Memory card test fixture and test system
By introducing a cooling fan and ventilation holes into the CF card module testing fixture, the problem of low efficiency in passive heat dissipation is solved, achieving efficient active heat dissipation and ensuring stable equipment operation and reliable test results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA ELECTRONICS CORP 6TH RES INST
- Filing Date
- 2025-04-16
- Publication Date
- 2026-05-29
AI Technical Summary
The passive cooling method of existing CF card module testing fixtures has limited efficiency, especially under long-term high-load operation, which may lead to temperature rise, affecting equipment stability and lifespan.
Active cooling with a cooling fan, combined with a heat dissipation hole and heat sink design, improves airflow efficiency and removes heat from the circuit board.
This improves the heat dissipation efficiency of the testing fixture, reduces the temperature, ensures reliable equipment operation, and enhances the reliability and consistency of test results.
Smart Images
Figure CN224304375U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of testing equipment, and in particular to a memory card testing fixture and testing system. Background Technology
[0002] A CF card module is an embedded device widely used in portable electronic data storage devices. As an embedded module, the use and functionality of a CF card module must rely on the host device.
[0003] During the production of CF card modules, test fixtures are essential for program loading and functional performance testing. During this testing process, the test fixtures generate heat, which negatively impacts their stability and lifespan. Existing test fixtures typically achieve passive cooling by creating ventilation holes in the casing. This method is simple and inexpensive. However, passive cooling is relatively inefficient, especially under prolonged high-load operation. Insufficient heat dissipation can lead to increased test fixture temperature, affecting performance and even causing malfunctions. Utility Model Content
[0004] The purpose of this application is to provide a memory card testing fixture and testing system, which can improve the heat dissipation efficiency of the testing fixture and reduce the temperature of the testing fixture, so that the testing fixture can operate reliably.
[0005] This application provides a memory card testing fixture, including a housing, a circuit board, and a cooling fan;
[0006] The circuit board is located inside the housing; the cooling fan is mounted on the housing, and the cooling fan is opposite to the heat-generating area of the circuit board;
[0007] The housing has heat dissipation holes, which are located on the periphery of the circuit board surface.
[0008] Furthermore, the above technical solution also includes a heat sink; the heat sink is attached to the heat-generating area of the circuit board, and the airflow channel of the heat sink is opposite to the heat dissipation hole.
[0009] In the above technical solution, the housing further includes an upper cover and a lower cover;
[0010] The circuit board is mounted on the lower housing; the cooling fan is mounted on the upper cover;
[0011] The upper cover is hinged to the lower shell, and a buckle is provided between the upper cover and the lower shell.
[0012] In the above technical solution, the upper cover is further provided with a transparent window, which is at least opposite to the position of the module slot provided on the circuit board.
[0013] In the above technical solution, the upper cover is further provided with a light guide, which is opposite to the indicator light on the circuit board.
[0014] In the above technical solution, the inner edge of the lower shell is provided with a plurality of support protrusions, and the plurality of support protrusions are spaced apart to support the circuit board.
[0015] The support protrusion is provided with a connection hole corresponding to the circuit board.
[0016] In the above technical solution, the lower shell is further provided with multiple insertion interfaces in the circumferential direction, and the insertion interfaces correspond one-to-one with the connectors provided on the circuit board.
[0017] In the above technical solution, the housing is further provided with lead wire holes; and multiple reinforcing ribs are provided on the outer side of the housing at intervals.
[0018] In the above technical solution, the bottom of the housing is provided with an anti-slip structure to increase the friction between the housing and the place where it is placed.
[0019] And / or the housing is provided with reserved mounting holes.
[0020] This application also provides a testing system, including the memory card testing fixture described in the above solution.
[0021] Compared with the prior art, the beneficial effects of this application are as follows:
[0022] The memory card testing fixture provided in this application uses a cooling fan to drive airflow within the housing, achieving active heat dissipation for the device. This results in high heat dissipation efficiency, quickly removing heat generated by the circuit board and reducing the temperature of the testing fixture. This ensures reliable operation of the testing fixture and improves the reliability and consistency of test results.
[0023] This application also provides a testing system, including the memory card testing fixture described in the above scheme. Based on the above analysis, it is clear that the testing system also possesses the aforementioned beneficial effects, which will not be elaborated upon further here. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0025] Figure 1 This is a first structural schematic diagram of the memory card testing fixture provided in this application;
[0026] Figure 2 This is a schematic diagram of the second structure of the memory card testing fixture provided in this application;
[0027] Figure 3 A schematic diagram of the third structure of the memory card testing fixture provided in this application;
[0028] Figure 4 The fourth structural diagram of the memory card testing fixture provided in this application.
