5G high-frequency flexible circuit board bonding double-sided adhesive tape pasting equipment

Abstract

The utility model discloses a 5G high frequency flexible circuit board bonding double -sided adhesive tape opposite pasting equipment. The equipment includes four pasting devices and three die cutting devices from left to right and interval arrangement in proper order, and each die cutting device is located between every adjacent two pasting devices respectively, wherein, the pasting device includes a frame, and the left side of frame is provided with a feeding wheel, and three work stations are installed side by side on the frame, and five feeding wheels are installed side by side from left to right on the top of frame, and each feeding wheel is located above each work station, and the lower part of frame is provided with at least one discharging wheel, and the die cutting device includes a bottom base, and the top of bottom base is provided with a die cutting mould. A kind of 5G high frequency flexible circuit board bonding double -sided adhesive tape opposite pasting equipment in the utility model can make two material tapes on the same mould and carry out opposite pasting, ensure the precision of opposite pasting size of opposite pasting product, and save the time of making and opposite pasting, improve the production capacity and efficiency of production, reduce manufacturing cost.

Description

Technical Field

[0001] This utility model relates to the field of electrical appliances, and in particular to a double-sided adhesive bonding device for 5G high-frequency flexible circuit boards. Background Technology

[0002] In the processing of 5G high-frequency flexible circuit boards, double-sided adhesive tape needs to be bonded and matched onto the flexible circuit board. However, traditional double-sided adhesive tape matching for flexible circuit boards relies on manual operation, which often suffers from defects such as insufficient precision, low efficiency, and low yield, thus affecting the stability of 5G high-frequency signal transmission in the product. Furthermore, existing die-cutting machines often lack a dedicated matching structure, making it impossible to achieve synchronous and precise lamination of the two tapes. Utility Model Content

[0003] To address the aforementioned issues, this invention provides a 5G high-frequency flexible circuit board bonding double-sided adhesive applicator, which can produce two strips on the same mold and bond them together, ensuring the accuracy of the bonding dimensions of the bonded products, saving manufacturing and bonding time, improving production capacity and efficiency, and reducing manufacturing costs.

[0004] According to one aspect of this utility model, a double-sided adhesive bonding device for high-frequency flexible circuit boards is provided, comprising four bonding devices and three die-cutting devices arranged sequentially from left to right, with each die-cutting device located between every two adjacent bonding devices; wherein, each bonding device includes a frame, a feeding roller is provided on the left side of the frame, three workstations are installed side by side on the frame, five feeding rollers are installed side by side from left to right above the frame, each feeding roller is located above each of the workstations, and at least one unloading roller is provided at the lower part of the frame; the die-cutting device includes a base platform, and a die-cutting mold is provided on the top of the base platform.

[0005] In some embodiments, a first guide frame is mounted on the left side of the frame. This is advantageous because the direction of the film material dispensed by the feeding wheel can be adjusted via the first guide frame.

[0006] In some embodiments, a top beam is mounted above the frame, and each of the feeding rollers is mounted on the top beam. The advantage of this is that it describes the specific mounting position of each feeding roller.

[0007] In some embodiments, each pair of adjacent feed rollers is mounted on the upper and lower sides of the top beam, respectively. This is advantageous because it further describes the installation of each feed roller, thereby improving space utilization.

[0008] In some implementations, the number of feeding rollers is more than five. This has the advantage of allowing for the handling of more complex bonding tasks as needed.

[0009] In some embodiments, two guide wheels are mounted on the frame via two supports, with each guide wheel located between and above each of the workstations. The advantage is that the film material discharged from each feeding wheel can be guided by the corresponding guide wheel as needed.

[0010] In some embodiments, the die-cutting die has an upper die holder at its top. This is advantageous because the upper die holder can be used with appropriate punching equipment to punch the die material passing through the die-cutting die.

