PCB board, display module, display device and display equipment

Abstract

The utility model discloses a kind of PCB, display module, display device and display equipment, the PCB including board body, the first edge of board body is equipped with conductive contact piece, board body includes opposite first face and second face;First face has first copper exposure area, second face has second copper exposure area, first copper exposure area and / or second copper exposure area, except first edge, second edge of board body is equipped, and extend along the extension direction of second edge;First copper exposure area has first recess depth in first face, first composite conductive layer is arranged in the side of first copper exposure area away from second face in cascade, and the thickness of first composite conductive layer is greater than first recess depth;And / or, second copper exposure area has second recess depth in second face, second composite conductive layer is arranged in the side of second copper exposure area away from second face in cascade, and the thickness of second composite conductive layer is greater than second recess depth. The PCB is lower in processing difficulty, and higher in yield.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a PCB board, display module, display device and display equipment. Background Technology

[0002] A PCB (Printed Circuit Board) is an important electronic component, serving as the support for electronic components and the carrier for their electrical interconnections. To facilitate heat dissipation or increase current carrying capacity, exposed copper areas are typically incorporated into the PCB. However, in current technology, these exposed copper areas are located within the PCB's interior, requiring routing to avoid obstacles, which is detrimental to PCB traces and hinders conductive connections between the PCB and other structures. This increases manufacturing complexity and reduces yield. Utility Model Content

[0003] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes a PCB board in which exposed copper areas are located at the edges of the board body to facilitate trace routing, and composite conductive layers are stacked in the exposed copper areas to facilitate conductive connection with other structures, thereby reducing the processing difficulty of the PCB board and improving the yield rate.

[0004] This utility model also aims to provide a display module having the above-mentioned PCB board.

[0005] This utility model also aims to provide a display device having the above-mentioned display module.

[0006] This utility model also aims to provide a display device having the above-mentioned display device.

[0007] According to an embodiment of the first aspect of the present invention, a PCB board includes a board body, a conductive contact piece is provided on a first edge of the board body, and the board body includes a first surface and a second surface opposite to each other.

[0008] The first surface has a first exposed copper area, and the second surface has a second exposed copper area. The first exposed copper area and / or the second exposed copper area are located on the second edge of the plate body other than the first edge, and extend along the extension direction of the second edge.

[0009] The first exposed copper area has a first recessed depth on the first surface, and a first composite conductive layer is stacked on the side of the first exposed copper area away from the second surface, the thickness of the first composite conductive layer being greater than the first recessed depth; and / or, the second exposed copper area has a second recessed depth on the second surface, and a second composite conductive layer is stacked on the side of the second exposed copper area away from the second surface, the thickness of the second composite conductive layer being greater than the second recessed depth. The plate includes a board body, a conductive contact piece is provided on the first edge of the board body, and the board body includes opposing first and second surfaces;

[0010] The first surface has a first exposed copper area, and the second surface has a second exposed copper area. The first exposed copper area and / or the second exposed copper area are located on the second edge of the plate body other than the first edge, and extend along the extension direction of the second edge.

[0011] The first exposed copper region has a first recessed depth on the first surface, and a first composite conductive layer is stacked on the side of the first exposed copper region away from the second surface, the thickness of the first composite conductive layer being greater than the first recessed depth; and / or, the second exposed copper region has a second recessed depth on the second surface, and a second composite conductive layer is stacked on the side of the second exposed copper region away from the second surface, the thickness of the second composite conductive layer being greater than the second recessed depth.

[0012] According to some embodiments of the present invention, the first mask has a first exposed copper area, the first exposed copper area is located on the second edge, and extends from one end of the extension direction of the second edge to the other end;

[0013] Alternatively, the first surface has at least two first exposed copper areas, which are spaced apart at the second edge.

[0014] According to some embodiments of the present invention, the second surface has a second exposed copper area, which is located on the second edge and extends from one end of the extension direction of the second edge to the other end;

[0015] Alternatively, the second surface has at least two second exposed copper areas, which are spaced apart at the second edge.

[0016] According to some embodiments of the present invention, the first composite conductive layer includes a first conductive adhesive layer, a conductive buffer layer, and a second conductive adhesive layer stacked together, wherein the first conductive adhesive layer or the second conductive adhesive layer is connected to the first exposed copper area.

