A silicon wafer silicon trench depth measuring device

Abstract

The utility model discloses a kind of silicon wafer silicon groove depth measuring devices, including base, support platform, dial gauge, support, locking mechanism and probe, support platform is horizontally arranged above base, the lower end of support is fixedly connected with base, support upper end extends to above support platform, the main body of dial gauge is vertically locked in support upper end by locking mechanism, probe includes inner sleeve, outer sleeve, locking piece, claw and probe, inner sleeve coaxially covers in dial gauge lower end, multiple grooves are sequentially arranged in the circumference of inner sleeve, claw is slidably connected in groove, claw inner end clamps dial gauge lower end, claw outer end protrudes from inner sleeve, and be provided with inclined surface, outer sleeve is rotatably connected in inner sleeve outer, and extrude above inclined surface, locking piece locks outer sleeve on inner sleeve, probe is vertically fixedly connected in inner sleeve lower end, the outer diameter of probe lower end is greater than 50 microns and less than 500 microns.The utility model proposes a kind of silicon wafer silicon groove depth measuring devices, the groove depth of narrow small silicon groove can be measured.

Description

Technical Field

[0001] This utility model relates to the field of measuring device technology, and in particular to a silicon wafer silicon trench depth measuring device. Background Technology

[0002] After etching the surface of existing silicon wafers, it is necessary to measure and inspect the depth of the silicon trenches formed by the etching. The commonly used and simple measurement method is to use a dial indicator. However, the width of the silicon trenches on some silicon wafer surfaces is only 300-500 micrometers, and some trenches are only 100 micrometers wide. For such narrow silicon trenches, the probe of a traditional dial indicator cannot be inserted at all. Utility Model Content

[0003] To address the shortcomings of existing dial indicators in measuring the depth of narrow silicon trenches, this invention proposes a silicon wafer trench depth measuring device that can measure the depth of narrow silicon trenches.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A silicon wafer silicon trench depth measuring device includes a base, a support platform, a dial indicator, a bracket, a locking mechanism, and a probe. The support platform is horizontally positioned above the base. The lower end of the bracket is fixedly connected to the base, and the upper end of the bracket extends above the support platform. The main body of the dial indicator is vertically locked to the upper end of the bracket by the locking mechanism. The probe includes an inner sleeve, an outer sleeve, a locking element, claws, and a probe. The inner sleeve is coaxially fitted onto the lower end of the dial indicator. Multiple sliding grooves are sequentially arranged around the inner sleeve, and claws are slidably connected in each groove. The inner end of the claws clamps the lower end of the dial indicator, and the outer end of the claws protrudes outside the inner sleeve and is provided with an inclined surface. The outer sleeve is rotatably connected to the outer sleeve and presses against the inclined surface. The locking element locks the outer sleeve onto the inner sleeve. The probe is vertically fixedly connected to the lower end of the inner sleeve, and the outer diameter of the lower end of the probe is greater than 50 micrometers and less than 500 micrometers.

[0006] With the above settings, firstly, the outer diameter of the lower end of the probe is smaller, which is convenient for measuring the depth of silicon trenches with narrow trench widths; secondly, the probe is detachable, which is convenient for replacing probes with different probe thicknesses to measure the depth of silicon trenches with different trench widths; and thirdly, the locking mechanism makes it easy to install a traditional dial indicator on the bracket, and the probe can be easily installed at the lower end of the traditional dial indicator, thus expanding the application range of the measuring device.

[0007] Furthermore, the dial indicator includes a main body, a sleeve, and a measuring rod. The sleeve is vertically fixed to the lower side of the main body, and the measuring rod is slidably connected in the sleeve. The sleeve is locked to the upper end of the bracket by a locking mechanism, and the inner end of the chuck clamps the lower end of the measuring rod.

[0008] The dial indicator of this application has a scale and a pointer on its main body. A sleeve is vertically fixed to the lower side of the main body. The measuring rod vertically passes through the main body and the sleeve. When the measuring rod moves up and down, the pointer rotates to measure the groove depth. The sleeve is vertically locked to the upper end of the bracket by a locking mechanism and remains stationary. The probe is locked to the lower end of the measuring rod and moves up and down synchronously with the measuring rod. Depending on the depth of the silicon groove the probe enters, the vertical position of the measuring rod is different, and the pointer points to different scales to display the corresponding groove depth.

