PCB deformation repairing jig

Abstract

The utility model discloses a kind of PCB deformation repair jigs, including the compression assembly for the PCB that generates deformation is flattened, compression assembly includes backplate, and the bottom plate vertically arranged in the bottom end one side of backplate, fixed hole is opened on backplate, and fixed seat is fixed in the fixed hole in backplate one side, and fixed seat top is connected with a handle through pivot, and handle middle part is connected with lower one compression rod through connecting portion, and compression rod bottom is fixed with the surface of backplate, and backplate bottom is connected with the top of pressing block through spring, and PCB is located between bottom plate and pressing block, and pressing block is pressed down through handle, and cooperate with compression rod, backplate and spring, and pressurize to PCB.The utility model solves the lack of sustained pressurization repair mode to the deformation of PCB in prior art.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing, and in particular to a PCB deformation repair fixture. Background Technology

[0002] In existing PCB manufacturing processes, when PCB surface mount technology (SMT) is completed and the process enters the reflow soldering stage, the glass transition temperature (Tg value) of a conventional PCB substrate is approximately 140°C, while the actual soldering temperature in the reflow oven needs to reach 240-250°C. This significant temperature difference causes thermal stress to be generated in the high-temperature region of the PCB substrate, which leads to plastic deformation when the material's tolerance limit is exceeded.

[0003] Actual production data shows that after reflow soldering, approximately 35% of modular PCBs exhibit warping deformation exceeding 0.2mm, with multilayer PCB structures showing particularly significant deformation. When these modular PCBs are assembled into the motherboard as sub-modules, warping deformation causes multiple process problems, such as solder pad coplanarity deviations leading to cold / false solder joints, decreased surface mount alignment accuracy, and a 15-20% reduction in BGA device soldering yield. Furthermore, secondary processing of the deformed module becomes more difficult.

[0004] In view of this, this technical solution proposes a PCB deformation repair fixture to solve the deformation problem of modular PCBs. It adopts a continuously pressurized clamping component, relies on a purely mechanical mechanism to flatten the PCB, and has adjustable pressure characteristics, making assembly and use simple. Utility Model Content

[0005] The present invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the main objective of this invention is to provide a PCB deformation repair fixture for continuously applying pressure to a deformed PCB to flatten it for subsequent processes.

[0006] To achieve the above objectives, this utility model provides a PCB deformation repair fixture, including a clamping component for flattening a deformed PCB.

[0007] The clamping assembly includes a back plate and a base plate vertically disposed on one side of the bottom end of the back plate. The back plate has a fixing hole, and a fixing seat is fixed to one side of the back plate through the fixing hole. The upper part of the fixing seat is connected to a handle through a rotating shaft. The middle part of the handle is connected to a pressure rod below through a connecting part. The bottom of the pressure rod is fixed to the surface of the pressure plate. The bottom of the pressure plate is connected to the top of the pressure block through a spring. The PCB is located between the base plate and the pressure block. The pressure block is pressed down by the handle, and with the cooperation of the pressure rod, the pressure plate and the spring, pressure is applied to the PCB.

[0008] As a further embodiment of this utility model, the bottom of the fixed base is provided with a guide sleeve for limiting the movement of the pressure rod, and the guide sleeve is sleeved on the outside of the pressure rod.

[0009] As a further embodiment of this utility model, the pressing component is disposed on the heating platform, and the heating platform is provided with a control panel for temperature and time control.

[0010] As a further embodiment of this invention, the connecting part is a rotary connector with a locking mechanism.

[0011] As a further improvement of this utility model, a guide post for limiting the stroke is sleeved inside the spring.

[0012] As a further improvement of this utility model, the pressure plate is provided with an adjustment head for adjusting the tension of the spring.

[0013] As a further improvement of this utility model, the number of springs and pressure blocks corresponding to the bottom of the pressure plate is at least four.

