A near-infrared lamp set for heating and curing a printed matter

Abstract

The application relates to a near-infrared lamp group for heating and curing printed matters. The near-infrared lamp group comprises a shell with multiple independent spaces inside, multiple groups of near-infrared point light sources, a main refrigeration pipeline arranged inside the shell, a refrigeration module connected with the main refrigeration pipeline, a heat dissipation module in contact with the same group of near-infrared point light sources and connected with the main refrigeration pipeline, and a backflow pipeline connected with the heat dissipation module and the refrigeration module, and each group of near-infrared point light sources is arranged in an independent space. The near-infrared lamp group for heating and curing printed matters disclosed by the application uses an evaporation heat dissipation mode to transfer heat generated in the working process, the heat dissipation mode has higher heat dissipation efficiency, meanwhile, complex pipeline design and sealing design are not needed, and the use requirement of wide-width printing can be met.

Description

Technical Field

[0001] This application relates to the field of printing curing equipment technology, and in particular to a near-infrared lamp assembly for heat curing printed matter. Background Technology

[0002] The application of near-infrared heating curing in the printing industry is mainly concentrated in the drying and curing of inks, coatings and adhesives. It consumes significantly less energy than traditional hot air drying, and can also avoid local overheating and damage to the substrate, thus helping to improve printing quality.

[0003] In the field of wide-format printing, a major problem faced by near-infrared heating is the heat dissipation issue caused by dot matrix deployment. Dot matrix deployment is a dense deployment, and heat dissipation in non-edge areas is more difficult. Currently used methods such as vertical air cooling (interference between fans can cause airflow obstruction), horizontal air cooling (uneven airflow distribution, with lower airflow at the end), and liquid cooling (leakage can lead to product contamination) all have certain problems. Although aluminum materials and heat sinks can be used on the lamp body for active cooling, the cooling effect decreases as the array density increases. Utility Model Content

[0004] This application provides a near-infrared lamp assembly for heat curing printed materials, which uses evaporative cooling to dissipate the heat generated during operation. This cooling method has higher heat dissipation efficiency and does not require complex piping or sealing designs, thus meeting the needs of wide-format printing.

[0005] The above-mentioned objective of this application is achieved through the following technical solution:

[0006] This application provides a near-infrared lamp assembly for heat-curing printed materials, comprising:

[0007] The outer shell has multiple independent spaces inside;

[0008] Multiple sets of near-infrared point light sources, each set of near-infrared point light sources is arrayed in an independent space;

[0009] The main refrigeration pipes are located inside the outer casing;

[0010] The refrigeration module is connected to the main refrigeration pipes.

[0011] The heat dissipation module is in contact with the same set of near-infrared point light sources and is connected to the main cooling pipe.

[0012] The return pipe connects to the heat dissipation module and the cooling module.

[0013] In one possible implementation of this application, a group of near-infrared point light sources uses the same heat dissipation module.

[0014] In one possible implementation of this application, the heat dissipation module is connected to the main cooling pipe through a branch cooling pipe, and the branch cooling pipe is equipped with a flow valve.

[0015] In one possible implementation of this application, the heat dissipation module includes:

[0016] Heat sink;

[0017] Both the liquid chamber and the gas chamber are located inside the heat sink.

[0018] The connecting channel is located inside the heat sink, and its two ends are connected to the corresponding liquid chamber and gas chamber, respectively.

[0019] The input pipe is located inside the heat sink. One end of the input pipe is connected to the main refrigeration pipe, and the other end is connected to the liquid chamber.

[0020] The liquid chambers are multiple and independently configured.

[0021] In one possible implementation of this application, each liquid chamber uses an input pipe.

[0022] In one possible implementation of this application, the number of gas chambers is one.

[0023] In one possible implementation of this application, the flow area of ​​the connecting channel tends to increase in the direction closer to the gas chamber.

[0024] The beneficial effects of this application are as follows:

[0025] The near-infrared lamp assembly for heat curing printed materials provided in this application uses evaporative cooling to transfer the heat generated during operation. This method eliminates the need for numerous fans, complex piping, and sealing designs, enabling rapid heat transfer and meeting the needs of wide-format printing. Attached Figure Description

[0026] Figure 1 This is a structural schematic diagram of a near-infrared lamp assembly for heat curing printed materials, as provided in this application.

