Three-dimensional heat dissipation device and immersion cooling system

Abstract

The present application relates to a three-dimensional heat dissipation device and an immersion cooling system. The three-dimensional heat dissipation device comprises a base, a vapor chamber assembly, a fin set and an evaporation structure layer. The vapor chamber assembly comprises a vapor chamber and a plurality of heat pipes. The vapor chamber is disposed on the base and has an internal space. The heat pipes are arranged in parallel to each other and are connected to the vapor chamber respectively. Each of the heat pipes has an internal passage communicating with the internal space, and the internal passages and the internal space jointly form an airtight chamber. The fin set has a heat dissipation fin. The heat dissipation fin is inserted into the heat pipes respectively. The evaporation structure layer covers and is in thermal conductive connection with at least one of the vapor chamber and the heat dissipation fin. Through the above structure, the three-dimensional heat dissipation device and the immersion cooling system of the present application can effectively cool and dissipate heat for the to-be-cooled element, so as to maintain the working efficiency and service life of the to-be-cooled element.

Description

Technical Field

[0001] This invention relates to a three-dimensional heat dissipation device, and more particularly to a three-dimensional heat dissipation device with a heat spreader assembly and an immersion cooling system. Background Technology

[0002] In recent years, with the significant increase in processing power of electronic devices (such as computers or servers) used in cloud services, these devices generate a large amount of waste heat. Some manufacturers immerse the components of electronic devices that need to be cooled (such as CPUs and GPUs) in a closed tank of working fluid to remove the heat generated by these components.

[0003] However, if the current cooling system lacks effective heat dissipation methods, it will be unable to effectively cool and dissipate heat from the components to be cooled, which may affect the working performance and service life of the components to be cooled.

[0004] However, the aforementioned technologies still have inconveniences and shortcomings, requiring further improvement. Therefore, how to effectively solve these inconveniences and shortcomings is one of the important research and development topics at present, and has become a goal that urgently needs improvement in related fields. Utility Model Content

[0005] This invention proposes a three-dimensional heat dissipation device and an immersion cooling system to solve the problems of prior art.

[0006] According to one embodiment of the present invention, a three-dimensional heat dissipation device includes a base, a vapor chamber assembly, a fin assembly, and at least one evaporation structure layer. The vapor chamber assembly includes a vapor chamber and a plurality of heat pipes. The vapor chamber is located on the base and has an internal space. The heat pipes are arranged parallel to each other and connected to the vapor chamber. Each heat pipe has an internal channel communicating with the internal space, and the internal space and these internal channels together form an airtight chamber. The fin assembly includes at least one heat dissipation fin. The heat dissipation fin is passed through by the heat pipes. The evaporation structure layer covers and thermally connects at least one of the vapor chamber and the heat dissipation fins.

[0007] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer includes a plurality of first evaporation structure layers, which are respectively fixedly covered on the outer surface of the heat dissipation fins.

[0008] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the heat spreader includes a top surface and a bottom surface that are opposite to each other. These heat pipes are connected to the top surface of the heat spreader, and the bottom surface of the heat spreader protrudes outward with a top support. The evaporation structure layer includes a plurality of second evaporation structure layers, which respectively and fixedly cover the top surface and the bottom surface of the heat spreader.

[0009] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the heat dissipation fins include a plate, a plurality of perforations, and a plurality of connecting portions. The plate and the heat spreader are separate from each other. The perforations are spaced apart on the plate and are passed through by the heat pipes. Each connecting portion connects to the plate, surrounds one of the perforations, and fixes one of the heat pipes.

[0010] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the end face of each heat pipe away from the heat spreader is located outside one of the perforations.

[0011] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer has a plurality of filaments that interweave to form a plurality of gaps.

[0012] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is a single-layer or multi-layer structure.

[0013] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

[0014] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the base includes at least one opening, and the top portion extends out from the opening.

[0015] According to one embodiment of the present invention, an immersion cooling system includes a liquid container, a heat source module, and the aforementioned three-dimensional heat dissipation device. The liquid container has an inner chamber for storing coolant. The heat source module is located inside the liquid container and is immersed in the coolant. The three-dimensional heat dissipation device is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container is parallel to the long axis of the heat spreader and orthogonal to the long axis of each heat pipe.

[0016] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0017] The above description is only used to illustrate the problem that this creation aims to solve, the technical means to solve the problem, and the effects it produces. The specific details of this creation will be described in detail in the implementation methods and related diagrams below. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device.

[0021] Figure 3 for Figure 1 A cross-sectional view along line segment AA.

[0022] Figure 4 for Figure 3 A magnified view of a portion of region M.

[0023] Figure 5 This is a schematic diagram of an immersion cooling system according to an embodiment of the present invention.