[0017] According to some embodiments of the present invention, the projection of the first composite conductive layer on the second surface coincides with the projection of the first exposed copper region on the second surface, and the projection of the first exposed copper region on the first composite conductive layer is located within the first composite conductive layer.

[0018] This application provides a PCB board in which a first exposed copper area and / or a second exposed copper area are located on the second edge of the board body, excluding the first edge. This eliminates the need for routing in the area enclosed by the first and second edges of the first and / or second surfaces, facilitating routing. Furthermore, when the first and second exposed copper areas need to be connected to other structures, the difficulty of connecting the exposed copper areas located on the edge to other structures is reduced compared to setting the exposed copper areas in the inner area and then aligning and connecting them, thereby improving yield and processing efficiency. Moreover, by setting a composite conductive layer, and the thickness of the composite conductive layer being greater than the recess depth of the corresponding exposed copper area, it is easier to make the exposed copper areas conductively connected to other structures.

[0019] The display module according to the second aspect of the present invention includes a display panel, a heat dissipation film and a PCB board as described in the above embodiment, which are stacked in sequence, and also includes a connecting tape that connects the PCB board and the heat dissipation film.

[0020] The display module according to the present utility model adopts the PCB board in the above embodiment, which facilitates the conductive connection of the display module, reduces the processing difficulty of the display module, and improves the yield rate.

[0021] According to some embodiments of the present invention, the first composite conductive layer is stacked between the first exposed copper area and the heat dissipation film, and the projection of the first exposed copper area onto the first composite conductive layer is located within the first composite conductive layer.

[0022] The connecting tape connects the second exposed copper area of ​​the PCB and the first composite conductive layer to electrically connect the second exposed copper area and the first exposed copper area.

[0023] According to some embodiments of the present invention, the connecting tape has a third exposed copper area corresponding to the second exposed copper area, and a fourth exposed copper area that is electrically connected to the first composite conductive layer.

[0024] The display device according to a third aspect of the present invention includes the display module in the above embodiments.

[0025] The display device according to the present utility model reduces the processing difficulty and improves the yield rate by adopting the display module in the above embodiment.

[0026] The display device according to a fourth aspect of the present invention includes the display apparatus in the above embodiments.

[0027] The display device according to the present utility model reduces the processing difficulty of the display device and improves the yield rate by adopting the display device in the above embodiment.

[0028] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the second side of a PCB board in the prior art;

[0030] Figure 2 This is a schematic diagram of the first side of a PCB board in the prior art;

[0031] Figure 3 This is a schematic diagram of the second side of a PCB board according to an embodiment of this application;

[0032] Figure 4 This is a schematic diagram of the first side of a PCB board according to an embodiment of this application;

[0033] Figure 5 This is a side view of a PCB board according to an embodiment of this application;

[0034] Figure 6 This is a cross-sectional view of the first composite conductive layer or the second composite conductive layer in the PCB board according to an embodiment of this application;

[0035] Figure 7 This is a cross-sectional view of a display module according to an embodiment of this application.

[0036] Figure label:

[0037] PCB board 100

[0038] Board body 10, first edge 10a, second edge 10b, first surface 11, first exposed copper area 111, first composite conductive layer 112, first conductive adhesive layer 113, conductive buffer layer 114, second conductive adhesive layer 115, second surface 12, second exposed copper area 121, second composite conductive layer 122.

[0039] 20 electronic components, 30 conductive contacts

[0040] Display module 1000, display panel 200, heat dissipation film 300, connecting tape 400. Detailed Implementation

[0041] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0042] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0043] To facilitate heat dissipation or increase the flow rate of the PCB board, exposed copper areas are typically provided. In existing technologies, these exposed copper areas are located within the internal area of ​​the PCB board. Figure 1 and Figure 2 There are multiple first exposed copper areas 111 and second exposed copper areas 121, spaced apart. Since electronic components 20 need to be installed within the PCB board 100, and these components need to be connected via traces, these traces must avoid the exposed copper areas, increasing the difficulty and reducing efficiency of the wiring. Furthermore, when the PCB board 100 is connected to other structures, such as tape, exposed copper areas corresponding to those on the PCB board 100 need to be created on the tape for conductive connection. This requires the exposed copper areas on the tape to be the same shape and size as those on the PCB board 100, and the distance between adjacent exposed copper areas to be the same as the distance between adjacent exposed copper areas on the PCB board 100, increasing the processing difficulty of the tape. Moreover, when connecting the tape to the PCB board 100, the exposed copper areas on the tape and the exposed copper areas on the PCB board 100 must be aligned one-to-one to achieve conductive connection, which is difficult and reduces the yield rate.

