Bubble-proof attachment device for PCB surface treatment

Abstract

The utility model is suitable for PCB board surface treatment technical field provides a kind of anti-bubble attachment device for PCB board surface treatment, including nickel plating assembly, the inside of nickel plating assembly is provided with anti-bubble assembly, the side of nickel plating assembly is provided with transfer assembly;The anti-bubble assembly includes several groups of air pump, and several The air pump is respectively connected with a group of air blowing mechanism, and the top of several air blowing mechanism is respectively provided with a group of deflector;The nickel plating assembly includes placing rack, and the side of placing rack is provided with several liquid changing mechanism;To reduce bubble and attach on the surface of PCB board, therefore set up anti-bubble assembly to reach the purpose, wherein air pump is mainly used to provide sufficient gas for device, air blowing mechanism is mainly used to release gas, and deflector is used to change the flow of gas, guide more gas to flow along the surface of PCB board, realize the scouring of bubble by gas flow, reduce the possibility that bubble is attached on the PCB board, reach the purpose of anti-bubble attachment.

Description

Technical Field

[0001] This utility model relates to the field of PCB board surface treatment technology, and more specifically, it relates to an anti-bubble adhesion device for PCB board surface treatment. Background Technology

[0002] Surface treatment processes for PCBs are a key factor affecting their performance, reliability, and manufacturability. They are mainly used to protect copper foil, prevent oxidation, improve solderability, and provide a suitable surface for component soldering.

[0003] Currently, the main surface treatment method for PCB boards is electroless nickel plating with gold. Electroless nickel plating forms a uniform and dense nickel layer, and then a very thin gold layer is deposited on the surface of the nickel layer. The gold layer can effectively prevent the nickel layer from oxidizing, providing a long-term stable and flat pad surface for soldering, and avoiding poor soldering caused by oxidation.

[0004] However, during the electroless nickel plating process, air bubbles can adhere to the PCB board surface, hindering the plating solution from fully contacting the PCB board surface and preventing the proper deposition of a nickel layer. When the air bubbles fall off, pinholes or pits will form on the plating surface. These defects will reduce the density and corrosion resistance of the plating layer, affecting the appearance and service life of the product. A device for preventing air bubble adhesion for PCB board surface treatment is proposed to improve the existing problems. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an anti-bubble adhesion device for PCB board surface treatment.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A device for preventing bubble adhesion in PCB surface treatment includes a nickel plating assembly, wherein an anti-bubble assembly is disposed inside the nickel plating assembly, and a transfer assembly is disposed on one side of the nickel plating assembly.

[0008] The anti-bubble assembly includes several sets of air pumps, each set of air pumps is connected to a set of air blowing mechanisms, and each set of air blowing mechanisms is provided above a set of guide plates.

[0009] The nickel plating assembly includes a placement rack, the interior of which is provided with several liquid tanks, and one side of the placement rack is provided with several liquid changing mechanisms. The number of liquid changing mechanisms is the same as the number of liquid tanks, and the liquid tanks are connected to the liquid changing mechanisms.

[0010] The transfer assembly includes a conveying mechanism, and a gripping mechanism is disposed above the conveying mechanism. The conveying mechanism is used to assist the gripping mechanism in achieving horizontal movement.

[0011] The present invention is further configured such that the number of the air blowing mechanism and the guide plate is the same as the number of the liquid placement tank, and the air blowing mechanism and the guide plate are both disposed inside the liquid placement tank, and the guide plate is provided with a plurality of guide holes along the vertical direction.

[0012] The present invention is further configured such that: the number of air pumps is the same as the number of liquid storage tanks; the air pumps are installed on the side wall of the liquid storage tanks; the air pumps are connected to the air blowing mechanism; and the air pumps are used to transport gas.

[0013] The present invention is further configured such that: the air blowing mechanism includes a sleeve, the sleeve is hollow inside, and a one-way valve is provided inside the sleeve.

[0014] The present invention is further configured such that: one end of the one-way valve is connected to the air pump, the other end of the one-way valve is connected to the sleeve, and the one-way valve is used to reduce liquid backflow.

[0015] By adopting the above technical solution, in practical applications, when the air pump suddenly stops, the pipeline leaks, or the air pressure is not properly adjusted, the air pressure inside the sleeve will quickly drop below the liquid level pressure in the liquid tank. At this time, the solution may flow back into the air pump along the sleeve under atmospheric pressure, causing water backflow. Water backflow will damage the internal structure of the air pump and lead to equipment failure. Therefore, by setting a one-way valve, which can only allow one-way gas flow and not backflow, the possibility of plating solution flowing back into the air pump can be reduced.

