An optical waveguide chip structure for partial discharge ultrasonic detection
By designing the sensing arm and reference arm in the optical waveguide chip structure and coupling the ultrasonic signal with the hydrogel layer, the anti-interference and standardization problems of the optical ultrasonic solution under high pressure environment are solved, and high-precision detection of partial discharge ultrasonic signals is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SDG INFORMATION CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-05-29
AI Technical Summary
Existing optical ultrasonic solutions have poor anti-interference capabilities and low standardization under high-voltage environments, making it difficult to achieve high-precision sensing of partial discharge ultrasonic signals.
An optical waveguide chip structure is adopted, including a substrate, an optical waveguide structure, an optical fiber, and a snap-fit structure. The optical transmission loss is reduced by the sensing arm, the phase modulation caused by ultrasound is amplified by the reference arm, and the ultrasonic signal is coupled by the hydrogel layer to achieve high-precision sensing.
It improved detection sensitivity, achieved high-precision sensing of partial discharge ultrasonic signals, and enhanced anti-interference capabilities and standardized production capabilities.
Smart Images
Figure CN224303144U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of power equipment condition monitoring technology, and in particular relates to an optical waveguide chip structure for partial discharge ultrasonic detection. Background Technology
[0002] High-voltage electrical equipment, such as oil-immersed transformers, GIS switchgear, high-voltage switchgear, and high-voltage cables, are core components and key equipment of smart grids, undertaking important tasks such as voltage transformation, power distribution, and transmission. Partial discharge phenomena inside high-voltage electrical equipment may lead to a decrease in insulation performance and affect the safe operation of the equipment. Partial discharge can generate ultrasonic phenomena, and partial discharge detection methods based on optical ultrasonic sensing technology are the future direction of technological development.
[0003] Among existing optical ultrasonic solutions, extrinsic Fabry-Perot interferometric (EFPI) ultrasonic sensors based on Fabry-Perot interferometers have become a research hotspot. However, the presence of an air cavity limits the application of EFPI in high-pressure environments. While using fiber optic loops as detectors offers structural simplicity, their effectiveness is highly dependent on the winding of the fiber loops, making them unsuitable for standardized fabrication.
[0004] That is, to overcome the problems of poor anti-interference ability, low standardization and difficulty in large-scale production of traditional optical ultrasonic solutions, and to achieve high-precision sensing of partial discharge ultrasonic signals. Utility Model Content
[0005] The purpose of this invention is to provide an optical waveguide chip structure for partial discharge ultrasonic detection, thereby solving the problems of poor anti-interference performance, low standardization, and difficulty in large-scale production of existing optical ultrasonic solutions, and achieving high-precision sensing of partial discharge ultrasonic signals.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] An optical waveguide chip structure for partial discharge ultrasonic detection includes:
[0008] Substrate, used to support the optical waveguide structure;
[0009] An optical waveguide structure, connected to the substrate, is used to sense and transmit changes in optical signals related to partial discharge ultrasound;
[0010] The optical fiber is connected to the optical waveguide structure for input and output of optical signals, and the snap-fit structure is connected to the substrate for fixing the connection between the optical fiber and the optical waveguide structure.
[0011] As an optional technical solution for an optical waveguide chip structure used in partial discharge ultrasonic detection, the snap-fit structure includes:
[0012] A mounting base, connected to the substrate, is used to fix the insert block;
[0013] The insert block is inserted into the fixed base, and the rubber component is connected to the insert block;
[0014] An elastic element is sleeved on the outer surface of the insert block and its two ends are respectively connected to the insert block and the fixing seat.
[0015] As an optional technical solution for an optical waveguide chip structure used in partial discharge ultrasonic detection, the optical waveguide structure includes:
[0016] A bundler, connected to the optical fiber, is used to combine the sensing arm and the reference arm into a bundle;
[0017] A sensing arm, connected to the beam combiner, is used to sense partial discharge ultrasonic signals;
[0018] Reference arm, connected to the combiner.
[0019] As an optional technical solution for optical waveguide chip structure used for partial discharge ultrasonic detection, the surface of the sensing arm is coated with a 50μm thick polyacrylamide hydrogel layer for coupling ultrasonic signals.