[0014] The beneficial effects of this utility model are as follows:

[0015] This technical solution optimizes the clamping components. After the back plate and base plate are fixed, pressing down on the handle drives the rotating shaft, pressure rod, and pressure plate. A spring, in conjunction with these components, transmits pressure to the pressure block, creating uniform and continuous pressure between the PCB and the base plate. A guide sleeve at the bottom of the mounting base restricts the pressure rod to move only vertically, preventing offset. The heating platform, combined with a control panel, adjusts the temperature and time, softening the material and accelerating stress release. A rotating connector with a locking mechanism fixes the handle position, preventing pressure fluctuations. A guide post inside the spring limits the stroke and prevents compression offset. An adjustment head on the pressure plate allows for flexible calibration of the spring tension to accommodate different degrees of deformation. At least four springs and pressure blocks at the bottom of the pressure plate ensure even pressure distribution. This design solves the problems of insufficient and uneven pressure distribution in traditional processes, significantly improving repair efficiency and yield. It is particularly suitable for multilayer boards and modular products, while also being simple in structure and easy to operate, requiring no complex equipment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the technical solutions of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is an enlarged schematic diagram of the PCB that has undergone deformation in this utility model.

[0018] Figure 2 This is a schematic diagram of the overall structure of the pressing component and heating platform in this utility model.

[0019] Figure 3 This is a schematic diagram of the components of the clamping assembly in this utility model.

[0020] Figure 4 This is a partially enlarged schematic diagram of the pressure block and spring in this utility model.

[0021] Figure 5 This is a partially enlarged schematic diagram of the adjustment head in this utility model.

[0022] [Explanation of Markings on Main Components / Assemblies]

[0023] label name label name 1 Clamping components 18 pressure plate 10 Back panel 19 Press block 11 Fixing hole 190 spring 12 Fixed base 191 Guide column 13 pivot 192 Adjusting head 14 handle 2 PCB 15 Compression bar 3 Heating platform 16 Guide sleeve 30 control Panel 17 Connection part Detailed Implementation

[0024] as follows:

[0025] Please see the appendix Figure 1-5 ,

[0026] The main structure includes a pressing assembly (1) for flattening the deformed PCB (2). The pressing assembly (1) includes a back plate (10) and a base plate vertically disposed on one side of the bottom end of the back plate (10). The back plate (10) has a fixing hole (11). A fixing seat (12) is fixed on one side of the back plate (10) through the fixing hole (11). The upper part of the fixing seat (12) is connected to a handle (14) through a rotating shaft (13). The middle part of the handle (14) is connected to a pressure rod (15) below through a connecting part (17). The bottom of the pressure rod (15) is fixed to the surface of the pressure plate (18). The bottom of the pressure plate (18) is connected to the top of the pressure block (19) through a spring (190). The PCB (2) is located between the base plate and the pressure block (19). The pressure block (19) is pressed down by the handle (14). With the cooperation of the pressure rod (15), the pressure plate (18) and the spring (190), pressure is applied to the PCB (2).

[0027] The working principle is as follows:

[0028] In the prior art, during the reflow soldering stage, the PCB (2) generates thermal stress due to temperature differences, resulting in warping deformation of more than 0.2mm in about 35% of modular products, especially multilayer board structures. Such deformation easily leads to problems such as pad coplanarity deviation, cold solder joints or false solder joints, decreased mounting accuracy, and a 15-20% reduction in the soldering yield of BGA devices, and secondary processing is difficult. Traditional repair methods lack a continuous pressure mechanism, making it difficult to effectively correct deformation.

[0029] This technical solution achieves continuous pressure repair of PCB (2) through the mechanical structure design of the clamping assembly (1). The clamping assembly (1) consists of a back plate (10), a base plate, a fixing seat (12), a handle (14), a pressure rod (15), a pressure plate (18), a spring (190), and a pressure block (19). When the handle (14) is pressed down, the pressure rod (15) and the pressure plate (18) are driven by the rotating shaft (13), and the pressure is transmitted to the pressure block (19) in conjunction with the elasticity of the spring (190), so that the PCB (2) is clamped between the base plate and the pressure block (19), forming a uniform and adjustable continuous pressure. The guide sleeve (16) at the bottom of the fixed seat (12) is fitted onto the outside of the pressure rod (15) to limit its range of motion and ensure accurate pressure direction. The heating platform (3) combined with the control panel (30) can simultaneously adjust the temperature and time during pressure repair to accelerate the release of material stress. A guide column (191) is added inside the spring (190) to avoid compression deviation. With the adjustment head (192) on the pressure plate (18), the tightness of the spring (190) can be flexibly adjusted to adapt to different degrees of deformation. At least four springs (190) and pressure blocks (19) are set at the bottom of the pressure plate (18) to further ensure the uniformity of pressure distribution. This technical solution solves the problem of insufficient or uneven pressure in traditional processes through the above structural optimization, significantly improving the PCB (2) repair efficiency and yield. It is especially suitable for multilayer boards and modular products. The assembly is simple and does not require complex equipment support. In this technical solution, the clamping component (1) can be a symmetrical structure, that is, two sets of clamping structures are provided on the bottom plate and the back plate (10).

