A crystal frequency chip raw material cutting device

Abstract

The utility model discloses a crystal frequency piece raw material cutting device, include: work base plate, the raw material clamping subassembly of assembling on work base plate, the raw material clamping subassembly is used for fixed cutting raw material and adjusts raw material cutting angle, the device fixes and angle adjustment to raw material through raw material clamping subassembly, and the motor no.

Description

Technical Field

[0001] This utility model relates to the field of crystal frequency wafer raw material processing technology, and more specifically, this utility model relates to a crystal frequency wafer raw material cutting device. Background Technology

[0002] Crystal frequency wafer processing refers to a series of processing steps performed on crystalline materials with piezoelectric effects, such as quartz crystals, to ultimately create crystal frequency wafers that meet specific frequency requirements. First, the cutting angle and size of the crystal are determined based on the required frequency. Then, the crystal raw material undergoes mechanical processing such as cutting, grinding, and polishing to obtain precise geometry and surface flatness. Finally, after cleaning and packaging, it is manufactured into a crystal frequency wafer that can be used as a frequency control element in electronic devices. The processing precision and quality directly affect the performance and stability of the crystal frequency wafer.

[0003] A search revealed an existing patent (publication number: CN207403009U) disclosing a quartz crystal frequency wafer raw material cutting device. The device includes a main base with four supporting frames mounted at the bottom corners. Each supporting frame has internal fixing holes on both sides. A cutting blade holder is mounted on the right side of the motor bearing, with a blade mounting groove inside. Blades are mounted outside the blade mounting groove, and cutting blade holders are connected to both sides of the blades. A motor bearing is connected to the right side of the cutting blade holder, and a second motor is mounted on the right side of the motor bearing. A connecting frame is mounted on the top of the first motor, and a cylinder is connected to the middle of the connecting frame. The second motor is mounted on the bottom right side of the connecting frame. This quartz crystal frequency wafer raw material cutting device prevents the quartz crystal from tilting after cutting, thus preventing it from collapsing and colliding with the worktable and breaking. Furthermore, the device can simultaneously cut multiple quartz crystal frequency wafers of the same thickness, improving work efficiency.

[0004] The aforementioned device uses an adhesive layer to fix the quartz crystal material, but the adhesive strength gradually decreases over time, requiring periodic replacement to maintain the fixing effect. However, replacing the adhesive layer can be troublesome, requiring the cleaning of residual adhesive from the worktable and the application of a new adhesive layer. This not only increases the operator's workload but may also affect the quality of subsequent cuts due to adhesive residue or unevenness in the new adhesive layer. Furthermore, changes in the fit between the adhesive layer and the blade can also lead to cutting problems. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, this utility model provides a crystal frequency wafer raw material cutting device to solve the problems of cumbersome fixation by adhesive layer and low precision.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a crystal frequency wafer raw material cutting device, comprising: a working base plate; a raw material clamping assembly mounted on the working base plate, the raw material clamping assembly being used to fix the raw material to be cut and adjust the raw material cutting angle; a raw material cutting moving assembly mounted on the working base plate, the raw material cutting moving assembly being used to adjust the position during cutting; a cutting height adjusting assembly mounted on the raw material cutting moving assembly, the cutting height adjusting assembly being used to adjust the cutting height; a raw material cutting assembly mounted on the cutting height adjusting assembly, the raw material cutting assembly being used to cut the raw material; and a splash-proof protective cover mounted on the outer surface of the working base plate, the splash-proof protective cover being used to prevent debris from flying and injuring people during cutting.

[0007] Preferably, the raw material clamping assembly includes: a mounting plate movably mounted on the top of the working base plate, a motor fixedly mounted inside the working base plate, the drive end of the motor fixedly connected to the bottom of the mounting plate, and a movable sleeve plate provided on the movable slot.

[0008] Preferably, the raw material clamping assembly further includes: a movable sleeve plate movably installed inside the movable slot; a movable plate is movably sleeved on one side of the movable sleeve plate; a spring is movably installed between the movable sleeve plate and the movable plate; and clamping parts are assembled on the movable sleeve plate and the movable plate.

[0009] Preferably, the clamping part includes: a support plate fixedly installed on the top of the movable sleeve, an installation sleeve fixedly installed on one side of the support plate, a second spring movably installed inside the installation sleeve, and an installation plate two fixedly installed on one end of the second spring.

