A binding and alignment mechanism for an OPD sensor in a smart ring

Abstract

The utility model relates to intelligent ring processing technical field especially is a kind of binding alignment mechanism of intelligent ring OPD Sensor, it includes base, PCB adsorption positioning platform, movable adjusting assembly, the binding pedestal of being installed on base and the OPD Sensor adsorption positioning batten of being installed on movable adjusting assembly, product positioning groove is provided on PCB adsorption positioning platform, the middle part of product positioning groove is provided with avoiding slot, binding recess is provided on binding pedestal, and binding recess is located the middle part below of product positioning groove, and binding quartz strip is installed in binding recess. The utility model structure is novel, ensures that OPD Sensor can be accurately aligned with product PCB board and then is bound;Save overall space, and quartz strip ensures the heat conduction stability in hot-pressing process, guarantees accurate temperature control, improves the stability of binding between OPD Sensor and product PCB board.

Description

Technical Field

[0001] This utility model relates to the field of smart ring manufacturing technology, and in particular to a binding and alignment mechanism for a smart ring OPD Sensor. Background Technology

[0002] In recent years, with the miniaturization of smart wearable devices, the demand for integrating OPD optical sensors in ring-type products has been increasing. Traditional bonding processes for micro-sensors smaller than 4mm to high-density PCBs face several technical bottlenecks: the process requires bonding the OPD sensor to the PCB, but the bonding area for smart ring OPD sensors is small (<4mm wide), and there are many components on both sides of the PCB. Automated equipment is inefficient due to the product's specific characteristics, while manual equipment requires fixtures with low alignment accuracy, easily leading to misalignment and defects, and rework impacting manufacturing costs. These shortcomings result in a current micro-sensor bonding yield generally below 90%, severely restricting the mass production feasibility of smart ring-type products. Summary of the Invention

[0003] This invention addresses the problems of existing technologies by providing a binding and alignment mechanism for an intelligent ring OPD sensor. The novel structure ensures precise alignment and binding of the OPD sensor to the product's PCB board; it saves overall space, and the quartz strip ensures stable heat conduction during hot pressing, guaranteeing precise temperature control and improving the bonding stability between the OPD sensor and the product's PCB board.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] This utility model provides a binding and alignment mechanism for an OPD sensor in a smart ring, comprising a base, a PCB adsorption and positioning platform mounted on one side of the base, a movable adjustment component mounted on the other side of the base, a binding base mounted on the base, and an OPD sensor adsorption and positioning strip mounted on the movable adjustment component. The movable adjustment component is located on one side of the PCB adsorption and positioning platform. The PCB adsorption and positioning platform is provided with a product positioning groove, and an avoidance groove is formed in the middle of the product positioning groove. The binding base is provided with a binding groove, which is located below the middle of the product positioning groove. A binding quartz strip is installed in the binding groove. One end of the OPD sensor adsorption and positioning strip is located above the product positioning groove, and the other end of the OPD sensor adsorption and positioning strip is flipped and mounted on the movable adjustment component. The lower end face of one end of the OPD sensor adsorption and positioning strip is provided with a plurality of first vacuum adsorption holes for adsorbing the OPD sensor. The product positioning groove is provided with a plurality of second vacuum adsorption holes for adsorbing the product PCB board.

[0006] The movable adjustment assembly includes a Z-axis adjustment component, an XY-axis adjustment component mounted on the Z-axis adjustment component, a Q-axis adjustment component mounted on the XY-axis adjustment component, and a support base mounted on the Q-axis adjustment component. The other end of the OPDSensor adsorption positioning strip is flipped and connected to the support base.

[0007] The Z-axis adjustment component includes a Z-axis adjustment micrometer head and a Z-axis linear displacement stage. The Z-axis linear displacement stage is mounted on the base, and the Z-axis adjustment micrometer head is rotatably connected to the Z-axis linear displacement stage and is used to drive the Z-axis linear displacement stage to rise and fall.

[0008] The XY-axis adjustment component includes an X-axis adjustment micrometer head, a Y-axis adjustment micrometer head, and an XY-axis displacement stage, wherein the X-axis adjustment micrometer head and the Y-axis adjustment micrometer head are rotatably connected to the XY-axis displacement stage.

[0009] The Q-axis adjustment component includes a Q-axis adjustment micrometer head and an electric rotary table, wherein the Q-axis adjustment micrometer head is rotatably connected to the electric rotary table.