[0024] The reference numerals in the attached figures are explained as follows:

[0025] 10: Three-dimensional heat dissipation device

[0026] 100: Base

[0027] 110: Framework

[0028] 120: Opening

[0029] 130: Elastic Clip

[0030] 200: Heat spreader assembly

[0031] 210: Heat spreader

[0032] 211: Top surface

[0033] 212: Bottom

[0034] 213: Top and back sections

[0035] 214: Interior Space

[0036] 220: Capillary structure

[0037] 230: Heat pipe

[0038] 231: End face

[0039] 232: In-pipe passage

[0040] 240: Airtight Chamber

[0041] 300: Fin assembly

[0042] 301: Heatsink fins

[0043] 310: Sheet

[0044] 311: First Main Page

[0045] 312: Second Main Face

[0046] 320: Perforated section

[0047] 322: Solder layer

[0048] 330: Connecting part

[0049] 400: First evaporation structure layer

[0050] 401: Through-hole

[0051] 500: Second evaporation structure layer

[0052] 501: Through hole

[0053] 600: Immersion Cooling System

[0054] 610: Liquid containers

[0055] 611: Inner Chamber

[0056] 611A: Inner wall

[0057] 620: Coolant

[0058] 700: Heat source module

[0059] 710: Circuit Board

[0060] 720: Electronic Components

[0061] AA: line segment

[0062] G: Gap

[0063] M: Region

[0064] X, Y, Z: Axes Detailed Implementation

[0065] The following diagrams disclose various embodiments of this invention. For clarity, many practical details will be described in the following description. However, those skilled in the art will understand that these practical details are not essential in some embodiments of this invention and should not be used to limit the invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in a simplified schematic manner. Additionally, for ease of viewing, the dimensions of the components in the diagrams are not drawn to scale.

[0066] Figure 1 A perspective view of a three-dimensional heat dissipation device 10 according to an embodiment of this invention. Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device 10. Figure 3 for Figure 1 A sectional view along line segment AA. (e.g.) Figures 1 to 3As shown, in this embodiment, the three-dimensional heat dissipation device 10 includes a base 100, a vapor chamber assembly 200, a fin assembly 300, and multiple evaporation structure layers (such as a first evaporation structure layer 400 and a second evaporation structure layer 500). The vapor chamber assembly 200 includes a vapor chamber 210 and multiple heat pipes 230. The vapor chamber 210 is located on the base 100 and is used to thermally connect to an element to be cooled (not shown). These heat pipes 230 are respectively connected to the vapor chamber 210 and are arranged in parallel with each other. An internal space 214 is defined within the vapor chamber 210, and each heat pipe 230 has an internal channel 232 communicating with the internal space 214. The internal space 214 and these internal channels 232 together constitute an airtight chamber 240. The airtight chamber 240 is filled with a working fluid (not shown). The fin assembly 300 includes multiple (e.g., 2-3) heat dissipation fins 301. These heat dissipation fins 301 are arranged parallel to each other and are passed through by the heat pipes 230, meaning that each heat pipe 230 passes through all the heat dissipation fins 301 simultaneously. These heat dissipation fins 301 are completely separated from the vapor chamber 210, meaning that there is a gap between the heat dissipation fins 301 and the vapor chamber 210. An evaporation structure layer (refer to the first evaporation structure layer 400 and the second evaporation structure layer 500) covers and thermally connects the vapor chamber 210 and the heat dissipation fins 301.

[0067] In this way, the heat energy of the component to be cooled can be distributed to these heat pipes 230 through the working fluid (not shown in the figure) in the heat spreader 210, and then dissipated evenly to the outside through the heat dissipation fins 301.

[0068] More specifically, in this embodiment, the base 100 includes a frame 110 and a plurality of elastic clips 130. The frame 110 is to which the heat spreader 210 is welded or secured. The elastic clips 130 are located on two opposite sides of the frame 110 for securing the frame 110 to a stationary component (such as a housing or wiring board). The frame 110 has a plurality of openings 120. These openings 120 are arranged sequentially along the long axis (e.g., the Y-axis) of the frame 110 and are located between the elastic clips 130.

[0069] The vapor chamber 210 is generally plate-shaped, having a top surface 211 and a bottom surface 212 facing each other. The top surface 211 of the vapor chamber 210 overlaps with the heat dissipation fins 301 along the Z-axis. The bottom surface 212 of the vapor chamber 210 protrudes outward with a top abutment 213, which extends from one of the openings 120 of the frame 110 to abut against the element to be cooled. The heat pipes 230 are commonly inserted into the top surface 211 of the vapor chamber 210, and are evenly distributed on the top surface 211 of the vapor chamber 210. Each heat pipe 230 is straight, with one end inserted vertically into the top surface 211 of the vapor chamber 210, and the other end having a closed end face 231. The major axis direction (e.g., Z-axis) of the heat pipe 230 is orthogonal to the major axis direction (e.g., Y-axis) of the vapor chamber 210; however, this invention is not limited thereto.