[0010] Preferably, the raw material cutting moving assembly includes: a limiting groove fixedly installed on the top of the working base plate, a lead screw movably installed inside the limiting groove, a second motor fixedly installed at one end of the limiting groove, a drive shaft of the second motor fixedly connected to the lead screw, and an installation frame movably sleeved on the outer surface of the lead screw.

[0011] Preferably, the cutting height adjustment assembly includes: a hydraulic pump fixedly installed on the top of the mounting frame; a mounting plate three fixedly installed on one side of the mounting frame; a hydraulic rod fixedly installed on the bottom of the mounting plate three; a movable sleeve plate fixedly installed on the bottom of the hydraulic rod; the movable sleeve plate being movably sleeved on the mounting frame; and a connecting pipe fixedly installed on one end of the hydraulic pump, with one end of the connecting pipe communicating with the hydraulic rod.

[0012] Preferably, the raw material cutting assembly includes: a motor three fixedly installed on one side of the movable sleeve plate; two sets of movable sleeve plates are provided, and the two sets of movable sleeve plates are equidistantly arranged on the mounting frame; a motor four is fixedly installed on the other side of the movable sleeve plate; and a rotating shaft is fixedly installed on the drive shaft of the motor three and the motor four.

[0013] Preferably, the raw material cutting assembly further includes: a roller fixedly installed on the outer surface of the rotating shaft, and a cutting blade is detachably installed on the outer surface of the roller. The cutting blade is provided in multiple sets, and the multiple sets of cutting blades are equidistantly installed on the roller.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention uses a raw material clamping assembly to fix and adjust the angle of the raw material. Starting motor one moves mounting plate one, and the coordinated movement of the movable sleeve, spring one, movable plate, and clamping part achieves stable clamping of raw materials of different sizes and adjustment of the cutting angle. Next, the cutting position is adjusted by the raw material cutting moving assembly, and motor two drives the lead screw to rotate, moving the mounting frame to the appropriate position within the limiting groove. Then, the cutting height is precisely adjusted using the hydraulic pump, connecting pipe, hydraulic cylinder, hydraulic rod, and movable sleeve in the cutting height adjustment assembly. Finally, starting motors three and four of the raw material cutting assembly drives the rollers and cutting blades on the rotating shaft to rotate, completing the efficient cutting of the raw material. During the cutting process, a splash guard effectively prevents debris from flying and causing injury. The entire device has good flexibility and precision, meeting the cutting needs of raw materials for different crystal frequencies, improving cutting quality and efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the raw material clamping component structure of this utility model;

[0018] Figure 3 For the present utility model Figure 2 Enlarged schematic diagram of structure A;

[0019] Figure 4 This is a schematic diagram of the raw material cutting moving component and the cutting height adjustment component of this utility model.

[0020] Figure 5 This is a schematic diagram of the raw material cutting component of this utility model.

[0021] [Figure Labels]

[0022] 1. Working base plate; 2. Raw material clamping assembly; 3. Raw material cutting and moving assembly; 4. Cutting height adjustment assembly; 5. Raw material cutting assembly; 6. Splash protection cover; 201. Mounting plate one; 202. Motor one; 203. Moving groove; 204. Moving sleeve; 205. Moving plate; 206. Spring one; 207. Clamping part; 208. Support plate; 209. Mounting sleeve; 210. Spring two; 211. Mounting plate two; 301. Limiting groove; 302. Lead screw; 303. Motor two; 304. Mounting frame; 401. Hydraulic pump; 402. Mounting plate three; 403. Hydraulic rod; 404. Moving sleeve; 405. Connecting pipe; 501. Motor three; 502. Motor four; 503. Rotating shaft; 504. Roller shaft; 505. Cutting blade. Detailed Implementation

[0023] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model. Example

[0024] A preferred embodiment of the crystal frequency wafer raw material cutting device provided by this utility model is, for example... Figures 1 to 5 As shown, it includes: a working base plate 1; a raw material clamping assembly 2 mounted on the working base plate 1, which is used to fix the raw material to be cut and adjust the cutting angle of the raw material; a raw material cutting moving assembly 3 mounted on the working base plate 1, which is used to adjust the position during cutting; a cutting height adjusting assembly 4 mounted on the raw material cutting moving assembly 3, which is used to adjust the cutting height; a raw material cutting assembly 5 mounted on the cutting height adjusting assembly 4, which is used to cut the raw material; and a splash guard 6 mounted on the outer surface of the working base plate 1, which is used to prevent debris from flying and injuring people during cutting.