[0016] The present invention is further configured such that: a plurality of air outlet pipes are provided on one side of the sleeve, the air outlet pipes are connected to the sleeve, and the ends of the air outlet pipes are provided with chamfers.

[0017] The present invention is further configured such that: both the air outlet pipe and the guide plate are arranged in an inclined manner, the air outlet pipe is located below the guide plate, and the air outlet pipe is inclined downward toward the guide plate.

[0018] By adopting the above technical solution, the air pump is started, and the air pump begins to fill the sleeve. The gas enters the sleeve through the one-way valve, then flows from the sleeve to the outlet pipe, and finally is blown out through the outlet pipe. The gas blown out of the outlet pipe flows out through the guide hole after being reversed by the guide plate. The airflow ejected from the guide hole directly impacts the liquid surface, forming a turbulent vortex at the gas-liquid interface, generating strong shear force, tearing small bubbles and preventing them from accumulating, thus achieving the purpose of preventing bubble adhesion. In particular, since the guide hole is opened vertically along the guide plate, the gas ejected from the outlet pipe can be guided to a direction parallel to the PCB board surface, reducing the possibility of gas directly impacting the PCB board surface and reducing damage to the PCB board. At the same time, due to the limitation of the number of guide holes, more gas is concentrated and guided to flow along the PCB board surface. Through the gas flow, the bubbles are flushed, reducing the possibility of bubbles adhering to the PCB board, thus achieving the purpose of preventing bubble adhesion. In addition, since the outlet pipe is set to be inclined downward towards the guide plate, more gas can be sprayed towards the guide plate for easy diversion by the guide plate, improving the gas utilization rate.

[0019] In summary, this application includes at least one of the following beneficial technical effects:

[0020] To reduce the adhesion of air bubbles to the PCB board surface, an anti-bubble component is installed. The air pump is mainly used to provide sufficient gas to the device, the blowing mechanism is mainly used to release gas, and the guide plate is used to assist in changing the gas flow direction, reducing the direct impact of gas on the PCB board surface and preventing damage. At the same time, it guides more gas to flow along the PCB board surface, thereby flushing out the air bubbles and reducing the possibility of air bubbles adhering to the PCB board, thus achieving the purpose of preventing air bubble adhesion. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of an anti-bubble adhesion device for PCB board surface treatment according to the present invention.

[0022] Figure 2 for Figure 1 Top view.

[0023] Figure 3 for Figure 1 A magnified structural diagram of area A in the middle.

[0024] Figure 4 This is a partial structural diagram of the air blowing mechanism in this utility model.

[0025] Figure 5 This is a schematic diagram of the gas flow trajectory in this utility model.

[0026] Explanation of reference numerals in the attached drawings: 1. Anti-bubble assembly; 11. Air pump; 12. Air blowing mechanism; 121. Sleeve; 122. One-way valve; 123. Air outlet pipe; 13. Guide plate;

[0027] 2. Nickel plating assembly; 21. Placement rack; 22. Solution changing mechanism; 23. Solution tank;

[0028] 3. Transfer components; 31. Conveying mechanism; 32. Gripping mechanism. Detailed Implementation

[0029] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0030] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0031] Please see Figure 1-5 The present invention provides the following technical solution:

[0032] Example 1, see Figure 1 A device for preventing bubble adhesion in PCB surface treatment includes a nickel plating component 2, an anti-bubble component 1 inside the nickel plating component 2, and a transfer component 3 on one side of the nickel plating component 2.

[0033] See Figure 1 and Figure 2 The anti-bubble assembly 1 includes several sets of air pumps 11, each set of air pumps 11 is connected to a set of air blowing mechanism 12, and each set of air blowing mechanism 12 is provided above a set of guide plates 13.

[0034] See Figure 1 and Figure 2 The nickel plating assembly 2 includes a placement rack 21, which has several liquid tanks 23 inside. Several liquid exchange mechanisms 22 are provided on one side of the placement rack 21. The number of liquid exchange mechanisms 22 is the same as the number of liquid tanks 23, and the liquid tanks 23 are connected to the liquid exchange mechanisms 22.

[0035] The solution replacement mechanism 22 includes a water pump and a pipe body. The solution can be replaced in a timely manner through the pipe body and the water pump.

[0036] See Figure 3 The transfer component 3 includes a conveying mechanism 31, and a gripping mechanism 32 is provided above the conveying mechanism 31. The conveying mechanism 31 is used to assist the gripping mechanism 32 in moving horizontally.