[0009] Furthermore, the locking mechanism includes a locking sleeve and a first wing bolt. The locking sleeve is vertically fixed to the upper end of the bracket, and the sleeve is vertically inserted through the locking sleeve. A V-groove is provided on one side of the locking sleeve, and the first wing bolt is threadedly connected to the other side of the locking sleeve. The inner end of the first wing bolt presses the sleeve into the V-groove.

[0010] With the above settings, the locking mechanism can lock sleeves of different outer diameters.

[0011] The first wing bolt of this application is easy to rotate manually to press the sleeve onto the V-groove. The V-groove can support sleeves of different outer diameters. After the sleeve is pressed onto the V-groove, the V-groove automatically calibrates the position of the sleeve, making the sleeve vertical.

[0012] Furthermore, the inner circumference of the outer jacket is provided with multiple grooves, the outer end of the claw extends into the groove, and one end of the groove is provided with a pressing head. The end of the pressing head is hemispherical and the pressing head presses the inclined surface.

[0013] The above settings reduce the resistance to rotation of the outer jacket.

[0014] Furthermore, the locking element includes a support plate and a second wing bolt. The support plate is fixedly connected to the inner sleeve, and the second wing bolt is fixedly connected to the support plate and presses the outer sleeve.

[0015] The second wing bolt of this application is easy to rotate manually. The second wing bolt penetrates the support plate radially and is threadedly connected to the support plate. When the second wing bolt is tightened, the inner end of the second wing bolt is radially pressed against the outer circumferential surface of the outer sleeve to prevent the outer sleeve from loosening.

[0016] Furthermore, at least six claws are provided. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the measuring device used in an embodiment.

[0018] Figure 2 This is a side view of the measuring device in an embodiment.

[0019] Figure 3 for Figure 2 AA sectional view.

[0020] Figure 4 for Figure 2 BB cross-sectional view. Detailed Implementation

[0021] The technical solution of this utility model will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0022] like Figures 1 to 4 A silicon wafer trench depth measuring device includes a base 3, a support platform 4, a dial indicator 5, a bracket 6, a locking mechanism 7, and a probe 8. The support platform 4 is horizontally positioned above the base 3. The lower end of the bracket 6 is fixedly connected to the base 3, and the upper end of the bracket 6 extends above the support platform 4. The main body of the dial indicator 5 is vertically locked to the upper end of the bracket 6 by the locking mechanism 7. The probe 8 includes an inner sleeve 81, an outer sleeve 82, a locking element 83, a claw 84, and a probe 85. The inner sleeve 81 is coaxially fitted onto the dial indicator. At the lower end of the inner sleeve 81, multiple sliding grooves 9 are arranged circumferentially. Each sliding groove 9 is slidably connected to a claw 84. The inner end of the claw 84 clamps the lower end of the dial indicator 5. The outer end of the claw 84 protrudes from the inner sleeve 81 and is provided with an inclined surface 10. The outer sleeve 82 is rotatably connected to the outer sleeve 81 and presses against the inclined surface 10. The locking member 83 locks the outer sleeve 82 onto the inner sleeve 81. The probe 85 is vertically fixedly connected to the lower end of the inner sleeve 81. The outer diameter of the lower end of the probe 85 is greater than 50 micrometers and less than 500 micrometers.

[0023] With the above settings, firstly, the lower outer diameter of the probe 85 is smaller, which is convenient for measuring the depth of silicon trenches with narrow trench widths; secondly, the probe 8 is detachable, which is convenient for replacing probes 8 with different diameters to measure the depth of silicon trenches with different widths; thirdly, the locking mechanism 7 makes it convenient to install the traditional dial indicator 5 on the bracket 6, and the probe 8 can be conveniently installed at the lower end of the traditional dial indicator 5, thus expanding the application range of the measuring device.

