Hardware architecture of a combined telemetry and payload system

Abstract

The utility model discloses a hardware architecture of remote sensing and communication integrated load system, in view of traditional satellite system adopts the separation design of remote sensing and communication function, data rely on ground backhaul processing, lead to the poor timeliness of disaster monitoring scene etc.

Description

Technical Field

[0001] This utility model belongs to the technical field of spacecraft on-orbit data processing, and in particular relates to a hardware architecture of a communication and remote sensing integrated payload system. Background Technology

[0002] In recent years, the commercial space industry has developed rapidly. Low-Earth orbit (LEO) micro- and nano-satellites, due to their advantages such as short development cycles, low launch costs, and network deployment capabilities, have shown great application potential in fields such as remote sensing monitoring, Internet of Things (IoT) communication, and space science experiments. However, current technologies face multiple bottlenecks in on-orbit data processing for LEO micro- and nano-satellites:

[0003] 1. Traditional satellite systems adopt a design that separates remote sensing and communication functions, and data relies on ground backhaul for processing. This results in poor timeliness in scenarios such as disaster monitoring, and the bandwidth of the satellite-to-ground data transmission link is limited, which cannot meet the low latency requirements of various remote sensing applications.

[0004] 2. Due to the constraints of satellite platform size and power consumption, the frequent interaction between computing and storage units under the traditional von Neumann architecture results in 30%-50% of system power consumption being wasted. Furthermore, the computing power of existing onboard computing units is generally lower than 5 TOPS, making it difficult to support real-time fusion analysis of multispectral imagery and IoT data. Utility Model Content

[0005] The purpose of this invention is to provide a hardware architecture for an integrated communication and remote sensing payload system. By setting up communication and remote sensing payloads on commercial satellites and using high-computing-power hardware on the satellite end, multi-spectral remote sensing imaging, high-sensitivity satellite IoT communication and high-computing-power hardware are deeply coordinated to build an on-board intelligent processing closed loop, which significantly improves the overall sensing efficiency of the satellite.

[0006] To solve the above problems, the technical solution of this utility model is as follows:

[0007] A hardware architecture for an integrated communication and remote sensing payload system includes: a multispectral imaging payload, an infrared payload, an Internet of Things communication payload, and high-computing-power hardware;

[0008] The multispectral imaging payload, infrared payload, and IoT communication payload are connected to the high-computing hardware via a high-speed data interface.

[0009] The multispectral imaging payload, infrared payload, IoT communication payload, and high-performance computing hardware are integrated into a single design, sharing a power bus, star sensor, and data transmission module to enhance functional density.

[0010] According to one embodiment of the present invention, the multispectral imaging payload uses a CMOSIS CMV20000 sensor, covering eight bands from 450 to 900 nm, and achieves an 8m GSD resolution in a 500km orbit.

[0011] The infrared payload covers the 8–12.5 μm infrared spectrum, has a thermal sensitivity of 0.1 K @ 300 K, and supports switching between staring imaging and push-broom modes.

[0012] The IoT communication payload adopts a software-defined radio architecture, supports LoRaWAN and NB-IoT dual-mode protocols, has a receiving sensitivity of -130dBm, is equipped with a high-gain flat panel antenna, and can simultaneously connect 50 low-power terminals.

[0013] According to one embodiment of this utility model, the multispectral imaging payload, infrared payload, and IoT communication payload are integrated into one unit, and are integrated into a 0.2m... 3 Within the space.

[0014] According to one embodiment of this utility model, the multispectral imaging payload, infrared payload, and IoT communication payload are integrated into a 0.2m space via a carbon fiber composite bracket and a modular heat pipe cooling system. 3 Within the space.

[0015] According to one embodiment of the present invention, the high-computing-power hardware includes:

[0016] The NVIDIA Jetson AGX Orin module integrates a 2048-core Ampere GPU and a 12-core ARM CPU, supports 150 TOPS INT8 computing power, and connects to various payloads via CameraLink and LVDS buses.

[0017] The storage module uses a 4TB high-performance SSD with LDPC error correction and supports continuous read / write speeds of 1.5GB / s.

[0018] The flexible payload interface unit supports multiple payload interfaces, including CameraLink and LVDS, to connect to multispectral cameras, infrared payloads, and IoT data.

[0019] According to one embodiment of the present invention, the hardware architecture further includes integrated electronic computer hardware, wherein the multispectral imaging payload, infrared payload, Internet of Things communication payload, and high-computing-power hardware are remotely connected to the integrated electronic computer hardware.