[0020] As an optional technical solution for optical waveguide chip structure used in partial discharge ultrasonic detection, the reference arm has a length of 10mm and the sensing arm has a length of 50mm.
[0021] As an optional technical solution for the optical waveguide chip structure used for partial discharge ultrasonic detection, the insert block is provided with a limiting post, the fixing seat is provided with a sliding groove, and the limiting post is inserted into the sliding groove;
[0022] The insert block is equipped with a movable plate for pulling the insert block.
[0023] Beneficial effects:
[0024] This invention provides an optical waveguide chip structure for partial discharge ultrasonic detection. The structure includes a substrate, an optical waveguide structure, an optical fiber, and a snap-fit structure. The substrate supports the optical waveguide structure, which is connected to the substrate and used to sense and transmit changes in optical signals related to partial discharge ultrasonication. The optical fiber is connected to the optical waveguide structure for input and output of the optical signal. The snap-fit structure is connected to the substrate and used to fix the connection between the optical fiber and the optical waveguide structure. By using a sensing arm to reduce optical transmission loss and increase the interaction range between the optical and ultrasonic signals, and by using a reference arm optical path difference to amplify the phase modulation caused by the ultrasonication, the detection sensitivity is significantly improved compared to traditional methods, achieving high-precision sensing of partial discharge ultrasonic signals. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of an optical waveguide chip structure for partial discharge ultrasonic detection provided by an embodiment of the present invention. Figure 1 ;
[0026] Figure 2 This is a schematic diagram of an optical waveguide chip structure for partial discharge ultrasonic detection provided by an embodiment of the present invention. Figure 2 ;
[0027] Figure 3 This is a schematic diagram of the snap-fit structure provided in this embodiment of the utility model. Figure 1 .
[0028] In the figure: 1. Substrate; 2. Optical fiber; 3. Fixing base; 4. Insert block; 5. Rubber component; 6. Elastic component; 7. Bundle combiner; 8. Sensing arm; 9. Reference arm; 10. Hydrogel layer; 11. Limiting post; 12. Movable plate. Detailed Implementation
[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0030] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0031] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0032] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0033] like Figures 1 to 3 As shown, this embodiment provides an optical waveguide chip structure for partial discharge ultrasonic detection. This optical waveguide chip structure for partial discharge ultrasonic detection includes a substrate 1, an optical waveguide structure, an optical fiber 2, and a snap-fit structure. The substrate 1 supports the optical waveguide structure, which is connected to the substrate 1 and is used to sense and transmit changes in optical signals related to partial discharge ultrasonic detection. The optical fiber 2 is connected to the optical waveguide structure and is used for the input and output of optical signals. The snap-fit structure is connected to the substrate 1 and is used to fix the connection between the optical fiber 2 and the optical waveguide structure. The optical waveguide structure includes a... The optical fiber comprises a combiner 7, a sensing arm 8, and a reference arm 9. The combiner 7 is connected to the optical fiber 2 and is used to combine the sensing arm 8 and the reference arm 9 into a single bundle. The sensing arm 8 is connected to the combiner 7 and is used to sense partial discharge ultrasonic signals. The reference arm 9 is connected to the combiner 7 and is used to transmit stable optical signals that do not interact with external ultrasonic signals. The reference arm 9 is 10 mm long, and the sensing arm 8 is 50 mm long. The surface of the sensing arm 8 is coated with a 50 μm thick polyacrylamide hydrogel layer 10 for coupling ultrasonic signals.
[0034] By reducing optical transmission loss through sensing arm 8 and increasing the interaction range of light and ultrasonic signals, and amplifying the phase modulation caused by ultrasound through optical path difference of reference arm 9, the detection sensitivity is greatly improved compared with the traditional solution, and high-precision sensing of partial discharge ultrasonic signals is achieved.