[0024] Specifically, the support platform 4 is horizontally mounted on the upper side of the base 3. The support platform 4 can be a movable platform or a rotating platform. After the silicon wafer is placed flat on the upper side of the support platform 4, the support platform 4 can drive the silicon wafer to move so as to measure the groove depth at different positions. Adsorption holes can be opened on the upper side of the support platform 4. After the adsorption holes are connected to the suction device, the silicon wafer can be adsorbed on the support platform 4 to prevent the silicon wafer from moving during measurement. The lower end of the bracket 6 is located on one side of the support platform 4. The bracket 6 is in the shape of a "7" and the upper end of the bracket 6 extends horizontally to the support platform 3. Above the support platform 4, a dial indicator 5 (available commercially) is vertically locked to the upper end of the bracket 6 via a locking mechanism 7. The lower end of the dial indicator 5 can move up and down. The probe 8 is locked to the lower end of the dial indicator 5. Under the gravity of the probe 8, the lower end of the probe 85 extends into the silicon trench and abuts against the bottom of the trench to measure the trench depth. The probe 8 is detachably connected to the lower end of the dial indicator 5. The probe 8 of appropriate thickness can be selected according to the width of the silicon trench to be measured. When the trench width is large, such as a silicon trench with a width of 500 micrometers... A thicker probe 85 is selected, such as a probe 85 with a lower outer diameter of 300 micrometers, to prevent the lower end of the probe 85 from being too thin and damaging the filling material in the silicon trench. For example, for a silicon trench with a trench width of 100 micrometers, a thinner probe 85 is selected, such as a probe 85 with a lower outer diameter of 60 micrometers, to facilitate the lower end of the probe 85 to extend into the silicon trench. In this application, the inner sleeve 81 is circumferentially provided with multiple claws 84. When the outer sleeve 82 is rotated, the outer sleeve 82 presses against the inclined surface 10, so that each claw 84 can... The synchronous radial inward movement clamps the lower end of the dial indicator 5, ensuring high coaxiality between the probe 85 and the lower end of the dial indicator 5. The locking element 83 locks the outer sleeve 82 to prevent it from loosening. After the outer sleeve 82 is rotated in the opposite direction and the inclined surface 10 is released, the chuck 84 releases the dial indicator 5, allowing the probe 8 to be removed from the lower end of the dial indicator 5 for easy replacement of other probes 8. In this application, by rotating the outer sleeve 82, the radial position of the chuck 84 can be steplessly adjusted to adapt to dial indicators 5 with different lower outer diameters.

[0025] As one implementation, the dial indicator 5 includes a main body 51, a sleeve 52 and a measuring rod 53. The sleeve 52 is vertically fixed to the lower side of the main body 51, and the measuring rod 53 is slidably connected in the sleeve 52. The sleeve 52 is locked to the upper end of the bracket 6 by the locking mechanism 7, and the lower end of the measuring rod 53 is clamped by the inner end of the claw 84.

[0026] The dial indicator 5 of this application has a scale and a pointer on its main body 51. The sleeve 52 is vertically fixed to the lower side of the main body 51. The measuring rod 53 vertically passes through the main body 51 and the sleeve 52. When the measuring rod 53 moves up and down, the pointer rotates to measure the groove depth. The sleeve 52 is vertically locked to the upper end of the bracket 6 by the locking mechanism 7 and remains stationary. The probe 8 is locked to the lower end of the measuring rod 53 and moves up and down synchronously with the measuring rod 53. Depending on the depth of the silicon groove that the probe 8 enters, the upper and lower positions of the measuring rod 53 are different, and the pointer points to different scales to display the corresponding groove depth.

[0027] As one implementation, the locking mechanism 7 includes a locking sleeve 71 and a first wing bolt 72. The locking sleeve 71 is vertically fixed to the upper end of the bracket 6. The sleeve 52 vertically penetrates the locking sleeve 71. A V-groove 73 is provided on one side of the locking sleeve 71. The first wing bolt 72 is threadedly connected to the other side of the locking sleeve 71. The inner end of the first wing bolt 72 presses the sleeve 52 into the V-groove 73.