[0037] The conveying mechanism 31 consists of a drive motor, gears, racks, two sets of sliders, and slide rails. The output end of the drive motor is connected to the gears, and the drive motor can drive the gears to move along the racks. A fixed frame is provided on the outside of the output end of the gears, and the fixed frame is connected to one of the sets of sliders. Therefore, when the drive motor is started, the drive motor first drives the gears to move along the racks, and then the sliders can move linearly along the slide rails under the drive of the motor, gears, and racks. Since a gripping mechanism 32 is provided in the middle of the two sets of sliders, the gripping mechanism 32 can move under the drive of the two sets of sliders.

[0038] The gripping mechanism 32 consists of a lifting cylinder, grippers, and a support frame. The support frame is connected to two sets of sliders. The lifting cylinder is installed on one side of the support frame, and the grippers are connected to the cylinder. When the lifting cylinder is activated, the grippers can rise and fall, thereby picking up the lifting frame during the lifting process. In addition, it can move horizontally under the drive of the conveying mechanism 31. Therefore, under the action of the conveying mechanism 31 and the gripping mechanism 32, the grippers can rise, fall, and move horizontally, thereby moving the position of the lifting frame, that is, moving the position of the PCB board, to meet the needs of moving the PCB board after surface treatment.

[0039] To reduce the adhesion of air bubbles to the PCB board surface, an anti-bubble component 1 is provided. The air pump 11 is mainly used to provide sufficient gas to the device, the blowing mechanism 12 is mainly used to release gas, and the guide plate 13 is used to assist in changing the gas flow direction, reducing the direct impact of gas on the PCB board surface and preventing damage to the PCB board. At the same time, it guides more gas to flow along the PCB board surface, thereby flushing out the air bubbles and reducing the possibility of air bubbles adhering to the PCB board, thus achieving the purpose of preventing air bubble adhesion.

[0040] See Figure 1 and Figure 2 The number of air blowing mechanism 12 and guide plate 13 is the same as the number of liquid tank 23, and the air blowing mechanism 12 and guide plate 13 are both set inside the liquid tank 23. Several guide holes are opened on the guide plate 13 along the vertical direction. The guide plate 13 is inserted into the side wall of the liquid tank 23. Therefore, in practical applications, the position can be adjusted as needed to meet the requirement of preventing air bubbles from adhering.

[0041] See Figure 1 and Figure 2 The number of air pumps 11 is the same as that of liquid tanks 23. The air pumps 11 are installed on the side wall of the liquid tanks 23. The air pumps 11 are connected to the air blowing mechanism 12 and are used to transport gas.

[0042] See Figure 4The air blowing mechanism 12 includes a sleeve 121, which is hollow inside, and a one-way valve 122 is provided inside the sleeve 121.

[0043] See Figure 4 One end of the one-way valve 122 is connected to the air pump 11, and the other end of the one-way valve 122 is connected to the sleeve 121. The one-way valve 122 is used to reduce liquid backflow.

[0044] In practical applications, when the air pump 11 suddenly stops, the pipeline leaks, or the air pressure is not properly adjusted, the air pressure inside the sleeve 121 will quickly drop below the liquid level pressure in the liquid tank 23. At this time, the solution may flow back into the air pump 11 along the sleeve 121 under atmospheric pressure, causing water backflow. Water backflow will damage the internal structure of the air pump 11 and lead to equipment failure. Therefore, by setting a one-way valve 122, which can only allow one-way gas flow and not backflow, the possibility of plating solution flowing back into the air pump 11 can be reduced.

[0045] See Figure 4 A plurality of vent pipes 123 are provided on one side of the sleeve 121. The vent pipes 123 are connected to the sleeve 121 and the ends of the vent pipes 123 are chamfered.

[0046] When the air blowing stops, the plating solution will impact the pipe opening in the opposite direction due to gravity or liquid surface fluctuations, forming a vertical impact. This causes some liquid to directly enter the pipe. Therefore, by setting the air outlet pipe 123 to be inclined downward, the direct impact of the liquid is reduced. In addition, since the end of the air outlet pipe 123 is chamfered, when the reverse liquid flow impacts the chamfered slope, the impact force is decomposed into a tangential component and a vertical component along the slope. Most of the liquid flow will slide along the chamfered edge past the pipe opening instead of directly entering the pipe, reducing the possibility of water backflow and reducing damage to the air outlet pipe 123.

[0047] In addition, since the air outlet pipe 123 is installed in combination with the sleeve 121, even if water backflow occurs and liquid enters the pipe, the plating solution will first reach the position of the air outlet pipe 123, slowing down the time it takes to reach the air pump 11, which can be dealt with in time and reduce damage to the air pump 11.

