A multi-layer combined circuit board

Abstract

The utility model relates to a circuit board technical field especially a multilayer combined circuit board, including heat exchange board, the top surface of heat exchange board all bottom surface all bonding has U type support layer, two U type support layer's end face is pasted together, the top surface of heat exchange board is fixedly connected with the bottom surface and has a plurality of linear array's heat conduction plate, the height of heat conduction plate is equal with the thickness of U type support layer. The utility model has the advantages of: heat conduction plate adopts high heat conduction material aluminium alloy, further accelerated the conduction of heat, and heat conduction plate passes on the heat to the heat exchange board fixedly connected with it, and the heat exchange board is as the final collector of heat, and its large area aluminium alloy material can efficiently absorb and disperse these heat, and the side surface of heat exchange board is penetrated and is established with a plurality of linear array's through -hole. These through -holes are as the heat dissipation channel, and the heat is allowed to pass from the inside of heat exchange board to the outside environment, and the heat can be effectively taken away, prevents the heat from accumulating between two printing layers.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a multi-layer composite circuit board. Background Technology

[0002] Multilayer composite circuit boards (PCBs) are advanced electronic components that combine multiple printed circuit board (PCB) layers using precision processes to form a single unit with a complex circuit structure. These PCBs significantly improve circuit density, optimize electrical performance, and demonstrate enormous application potential in miniaturized electronic devices. PCBs are widely used in various electronic fields, including but not limited to communication equipment, computers and servers, consumer electronics, medical devices, industrial control, and automotive electronics.

[0003] Despite the numerous advantages of multilayer composite circuit boards, heat accumulation is a common problem at the junctions between printed layers in practical applications. This is primarily due to the increasing component and power density on circuit boards as electronic devices become smaller and more high-performance, leading to heat concentration and temperature rise. The impact of heat accumulation on the circuit board cannot be ignored. Firstly, it can cause the printed layers to overheat, thus affecting the normal operation of the circuit board. Therefore, a multilayer composite circuit board is needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a multi-layer composite circuit board to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of this utility model provides a multi-layer composite circuit board, including a heat exchange plate. A U-shaped support layer is bonded to both the top and bottom surfaces of the heat exchange plate. The end faces of two U-shaped support layers are abutted together. A plurality of linearly arrayed heat-conducting plates are fixedly connected to both the top and bottom surfaces of the heat exchange plate. The height of the heat-conducting plates is equal to the thickness of the U-shaped support layers. The heat-conducting plates are slidably connected to the U-shaped support layers. An adhesive layer is coated on the outer surface of each U-shaped support layer. The side of the adhesive layer closest to the U-shaped support layer is bonded to the heat-conducting plate. An insulating layer is bonded to the side of each adhesive layer furthest from the U-shaped support layer. A printed layer is bonded to the side of each insulating layer furthest from the adhesive layer by adhesive.

[0007] Preferably, the material of the U-shaped support layer is epoxy resin, as described in any of the above solutions.

[0008] Preferably, the insulating layer is made of polytetrafluoroethylene (PTFE), as described in any of the above embodiments.

[0009] Preferably, the adhesive layer is made of thermally conductive adhesive, as described in any of the above embodiments.

[0010] Preferably, one side of the U-shaped support layer is provided with a plurality of linear array clearance grooves, and the plurality of heat-conducting plates are slidably connected to the U-shaped support layer through the clearance grooves.

[0011] Preferably, in any of the above embodiments, the inner wall of the U-shaped support layer is provided with a plurality of symmetrically arranged positioning holes, and the top and bottom surfaces of the heat exchange plate are fixedly connected with a plurality of symmetrically arranged positioning pins, which are slidably connected to the U-shaped support layer through the positioning holes.

[0012] Preferably, in any of the above embodiments, the heat exchange plate has a plurality of linearly arrayed through holes on its side, and both the heat exchange plate and the heat conduction plate are made of aluminum alloy.

[0013] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0014] When the electronic components on the printed circuit board operate, they generate heat. This heat is first transferred through the material of the printed circuit board to the tightly bonded insulating layer, where there is good thermal contact between the insulating layer and the adhesive layer (thermal conductive adhesive). The thermal conductive adhesive, as the material of the adhesive layer, has excellent thermal conductivity. Therefore, heat can be rapidly transferred from the insulating layer to the thermal conductive adhesive layer, which is tightly bonded to the heat-conducting plate, where heat is efficiently transferred to the heat-conducting plate. Because the heat-conducting plate is slidably connected within the U-shaped support layer, and its height is equal to the thickness of the U-shaped support layer, this ensures that heat is evenly distributed across multiple heat-conducting plates. The heat-conducting plate uses a high thermal conductivity aluminum alloy, further accelerating heat conduction, and then transfers heat to the heat exchange plate fixedly connected to it. The heat exchange plate, as the final heat collector, uses its large area of ​​aluminum alloy to efficiently absorb and disperse this heat, and its sides are perforated with a linear array of through holes. These through-holes serve as heat dissipation channels, allowing heat to be transferred from the inside of the heat exchange plate to the external environment. The heat can be effectively carried away, thus preventing heat buildup between the two printed layers. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the assembly of this utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of the assembly of this utility model;