[0011] In some embodiments, a second guide frame is mounted on the left side of the base. This is advantageous because the bonded film material can be oriented and fed into the die-cutting mold via the second guide frame. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a 5G high-frequency flexible circuit board bonding double-sided adhesive pasting device according to one embodiment of the present invention;

[0013] Figure 2 for Figure 1 The diagram shows the structural schematic of the bonding device.

[0014] Figure 3 for Figure 1 The diagram shows the structure of the die-cutting device.

[0015] Figure 4 for Figure 1 The diagram shows the first bonding device used in the bonding process.

[0016] Figure 5 for Figure 1 The diagram shows the second bonding device used in the bonding process.

[0017] Figure 6 for Figure 1 The diagram shows the third bonding device used in the bonding process.

[0018] Figure 7 for Figure 1 The diagram shows the fourth bonding device used in the bonding process.

[0019] In the diagram: bonding device 10, frame 11, feeding roller 12, workstation 13, loading roller 14, unloading roller 15, first guide frame 16, top beam 17, bracket 18, guide wheel 19, die-cutting device 20, base platform 21, die-cutting mold 22, upper mold base 23, second guide frame 24, anti-scratch protective film 30, silicone protective film 31, silicone protective film with built-in film 32, red release film 33, double-sided tape 34, waste material from adhesive-free area 35, double-sided tape with built-in film 36, matte release film 37, blue PET film 38, product shape waste 39, single-sided tape 40, ultra-light transparent release film 41. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings.

[0021] like Figure 1 As shown, the equipment includes four bonding devices 10 and three die-cutting devices 20 arranged sequentially from left to right. Each die-cutting device 20 is located between each pair of adjacent bonding devices 10, that is, each bonding device 10 and each die-cutting device 20 are arranged sequentially at intervals.

[0022] like Figure 2 As shown, the bonding device 10 includes a frame 11, a feeding roller 12 is provided on one side (designated as the left side) of the frame 11, and three workstations 13 are installed side by side on the frame 11. The film material fed out by the feeding roller 12 passes through each workstation 13 in sequence and is bonded by each workstation 13.

[0023] Preferably, a first guide frame 16 is installed on the left side of the frame 11, and the direction of the film material that can be discharged by the feeding wheel 12 is adjusted by the first guide frame 16.

[0024] A top beam 17 is installed above the frame 11. Five feeding rollers 14 are installed side by side from left to right on the top beam 17. Each feeding roller 14 is located above each work station 13. They are used to feed another type of film onto the film material fed by the feeding roller 12 for bonding, or to pull out waste material from the film material fed by the feeding roller 12 for waste discharge.

[0025] Preferably, in order to improve space utilization, each pair of adjacent feeding wheels 14 of the five feeding wheels 14 can be installed on the upper and lower sides of the top beam 17 respectively.

[0026] In a further preferred embodiment, additional feeding rollers 14 can be set on the frame 11, so that the number of feeding rollers 14 is more than five, in order to cope with more complex bonding work.

[0027] In addition, at least one feed roller 15 is provided at the lower part of the frame 11. The feed roller 15 is mainly used for tasks such as discharging waste materials.

[0028] Preferably, two guide wheels 19 are installed above the frame 11 via two brackets 18. Each guide wheel 19 is located between and above each workstation 13. The film material released from each feeding wheel 14 can be guided by the corresponding guide wheel 19 as needed.

[0029] like Figure 3 As shown, the die-cutting device 20 includes a base 21, a die-cutting mold 22 is disposed on the top of the base 21, and an upper die holder 23 is disposed on the top of the punching die. The laminated film material passes under the upper die holder 23 of the die-cutting mold 22, and can be used with corresponding punching equipment to perform the required punching process on the film material.

[0030] Preferably, a second guide frame 24 is installed on the left side of the base 21, and the laminated film material can be adjusted in direction by the second guide frame 24 and enter the die-cutting mold 22.

[0031] When using this bonding equipment to adhere double-sided tape to flexible circuit boards and perform bonding, the workflow mainly includes the following steps.