[0048] Both the air outlet pipe 123 and the guide plate 13 are set at an angle. The air outlet pipe 123 is located below the guide plate 13 and is set at an angle downward towards the guide plate 13.

[0049] See Figure 5 The anti-bubble process is as follows:

[0050] First, the air pump 11 is started, and the air pump 11 begins to inflate. The gas enters the sleeve 121 through the one-way valve 122, then flows from the sleeve 121 to the air outlet pipe 123, and finally blows out through the air outlet pipe 123. The gas blown out of the air outlet pipe 123 flows out through the guide hole after being guided by the guide plate 13. The airflow ejected from the guide hole directly impacts the liquid surface, forming a turbulent vortex at the gas-liquid interface, generating strong shear force, tearing small bubbles and preventing them from accumulating, thus achieving the purpose of preventing bubble adhesion. During the blowing process, the air pump 11 is always in working condition. Because the gas from the air pump 11 is constantly being ejected, the gas is always in a high-speed motion state, which will form an airflow parallel to the PCB board. The airflow blows away the bubbles attached to the PCB board.

[0051] The guide plate 13 is inserted into the liquid tank 23 and fits against the bottom, which can guide the gas over a large range. Since the guide holes are opened vertically along the guide plate 13, the gas can be guided to a direction parallel to the PCB board surface, reducing the possibility of gas directly impacting the PCB board surface and reducing damage to the PCB board. At the same time, due to the limitation of the number of guide holes, more gas is concentrated and guided to flow along the PCB board surface. Through the gas flow, the air bubbles are flushed, reducing the possibility of air bubbles adhering to the PCB board, thus achieving the purpose of preventing air bubble adhesion.

[0052] In addition, since the exhaust pipe 123 is inclined downward toward the guide plate 13, more gas can be sprayed onto the guide plate to facilitate the flow of the gas and improve the utilization rate of the gas.

[0053] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A device for preventing bubble adhesion in PCB board surface treatment, characterized in that: The nickel plating assembly (2) includes an anti-bubble assembly (1) inside the nickel plating assembly (2) and a transfer assembly (3) on one side of the nickel plating assembly (2). The anti-bubble assembly (1) includes several sets of air pumps (11), each of the several air pumps (11) is connected to a set of air blowing mechanism (12), and each of the several air blowing mechanism (12) is provided with a set of guide plates (13) above it. The nickel plating assembly (2) includes a placement rack (21), the interior of which is provided with a plurality of liquid tanks (23), and a plurality of liquid changing mechanisms (22) are provided on one side of the placement rack (21). The number of liquid changing mechanisms (22) is the same as the number of liquid tanks (23), and the liquid tanks (23) are connected to the liquid changing mechanisms (22). The transfer component (3) includes a conveying mechanism (31), and a gripping mechanism (32) is provided above the conveying mechanism (31). The conveying mechanism (31) is used to assist the gripping mechanism (32) in moving horizontally.

2. The anti-bubble adhesion device for PCB board surface treatment according to claim 1, characterized in that: The number of the air blowing mechanism (12) and the guide plate (13) is the same as the number of the liquid tank (23), and the air blowing mechanism (12) and the guide plate (13) are both located inside the liquid tank (23). The guide plate (13) has several guide holes along the vertical direction.

3. The anti-bubble adhesion device for PCB board surface treatment according to claim 2, characterized in that: The number of air pumps (11) is the same as that of liquid tanks (23). The air pumps (11) are installed on the side wall of the liquid tanks (23). The air pumps (11) are connected to the air blowing mechanism (12) and are used to transport gas.

4. The anti-bubble adhesion device for PCB board surface treatment according to claim 3, characterized in that: The air blowing mechanism (12) includes a sleeve (121), which is hollow inside, and a one-way valve (122) is provided inside the sleeve (121).

5. The anti-bubble adhesion device for PCB board surface treatment according to claim 4, characterized in that: One end of the one-way valve (122) is connected to the air pump (11), and the other end of the one-way valve (122) is connected to the sleeve (121). The one-way valve (122) is used to reduce liquid backflow.

6. The anti-bubble adhesion device for PCB board surface treatment according to claim 5, characterized in that: A plurality of air outlet pipes (123) are provided on one side of the sleeve (121), the air outlet pipes (123) are connected to the sleeve (121), and the ends of the air outlet pipes (123) are provided with chamfers.

7. The anti-bubble adhesion device for PCB board surface treatment according to claim 6, characterized in that: The air outlet pipe (123) and the guide plate (13) are both arranged in an inclined manner. The air outlet pipe (123) is located below the guide plate (13) and is inclined downward towards the guide plate (13).

Images