High-temperature-resistant and folding-resistant double-sided circuit board

Abstract

The utility model relates to double -sided circuit board technical field, concretely for a kind of high-temperature-resistant and break-resistant double -sided circuit board, it include: double -sided board, the upper and lower of double -sided board are equipped with upper break-resistant frame and lower break-resistant frame respectively, the bottom of upper break-resistant frame and the top of lower break-resistant frame are all set with the clamping groove of double -sided board insertion, upper break-resistant frame and lower break-resistant frame are equipped with the heat dissipation component of blowing to double -sided board, limit component is equipped between upper break-resistant frame and lower break-resistant frame.The utility model inserts the clamping groove between the clamping groove of upper break-resistant frame bottom and lower break-resistant frame to double -sided board, improves double -sided board break resistance, and the upper and lower of double -sided board are not shielded, avoid influencing wiring and heat dissipation, plug-in block is inserted into slot, round block is bounced into round groove by the restoring force of spring, it can be fixed to upper and lower break-resistant frame, when disassembling, just press round block to make it leave round groove, the double -sided board of convenient dismounting.

Description

Technical Field

[0001] This utility model relates to the field of double-sided circuit board technology, specifically a high-temperature resistant and bending-resistant double-sided circuit board. Background Technology

[0002] A double-sided circuit board is a printed circuit board with conductive patterns fabricated on both sides of an insulating substrate. When the circuit is complex and requires the installation of a large number of electronic components, and the space on a single side cannot meet the layout requirements, components are installed on both sides of a double-sided circuit board.

[0003] Announcement No.: CN219068446U includes a rectangular plate with a hollow pressure plate on its top. Two symmetrical slots are formed on both the front and rear surfaces of the rectangular plate. Each slot contains a locking block installed via a first screw. The tops of the four locking blocks are fixed to the bottom of the hollow pressure plate. A mounting hole is provided on the top of the rectangular plate. This invention, through the cooperation of the rectangular plate, hollow pressure plate, and base plate, effectively improves the bending resistance of the circuit board body, thus effectively increasing its service life. The first screw, locking blocks, and slots work together to firmly fix the hollow pressure plate and rectangular plate together, stably securing the circuit board body inside the mounting hole. The L-shaped block and second screw work together to stably fix the base plate to the bottom of the rectangular plate.

[0004] The aforementioned patent has some shortcomings: when wiring is required on both sides of the double-sided circuit board, the bottom plate will block the wiring and affect the heat dissipation at the bottom. In addition, the hollow pressure plate, rectangular plate and four clips are fixed with screws, which requires screwing one by one during disassembly and assembly, which is not convenient.

[0005] Therefore, this invention designs a high-temperature resistant and flexurally resistant double-sided circuit board to solve the problems existing in the prior art. Utility Model Content

[0006] The purpose of this invention is to provide a high-temperature resistant and flexurally resistant double-sided circuit board to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature resistant and bend-resistant double-sided circuit board, comprising: a double-sided board, an upper bend-resistant frame and a lower bend-resistant frame respectively provided on the upper and lower sides of the double-sided board, slots for insertion into the double-sided board being provided at the bottom of the upper bend-resistant frame and the top of the lower bend-resistant frame, heat dissipation components for blowing air onto the double-sided board being provided on the upper and lower bend-resistant frames, and a limiting component being provided between the upper and lower bend-resistant frames, the limiting component comprising two inserts, the two inserts being respectively installed on the bottom sides of the upper bend-resistant frame, and a circular hole being provided on the side of the two inserts that is far apart from each other, the circular hole being into which a sliding mechanism is formed. A circular block is installed, with one side of the circular block connected to the insert block by a spring. The top two sides of the lower anti-bending frame have slots for inserting the insert block, and the sides of the lower anti-bending frame have circular grooves communicating with the slots. The circular block passes through the circular grooves. By inserting the double-sided panels between the slots at the bottom of the upper anti-bending frame and the slots of the lower anti-bending frame, the bending resistance of the double-sided panels is improved, and the upper and lower sides of the double-sided panels are not obstructed, avoiding interference with wiring and heat dissipation. When the insert block is inserted into the slot, the restoring force of the spring causes the circular block to spring into the circular groove, thus fixing the upper and lower anti-bending frames. When disassembling, simply press the circular block to make it leave the circular groove, making it easy to disassemble and assemble the double-sided panels.