[0017] Figure 3 This is an exploded structural diagram of the U-shaped support layer of this utility model;

[0018] Figure 4 This is a schematic diagram of the structure at point A of this utility model.

[0019] In the diagram: 1-Heat exchange plate, 2-U-shaped support layer, 3-Heat conduction plate, 4-Adhesive layer, 5-Insulation layer, 6-Printed layer, 7-Allowing groove, 8-Positioning hole, 9-Positioning pin, 10-Through hole. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0021] like Figures 1 to 4 As shown, a multi-layer composite circuit board includes a heat exchange plate 1. A U-shaped support layer 2 is bonded to both the top and bottom surfaces of the heat exchange plate 1. The end faces of two U-shaped support layers 2 are joined together. Several linear arrays of heat-conducting plates 3 are fixedly connected to both the top and bottom surfaces of the heat exchange plate 1. The height of the heat-conducting plates 3 is equal to the thickness of the U-shaped support layers 2. The heat-conducting plates 3 are slidably connected to the U-shaped support layers 2. An adhesive layer 4 is coated on the outer surface of each U-shaped support layer 2. The side of the adhesive layer 4 closest to the U-shaped support layer 2 is bonded to the heat-conducting plate 3. An insulating layer 5 is bonded to the side of each adhesive layer 4 furthest from the U-shaped support layer 2. A printed layer 6 is glued to the side of each insulating layer 5 furthest from the adhesive layer 4.

[0022] As an optional technical solution of this utility model, the U-shaped support layer 2 is made of epoxy resin. The U-shaped support layer 2 not only serves as part of the heat conduction channel, but also provides stable structural support for the entire circuit board. Made of epoxy resin, it possesses good mechanical strength and heat resistance, enabling it to resist thermal stress caused by temperature changes and maintain the overall stability of the circuit board.

[0023] As an optional technical solution of this utility model, the insulating layer 5 is made of polytetrafluoroethylene. The insulating layer 5 is made of polytetrafluoroethylene, which has good electrical insulation and heat resistance properties, ensuring electrical isolation between layers and preventing current leakage and short circuit.

[0024] As an optional technical solution of this utility model, the adhesive layer 4 is made of thermally conductive adhesive. The adhesive layer 4 (thermally conductive adhesive) not only has the function of heat conduction, but also enhances the bonding strength between layers, while maintaining the insulation performance, providing additional safety protection for the circuit board.

[0025] As an optional technical solution of this utility model, a plurality of linear array of clearance grooves 7 are provided through one side of the U-shaped support layer 2, and a plurality of heat conduction plates 3 are slidably connected to the U-shaped support layer 2 through the clearance grooves 7.

[0026] As an optional technical solution of this utility model, the inner wall of the U-shaped support layer 2 is provided with a number of symmetrically arranged positioning holes 8. The top and bottom surfaces of the heat exchange plate 1 are fixedly connected with a number of symmetrically arranged positioning pins 9. The positioning pins 9 are slidably connected to the U-shaped support layer 2 through the positioning holes 8. The heat exchange plate 1 is engaged with the U-shaped support layer 2 through the positioning pins 9. The positioning pins 9 play a certain fixing role within the positioning holes 8, effectively preventing loosening between the heat exchange plate 1 and the U-shaped support layer 2. This fastening effect helps maintain the stability of the circuit board during long-term operation and extends its service life.

[0027] As an optional technical solution of this utility model, the side of the heat exchange plate 1 is provided with a number of linear array through holes 10. The heat exchange plate 1 and the heat conduction plate 3 are both made of aluminum alloy. These through holes 10 serve as heat dissipation channels, allowing heat to be transferred from the inside of the heat exchange plate 1 to the external environment. The heat can be effectively carried away, thereby preventing heat from accumulating between the printed layers 6.

[0028] A multi-layer composite circuit board, the working principle of which is as follows:

[0029] 1): When the electronic components on the printed layer 6 are in operation, they generate heat. This heat is first transferred through the material of the printed layer 6 to the insulating layer 5 that is closely attached to it.