[0032] S1: As Figure 4 As shown, the first (counting from the left) bonding device 10 uses the feeding roller 12 to feed a piece of anti-scratch protective film 30 and lets it pass through each workstation 13. Then, the upper feeding rollers 14 sequentially apply silicone protective film 31 (with its own film 32 on top) to the anti-scratch protective film 30, remove the silicone protective film's own film 32, apply red release film 33 (with its release side facing up), and apply two pieces of double-sided tape 34 that can be dispensed.

[0033] S2: The film material after the above-mentioned bonding process is fed to the first die-cutting device 20, and the first die-cutting device 20 performs the first die-cutting, mainly to cut out the approximate shape of the product.

[0034] S3: As Figure 5 As shown, after the first die-cutting, the film material is fed to the second laminating device 10 and passes through each workstation 13. Then, each feeding wheel 14 is used to sequentially remove the waste material from the non-adhesive area 35, remove the double-sided adhesive film 36, laminate the matte release film on one side of the double-sided adhesive 37, and laminate the blue PET film on the other side of the double-sided adhesive 38, etc.

[0035] S4: The film material after the above-mentioned bonding process is fed to the second die-cutting device 20, and the second die-cutting device 20 performs a second die-cutting, mainly to further die-cut out the shape of the product and its small holes and other structures.

[0036] S5: As Figure 6As shown, after the second die-cutting, the film material is fed to the third laminating device 10 (more feeding rollers 14 are set as needed in the figure) and passes through each station 13. Then, each feeding roller 14 and unloading roller 15 sequentially removes the product shape waste 39 of the blue PET film 38, laminates single-sided tape 40 on one side and removes the product shape and matte release film 37 on that side, and removes the anti-scratch protective film 30. Then, one station 13 divides the film material into two strips, and after flipping one of them (so that the blue PET film is facing down), they enter the third die-cutting device 20 together.

[0037] S6: Use the third die-cutting device 20 to bond the two film materials together and perform a third die-cutting;

[0038] S7: As Figure 7 As shown, the film material after the third die-cutting is fed to the fourth laminating device 10 and passes through each workstation 13. Then, each feeding roller 14 and unloading roller 15 sequentially removes the top layer of silicone protective film 31 and red release film 33, laminates the ultra-light transparent release film 41, removes the bottom layer of silicone protective film 31, etc., and finally performs winding inspection.

[0039] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A double-sided adhesive bonding device for 5G high-frequency flexible circuit boards, characterized in that: The assembly includes four bonding devices (10) and three die-cutting devices (20) arranged sequentially from left to right, with each die-cutting device (20) located between each pair of adjacent bonding devices (10). Each bonding device (10) includes a frame (11), a feeding wheel (12) on the left side of the frame (11), three workstations (13) mounted side by side on the frame (11), five feeding wheels (14) mounted side by side from left to right above the frame (11), each feeding wheel being located above each workstation (13), and at least one unloading wheel (15) located at the bottom of the frame (11). Each die-cutting device (20) includes a base (21), and a die-cutting mold (22) is located on the top of the base (21).

2. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 1, characterized in that: A first guide frame (16) is installed on the left side of the frame (11).

3. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 1, characterized in that: A top beam (17) is installed above the frame (11), and each of the feeding wheels (12) is installed on the top beam (17).

4. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 3, characterized in that: Each pair of adjacent feeding wheels (12) are installed on the upper and lower sides of the top beam (17).

5. The double-sided adhesive bonding device for 5G high-frequency flexible circuit boards according to claim 1, characterized in that: The number of the feeding rollers (14) is more than five.

6. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 1, characterized in that: Two guide wheels (19) are respectively mounted on the frame (11) via two brackets (18), and each guide wheel (19) is located between and above each workstation (13).

7. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 1, characterized in that: The die-cutting mold (22) has an upper mold base (23) on its top.

8. The 5G high-frequency flexible circuit board bonding double-sided adhesive bonding device according to claim 1, characterized in that: A second guide frame (24) is installed on the left side of the base (21).

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