[0008] Preferably, the side of the circular block away from the spring is provided with a rubber layer, which is made of rubber and can improve the comfort of the operator's fingers when pressing the circular block.

[0009] Preferably, the heat dissipation component includes two elongated slots, which are respectively opened at one end of the upper and lower anti-bending frames and are far away from the card slot. Several miniature fans are installed in the elongated slots, and the miniature fans can blow air onto both sides of the double panel to achieve the effect of cooling.

[0010] Preferably, the other end of the upper anti-bending frame is provided with a dust outlet groove, so that when air is blown on the top of the double panel, the dust on its top can be blown away through the dust outlet groove.

[0011] Preferably, two Z-shaped brackets are installed on both sides of the lower anti-bending frame, which facilitates fixing the lower anti-bending frame to the mounting holes of the equipment.

[0012] Preferably, the inner wall of the card slot is provided with a silicone layer, which is made of silicone material and can protect the perimeter of the double-sided panel.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] This invention improves the bending resistance of the double-sided panels by inserting them between the slots at the bottom of the upper and lower anti-bending frames. Furthermore, the upper and lower surfaces of the double-sided panels are unobstructed, preventing interference with wiring and heat dissipation. The insert block is inserted into the slot, and the spring's restoring force causes the round block to spring into the round groove, thus fixing the upper and lower anti-bending frames. Disassembly is simple; just press the round block to remove it from the round groove, making it easy to install and remove the double-sided panels. Attached Figure Description

[0015] Figure 1 This is a front view exploded view of the present invention;

[0016] Figure 2 This is a front view schematic diagram of the present invention;

[0017] Figure 3 This is a bottom view of the present invention.

[0018] In the diagram: 1. Double-sided panel; 2. Upper anti-bending frame; 3. Lower anti-bending frame; 4. Card slot; 5. Heat dissipation component; 6. Limiting component; 7. Z-shaped bracket; 501. Long slot; 502. Miniature fan; 503. Dust outlet; 601. Insert block; 602. Round hole; 603. Round block; 604. Spring; 605. Slot; 606. Round slot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-3This utility model provides an embodiment of a high-temperature resistant and bend-resistant double-sided circuit board, comprising: a double-sided panel 1, an upper bend-resistant frame 2 and a lower bend-resistant frame 3 respectively provided on the upper and lower sides of the double-sided panel 1, and slots 4 for insertion into the double-sided panel 1 provided at the bottom of the upper bend-resistant frame 2 and the top of the lower bend-resistant frame 3, heat dissipation components 5 for blowing air onto the double-sided panel 1 provided on the upper bend-resistant frame 2 and the lower bend-resistant frame 3, and a limiting component 6 provided between the upper bend-resistant frame 2 and the lower bend-resistant frame 3, the limiting component 6 including two inserts 601, the two inserts 601 respectively installed on the bottom sides of the upper bend-resistant frame 2, and a circular hole 602 provided on the side of the two inserts 601 that is far apart from each other, a circular block 603 slidably installed in the circular hole 602, and one side of the circular block 603 and the insert 603... 01 is connected by spring 604. The top two sides of the lower anti-bending frame 3 are provided with slots 605 for inserting the insert block 601. The two sides of the lower anti-bending frame 3 are provided with circular grooves 606 that communicate with the slots 605. The circular block 603 passes through the circular groove 606. Press the circular block 603 with both hands to press the circular block 603 into the circular hole 602 and squeeze the spring 604. Then, align the insert block 601 with the slot 605 and insert it. After the insert block 601 is fully inserted into the slot 605, the restoring force of the spring 604 causes the circular block 603 to spring into the circular groove 606, which can fix the upper anti-bending frame 2 and the lower anti-bending frame 3. The double panel 1 can be fixed between the two slots 4. The upper anti-bending frame 2 and the lower anti-bending frame 3 can improve the bending resistance of the double panel 1.

[0021] Please see Figure 1-3 In this embodiment: the side of the round block 603 away from the spring 604 is provided with a rubber layer.

[0022] Please see Figure 1-3 In this embodiment: the heat dissipation component 5 includes two long slots 501, which are respectively opened at one end of the upper anti-bending frame 2 and the lower anti-bending frame 3, and the long slots 501 are far away from the card slot 4. Several micro fans 502 are installed in the long slots 501.