[0070] Figure 4 for Figure 3 A magnified view of a portion of region M. For example... Figure 2 , Figure 3 and Figure 4 As shown, in this embodiment, each heat dissipation fin 301 includes a body 310, a plurality of perforations 320, and a plurality of connecting portions 330. The body 310 extends along the XY axis and has a first main surface 311 and a second main surface 312 facing each other. The first main surface 311 is arranged between the top surface 211 and the second main surface 312 of the heat spreader 210 (i.e., the first main surface 311 faces the top surface 211 of the heat spreader 210). The perforations 320 are spaced apart on the body 310 and are respectively passed through by the heat pipes 230. More specifically, the end of the heat pipe 230 away from the heat spreader 210 has an end face 231, which is located outside one of the perforations 320. Each perforation 320 connects to the first main surface 311 and the second main surface 312 of the body 310. Each connecting portion 330 connects to the first main surface 311 of the sheet 310 and is coaxially aligned and surrounds one of the perforations 320 and one of the heat pipes 230 therein. For example, the connecting portion 330 is integrally formed with the sheet 310; however, the invention is not limited thereto.

[0071] In addition, each connection 330 is fixed to the corresponding heat pipe 230 by a solder layer 322, and the solder layer 322 is located directly between the heat pipe 230 and the connection 330, so that the heat dissipation fins 301 can be more securely fixed on these heat pipes 230.

[0072] The evaporation structure layer includes multiple first evaporation structure layers 400. These first evaporation structure layers 400 are respectively fixed to the first main surface 311 and the second main surface 312 of the sheet 310.

[0073] In this embodiment, the first evaporation structure layer 400 completely surrounds the heat pipes 230 on the first main surface 311 and the second main surface 312 of the plate 310. That is, the heat pipes 230 extend into the through holes 401 formed by the first evaporation structure layer 400 located on the upper and lower sides of the heat dissipation fins 301. However, this invention is not limited to this.

[0074] For example, the first evaporation structure layer 400 may be a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the sheet 310; however, the invention is not limited to this.

[0075] In this embodiment, the first evaporation structure layer 400 is a mesh structure, hence also called the first mesh structure layer, which has many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0076] Furthermore, in this embodiment, the first evaporation structure layer 400 is a multi-layer structure with layers stacked sequentially on each other. However, this invention is not limited to this. In other embodiments, the first evaporation structure layer 400 may also be a single-layer structure.

[0077] Also, such as Figure 2 and Figure 3 As shown, in this embodiment, the evaporation structure layer includes a plurality of second evaporation structure layers 500. These second evaporation structure layers 500 are respectively fixedly covered on the outer surface of the heat spreader 210 and are thermally connected to the heat spreader 210.

[0078] For example, these second evaporation structure layers 500 are respectively fixed to the bottom surface 212 and the top surface 211 of the heat spreader 210. The second evaporation structure layer 500 located on the bottom surface 212 of the heat spreader 210 is exposed through another opening 120 of the frame 110. However, the invention is not limited to this, and in other embodiments, the second evaporation structure layer 500 may only be located on the top surface 211 of the heat spreader 210.

[0079] In this embodiment, the second evaporation structure layer 500 completely surrounds the heat pipes 230 on the top surface 211 of the heat spreader 210, that is, the heat pipes 230 extend into the through holes 501 formed in the second evaporation structure layer 500. However, this invention is not limited to this.

[0080] For example, the second evaporation structure layer 500 may be a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the heat spreader 210; however, this invention is not limited to this.

[0081] In this embodiment, the second evaporation structure layer 500 is a mesh structure, hence also called the second mesh structure layer, which has many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0082] Furthermore, in this embodiment, the second evaporation structure layer 500 is a multi-layer structure with layers stacked sequentially on top of each other. However, the invention is not limited to this, and in other embodiments, the second evaporation structure layer 500 may also be a single-layer structure.

[0083] Furthermore, the airtight chamber 240 of the heat spreader 210 includes a capillary structure 220. The capillary structure 220 is disposed on the inner surface of the airtight chamber 240, allowing the working fluid (not shown) within the airtight chamber 240 to flow under the guidance of the capillary structure 220. The capillary structure 220, the first evaporation structure layer 400, and the second evaporation structure layer 500 can be similar components. For example, the capillary structure 220 can be made of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or any combination thereof, but this invention is not limited thereto.

[0084] It should be understood that this invention is not limited to the number of heat dissipation fins 301, heat pipes 230, first evaporation structure layer 400 and second evaporation structure layer 500. In other embodiments, heat dissipation fins 301, heat pipes 230 and first evaporation structure layer 400 and second evaporation structure layer 500 may also be a single unit.