[0035] In use, the signal is input to the combiner 7 via optical fiber 2, and split into two paths by the combiner 7. The optical signal is transmitted through the reference arm 9, with a stable path and no contact with the ultrasonic signal, serving as a phase reference. The optical signal enters the sensing arm 8 to sense the ultrasonic mechanical waves generated by partial discharge. During this process, the ultrasonic mechanical waves generated by partial discharge inside the high-voltage equipment act on the hydrogel layer 10. Utilizing the high elasticity and low acoustic impedance characteristics of the hydrogel, the acoustic pressure signal is efficiently transmitted to the sensing arm 8, causing a slight deformation in the optical waveguide structure. The two optical signals re-converge at the other end to the combiner 7. The phase difference is reflected by the change in output light intensity. By detecting the characteristics of the light intensity change, the intensity, frequency, and other parameters of the partial discharge ultrasonic signal can be deduced, achieving accurate monitoring of partial discharge inside the high-voltage equipment.
[0036] Specifically, the sensing arm 8 uses a third-order Bezier curve waveguide instead of the traditional circular arc bend, reducing the mode matching loss of the spiral layout and ensuring efficient transmission of optical signals. At the same time, the stable optical signal of the reference arm 9 can cancel common-mode interference such as ambient temperature and air pressure, improving the reliability of the detection results. The optical fiber 2 and the optical waveguide structure are connected by fusion splicing. The optical waveguide structure is the existing asymmetric Mach-Zehnder interferometer (MZI) structure, and the optical waveguide structure uses a silicon dioxide optical waveguide.
[0037] In this embodiment, two sets of optical fiber 2 and bundle combiner 7 are provided. Optical fiber 2 is connected to one end of bundle combiner 7, and sensing arm 8 is connected to the other end of bundle combiner 7.
[0038] See Figure 2 and Figure 3 In this embodiment, the snap-fit structure includes a fixing base 3, an insert block 4, a rubber component 5, and an elastic component 6. The fixing base 3 is connected to the substrate 1 and is used to fix the insert block 4. The insert block 4 is inserted into the fixing base 3. The rubber component 5 is connected to the insert block 4. The elastic component 6 is sleeved on the outer surface of the insert block 4 and its two ends are respectively connected to the insert block 4 and the fixing base 3. The insert block 4 is provided with a limiting post 11. The fixing base 3 is provided with a sliding groove. The limiting post 11 is inserted into the sliding groove. The insert block 4 is provided with a movable plate 12 for pulling the insert block 4.
[0039] By wrapping the connection between the optical fiber 2 and the optical waveguide structure with rubber component 5, the connection between the optical fiber 2 and the optical waveguide structure is made stable, preventing the connection from becoming loose due to vibration, external pulling force, etc., ensuring the stability and reliability of optical signal transmission, effectively buffering external impact force, and avoiding damage to the connection part due to mechanical stress such as collision and compression.
[0040] First, pull the movable plate 12. The movable plate 12 moves the insertion block 4 and the rubber part 5. At the same time, the elastic part 6 is squeezed by the insertion block 4 and the fixed seat 3. The elastic part 6 elastically contracts. The insertion block 4 drives the limiting post 11 to slide within the fixed seat 3, ensuring that the elastic part 6 and the insertion block 4 slide horizontally and ensuring the stability of the insertion block 4 when sliding. At this time, the connection position of the optical waveguide structure and the optical fiber 2 is placed inside the elastic part 6. Then, release the movable plate 12. The elastic part 6 loses the compression and recovers its elasticity, acting on the fixed seat 3 and the insertion block 4, thereby pushing the insertion block 4 and the rubber part 5 to move, so that the rubber part 5 fits against the connection position of the optical fiber 2 and the optical waveguide.
[0041] Specifically, the snap-fit structure is provided in four sets. One set is located at the left and right ends of the connection position between the optical fiber 2 and the combiner 7 at one end of the fixed base 3. The elastic element 6 can be an elastic element such as a spring. The rubber element 5 can be an element such as a rubber pad that can protect the connection position between the optical fiber 2 and the combiner 7. The inner surface of the rubber element 5 is in contact with the outer surface of the optical fiber 2 and the combiner 7. The fixed base 3 is fixedly installed on the fixed base 3. The plug 4 is slidably installed on one end of the fixed base 3. The rubber element 5 is fixedly installed on one end of the plug 4. The movable plate 12 is fixedly installed on the other end of the plug 4. The elastic element 6 is sleeved on the outer surface of the plug 4.