[0044] Based on this, the present invention proposes a PCB board 100. The PCB board 100 facilitates the routing of traces in the internal area of ​​the PCB board 100 by setting the exposed copper area at the edge of the board body 10. Furthermore, by stacking a composite conductive layer in the exposed copper area at the edge of the board body 10, it facilitates conductive connection with other structures, thereby reducing the processing difficulty of the PCB board 100 and improving the yield rate.

[0045] Figures 3-5This is a schematic diagram of the structure of the PCB board 100 according to an embodiment of the present utility model. (Refer to...) Figures 3-5 The PCB board 100 includes a board body 10, which may include the top layer (signal lines), the middle power layer (complete planar / multilayer board), the bottom layer (signal lines), and vias connecting the top layer and the bottom layer as described above.

[0046] Reference Figure 3 The first edge 10a of the board body 10 is provided with a conductive contact 30, commonly known as a gold finger (or edge connector), which serves as the outlet for the PCB board 100 to connect to the external network. Multiple conductive contacts 30 can be provided, and the multiple conductive contacts 30 are arranged at intervals.

[0047] Generally, the conductive contact 30 is located on the longer edge of the plate 10. For example, if the plate 10 is rectangular, the conductive contact 30 is located on the longer edge of the rectangle.

[0048] Reference Figure 5 The plate 10 includes a first surface 11 and a second surface 12 opposite to each other; the first surface 11 and the second surface 12 can be the top surface and the bottom surface of the plate 10 along the thickness direction; in the present application, the first surface 11 and the second surface 12 are the top surface and the bottom surface of the plate 10 along the thickness direction, wherein the first surface 11 can be the top surface, and the second surface 12 is the bottom surface; or the first surface 11 is the bottom surface, and the second surface 12 is the top surface.

[0049] Reference Figures 3-5 The first surface 11 has a first exposed copper area 111, and the second surface 12 has a second exposed copper area 121. The first exposed copper area 111 and / or the second exposed copper area 121 are disposed on the second edge 10b of the plate body 10 other than the first edge 10a, and extend along the extension direction of the second edge 10b.

[0050] By setting the first exposed copper area 111 and / or the second exposed copper area 121 on the second edge 10b of the board 10 other than the first edge 10a, it is possible to route traces in the inner area enclosed by the first edge 10a and the second edge 10b without needing to make avoidance design, which facilitates the routing. At the same time, when the first exposed copper area 111 and the second exposed copper area 121 need to be connected to other structures, such as tape, the tape can also have exposed copper areas set on the corresponding edges. Compared with setting exposed copper areas in the inner area and then aligning and connecting them, the connection of exposed copper areas set on the edges is less difficult, thereby improving the yield and processing efficiency.

[0051] Specifically, the first exposed copper area 111 can be located at the second edge 10b and extend along the extension direction of the second edge 10b; simultaneously, the second exposed copper area 121 can be located at the second edge 10b and extend along the extension direction of the second edge 10b. In this case, the first exposed copper area 111 and the second exposed copper area 121 can be provided correspondingly or not correspondingly, for example, staggered, randomly, etc.; for example, the plate 10 is a quadrilateral, the first exposed copper area 111 is located at the edge opposite to the first edge 10a, and the second exposed copper area 121 can be located at the edge opposite to the first edge 10a, or at least one of the two edges adjacent to the first edge 10a.

[0052] Alternatively, the first exposed copper area 111 can be located at the second edge 10b and extend along the extension direction of the second edge 10b; meanwhile, the second exposed copper area 121 can be located in the internal area enclosed by the first edge 10a and the second edge 10b. For example, the plate 10 is quadrilateral, and the first exposed copper area 111 can be located at the edge opposite to the first edge 10a, or at least one of the two edges adjacent to the first edge 10a.