[0010] The base has multiple mounting holes.

[0011] The beneficial effects of this utility model are:

[0012] This utility model features a novel structure. During the bonding process, the product PCB board is placed in the product positioning groove for positioning. The OPD Sensor adsorption positioning strip is flipped open, and the OPD Sensor is adsorbed through one end of the adsorption positioning strip. Then, the orientation of the OPD Sensor adsorption positioning strip is adjusted by the movable adjustment component to ensure that the OPD Sensor can be accurately aligned with the product PCB board before bonding. The structure of the product positioning groove, the avoidance groove, and the bonding groove is used to store and position the bonding quartz strip, saving overall space. In the bonding process, the quartz strip ensures the thermal conductivity stability during hot pressing, guarantees precise temperature control, and improves the bonding stability between the OPD Sensor and the product PCB board. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the binding and alignment mechanism of an intelligent ring OPD Sensor according to the present invention.

[0014] exist Figure 1 The reference numerals in the figures include:

[0015] 1. Base; 2. PCB adsorption positioning platform; 3. Adjustable assembly; 4. Binding base; 5. OPD sensor adsorption positioning strip; 6. Product positioning slot; 7. Clearance slot; 8. Binding groove; 9. Binding quartz strip; 10. Z-axis adjustment micrometer head; 11. Z-axis linear displacement stage; 12. X-axis adjustment micrometer head; 13. Y-axis adjustment micrometer head; 14. XY-axis displacement stage; 15. Q-axis adjustment micrometer head; 16. Electric rotary table; 17. Mounting hole; 18. Support base. Detailed Implementation

[0016] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0017] like Figure 1As shown, a binding and alignment mechanism for an OPD sensor in a smart ring includes a base 1, a PCB adsorption and positioning platform 2 mounted on one side of the base 1, a movable adjustment component 3 mounted on the other side of the base 1, a binding base 4 mounted on the base 1, and an OPD sensor adsorption and positioning strip 5 mounted on the movable adjustment component 3. The movable adjustment component 3 is located on one side of the PCB adsorption and positioning platform 2. The PCB adsorption and positioning platform 2 is provided with a product positioning groove 6, and an avoidance groove 7 is formed in the middle of the product positioning groove 6. The binding base 4 is provided with a binding groove 8, which is located below the middle of the product positioning groove 6. A binding quartz strip 9 is installed in the binding groove 8. One end of the OPD sensor adsorption and positioning strip 5 is located above the product positioning groove 6, and the other end of the OPD sensor adsorption and positioning strip 5 is flipped and mounted on the movable adjustment component 3. The lower end face of one end of the OPD sensor adsorption and positioning strip 5 is provided with a plurality of first vacuum adsorption holes for adsorbing OPD. Sensor; The product positioning groove 6 is provided with multiple second vacuum adsorption holes for adsorbing the product PCB board, ensuring that the product PCB board is not easily loosened.

[0018] Specifically, this utility model features a novel structure. During the bonding process, the product PCB board is placed in the product positioning groove 6 for positioning. The OPD Sensor is adsorbed by one end of the positioning strip 5, and then the orientation of the positioning strip 5 is adjusted by the movable adjustment component 3 to ensure that the OPD Sensor can be accurately aligned with the product PCB board before bonding. The product positioning groove 6, the clearance groove 7, and the bonding groove 8 are used to store and position the bonding quartz strip 9, saving overall space. In the bonding process, the quartz strip, with its ultra-low coefficient of thermal expansion of 0.55×10^-6 / ℃, maintains a thermal deformation of ±2μm within the working temperature range of 150-220℃, ensuring the thermal conductivity stability during hot pressing, guaranteeing precise temperature control, and improving the bonding stability between the OPD Sensor and the product PCB board.