[0085] Figure 5 This is a schematic diagram of an immersion cooling system 600 according to an embodiment of the present invention. Figure 5 As shown, the immersion cooling system 600 includes a liquid container 610, a heat source module 700, and the aforementioned three-dimensional heat dissipation device 10. The liquid container 610 has an inner chamber 611 for storing coolant 620. The heat source module 700 is located within the liquid container 610 and is immersed in the coolant 620. The three-dimensional heat dissipation device 10 is located within the liquid container 610 and is thermally connected to the heat source module 700.

[0086] Thus, as Figure 3 and Figure 5 As shown, when the heat energy of the heat source module 700 is transferred to the three-dimensional heat dissipation device 10, since all surfaces of the first evaporation structure layer 400 and the second evaporation structure layer 500 are in contact with the coolant 620, part of the heat energy transferred to the first evaporation structure layer 400 and the second evaporation structure layer 500 can be quickly exchanged by the coolant 620, thereby effectively accelerating the heat dissipation of the heat source module 700.

[0087] Furthermore, in this embodiment, the three-dimensional heat dissipation device 10 is located upright in the inner cavity 611, and the long axis direction (e.g., Z-axis) of the liquid container 610 is parallel to the long axis direction (e.g., Z-axis) of the heat spreader 210, and orthogonal to the long axis direction (e.g., Y-axis) of each heat pipe 230.

[0088] Thus, as Figure 3 and Figure 5 As shown, the coolant 620 can enter the gap G between the heat pipe 230 and the heat dissipation fins 301, the first evaporation structure layer 400 and the second evaporation structure layer 500, so that the coolant 620 evaporates into bubbles due to heat and rises along the Z-axis to the surface of the coolant 620, thereby effectively removing the heat energy of the heat source module 700.

[0089] For example, the immersion cooling system 600 is a two-phase immersion liquid cooling system, and the liquid container 610 is a 1U server chassis; the heat source module 700 includes a circuit board 710 and several electronic components 720. The circuit board 710 is vertically fixed to the inner wall 611A of the liquid container 610. The electronic components 720 are distributed on the circuit board 710 and are in contact with the top portion 213 of the heat spreader 210. In this embodiment, the electronic components 720 are conventional components such as CPUs, GPUs, or interface cards; however, this invention is not limited to these.

[0090] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0091] Finally, the embodiments disclosed above are not intended to limit this invention. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of this invention, and all such modifications and refinements shall be protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that, include: A base; A vapor chamber assembly includes a vapor chamber and a plurality of heat pipes. The vapor chamber is located on a base and has an internal space. The plurality of heat pipes are arranged in parallel to each other and are respectively connected to the vapor chamber. Each of the plurality of heat pipes has an internal channel communicating with the internal space. The internal space and the plurality of internal channels together form an airtight chamber. A fin assembly, comprising at least one heat dissipation fin, wherein the at least one heat dissipation fin is respectively passed through by the plurality of heat pipes; and At least one evaporation structure layer covers and thermally connects the vapor chamber to at least one of the at least one heat dissipation fins.

2. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer includes a plurality of first evaporation structure layers, which are respectively fixedly covered on the outer surface of the at least one heat dissipation fin.

3. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The vapor chamber includes a top surface and a bottom surface that are opposite to each other. The plurality of heat pipes are connected to the top surface of the vapor chamber, and the bottom surface of the vapor chamber has an outwardly protruding top portion. The at least one evaporation structure layer includes a plurality of second evaporation structure layers, which respectively and fixedly cover the top and bottom surfaces of the heat spreader.

4. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one heat dissipation fin includes: A single piece, separate from the heat exchange plate; Multiple perforations are spaced apart on the sheet, and are respectively passed through by the multiple heat pipes; and Multiple connecting portions, each of which connects to the sheet body, surrounds one of the multiple perforated portions, and fixes one of the multiple heat pipes.

5. The three-dimensional heat dissipation device as described in claim 4, characterized in that, The end face of each of the plurality of heat pipes relative to one end of the vapor chamber is located outside one of the plurality of perforations.

6. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer has a plurality of filaments that are interwoven to form a plurality of voids.

7. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is a single-layer or multi-layer structure.

8. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

9. The three-dimensional heat dissipation device as described in claim 3, characterized in that, The base includes at least one opening, from which the top extends.

10. An immersion cooling system, characterized in that, include: A liquid container having an internal chamber for storing coolant; A heat source module is located inside the liquid container and is used to be immersed in the coolant; as well as The three-dimensional heat dissipation device as described in any one of claims 1 to 9 is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container is parallel to the long axis of the heat spreader and orthogonal to the long axis of each of the plurality of heat pipes.

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