[0053] Alternatively, the second exposed copper region 121 may be located at the second edge 10b and extend along the extension direction of the second edge 10b; meanwhile, the first exposed copper region 111 may be located in the internal region enclosed by the first edge 10a and the second edge 10b. For example, the plate 10 is quadrilateral, and the second exposed copper region 121 may be located at the edge opposite to the first edge 10a, or at least one of the two edges adjacent to the first edge 10a.

[0054] The first exposed copper region has a first recessed depth on the first surface 11, and a first composite conductive layer 112 is stacked on the side of the first exposed copper region 111 away from the second surface 12, the thickness of the first composite conductive layer 112 being greater than the first recessed depth; and / or, the second exposed copper region has a second recessed depth on the second surface 12, and a second composite conductive layer 122 is stacked on the side of the second exposed copper region 121 away from the second surface 12, the thickness of the second composite conductive layer 122 being greater than the second recessed depth.

[0055] By setting a composite conductive layer, and ensuring that the thickness of the composite conductive layer is greater than the recess depth of the corresponding exposed copper area, it is easy to make the exposed copper area conductively connected to other structures.

[0056] Specifically, a first composite conductive layer 112 is stacked on the side of the first exposed copper area 111 away from the second surface 12. The thickness of the first composite conductive layer 112 is greater than the first recess depth 'a' of the first exposed copper area on the first surface 11. Simultaneously, a second composite conductive layer 122 is stacked on the side of the second exposed copper area 121 away from the second surface 12. The thickness of the second composite conductive layer 122 is greater than the second recess depth 'b' of the second exposed copper area on the second surface 12. In this way, the exposed copper areas can be electrically connected to other structures on both sides of the board 10 via the composite conductive layers.

[0057] Alternatively, a first composite conductive layer 112 may be stacked on the side of the first exposed copper region 111 away from the second surface 12, and the thickness of the first composite conductive layer 112 may be greater than the first recess depth of the first exposed copper region on the first surface 11. Meanwhile, a second composite conductive layer 122 may not be stacked on the side of the second exposed copper region 121 away from the second surface 12. In this way, the first exposed copper region 111 can be electrically connected to other structures on the first surface 11 of the board 10 via the first composite conductive layer 112.

[0058] Alternatively, the first composite conductive layer 112 is not stacked on the side of the first exposed copper area 111 away from the second surface 12, while a second composite conductive layer 122 is stacked on the side of the second exposed copper area 121 away from the second surface 12. The thickness of the second composite conductive layer 122 is greater than the second recess depth of the second exposed copper area on the second surface 12. In this way, the second exposed copper area 121 can be electrically connected to other structures on the second surface 12 of the board 10 through the second composite conductive layer 122.

[0059] Therefore, referring to Figures 3-5 According to the PCB board 100 of this utility model, by setting the first exposed copper area 111 and / or the second exposed copper area 121 on the second edge 10b of the board body 10 other than the first edge 10a, when routing traces in the internal area enclosed by the first edge 10a and the second edge 10b of the first surface 11 and / or the second surface 12, no avoidance design is required, which facilitates the routing. At the same time, when the first exposed copper area 111 and the second exposed copper area 121 need to be connected with other structures, compared with setting the exposed copper area in the internal area and then aligning and connecting, the exposed copper area set on the edge is less difficult to connect with other structures, thereby improving the yield and processing efficiency. Furthermore, by setting a composite conductive layer, and the thickness of the composite conductive layer is greater than the recess depth of the corresponding exposed copper area, it is convenient to make the exposed copper area conductively connected with other structures.

[0060] In some embodiments of this utility model, reference is made to Figure 4The first surface 11 has a first exposed copper area 111, which is located on the second edge 10b and extends from one end of the second edge 10b to the other end. For example, if the plate 10 is rectangular, and the other three sides besides the first edge 10a are all second edges 10b, the first exposed copper area 111 can be located on any one of the other three sides, and its length is the same as the length of that side. Alternatively, the first exposed copper area 111 can be located on two or three of the other three sides, and its length on each side can be the same as that of the side.

[0061] Alternatively, the first surface 11 may have at least two first exposed copper areas 111, which are spaced apart from each other on the second edge 10b. For example, if the plate 10 is rectangular, and the other three sides besides the first edge 10a are all second edges 10b, the at least two first exposed copper areas 111 may be located on one or two of the other three sides. When the at least two first exposed copper areas 111 are located on two of the other three sides, they may extend from one end to the other along one side, with the first exposed copper areas 111 on the other side spaced apart from the first exposed copper areas 111 on the other side.