[0020] According to one embodiment of the present invention, the integrated electronic computer hardware includes an RTU to realize remote monitoring and data acquisition of the multispectral imaging payload, infrared payload, Internet of Things communication payload, and high-computing-power hardware.

[0021] Because of the adoption of the above technical solution, this utility model has the following advantages and positive effects compared with the prior art:

[0022] The hardware architecture of the integrated remote sensing payload system in one embodiment of this utility model addresses the problem of poor timeliness in scenarios such as disaster monitoring caused by the traditional satellite system's separate design of remote sensing and communication functions and reliance on ground-based data transmission for processing. By connecting the multispectral imaging payload, infrared payload, and IoT communication payload to the high-computing-power hardware through a high-speed data interface, and adopting an integrated design that shares a power bus, star sensor, and data transmission module, a closed-loop intelligent processing system on the satellite is constructed, significantly improving the satellite's overall sensing efficiency and functional density. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the hardware architecture of the integrated telemetry and remote sensing payload system in one embodiment of the present invention. Detailed Implementation

[0024] The hardware architecture of the integrated communication and remote sensing payload system proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description and claims.

[0025] Please refer to Figure 1 This embodiment provides a hardware architecture for an integrated communication and remote sensing payload system, including: a multispectral imaging payload (such as a visible light camera), an infrared payload (such as an infrared camera), an IoT communication payload (such as a communication unit), and high-computing-power hardware; the multispectral imaging payload, infrared payload, and IoT communication payload are connected to the high-computing-power hardware through a high-speed data interface. The multispectral imaging payload, infrared payload, IoT communication payload, and high-computing-power hardware are integrated into a single design, sharing a power bus, star sensor, and data transmission module to improve functional density.

[0026] Specifically, the multispectral imaging payload uses a CMOSIS CMV20000 sensor, covering eight bands from 450 to 900 nm (including key spectral bands such as coastal blue and red edges), employing an off-axis three-mirror optical design to achieve 8m GSD resolution at a 500km orbit. The infrared payload covers the 8–12.5μm infrared spectral band, with a thermal sensitivity of 0.1K@300K, supporting staring imaging and pushbroom mode switching. The IoT communication payload adopts a software-defined radio architecture, supporting LoRaWAN and NB-IoT dual-mode protocols, with a receiving sensitivity of -130dBm, equipped with a high-gain flat panel antenna, and can simultaneously connect 50 low-power terminals (such as buoys and forest monitoring systems). The three payloads are integrated into a 0.2m space using a carbon fiber composite bracket and a modular heat pipe cooling system. 3 Within the space, the total power consumption is ≤80W, which is significantly better than the traditional split design.

[0027] The off-axis three-mirror optical design consists of three mirrors. By rationally setting the off-axis amount, tilt amount, spacing, and surface shape of the mirrors, an optical system with unobstructed, chromatic aberration-free, and high-quality imaging can be achieved. Its design is typically based on the initial structure of a coaxial three-mirror system, eliminating central obstruction problems through off-axis field of view or aperture processing, and further optimizing aberrations to achieve diffraction-limited imaging quality. This embodiment uses the off-axis three-mirror optical design for a multispectral imaging payload, employing a common aperture design, i.e., achieving imaging of multiple wavelengths in the same optical path, thereby reducing system size and weight.

[0028] The three loads are integrated into a 0.2m space using a carbon fiber composite support and a modular heat pipe cooling system. 3 Within the space, it not only effectively manages heat load but also ensures the system's lightweight design and efficient heat dissipation. Carbon fiber composite supports, due to their lightweight, high strength, and excellent thermal management performance, are suitable for applications requiring high mechanical strength and lightweight design. Through multi-level structural design, carbon fiber, polyaniline nanofibers, and silver nanowires can be integrated into a single composite material, forming a unique "branch-trunk" interlocking micro / nano structure, thereby significantly improving the material's mechanical and thermal management properties. In practical applications, the strong adhesion of polydopamine can be used to form a branch-trunk interlocking micro / nano structure of carbon fiber, enhancing the material's mechanical properties. By employing a dual-control strategy that synergistically controls thermal conductivity and infrared radiation, the thermal management performance of the composite material is optimized, making it potentially applicable in thermal insulation and infrared stealth fields.

[0029] Modular heat pipe cooling systems effectively manage heat from multiple heat sources by integrating heat pipes and radiators into a compact module. This design not only improves heat dissipation efficiency but also reduces the overall system complexity and weight. In practical applications, a six-heat pipe cooling system can be selected to provide higher heat dissipation efficiency and better thermal management performance; by rationally arranging the heat pipes, heat can be evenly distributed and effectively transferred to the radiator, thereby improving overall heat dissipation efficiency.