[0019] In this embodiment, the movable adjustment component 3 includes a Z-axis adjustment component, an XY-axis adjustment component mounted on the Z-axis adjustment component, a Q-axis adjustment component mounted on the XY-axis adjustment component, and a support base 18 mounted on the Q-axis adjustment component. The other end of the OPD Sensor adsorption positioning strip 5 is flipped and connected to the support base 18. The Z-axis adjustment component includes a Z-axis adjustment microhead 10 and a Z-axis linear displacement stage 11. The Z-axis linear displacement stage 11 is mounted on the base 1. The Z-axis adjustment microhead 10 is rotatably connected to the Z-axis linear displacement stage 11 and is used to drive the Z-axis linear displacement stage 11 to rise and fall. The XY-axis adjustment component includes an X-axis adjustment microhead 12, a Y-axis adjustment microhead 13, and an XY-axis displacement stage 14. The XY-axis displacement stage 14 is mounted on the Z-axis linear displacement stage 11. The X-axis adjusting micrometer head 12 and the Y-axis adjusting micrometer head 13 are rotatably connected to the XY-axis displacement stage 14, respectively. The Q-axis adjusting component includes a Q-axis adjusting micrometer head 15 and an electric rotary table 16. The Q-axis adjusting micrometer head 15 is rotatably connected to the electric rotary table 16. The support base 18 is mounted on the electric rotary table 16, and the electric rotary table 16 is mounted on the XY-axis displacement stage 14. Specifically, under the above settings, the Z-axis adjustment microhead 10 can be used to adjust the Z-axis height of the Z-axis linear displacement stage 11, the X-axis adjustment microhead 12 and the Y-axis adjustment microhead 13 can be used to adjust the X-axis position and Y-axis position of the XY-axis displacement stage 14, respectively, and the Q-axis adjustment microhead 15 can be used to control the movement and precision of the rotary table, thereby achieving high-precision angle adjustment; the other end of the OPD Sensor adsorption positioning plate 5 can be flipped relative to the support base 18 to facilitate the opening of the OPD Sensor adsorption positioning plate 5, so as to facilitate the adsorption of the OPD Sensor by the OPD Sensor adsorption positioning plate 5.

[0020] In this embodiment, the base 1 is provided with a plurality of mounting holes 17. Specifically, with the above-described arrangement, it is convenient to fix the base 1 to the workbench by connecting it to external screws through the mounting holes 17.

[0021] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes, and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A binding and alignment mechanism for an OPD sensor in a smart ring, characterized in that: The device includes a base, a PCB adsorption and positioning platform mounted on one side of the base, a movable adjustment component mounted on the other side of the base, a binding base mounted on the base, and an OPD Sensor adsorption and positioning strip mounted on the movable adjustment component. The movable adjustment component is located on one side of the PCB adsorption and positioning platform. The PCB adsorption and positioning platform is provided with a product positioning groove, and an avoidance groove is formed in the middle of the product positioning groove. The binding base is provided with a binding groove, which is located below the middle of the product positioning groove. A binding quartz strip is installed in the binding groove. One end of the OPD Sensor adsorption and positioning strip is located above the product positioning groove, and the other end of the OPD Sensor adsorption and positioning strip is flipped and mounted on the movable adjustment component. The lower end face of one end of the OPD Sensor adsorption and positioning strip is provided with multiple first vacuum adsorption holes for adsorbing the OPD Sensor. The product positioning groove is provided with multiple second vacuum adsorption holes for adsorbing the product PCB board.

2. The binding and alignment mechanism of the smart ring OPD Sensor according to claim 1, characterized in that: The movable adjustment assembly includes a Z-axis adjustment component, an XY-axis adjustment component mounted on the Z-axis adjustment component, a Q-axis adjustment component mounted on the XY-axis adjustment component, and a support base mounted on the Q-axis adjustment component. The other end of the OPD Sensor adsorption positioning strip is flipped and connected to the support base.

3. The binding and alignment mechanism of an intelligent ring OPD Sensor according to claim 2, characterized in that: The Z-axis adjustment component includes a Z-axis adjustment micrometer head and a Z-axis linear displacement stage. The Z-axis linear displacement stage is mounted on the base, and the Z-axis adjustment micrometer head is rotatably connected to the Z-axis linear displacement stage and is used to drive the Z-axis linear displacement stage to rise and fall.

4. The binding and alignment mechanism of an intelligent ring OPD Sensor according to claim 2, characterized in that: The XY axis adjustment component includes an X-axis adjustment micrometer head, a Y-axis adjustment micrometer head, and an XY axis displacement stage, wherein the X-axis adjustment micrometer head and the Y-axis adjustment micrometer head are respectively rotatably connected to the XY axis displacement stage.

5. The binding and alignment mechanism of an intelligent ring OPD Sensor according to claim 2, characterized in that: The Q-axis adjustment component includes a Q-axis adjustment micrometer head and an electric rotary table, with the Q-axis adjustment micrometer head rotatably connected to the electric rotary table.

6. The binding and alignment mechanism of the smart ring OPD Sensor according to claim 1, characterized in that: The base has multiple mounting holes.

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