[0027] Figure 2 This is a structural schematic diagram of a shell provided in this application.

[0028] Figure 3 This is a schematic diagram of the internal structure of a near-infrared lamp assembly for heat curing printed materials, as provided in this application.

[0029] Figure 4 This is a structural schematic diagram of a refrigeration pipe and a flow valve provided in this application.

[0030] Figure 5 This is a structural schematic diagram of a heat dissipation module provided in this application.

[0031] Figure 6 This is a schematic diagram of the connection between multiple liquid chambers and an input pipe provided in this application.

[0032] In the diagram, 1. Outer shell, 2. Near-infrared point light source, 3. Main cooling pipe, 4. Cooling module, 5. Heat dissipation module, 6. Return pipe, 11. Independent space, 31. Sub-cooling pipe, 32. Flow valve, 51. Heat sink, 52. Liquid chamber, 53. Gas chamber, 54. Connecting channel, 55. Input pipe. Detailed Implementation

[0033] The technical solutions in this application will be further described in detail below with reference to the accompanying drawings.

[0034] This application discloses a near-infrared lamp assembly for heat-curing printed materials. In some examples, the near-infrared lamp assembly for heat-curing printed materials disclosed in this application includes a housing 1, a near-infrared point light source 2, a main cooling pipe 3, a cooling module 4, a heat dissipation module 5, and a return pipe 6. Please refer to [link to relevant documentation]. Figure 1 and Figure 2 The interior of the outer shell 1 has multiple independent spaces 11. The independent spaces 11 are formed by welding plates inside the outer shell 1 to divide the space inside the outer shell 1.

[0035] The near-infrared point light source 2 is divided into multiple groups, and each group of near-infrared point light sources 2 is arrayed in an independent space 11. The array is generally arranged in an MxN matrix form, where M and N are both natural numbers greater than zero.

[0036] Please see Figure 3 The main cooling pipe 3 is installed inside the outer casing 1, the cooling module 4 is located outside the outer casing 1 and is connected to the main cooling pipe 3, the heat dissipation module 5 is in contact with the near-infrared point light source 2 and is connected to the main cooling pipe 3, and the return pipe 6 is connected to the heat dissipation module 5 and the cooling module 4.

[0037] Specifically, after the coolant (water and water-based solutions) is cooled in the refrigeration module 4, it is input into the main refrigeration pipe 3 and then sent to the heat dissipation module 5. The coolant in the heat dissipation module 5 becomes gas after heat exchange and enters the return pipe 6. Then, it returns to the refrigeration module 4 through the return pipe 6 for cooling and becomes liquid again.

[0038] It should be understood that the refrigeration module 4 generally includes four parts: a compressor, a condenser, an expansion valve, and an evaporator. Taking a household air conditioner as an example, the blower blows airflow to the evaporator for heat exchange before blowing out cold air. In this application, a direct contact method is used for cooling. Specifically, a heat exchanger is added to the above structure, replacing the evaporator. The two media (refrigerant, gaseous coolant, or gas-liquid two-phase coolant) flow independently in the heat exchanger and complete the heat exchange.

[0039] In some cases, the number of heat dissipation modules 5 is increased to multiple, with a group of near-infrared point light sources 2 using the same heat dissipation module 5. This approach is mainly to ensure the consistency of temperature in each area.

[0040] It should be understood that when the near-infrared point light source 2 is used in groups, the temperature in the middle area is still higher than the temperature in the surrounding area. If the same heat dissipation module 5 is used at this time, it will inevitably lead to inconsistent evaporation rates inside the heat dissipation module 5, which in turn will prevent the temperature of the near-infrared point light source 2 inside the shell 1 from becoming uniform.

[0041] When the number of heat dissipation modules 5 is increased, the power of the heat dissipation modules 5 can be adjusted so that the temperature range of the near-infrared point light source 2 inside the shell 1 is consistent, that is, the temperature at the center and the temperature at the edge inside the shell 1 can be made consistent.

[0042] Further, please refer to Figure 4 The above can be achieved by using dynamic adjustment. For example, a sub-cooling pipe 31 can be added between the heat dissipation module 5 and the main cooling pipe 3. A flow valve 32 is installed on the sub-cooling pipe 31. By adjusting the flow area of ​​the flow valve 32, the flow rate of the coolant can be adjusted. For high temperature areas, the flow rate of the coolant can be increased appropriately, and for low temperature areas, the flow rate of the coolant can be decreased appropriately.