[0023] Please see Figure 1-3 In this embodiment: the other end of the upper anti-bending frame 2 is provided with an ash outlet groove 503.

[0024] Please see Figure 1-3 In this embodiment: two Z-shaped brackets 7 are installed on both sides of the lower anti-bending frame 3. The Z-shaped brackets 7 have threaded holes and can be connected to the mounting holes of the equipment by bolts.

[0025] Please see Figure 1-3 In this embodiment: the inner wall of the card slot 4 is provided with a silicone layer.

[0026] Working principle: The lower anti-bending frame 3 is first fixed to the mounting hole of the equipment using the Z-shaped bracket 7. Then, the double-sided panel 1 is placed in the slot 4 of the top plate of the lower anti-bending frame 3. Then, the round block 603 is pressed down with both hands, pressing it into the round hole 602 and compressing the spring 604. Then, the insert block 601 is aligned with the slot 605 and inserted. After the insert block 601 is fully inserted into the slot 605, the restoring force of the spring 604 causes the round block 603 to spring into the round groove 606, thus fixing the upper anti-bending frame 2 and the lower anti-bending frame 3. This fixes the double-sided panel 1 between the two slots 4, thus securing the upper anti-bending frame 2. The frame 2 and the lower anti-bending frame 3 can improve the bending resistance of the double-sided panel 1. When the double-sided panel 1 needs to be removed, simply press the round block 603 again to make the round block 603 leave the round groove 606, and then the upper anti-bending frame 2 can be lifted upwards, making it easy to remove the double-sided panel 1. The upper anti-bending frame 2 and the lower anti-bending frame 3 do not block the electronic components on both sides of the double-sided panel 1, thus avoiding affecting heat dissipation. Moreover, the micro fan 502 can blow air to dissipate heat from the electronic components on both sides of the double-sided panel 1, thereby improving the high temperature resistance of the double-sided panel 1. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0027] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-temperature resistant and flexurally resistant double-sided circuit board, comprising: A double-sided panel (1) is characterized in that: an upper anti-bending frame (2) and a lower anti-bending frame (3) are respectively provided above and below the double-sided panel (1); the bottom of the upper anti-bending frame (2) and the top of the lower anti-bending frame (3) are provided with slots (4) for insertion into the double-sided panel (1); heat dissipation components (5) for blowing air onto the double-sided panel (1) are provided on the upper anti-bending frame (2) and the lower anti-bending frame (3); a limiting component (6) is provided between the upper anti-bending frame (2) and the lower anti-bending frame (3); the limiting component (6) includes two inserts (601); the two inserts (601) respectively Installed on the bottom sides of the upper anti-bending frame (2), the two inserts (601) are provided with round holes (602) on the side away from each other. A round block (603) is slidably installed in the round hole (602). One side of the round block (603) is connected to the insert (601) by a spring (604). The top sides of the lower anti-bending frame (3) are provided with slots (605) for inserting into the insert (601). The sides of the lower anti-bending frame (3) are provided with round grooves (606) communicating with the slots (605). The round block (603) passes through the round grooves (606).

2. The high-temperature resistant and flexurally resistant double-sided circuit board as described in claim 1, characterized in that: The circular block (603) has a rubber layer on the side away from the spring (604).

3. The high-temperature resistant and flexurally resistant double-sided circuit board as described in claim 1, characterized in that: The heat dissipation component (5) includes two long slots (501), which are respectively opened at one end of the upper anti-bending frame (2) and the lower anti-bending frame (3), and the long slots (501) are far away from the card slot (4). Several micro fans (502) are installed in the long slots (501).

4. The high-temperature resistant and flexurally resistant double-sided circuit board as described in claim 3, characterized in that: The other end of the upper anti-bending frame (2) is provided with an ash outlet groove (503).

5. The high-temperature resistant and flexurally resistant double-sided circuit board as described in claim 1, characterized in that: Two Z-shaped brackets (7) are installed on both sides of the lower anti-bending frame (3).

6. The high-temperature resistant and flexurally resistant double-sided circuit board as described in claim 1, characterized in that: The inner wall of the card slot (4) is provided with a silicone layer.

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