous pulley 232 is connected to the input end of the reduction assembly 24, and the synchronous belt body 233 is sleeved on the first synchronous pulley 231 and the second synchronous pulley 232. Thus, the first drive assembly 22 can drive the reduction assembly 24 to run sequentially through the first synchronous pulley 231, the synchronous belt body 233, and the second synchronous pulley 232. Furthermore, by controlling the tooth ratio between the first synchronous pulley 231 and the second synchronous pulley 232, the transmission ratio between them can be controlled, thereby improving transmission efficiency. Optionally, the synchronous belt body 233 is a circular arc tooth synchronous belt.

[0045] like Figures 1-3 As shown, the mobile device also includes a mounting frame 5 and a corrugated pipe 6. The mounting frame 5 is located on the swing arm 12, and one end of the corrugated pipe 6 is connected to the mounting frame 5. The cable can be connected to the first drive component 22 and the second drive component 31 through the corrugated pipe 6 to supply power to the first drive component 22 and the second drive component 31 respectively, so as to realize the operation of the first drive component 22 and the second drive component 31. At the same time, the corrugated pipe 6 can protect the cable and prevent the cable mess from affecting the swing of the swing arm 12.

[0046] Example 2

[0047] This embodiment also provides a polishing device, such as... Figure 1 and Figure 4As shown, the polishing equipment includes the moving device as in Embodiment 1, and also includes a polishing head 100, a polishing frame 200, a loading platform assembly 300, a polishing disc assembly 400, a dresser assembly 500, and a polishing slurry spraying assembly 600. The moving device, loading platform assembly 300, polishing disc assembly 400, dresser assembly 500, and polishing slurry spraying assembly 600 are all mounted on the polishing frame 200. The polishing head 100 is located at the output end of the moving device. In this polishing equipment, the loading platform assembly 300 can receive wafers, and the moving device can move the polishing head 100 to adsorb the wafers on the loading platform assembly 300 and move the wafers onto the polishing pad of the polishing disc assembly 400. The planarization of the wafer surface is achieved by rotating the polishing head 100 and the polishing disc.

[0048] The polishing equipment includes a polishing slurry spraying assembly 600 that sprays polishing slurry onto the polishing pad, and a dressing assembly 500 that dresses the polishing pad. Optionally, the polishing equipment also includes a cleaning assembly mounted on the polishing frame 200 for cleaning the dressing assembly 500.

[0049] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A moving device for moving a polishing head (100), characterized in that, The mobile device includes: A swing assembly (1) includes a support (11) and a swing arm (12), one end of which is rotatably sleeved on the support (11). A first driving mechanism (2) includes a support frame (21), a first driving component (22), a transmission component (23), and a reduction component (24). The support frame (21) is located on the swing arm (12), the first driving component (22) is located on the support frame (21), and the reduction component (24) is located on the support (11). The output end of the first driving component (22) is connected to the input end of the reduction component (24) via the transmission component (23), and the output end of the reduction component (24) is connected to the swing arm (12). The first driving component (22) is used to drive the swing arm (12) to swing around the support (11). The second drive mechanism (3) includes a second drive assembly (31) and a drive shaft assembly (32). The second drive assembly (31) is located at the other end of the swing arm (12) away from the support (11). The output end of the second drive assembly (31) is connected to the drive shaft assembly (32), and the drive shaft assembly (32) is connected to the polishing head (100). The second drive assembly (31) is used to drive the polishing head (100) to rotate.

2. The mobile device according to claim 1, characterized in that, The reduction assembly (24) includes a drive shaft, a reducer (241), an annular mounting base (242), and a connecting assembly (243). The reducer (241) is mounted on the support (11). The transmission assembly (23) is connected to the input end of the reducer (241) via the drive shaft. The annular mounting base (242) is sleeved on the reducer (241) and connected to the output end of the reducer (241). The connecting assembly (243) connects the annular mounting base (242) and the swing arm (12).

3. The mobile device according to claim 2, characterized in that, The connecting assembly (243) includes a connector (2431) and at least two clamps (2432), the at least two clamps (2432) surrounding the annular mounting base (242), the connector (2431) connecting the at least two clamps (2432) to clamp the annular mounting base (242); the clamps (2432) are connected to the swing arm (12).

4. The mobile device according to claim 2, characterized in that, The deceleration assembly (24) further includes a bearing housing (244) and a first bearing assembly (245). The bearing housing (244) covers the annular mounting base (242), the first bearing assembly (245) is disposed inside the bearing housing (244), and the drive shaft passes through the first bearing assembly (245).

5. The mobile device according to claim 1, characterized in that, The support (11) includes a base (111), an inner pressure plate (112), an outer ring pressure plate (113), and a second bearing assembly (114). The inner pressure plate (112) is connected to the base (111) and is used to press a part of the second bearing assembly (114) between the base (111) and the inner pressure plate (112). The outer ring pressure plate (113) is sleeved on the outside of the base (111) and connected to the swing arm (12) and is used to press another part of the second bearing assembly (114) between the outer ring pressure plate (113) and the swing arm (12). The deceleration assembly (24) is disposed on the inner pressure plate (112).

6. The mobile device according to claim 1, characterized in that, The transmission assembly (23) includes a first synchronous pulley (231), a second synchronous pulley (232), and a synchronous belt body (233). The first synchronous pulley (231) is connected to the output end of the first drive assembly (22), the second synchronous pulley (232) is connected to the input end of the reduction assembly (24), and the synchronous belt body (233) is sleeved on the first synchronous pulley (231) and the second synchronous pulley (232).

7. The mobile device according to claim 1, characterized in that, The mobile device also includes a sensor (4), which is located on the swing arm (12) and is used to measure the rotation angle of the swing arm (12).

8. The mobile device according to claim 1, characterized in that, The mobile device also includes a mounting frame (5) and a corrugated pipe (6). The mounting frame (5) is disposed on the swing arm (12). One end of the corrugated pipe (6) is connected to the mounting frame (5). The cable can be connected to the first drive assembly (22) and the second drive assembly (31) via the corrugated pipe (6).

9. The mobile device according to any one of claims 1 to 8, characterized in that, The first drive component (22) is a servo motor, and the second drive component (31) is a direct drive motor.

10. A polishing device, characterized in that, The polishing equipment includes the mobile device as described in any one of claims 1 to 9, and further includes a polishing head (100), a polishing frame (200), a loading platform assembly (300), a polishing disc assembly (400), a dresser assembly (500), and a polishing slurry spraying assembly (600). The mobile device, the loading platform assembly (300), the polishing disc assembly (400), the dresser assembly (500), and the polishing slurry spraying assembly (600) are all disposed on the polishing frame (200), and the polishing head (100) is disposed at the output end of the mobile device.

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