[0043] The above method requires the use of temperature sensors and controllers. Both the temperature sensors and the flow valve 32 are connected to the controller. One or more temperature sensors are installed in each independent space 11. The temperature sensors feed back temperature data to the controller, and the controller adjusts the flow valve 32 according to the temperature data.

[0044] The controller here can be implemented using a microcontroller (89C51) combined with a PID control algorithm.

[0045] In some examples, please refer to Figure 5 The heat dissipation module 5 includes a heat sink 51, a liquid chamber 52, a gas chamber 53, a connecting channel 54, and an input pipe 55. The connecting channel 54, the liquid chamber 52, and the gas chamber 53 are all located inside the heat sink 51. The two ends of the connecting channel 54 are connected to the corresponding liquid chamber 52 and gas chamber 53, respectively.

[0046] The input pipe 55 is also located inside the heat sink 51. One end of the input pipe 55 is connected to the main refrigeration pipe 3, and the other end is connected to the liquid chamber 52, which is responsible for introducing coolant into the liquid chamber 52. When there is a sub-refrigeration pipe 31, the input pipe 55 is changed to be connected to both the sub-refrigeration pipe 31 and the liquid chamber 52.

[0047] For some possible implementations, please refer to Figure 6 There are multiple liquid chambers 52, each independently set, and one gas chamber 53. The purpose of increasing the number of liquid chambers 52 is to make the distribution of coolant within the liquid chambers 52 more uniform. It should be understood that when the volume of the liquid chamber 52 is large, the flow path of the coolant will be longer, which can easily lead to uneven coolant level because the rate of increase is inconsistent at different locations.

[0048] By increasing the number of liquid chambers 52, you can effectively restrict the flow path of the coolant and improve the coolant replenishment rate.

[0049] In some possible implementations, each liquid chamber 52 uses an input pipe 55 to avoid inconsistent coolant inflow rates caused by mutual interference.

[0050] In some possible implementations, the flow area of ​​the connecting channel 54 tends to increase in the direction close to the gas chamber 53, with the aim of enabling steam to flow into the gas chamber 53 quickly.

[0051] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A near-infrared lamp assembly for heat curing printed materials, characterized in that, include: The outer shell (1) has multiple independent spaces (11) inside; Multiple sets of near-infrared point light sources (2), each set of near-infrared point light sources (2) is arrayed in an independent space (11); The main refrigeration pipe (3) is located inside the outer casing (1); The refrigeration module (4) is connected to the main refrigeration pipe (3); The heat dissipation module (5) is in contact with the same group of near-infrared point light sources (2) and connected to the main cooling pipe (3); The return pipe (6) is connected to the heat dissipation module (5) and the cooling module (4).

2. The near-infrared lamp assembly for heat curing printed matter according to claim 1, characterized in that, A group of near-infrared point light sources (2) use the same heat dissipation module (5).

3. The near-infrared lamp assembly for heat curing printed matter according to claim 1 or 2, characterized in that, The heat dissipation module (5) is connected to the main refrigeration pipe (3) through a branch refrigeration pipe (31), and a flow valve (32) is provided on the branch refrigeration pipe (31).

4. The near-infrared lamp assembly for heat curing printed matter according to claim 1, characterized in that, The heat dissipation module (5) includes: Heat sink (51); The liquid chamber (52) and the gas chamber (53) are both located inside the heat sink (51); A connecting channel (54) is located inside the heat sink (51), and the two ends of the connecting channel (54) are connected to the corresponding liquid chamber (52) and gas chamber (53) respectively. An inlet pipe (55) is connected at one end to the main refrigeration pipe (3) and at the other end to the liquid chamber (52); The liquid chambers (52) are multiple and independently set.

5. The near-infrared lamp assembly for heat curing printed matter according to claim 4, characterized in that, Each liquid chamber (52) uses an input pipe (55).

6. The near-infrared lamp assembly for heat curing printed matter according to claim 4, characterized in that, The number of gas chambers (53) is one.

7. The near-infrared lamp assembly for heat curing printed matter according to claim 4, characterized in that, In the direction closer to the gas chamber (53), the flow area of ​​the connecting channel (54) tends to increase.

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