[0030] The assembly and disassembly process of this structure can be as follows:

[0031] During assembly, the base plate is vertically fixed to one side of the bottom end of the back plate (10) to ensure a stable connection between the two. The fixing seat (12) is installed through the fixing hole (11) on the back plate (10), and a guide sleeve (16) is added to the bottom of the fixing seat (12) so that it is fitted onto the outside of the subsequent pressure rod (15) for limiting. The handle (14) is connected to the top of the fixing seat (12) through the rotating shaft (13). The middle part of the handle (14) is hinged to the upper end of the pressure rod (15) through the connecting part (17) with the locking mechanism to ensure that the handle (14) can rotate flexibly. The bottom of the pressure rod (15) is fixed to the surface of the pressure plate (18). The bottom of the pressure plate (18) At least four springs (190) are evenly installed. A guide post (191) is inserted inside the spring (190) to prevent displacement. A pressure block (19) is connected to the end of each spring (190). An adjustment head (192) is installed on the pressure plate (18) to adjust the tightness of the spring (190). The entire clamping assembly (1) is placed on the heating platform (3) and connected to the external control panel (30) to set the temperature and pressurization time. The handle (14) is manually pressed down to observe whether the contact between the pressure block (19) and the base plate is uniform. The pressure of the spring (190) is calibrated by the adjustment head (192) to ensure that the PCB (2) is clamped under balanced force.

[0032] When disassembling, turn off the power of the heating platform (3), wait for the equipment to cool down completely to avoid burns, rotate the adjustment head (192) in the opposite direction to release the pressure of the spring (190), lift the handle (14) to make the pressure block (19) separate from the PCB (2), gradually disassemble the pressure plate (18), spring (190) and pressure block (19), release the locking mechanism of the handle (14) connection part (17), separate the handle (14) and pressure rod (15), then remove the rotating shaft (13) from the fixed seat (12), loosen the bolt at the fixing hole (11) of the back plate (10), remove the fixed seat (12) and guide sleeve (16), disassemble the connecting parts of the bottom plate and the back plate (10), and complete the jig disassembly.

[0033] Reference Appendix Figure 3 In a preferred embodiment of this utility model, the bottom of the fixed base (12) is provided with a guide sleeve (16) for limiting the movement of the pressure rod (15), and the guide sleeve (16) is sleeved on the outside of the pressure rod (15).

[0034] The guide sleeve (16) at the bottom of the fixed seat (12) is fitted over the outside of the pressure rod (15). By limiting the lateral offset of the pressure rod (15), it ensures that it only moves up and down in the vertical direction, thus ensuring the accuracy of pressure transmission, avoiding uneven force due to shaking of the pressure rod (15), controlling the stroke range of the pressure rod (15), preventing excessive pressure from damaging the PCB (2) or the fixture structure, thereby improving the stability and reliability of the repair process.

[0035] Reference Appendix Figure 2In a preferred embodiment of the present invention, the pressing component (1) is disposed on the heating platform (3), and the heating platform (3) is provided with a control panel (30) for temperature and time control.

[0036] This technical solution also combines the clamping component (1) with the heating platform (3), and sets the temperature and time parameters through the control panel (30). The heating platform (3) heats the PCB (2) uniformly during pressure repair, softening the material to accelerate stress release. Precise temperature and time control can avoid overheating damage, while ensuring that the material is fully shaped under pressure, improving repair efficiency and flatness, and is especially suitable for high-temperature sensitive multilayer board structures.