[0030] 2) The thermally conductive adhesive layer is tightly bonded to the heat-conducting plate 3, and heat is efficiently transferred to the heat-conducting plate 3 through the thermally conductive adhesive layer. Since the heat-conducting plate 3 is slidably connected within the U-shaped support layer 2, and its height is equal to the thickness of the U-shaped support layer 2, this ensures that heat can be evenly distributed on multiple heat-conducting plates 3.

[0031] 3) The heat-conducting plate 3 transfers heat to the heat exchange plate 1, which is fixedly connected to it. The heat exchange plate 1, as the final heat collector, uses its large-area aluminum alloy material to efficiently absorb and disperse this heat. Several linear array of through holes 10 are opened through the side of the heat exchange plate 1. These through holes 10 serve as heat dissipation channels, allowing heat to be transferred from the inside of the heat exchange plate 1 to the external environment.

[0032] In summary, in this multi-layer composite circuit board, when the electronic components on the printed layer 6 are operating, they generate heat. This heat is first transferred through the material of the printed layer 6 to the tightly bonded insulating layer 5, where there is good thermal contact between the insulating layer 5 and the adhesive layer 4 (thermal conductive adhesive). The thermal conductive adhesive, as the material of the adhesive layer 4, has excellent thermal conductivity. Therefore, heat can be rapidly transferred from the insulating layer 5 to the thermal conductive adhesive layer, which is tightly bonded to the heat-conducting plate 3, and the heat is efficiently transferred to the heat-conducting plate 3 through the thermal conductive adhesive layer. Since the heat-conducting plate 3 is slidably connected within the U-shaped support layer 2, and its height is equal to the thickness of the U-shaped support layer 2, this ensures that heat can be evenly distributed across the multiple heat-conducting plates 3. The heat-conducting plate 3 is made of a high thermal conductivity aluminum alloy, further accelerating heat conduction, and the heat-conducting plate 3 transfers heat to the heat exchange plate 1, which is fixedly connected to it. As the final heat collector, the heat exchange plate 1, with its large area of ​​aluminum alloy material, can efficiently absorb and disperse this heat. Several linear arrays of through holes 10 are opened through the side of the heat exchange plate 1. These through holes 10 serve as heat dissipation channels, allowing heat to be transferred from the inside of the heat exchange plate 1 to the external environment. The heat can be effectively carried away, thereby preventing heat from accumulating between the two printed layers 6.

Claims

1. A multilayer composite circuit board, characterized in that: The heat exchange plate (1) is provided with a U-shaped support layer (2) bonded to both the top and bottom surfaces of the heat exchange plate (1). The end faces of the two U-shaped support layers (2) are in contact with each other. Several linear array heat-conducting plates (3) are fixedly connected to the top and bottom surfaces of the heat exchange plate (1). The height of the heat-conducting plate (3) is equal to the thickness of the U-shaped support layer (2). The heat-conducting plate (3) is slidably connected to the U-shaped support layer (2). An adhesive layer (4) is coated on the outer surface of each U-shaped support layer (2). The side of the adhesive layer (4) close to the U-shaped support layer (2) is in contact with the heat-conducting plate (3). An insulating layer (5) is bonded to the side of the two adhesive layers (4) away from the U-shaped support layer (2). A printed layer (6) is bonded to the side of each insulating layer (5) away from the adhesive layer (4) by glue.

2. The multilayer composite circuit board according to claim 1, characterized in that: The U-shaped support layer (2) is made of epoxy resin.

3. A multilayer composite circuit board according to claim 2, characterized in that: The insulating layer (5) is made of polytetrafluoroethylene.

4. A multilayer composite circuit board according to claim 3, characterized in that: The adhesive layer (4) is made of thermally conductive adhesive.

5. A multilayer composite circuit board according to claim 4, characterized in that: The U-shaped support layer (2) has several linear arrays of clearance slots (7) through one side, and several heat-conducting plates (3) are slidably connected to the U-shaped support layer (2) through the clearance slots (7).

6. A multilayer composite circuit board according to claim 5, characterized in that: The inner wall of the U-shaped support layer (2) is provided with a number of symmetrically arranged positioning holes (8), and the top and bottom surfaces of the heat exchange plate (1) are fixedly connected with a number of symmetrically arranged positioning pins (9). The positioning pins (9) are slidably connected to the U-shaped support layer (2) through the positioning holes (8).

7. A multilayer composite circuit board according to claim 6, characterized in that: The heat exchange plate (1) has several linear array of through holes (10) through its side. Both the heat exchange plate (1) and the heat conduction plate (3) are made of aluminum alloy.

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