[0025] In this embodiment, the raw material clamping assembly 2 includes: a mounting plate 201 movably mounted on the top of the working base plate 1, a motor 202 fixedly mounted inside the working base plate 1, the driving end of the motor 202 being fixedly connected to the bottom of the mounting plate 201, and a movable sleeve 204 being provided on the movable slot 203.

[0026] In this embodiment, the raw material clamping assembly 2 further includes: a movable sleeve plate 204 movably installed inside the movable groove 203; a movable plate 205 movably sleeved on one side of the movable sleeve plate 204; a spring 206 movably installed between the movable sleeve plate 204 and the movable plate 205; and clamping parts 207 assembled on the movable sleeve plate 204 and the movable plate 205.

[0027] In this embodiment, the clamping part 207 includes: a support plate 208 fixedly installed on the top of the movable sleeve plate 204, an installation sleeve 209 fixedly installed on one side of the support plate 208, a second spring 210 movably installed inside the installation sleeve 209, and an installation plate 211 fixedly installed on one end of the second spring 210.

[0028] In this embodiment, the raw material cutting moving component 3 includes: a limiting groove 301 fixedly installed on the top of the working base plate 1, a lead screw 302 movably installed inside the limiting groove 301, a second motor 303 fixedly installed at one end of the limiting groove 301, the drive shaft of the second motor 303 being fixedly connected to the lead screw 302, and an installation frame 304 movably sleeved on the outer surface of the lead screw 302. Example

[0029] Based on Embodiment 1, a preferred embodiment of the crystal frequency wafer raw material cutting device provided by this utility model is, for example... Figures 1 to 5 As shown: The cutting height adjustment assembly 4 includes: a hydraulic pump 401 fixedly installed on the top of the mounting frame 304; a mounting plate 3 402 fixedly installed on one side of the mounting frame 304; a hydraulic rod 403 fixedly installed on the bottom of the mounting plate 3 402; a movable sleeve 404 fixedly installed on the bottom of the hydraulic rod 403; the movable sleeve 404 is movably sleeved on the mounting frame 304; and a connecting pipe 405 fixedly installed at one end of the hydraulic pump 401, with one end of the connecting pipe 405 communicating with the hydraulic rod 403.

[0030] In this embodiment, the raw material cutting assembly 5 includes: a motor 501 fixedly installed on one side of the movable sleeve plate 404; two sets of movable sleeve plates 404 are provided, and the two sets of movable sleeve plates 404 are equidistantly arranged on the mounting frame 304; a motor 502 is fixedly installed on the other side of the movable sleeve plate 404; and a rotating shaft 503 is fixedly installed on the drive shafts of the motor 501 and the motor 502.

[0031] In this embodiment, the raw material cutting assembly 5 further includes: a roller 504 fixedly installed on the outer surface of the rotating shaft 503, and a cutting blade 505 detachably installed on the outer surface of the roller 504. Multiple sets of cutting blades 505 are provided, and multiple sets of cutting blades 505 are equidistantly installed on the roller 504.

[0032] The aforementioned device first fixes and adjusts the angle of the raw material using the raw material clamping assembly 2. Then, motor 202 is started, driving the mounting plate 201 to move. The coordinated movement of the movable sleeve 204, spring 206, movable plate 205, and clamping part 207 achieves stable clamping of raw materials of different sizes and adjustment of the cutting angle. Next, the cutting position is adjusted using the raw material cutting moving assembly 3. Motor 303 drives the lead screw 302 to rotate, moving the mounting frame 304 to the appropriate position within the limiting groove 301. Then, the cutting height is precisely adjusted using the hydraulic pump 401, connecting pipe 405, hydraulic cylinder hydraulic rod 403, and movable sleeve 404 in the cutting height adjusting assembly 4. Finally, motors 501 and 502 of the raw material cutting assembly 5 are started, driving the roller 504 on the rotating shaft 503 and the cutting blade 505 to rotate, completing the efficient cutting of the raw material. During the cutting process, the splash guard 6 effectively prevents debris from flying and injuring people. The entire device has good flexibility and precision, and can meet the cutting requirements of raw materials with different crystal frequencies, thereby improving cutting quality and efficiency.