[0029] In the diagram: 1-Top cover; 2-Transparent acrylic sheet; 3-Snap fastener; 4-Light guide post; 5-Cooling fan; 6-Circuit board; 7-Lower shell; 8-CF card module; 9-Module slot; 10-Heat sink; 11-Heat dissipation hole; 12-Lead wire hole; 13-Reinforcing rib; 14-Test fixture base plate debugging serial port; 15-JTAG debugging serial port; 16-Gigabit Ethernet port; 17-Anti-slip structure; 18-Reserved mounting hole. Detailed Implementation
[0030] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0031] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0032] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0033] Example 1
[0034] See Figures 1 to 4 As shown, the memory card testing fixture provided in this application includes a housing, a circuit board 6, and a cooling fan 5. Specifically, the housing can be 3D printed from ABS engineering plastic, which can significantly reduce the weight of the housing while maintaining its structural strength, thereby reducing the weight of the memory card testing fixture and making the device easier to carry.
[0035] Circuit board 6 is located inside the housing. Circuit board 6 has two CF card type II module slots 9, which can simultaneously accommodate two CF card modules 8. Circuit board 6 also houses an Xlinx K50 FPGA chip, located between the two module slots 9, used to implement the algorithm logic of the test program. Multiple data interfaces on circuit board 6 enable testing of CF card devices. To dissipate heat from the running circuit board 6, a cooling fan 5 is installed on the housing, facing the heat-generating area of circuit board 6 (the area where the FPGA chip is located). The housing has ventilation holes 11 located around the perimeter of the circuit board 6. During testing, the high-frequency cooling fan 5 blows outside air into the housing and onto the FPGA chip, thus removing the heat generated by the FPGA chip. The hot air is then discharged through the ventilation holes 11, achieving active cooling of the memory card test fixture.
[0036] The memory card testing fixture provided in this application uses a cooling fan 5 to drive airflow within the housing, thereby achieving active heat dissipation for the device. This results in high heat dissipation efficiency, quickly removing the heat generated by the circuit board 6 and reducing the temperature of the testing fixture. This ensures reliable operation of the testing fixture and improves the reliability and consistency of the test results.
[0037] In the optional solutions of this embodiment, such as Figure 1 As shown, the memory card testing fixture also includes a heat sink 10; the heat sink 10 is attached to the heat-generating area of the circuit board 6, and the airflow of the heat sink 10 is opposite to the heat dissipation hole 11.
[0038] In this embodiment, the heat sink 10 can be connected to the circuit board 6 by bolts, and the heat sink 10 is directly attached to the FPGA chip of the circuit board 6, which can effectively absorb heat and dissipate the heat quickly through its own high thermal conductivity.
[0039] In addition, such as Figure 4 As shown, heat dissipation holes 11 are provided on both sides of the housing, and the air duct of the heat sink 10 is opposite to the heat dissipation holes 11. Specifically, the length direction of the heat dissipation holes 11 is parallel to the height direction of the air duct. Air can flow along the air duct and exit the housing through the heat dissipation holes 11, ensuring directional airflow and avoiding airflow turbulence. This allows for more efficient use of the airflow brought by the fan, reducing unnecessary energy loss and accelerating heat transfer and dissipation. This design significantly improves the overall heat dissipation efficiency and helps maintain the stable operation of the memory card testing fixture.
[0040] In the optional solutions of this embodiment, such as Figure 1 and Figure 2 As shown, the housing includes an upper cover 1 and a lower cover 7; a circuit board 6 is mounted on the lower cover 7; and a cooling fan 5 is mounted on the upper cover 1. Specifically, the upper cover 1 has a first mounting opening, the cooling fan 5 is mounted on the first mounting opening and connected to the upper cover 1 by screws, and the power input line of the cooling fan 5 is led from the inside to the 5V power output interface of the circuit board 6. The upper cover 1 has a lead hole 12 to lead out additional internal test circuits. The upper cover 1 and the lower cover 7 are hinged, and a buckle 3 is provided between the upper cover 1 and the lower cover 7.
[0041] In this embodiment, both the upper cover 1 and the lower shell 7 are 3D printed from ABS engineering plastic. Multiple spaced reinforcing ribs 13 are provided on the outer sides of both the upper cover 1 and the lower shell 7 to improve lateral strength. The upper cover 1 and the lower shell 7 are hinged together by a hinge located between them. During use, the opening angle of the upper cover 1 and the lower shell 7 can exceed 180°, facilitating the installation, debugging, or maintenance of the internal circuit board 6 and other components. Furthermore, the upper cover 1 and the lower shell 7 are tightly secured by two clips 3, ensuring structural stability and avoiding the complexity and time consumption associated with traditional fasteners such as screws, thereby improving assembly efficiency.
[0042] In an optional embodiment, the top cover 1 is provided with a transparent window, which is at least opposite to the position of the module slot 9 provided on the circuit board 6.
[0043] In this embodiment, such as Figures 1 to 3 As shown, the top cover 1 has two rectangular second mounting openings opposite to the module slot 9. Transparent acrylic sheets 2 are installed at the two second mounting openings. The transparent acrylic sheets 2 can be glued to the inside of the top cover 1 with PVC glue, so that the user can observe the internal condition of the test fixture from the outside during the test.