[0030] The high-performance hardware in this embodiment includes: an NVIDIA Jetson AGX Orin module, integrating a 2048-core Ampere GPU and a 12-core ARM CPU, supporting 150 TOPS INT8 computing power, and connected to the payload via cameralink and LVDS buses; a storage module using a 4TB high-performance SSD (Seagate Nytro® XF1230), employing LDPC error correction, supporting continuous read and write speeds of 1.5GB / s, and having a more than 5-year on-orbit lifespan through partitioned redundancy design; and a flexible payload interface unit supporting multiple payload interfaces such as cameralink, 2711, and LVDS, capable of connecting to multispectral cameras (2Gbps), infrared payloads (800Mbps), and IoT data (10kbps).

[0031] This high-performance hardware combines multimodal intelligent processing algorithms with satellite on-orbit communication and remote sensing collaborative algorithms. Through the synergistic effect of each component, it enables micro- and nano-satellites to achieve efficient remote sensing and communication functions under resource-constrained conditions.

[0032] The hardware architecture of the aforementioned integrated remote sensing payload system also includes integrated electronic computer hardware. Multispectral imaging payloads, infrared payloads, IoT communication payloads, and high-computing-power hardware are remotely connected to this integrated electronic computer hardware. This integrated electronic computer hardware includes an Remote Monitoring Unit (RTU) to enable remote monitoring and data acquisition of the multispectral imaging payload, infrared payload, IoT communication payload, and high-computing-power hardware. This integrated electronic computer hardware system is a highly integrated system, encompassing multiple aspects from CPU, memory, and input / output interfaces to communication modules and power management. These hardware components together constitute the core functionality of the RTU, enabling it to efficiently and reliably complete remote monitoring and control tasks for the satellite system.

[0033] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, if these changes fall within the scope of the claims of the present invention and their equivalents, they shall still fall within the protection scope of the present invention.

Claims

1. A hardware architecture for a telemetry and remote sensing integrated payload system, characterized in that, include: Multispectral imaging payload, infrared payload, IoT communication payload, and high-performance computing hardware; The multispectral imaging payload, infrared payload, and IoT communication payload are connected to the high-computing hardware via a high-speed data interface. The multispectral imaging payload, infrared payload, IoT communication payload, and high-performance computing hardware are integrated into a single design, sharing a power bus, star sensor, and data transmission module to enhance functional density.

2. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 1, characterized in that, The multispectral imaging payload uses a CMOSIS CMV20000 sensor, covering eight bands from 450 to 900 nm, and achieves an 8 m GSD resolution at a 500 km orbit. The infrared payload covers the 8–12.5 μm infrared spectrum, has a thermal sensitivity of 0.1 K @ 300 K, and supports switching between staring imaging and push-broom modes. The IoT communication payload adopts a software-defined radio architecture, supports LoRaWAN and NB-IoT dual-mode protocols, has a receiving sensitivity of -130dBm, is equipped with a high-gain flat panel antenna, and can simultaneously connect 50 low-power terminals.

3. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 1 or 2, characterized in that, The multispectral imaging payload, infrared payload, and IoT communication payload are integrated into one unit, and are integrated into a 0.2m space. 3 Within the space.

4. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 3, characterized in that, The multispectral imaging payload, infrared payload, and IoT communication payload are integrated into a 0.2m space via a carbon fiber composite bracket and a modular heat pipe cooling system. 3 Within the space.

5. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 1, characterized in that, The high-performance computing hardware includes: The NVIDIA Jetson AGX Orin module integrates a 2048-core Ampere GPU and a 12-core ARM CPU, supports 150 TOPS INT8 computing power, and connects to various payloads via CameraLink and LVDS buses. The storage module uses a 4TB high-performance SSD with LDPC error correction and supports continuous read / write speeds of 1.5GB / s. The flexible payload interface unit supports multiple payload interfaces, including CameraLink and LVDS, to connect to multispectral cameras, infrared payloads, and IoT data.

6. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 1, characterized in that, It also includes integrated electronic computer hardware, and the multispectral imaging payload, infrared payload, Internet of Things communication payload and high computing power hardware are remotely connected to the integrated electronic computer hardware.

7. The hardware architecture of the integrated communication and remote sensing payload system as described in claim 6, characterized in that, The integrated electronic computer hardware includes an RTU to enable remote monitoring and data acquisition of the multispectral imaging payload, infrared payload, IoT communication payload, and high-computing-power hardware.

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