[0033] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can be mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0034] Secondly: The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0035] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A crystal frequency wafer raw material cutting device, characterized in that, include: Working base plate (1); The raw material clamping assembly (2) is mounted on the working base plate (1). The raw material clamping assembly (2) is used to fix the raw material to be cut and to adjust the cutting angle of the raw material. The raw material cutting moving assembly (3) is mounted on the working base plate (1), and the raw material cutting moving assembly (3) is used to adjust the position during cutting; A cutting height adjustment component (4) is mounted on the raw material cutting moving assembly (3), the cutting height adjustment component (4) being used to adjust the cutting height; The raw material cutting component (5) is mounted on the cutting height adjustment component (4) and is used to cut the raw material. A splash guard (6) is mounted on the outer surface of the working base plate (1). The splash guard (6) is used to prevent debris from flying and injuring people during cutting.

2. The crystal frequency wafer raw material cutting device according to claim 1, characterized in that, The raw material clamping assembly (2) includes: The mounting plate 1 (201) is installed on the top of the working base plate (1). The motor 1 (202) is fixedly installed inside the working base plate (1). The driving end of the motor 1 (202) is fixedly connected to the bottom of the mounting plate 1 (201). The moving slot (203) is provided with a moving sleeve plate (204).

3. The crystal frequency wafer raw material cutting device according to claim 2, characterized in that, The raw material clamping assembly (2) further includes: A movable sleeve plate (204) is movably installed inside the movable slot (203). A movable plate (205) is movably sleeved on one side of the movable sleeve plate (204). A spring (206) is movably installed between the movable sleeve plate (204) and the movable plate (205). A clamping part (207) is assembled on the movable sleeve plate (204) and the movable plate (205).

4. The crystal frequency wafer raw material cutting device according to claim 3, characterized in that, The clamping part (207) includes: A support plate (208) is fixedly installed on the top of the movable sleeve (204). An installation sleeve (209) is fixedly installed on one side of the support plate (208). A second spring (210) is movably installed inside the installation sleeve (209). An installation plate (211) is fixedly installed on one end of the second spring (210).

5. The crystal frequency wafer raw material cutting device according to claim 4, characterized in that, The raw material cutting moving component (3) includes: A limiting groove (301) is fixedly installed on the top of the working base plate (1). A lead screw (302) is movably installed inside the limiting groove (301). A motor (303) is fixedly installed at one end of the limiting groove (301). The drive shaft of the motor (303) is fixedly connected to the lead screw (302). An installation frame (304) is movably sleeved on the outer surface of the lead screw (302).

6. The crystal frequency wafer raw material cutting device according to claim 5, characterized in that, The cutting height adjustment component (4) includes: A hydraulic pump (401) is fixedly installed on the top of the mounting frame (304). A mounting plate three (402) is fixedly installed on one side of the mounting frame (304). A hydraulic rod (403) is fixedly installed at the bottom of the mounting plate three (402). A movable sleeve plate (404) is fixedly installed at the bottom of the hydraulic rod (403). The movable sleeve plate (404) is movably sleeved on the mounting frame (304). A connecting pipe (405) is fixedly installed at one end of the hydraulic pump (401). One end of the connecting pipe (405) is connected to the hydraulic rod (403).

7. The crystal frequency wafer raw material cutting device according to claim 6, characterized in that, The raw material cutting assembly (5) includes: Motor 3 (501) is fixedly installed on one side of the movable sleeve (404). There are two sets of movable sleeves (404), and the two sets of movable sleeves (404) are equidistantly arranged on the mounting frame (304). Motor 4 (502) is fixedly installed on the other side of the movable sleeve (404). Rotary shafts (503) are fixedly installed on the drive shafts of motor 3 (501) and motor 4 (502).

8. The crystal frequency wafer raw material cutting device according to claim 7, characterized in that, The raw material cutting assembly (5) also includes: A roller (504) is fixedly installed on the outer surface of the rotating shaft (503). A cutting blade (505) is detachably installed on the outer surface of the roller (504). Multiple sets of the cutting blade (505) are provided, and multiple sets of the cutting blade (505) are equidistantly installed on the roller (504).

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