[0037] Reference Appendix Figure 3 In a preferred embodiment of this utility model, the connecting part (17) is a rotary connector with a locking mechanism.

[0038] The connecting part (17) adopts a rotating connector with a locking mechanism, which allows the handle (14) to rotate flexibly to adjust the angle of the pressure rod (15). After locking, it is fixed in position to prevent pressure fluctuations caused by the rebound of the handle (14) during the pressurization process, ensuring that the pressure is stably transmitted to the PCB (2), while facilitating one-handed operation and quick locking.

[0039] Reference Appendix Figure 4 In a preferred embodiment of the present invention, a guide post (191) for limiting the stroke is sleeved inside the spring (190).

[0040] A guide post (191) is added inside the spring (190) to guide the spring (190) to compress or extend in a straight line, so as to avoid deviation and uneven force; at the same time, the maximum stroke of the spring (190) is limited to prevent excessive compression from causing elastic failure or structural damage, and to ensure stable and controllable pressure transmission.

[0041] Reference Appendix Figure 3 , 5 In a preferred embodiment of this utility model, the pressure plate (18) is provided with an adjusting head (192) for adjusting the tension of the spring (190).

[0042] The tension of the spring (190) directly affects the pressure applied to the PCB (2). If the spring (190) is too loose, the pressure may be insufficient and unable to effectively repair the deformation; if it is too tight, it may cause excessive pressure and damage the PCB (2). The adjusting head (192) on the pressure plate (18) changes the tension of the spring (190) by rotation or displacement, thereby flexibly adjusting the pressure applied to the PCB (2). The pressure intensity can be calibrated in real time according to different degrees of deformation or board thickness, which can avoid insufficient pressure leading to ineffective repair and prevent excessive pressure from damaging the PCB (2).

[0043] Reference Appendix Figure 3 In a preferred embodiment of this utility model, the number of springs (190) and pressure blocks (19) corresponding to the bottom of the pressure plate (18) is at least four.

[0044] The clamping assembly (1) can be a symmetrical structure, that is, two clamping structures are provided on the bottom plate and the back plate (10). The number of springs (190) and pressure blocks (19) corresponding to the bottom of the pressure plate (18) is at least four, which is sufficient to cover and adapt to a variety of modules.

[0045] The above are merely preferred embodiments of the present utility model and do not limit the patent scope of the present utility model. Any equivalent structural transformations made using the contents of the present utility model specification and drawings under the concept of the present utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A PCB deformation repair fixture, characterized in that, include A clamping assembly used to flatten a deformed PCB. The clamping assembly includes a back plate and a base plate vertically disposed on one side of the bottom end of the back plate. The back plate has a fixing hole, and a fixing seat is fixed to one side of the back plate through the fixing hole. The upper part of the fixing seat is connected to a handle through a rotating shaft. The middle part of the handle is connected to a pressure rod below through a connecting part. The bottom of the pressure rod is fixed to the surface of the pressure plate. The bottom of the pressure plate is connected to the top of the pressure block through a spring. The PCB is located between the base plate and the pressure block. The pressure block is pressed down by the handle, and with the cooperation of the pressure rod, the pressure plate and the spring, pressure is applied to the PCB.

2. The PCB deformation repair fixture according to claim 1, characterized in that, The bottom of the fixed base is provided with a guide sleeve for limiting the movement of the pressure rod, and the guide sleeve is sleeved on the outside of the pressure rod.

3. The PCB deformation repair fixture according to claim 1, characterized in that, The clamping assembly is mounted on a heating platform, and the heating platform is equipped with a control panel for temperature and time control.

4. The PCB deformation repair fixture according to claim 1, characterized in that, The connecting part is a rotary connector with a locking mechanism.

5. The PCB deformation repair fixture according to claim 1, characterized in that, The spring is fitted with a guide post for limiting its travel.

6. The PCB deformation repair fixture according to claim 1, characterized in that, The pressure plate is equipped with an adjustment head for adjusting the tension of the spring.

7. The PCB deformation repair fixture according to claim 1, characterized in that, The number of springs and pressure blocks corresponding to the bottom of the pressure plate is at least four.

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