[0062] In some embodiments of this utility model, reference is made to Figure 3 The second surface 12 has a second exposed copper area 121, which is located on the second edge 10b and extends from one end of the second edge 10b to the other end. For example, if the plate 10 is rectangular, and the other three sides besides the first edge 10a are all second edges 10b, the second exposed copper area 121 can be located on any one of the other three sides, and its length is the same as the length of that side. Alternatively, the second exposed copper area 121 can be located on two or three of the other three sides, and its length on each side can be the same as that of the side.

[0063] Alternatively, the second surface 12 may have at least two second exposed copper areas 121, which are spaced apart from each other on the second edge 10b. For example, if the plate 10 is rectangular, and the other three sides besides the first edge 10a are all second edges 10b, the at least two second exposed copper areas 121 may be located on one or two of the other three sides. When the at least two second exposed copper areas 121 are located on two of the other three sides, they may extend from one end to the other along one side, with the second exposed copper areas 121 on the other side spaced apart from those on the first side.

[0064] In some embodiments of this utility model, reference is made to Figure 6The first composite conductive layer 112 includes a first conductive adhesive layer 113, a conductive buffer layer 114, and a second conductive adhesive layer 115 stacked together. The first conductive adhesive layer 113 or the second conductive adhesive layer 115 is connected to the first exposed copper area 111.

[0065] In the stacked first conductive adhesive layer 113, conductive buffer layer 114, and second conductive adhesive layer 115, one of the first conductive adhesive layer 113 and the second conductive adhesive layer 115 is connected to the first exposed copper area 111, and the other is used for structural connection with the PCB board 100. The conductive buffer layer 114 can provide a buffering effect and is also easy to compress, so that the thickness of the composite conductive layer is compressed to the same depth as the first recess depth.

[0066] In some embodiments, the modulus of the conductive buffer layer 114 is less than that of the PCB board 100. This reduces the likelihood of damage to other structures during the pressing and bonding process. For example, when other structures are flexible structures such as the heat dissipation film 300, mold marks are less likely to form. Furthermore, the conductive buffer layer 114 can be conductive foam, etc.

[0067] In some embodiments, the second composite conductive layer 122 may have the same structure as the first composite conductive layer 112. Specifically, the second composite conductive layer 122 includes a first conductive adhesive layer 113, a conductive buffer layer 114 and a second conductive adhesive layer 115 stacked together. The first conductive adhesive layer 113 or the second conductive adhesive layer 115 is connected to the second exposed copper region 121.

[0068] In some embodiments of this utility model, reference is made to Figure 7 The projection of the first composite conductive layer 112 onto the second surface 12 coincides with the projection of the first exposed copper region 111 onto the second surface 12, and the projection of the first exposed copper region 111 onto the first composite conductive layer 112 is located within the first composite conductive layer 112.

[0069] Specifically, the projection of the first composite conductive layer 112 onto the second surface 12 coincides with the projection of the first exposed copper area 111 onto the second surface 12. This ensures that the first exposed copper area 111 is completely flush with one side of the first composite conductive layer 112, increasing the current carrying capacity. Simultaneously, the projection of the first exposed copper area 111 onto the first composite conductive layer 112 is located within the first composite conductive layer 112, meaning the first composite conductive layer 112 extends out of the PCB board 100 from the edge where the first exposed copper area 111 is located. This facilitates the conductive structure to electrically connect the first exposed copper area 111 and the second exposed copper area 121 by connecting the second exposed copper area 121 and the first composite conductive layer 112, improving the grounding capability inside the PCB board 100.

[0070] In some embodiments, the projection of the second composite conductive layer 122 onto the first surface 11 coincides with the projection of the second exposed copper region 121 onto the first surface 11, and the projection of the second exposed copper region 121 onto the second composite conductive layer 122 coincides with the second composite conductive layer 122.

[0071] According to a second aspect embodiment of the present utility model, a display module 1000 is shown, with reference to... Figure 7 It includes a display panel 200, a heat dissipation film 300 and a PCB board 100 in the above embodiment, which are stacked in sequence, and also includes a connecting tape 400, which connects the PCB board 100 and the heat dissipation film 300.