[0028] With the above settings, the locking mechanism 7 can lock sleeves 52 with different outer diameters.

[0029] The first wing bolt 72 of this application is easy to rotate manually to press the sleeve 52 onto the V-groove 73. The V-groove 73 can support sleeves 52 with different outer diameters. After the sleeve 52 is pressed onto the V-groove 73, the V-groove 73 automatically calibrates the position of the sleeve 52 to make the sleeve 52 vertical.

[0030] As one implementation, the inner circumference of the outer jacket 82 is provided with multiple grooves 11, the outer end of the claw 84 extends into the groove 11, and one end of the groove 11 is provided with a pressing head 12. The end of the pressing head 12 is hemispherical, and the pressing head 12 presses the inclined surface 10.

[0031] The above settings reduce the rotational resistance of the outer jacket 82.

[0032] As one implementation, the locking member 83 includes a support plate 831 and a second wing bolt 832. The support plate 831 is fixedly connected to the inner sleeve 81, and the second wing bolt 832 is fixedly connected to the support plate 831 and presses against the outer sleeve 82.

[0033] The second wing bolt 832 of this application is easy to rotate manually. The second wing bolt 832 penetrates the support plate 831 radially and is threadedly connected to the support plate 831. When the second wing bolt 832 is tightened, the inner end of the second wing bolt 832 is radially pressed against the outer circumferential surface of the outer sleeve 82 to prevent the outer sleeve 82 from loosening.

[0034] As one implementation method, the 84 claw has at least six claws.

[0035] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A device for measuring the depth of silicon trenches on a silicon wafer, characterized in that, The device includes a base, a support platform, a dial indicator, a bracket, a locking mechanism, and a probe. The support platform is horizontally positioned above the base. The lower end of the bracket is fixedly connected to the base, and the upper end of the bracket extends above the support platform. The main body of the dial indicator is vertically locked to the upper end of the bracket by the locking mechanism. The probe includes an inner sleeve, an outer sleeve, a locking element, claws, and a probe tip. The inner sleeve is coaxially fitted onto the lower end of the dial indicator. The inner sleeve has multiple circumferentially arranged grooves, each containing a slidably connected claw. The inner end of the claw clamps the lower end of the dial indicator, and the outer end of the claw protrudes beyond the inner sleeve and has an inclined surface. The outer sleeve is rotatably connected to the outer sleeve and presses against the inclined surface. The locking element locks the outer sleeve onto the inner sleeve. The probe is vertically fixedly connected to the lower end of the inner sleeve, and the outer diameter of the lower end of the probe is greater than 50 micrometers and less than 500 micrometers.

2. The silicon trench depth measuring device for silicon wafers according to claim 1, characterized in that, The dial indicator includes a main body, a sleeve, and a measuring rod. The sleeve is vertically fixed to the lower side of the main body, and the measuring rod is slidably connected in the sleeve. The sleeve is locked to the upper end of the bracket by a locking mechanism, and the inner end of the chuck clamps the lower end of the measuring rod.

3. The silicon trench depth measuring device for silicon wafers according to claim 2, characterized in that, The locking mechanism includes a locking sleeve and a first wing bolt. The locking sleeve is vertically fixed to the upper end of the bracket. The sleeve vertically penetrates the locking sleeve. A V-groove is provided on one side of the locking sleeve. The first wing bolt is threaded to the other side of the locking sleeve. The inner end of the first wing bolt presses the sleeve into the V-groove.

4. The silicon trench depth measuring device for silicon wafers according to claim 3, characterized in that, The inner circumference of the outer jacket is provided with multiple grooves, the outer end of the claw extends into the groove, and one end of the groove is provided with a pressing head. The end of the pressing head is hemispherical, and the pressing head presses the inclined surface.

5. The silicon wafer trench depth measuring device according to claim 1, characterized in that, The locking component includes a support plate and a second wing bolt. The support plate is fixedly connected to the inner sleeve, and the second wing bolt is fixedly connected to the support plate and presses the outer sleeve.

6. The silicon trench depth measuring device for silicon wafers according to claim 1, characterized in that, The chuck is provided with at least six claws.

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