[0044] In this optional embodiment, the upper cover 1 is equipped with light guide pillars 4, which are opposite to the indicator lights on the circuit board 6. Specifically, there are three light guide pillars 4, which are made of transparent plexiglass. The upper cover 1 has three third mounting openings, and the three light guide pillars 4 are respectively attached to the three third mounting openings with PVC adhesive. When the upper cover 1 is closed, the bottom end of the light guide pillar 4 directly presses against the LED indicator light on the circuit board 6, thereby guiding the light from the LED indicator light out.
[0045] In an optional embodiment, the inner edge of the lower shell 7 is provided with multiple support protrusions, and the multiple support protrusions are spaced apart to support the circuit board 6; the support protrusions and the circuit board 6 are provided with corresponding connection holes.
[0046] In this embodiment, for the cubic shell structure, support protrusions are provided at the four corners of the inner cavity of the lower shell 7 to support the circuit board 6. Multiple connectors are provided on the side of the circuit board 6 facing the lower shell 7. The support protrusions can lift the circuit board 6 to a certain height, providing space for the connectors. The support protrusions are provided with threaded holes, and the circuit board 6 can be connected to the threaded holes of the support protrusions with bolts to achieve installation and fixation of the circuit board 6.
[0047] In this optional embodiment, the lower shell 7 is provided with multiple plug-in interfaces around its circumference, and each plug-in interface corresponds one-to-one with the connectors provided on the circuit board 6 to form multiple external interfaces. These external interfaces are used to connect to external devices to enable testing of CF card devices. Specifically, the multiple external interfaces include one JTAG debugging serial port 15, one gigabit Ethernet port 16, one test fixture baseplate debugging serial port 14, two test module debugging serial ports, one fixture baseplate program burning port, one 12V power input, and one 5V power output.
[0048] Example 2
[0049] The memory card testing fixture in this second embodiment is an improvement on the above embodiments. The technical content disclosed in the above embodiments will not be described again, and the content disclosed in the above embodiments also belongs to the content disclosed in this second embodiment.
[0050] See Figure 4 As shown, in an optional embodiment, the bottom of the housing is provided with an anti-slip structure 17 to increase the friction between the housing and the placement surface. The anti-slip structure 17 shown in the figure is a long strip of anti-slip texture designed on the bottom surface of the lower housing 7 to improve the friction between the memory card testing fixture and the table. Optionally, the anti-slip structure 17 can also be other shapes of anti-slip textures such as circles or triangles on the bottom surface of the lower housing 7, or an anti-slip pad can be covered on the bottom surface of the lower housing 7 to increase friction.
[0051] Preferably, the housing is provided with reserved mounting holes 18, which can be set at the four corners. If necessary, the memory card test fixture can be fixed on a fixture of the corresponding size to improve the stability of the memory card test fixture installation.
[0052] Example 3
[0053] This application provides a testing system in embodiment three, which includes the memory card testing fixture of any of the above embodiments. Therefore, it has all the beneficial technical effects of the memory card testing fixture of any of the above embodiments, which will not be repeated here.
[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In addition, those skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are meant to be within the scope of this application and form different embodiments.
Claims
1. A memory card testing fixture, characterized in that, Includes housing, circuit board, and cooling fan; The circuit board is located inside the housing; the cooling fan is mounted on the housing, and the cooling fan is opposite to the heat-generating area of the circuit board; The housing has heat dissipation holes, and the heat dissipation holes are located on the periphery of the circuit board surface; It also includes a heat sink; the heat sink is attached to the heat-generating area of the circuit board, and the airflow of the heat sink is opposite to the heat dissipation holes.
2. The memory card testing fixture according to claim 1, characterized in that, The housing includes an upper cover and a lower cover; The circuit board is mounted on the lower housing; the cooling fan is mounted on the upper cover; The upper cover is hinged to the lower shell, and a buckle is provided between the upper cover and the lower shell.
3. The memory card testing fixture according to claim 2, characterized in that, The top cover is provided with a transparent window, which is at least opposite to the position of the module slot on the circuit board.
4. The memory card testing fixture according to claim 3, characterized in that, The top cover is equipped with a light guide, which is opposite to the indicator lights on the circuit board.
5. The memory card testing fixture according to claim 2, characterized in that, The inner edge of the lower shell is provided with a plurality of support protrusions, and the plurality of support protrusions are spaced apart to support the circuit board. The support protrusion is provided with a connection hole corresponding to the circuit board.
6. The memory card testing fixture according to claim 2, characterized in that, The lower shell has multiple insertion interfaces arranged circumferentially, and each insertion interface corresponds to a connector on the circuit board.
7. The memory card testing fixture according to claim 1, characterized in that, The housing has lead wire holes; the outer side of the housing is provided with multiple spaced reinforcing ribs.
8. The memory card testing fixture according to claim 1, characterized in that, The bottom of the housing is provided with an anti-slip structure to increase the friction between the housing and the place where it is placed. And / or the housing is provided with reserved mounting holes.
9. A testing system, characterized in that, Includes the memory card test fixture as described in any one of claims 1 to 8.