[0072] The display module 1000 according to the present utility model adopts the PCB board 100 in the above embodiment, which facilitates the conductive connection of the display module 1000, reduces the processing difficulty of the display module 1000, and improves the yield rate.

[0073] Display Module 1000 is an electronic component used to display images, text and other information.

[0074] As one embodiment, the display panel 200 can be an OLED (Organic Light-Emitting Diode), also known as an organic electroluminescence display or organic electroluminescence display. OLEDs are current-driven organic light-emitting devices that emit light through the injection and recombination of charge carriers; the luminous intensity is directly proportional to the injected current. Under the influence of an electric field, holes generated at the anode and electrons generated at the cathode move and are injected into the hole transport layer and electron transport layer, respectively, migrating to the light-emitting layer. When these two elements meet in the light-emitting layer, they generate excitons, which excite the light-emitting molecules to ultimately produce visible light.

[0075] The basic structure of an OLED can include a substrate (transparent plastic, glass, or metal foil), an anode (transparent material), an organic light-emitting layer, and a cathode. The anode is responsible for injecting positive charges (holes), while the cathode injects electrons.

[0076] In another embodiment, the display panel 200 can be an LCD (Liquid Crystal Display), a display technology that utilizes the properties of liquid crystal materials. It mainly consists of two parallel glass substrates filled with liquid crystal material. An alignment film on the inner surface of the glass substrate guides the liquid crystal molecules to align in a specific manner. When no voltage is applied, the liquid crystal molecules are arranged in an ordered manner under the influence of an electric field, and light passing through the liquid crystal layer can display transmitted or reflected patterns. When a voltage is applied, the liquid crystal molecules rotate under the influence of the electric field, changing the polarization direction of the light, thereby achieving image display.

[0077] In this application, a heat dissipation film 300 is stacked on the display panel 200 for heat dissipation. Generally, the heat dissipation film 300 may include a stacked copper foil layer, a foam layer, and an adhesive layer. The PCB board 100 is connected to the copper foil layer, wherein the first composite conductive layer 112 is electrically connected to the copper foil layer. The foam layer serves as a buffer, reducing the generation of molded marks.

[0078] The connecting tape 400, or Tape, connects the first exposed copper area 111 and the second exposed copper area 121 of the PCB board 100 to the heat dissipation film 300.

[0079] In some embodiments of this utility model, reference is made to Figure 7 The first composite conductive layer 112 is stacked between the first exposed copper area 111 and the heat dissipation film 300. The first composite conductive layer 112 can electrically connect the first exposed copper area 111 and the heat dissipation film 300. The projection of the first exposed copper area 111 onto the first composite conductive layer 112 is located within the first composite conductive layer 112. That is, the first composite conductive layer 112 extends beyond the edge of the first exposed copper area, which facilitates connection.

[0080] The connecting tape 400 connects the second exposed copper area 121 of the PCB and the first composite conductive layer 112 to electrically connect the second exposed copper area 121 and the first exposed copper area 111. By connecting the second exposed copper area 121 and the first composite conductive layer 112 of the PCB, the connecting tape 400 can make the second exposed copper area 121 and the first exposed copper area 111 electrically connected. Compared with connecting the second exposed copper area 121 of the PCB and the heat dissipation film 300, the conductive connection path includes the second exposed copper area 121, the connecting tape 400, the heat dissipation film 300, the first composite conductive layer 112 and the first exposed copper area 111, which reduces the conductive path and improves the grounding effect inside the PCB board 100.

[0081] In some embodiments of this utility model, the connecting tape 400 is provided with a third exposed copper area corresponding to the second exposed copper area 121, and a fourth exposed copper area electrically connected to the first composite conductive layer 112.

[0082] By providing a third exposed copper area, it is easier to make conductive connections between the connecting tape 400 and the second exposed copper area 121. By providing a fourth exposed copper area, it is easier to make conductive connections between the connecting tape 400 and the first composite conductive layer 112. Positioning the second exposed copper area 121 at the second edge 10b of the PCB board 100 allows the third exposed copper area to also be positioned at the edge of the connecting tape 400, simplifying the placement and facilitating the connection between the third exposed copper area of ​​the connecting tape 400 and the second exposed copper area 121. This reduces processing difficulty and improves yield.