[0042] The following is a detailed usage process of an optical waveguide chip structure for partial discharge ultrasonic detection:
[0043] First, pull the movable plate 12. The movable plate 12 moves the insert block 4 and the rubber part 5. At the same time, the elastic part 6 is squeezed by the insert block 4 and the fixed seat 3, and the elastic part 6 elastically contracts. The insert block 4 drives the limiting post 11 to slide within the fixed seat 3, ensuring that the elastic part 6 and the insert block 4 slide horizontally and ensuring the stability of the insert block 4 during sliding. At this time, the connection position of the optical waveguide structure and the optical fiber 2 is placed inside the elastic part 6. Then, release the movable plate 12. The elastic part 6 loses its compression and elasticity, acting on the fixed seat 3 and the insert block 4, thereby pushing the insert block 4 and the rubber part 5 to move. This causes the rubber part 5 to fit against the connection position of the optical fiber 2 and the optical waveguide, wrapping the connection. When the ultrasonic mechanical wave generated by partial discharge inside the high-voltage equipment is transmitted, the signal passes through... The optical signal is input through fiber optic cable 2 to combiner 7, and split into two paths by combiner 7. The optical signal is transmitted through reference arm 9, with a stable path and no contact with the ultrasonic signal, serving as a phase reference. The optical signal enters sensing arm 8 to sense the ultrasonic mechanical wave generated by partial discharge. During this process, the ultrasonic mechanical wave generated by partial discharge inside the high-voltage equipment acts on the hydrogel layer 10. Utilizing the high elasticity and low acoustic impedance characteristics of the hydrogel, the acoustic pressure signal is efficiently transmitted to sensing arm 8, causing a slight deformation of the optical waveguide structure. The two optical signals re-merge at the other end to combiner 7. The phase difference is reflected by the change in output light intensity. By detecting the characteristics of the change in light intensity, the intensity, frequency, and other parameters of the partial discharge ultrasonic signal can be deduced, achieving accurate monitoring of partial discharge inside the high-voltage equipment.
[0044] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. An optical waveguide chip structure for partial discharge ultrasonic detection, characterized in that, include: Substrate (1) is used to support the optical waveguide structure; An optical waveguide structure, connected to the substrate (1), is used to sense and transmit changes in optical signals related to partial discharge ultrasound; The optical fiber (2) and the snap-fit structure are connected to the optical waveguide structure for input and output of optical signals. The snap-fit structure is connected to the substrate (1) for fixing the connection between the optical fiber (2) and the optical waveguide structure.
2. The optical waveguide chip structure for partial discharge ultrasonic detection according to claim 1, characterized in that, The snap-fit structure includes: A fixing base (3) is connected to the substrate (1) and is used to fix the insert (4); Insert (4) and rubber part (5), wherein the insert (4) is inserted into the fixing seat (3) and the rubber part (5) is connected to the insert (4); The elastic element (6) is sleeved on the outer surface of the insert (4) and its two ends are respectively connected to the insert (4) and the fixing seat (3).
3. The optical waveguide chip structure for partial discharge ultrasonic detection according to claim 1, characterized in that, The optical waveguide structure includes: A bundler (7), connected to the optical fiber (2), is used to combine the sensing arm (8) and the reference arm (9) into a bundle; The sensing arm (8) is connected to the beam combiner (7) and is used to sense the partial discharge ultrasonic signal; Reference arm (9) is connected to the bundle combiner (7).
4. The optical waveguide chip structure for partial discharge ultrasonic detection according to claim 3, characterized in that, The surface of the sensing arm (8) is coated with a 50 μm thick polyacrylamide hydrogel layer (10) for coupling ultrasonic signals.
5. The optical waveguide chip structure for partial discharge ultrasonic detection according to claim 3, characterized in that, The reference arm (9) is 10 mm long and the sensing arm (8) is 50 mm long.
6. The optical waveguide chip structure for partial discharge ultrasonic detection according to claim 2, characterized in that, The insert (4) is provided with a limiting post (11), and the fixed seat (3) is provided with a sliding groove. The limiting post (11) is inserted into the sliding groove. The insert (4) is provided with a movable plate (12) for pulling the insert (4).