[0083] The display device according to a third aspect of the present invention includes the display module in the above embodiments.

[0084] The display device according to the present utility model reduces the processing difficulty and improves the yield rate by adopting the display module in the above embodiment.

[0085] It is understandable that this display device possesses all the features and advantages of the aforementioned display module, which will not be elaborated upon here.

[0086] Display devices are products with image display capabilities. For example, a display device can be any of the following: mobile phone, monitor, television, billboard, digital photo frame, laser printer with display function, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large-area wall, home appliance, information query equipment (such as business query equipment for e-government, banks, hospitals, power companies, etc.), monitor, etc. A display device can also be a microdisplay or a product containing a microdisplay. Products containing microdisplays can be any of the following: smartwatch, smart bracelet, helmet display, stereoscopic display, and AR devices (such as AR glasses), VR devices (such as VR glasses), etc. For example, a microdisplay can be a display with a display size ranging from approximately 0.2 inches to approximately 2.5 inches, but is not limited to this. Understandably, a microdisplay can also be a display with a smaller display size, such as a display size less than or equal to 0.2 inches.

[0087] The display device according to a fourth aspect of the present invention includes the display apparatus in the above embodiments.

[0088] The display device according to the present utility model reduces the processing difficulty of the display device and improves the yield rate by adopting the display device in the above embodiment.

[0089] It is understandable that this display device possesses all the features and advantages of the aforementioned display devices, which will not be elaborated upon here.

[0090] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0091] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0092] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or that the first feature is at a lower horizontal level than the second feature.

[0093] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0094] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A PCB board, characterized in that, The plate includes a plate body, a conductive contact piece is provided on the first edge of the plate body, and the plate body includes a first surface and a second surface opposite to each other; The first surface has a first exposed copper area, and the second surface has a second exposed copper area. The first exposed copper area and / or the second exposed copper area are located on the second edge of the plate body other than the first edge, and extend along the extension direction of the second edge. The first exposed copper region has a first recessed depth on the first surface, and a first composite conductive layer is stacked on the side of the first exposed copper region away from the second surface, the thickness of the first composite conductive layer being greater than the first recessed depth; and / or, the second exposed copper region has a second recessed depth on the second surface, and a second composite conductive layer is stacked on the side of the second exposed copper region away from the second surface, the thickness of the second composite conductive layer being greater than the second recessed depth.

2. The PCB board according to claim 1, characterized in that, The first mask has a first exposed copper area, which is located on the second edge and extends from one end of the second edge to the other end in the direction of extension; Alternatively, the first surface has at least two first exposed copper areas, which are spaced apart at the second edge.

3. The PCB board according to claim 1, characterized in that, The second mask has a second exposed copper area, which is located on the second edge and extends from one end of the second edge to the other end in the direction of extension. Alternatively, the second surface has at least two second exposed copper areas, which are spaced apart at the second edge.

4. The PCB board according to claim 1, characterized in that, The first composite conductive layer includes a first conductive adhesive layer, a conductive buffer layer, and a second conductive adhesive layer stacked together, and the first conductive adhesive layer or the second conductive adhesive layer is connected to the first exposed copper area.

5. The PCB board according to claim 1, characterized in that, The projection of the first composite conductive layer onto the second surface coincides with the projection of the first exposed copper region onto the second surface, and the projection of the first exposed copper region onto the first composite conductive layer is located within the first composite conductive layer.

6. A display module, characterized in that, It includes a display panel, a heat dissipation film, and a PCB board as described in any one of claims 1-5, which are stacked sequentially. It also includes a connecting tape that connects the PCB board and the heat dissipation film.

7. The display module according to claim 6, characterized in that, The first composite conductive layer is stacked between the first exposed copper area and the heat dissipation film, and the projection of the first exposed copper area onto the first composite conductive layer is located within the first composite conductive layer. The connecting tape connects the second exposed copper area of ​​the PCB and the first composite conductive layer to electrically connect the second exposed copper area and the first exposed copper area.

8. The display module according to claim 7, characterized in that, The connecting tape has a third exposed copper area corresponding to the second exposed copper area, and a fourth exposed copper area that is electrically connected to the first composite conductive layer.

9. A display device, characterized in that, Includes the display module as described in any one of claims 6-8.

10. A display device, characterized in that, Includes the display device as described in claim 9.

Images