A double-main-drive electric drive controller heat dissipation structure

Abstract

The utility model discloses a double main drive electric drive controller heat dissipation structure relates to the technical field of automotive components. Including the box, the inside of box is provided with the mounting panel, the top and bottom of mounting panel all are provided with the liquid cooling tank of intercommunication, the top and bottom of liquid cooling tank all are provided with IGBT module, and the heat dissipation tooth of a few one end extension is provided to the inside of liquid cooling tank on IGBT module, and the top and bottom of liquid cooling tank all are provided with the sealed groove. The heat on IGBT module is taken away by the cooling liquid through the heat dissipation tooth heat, eliminates the contact thermal resistance of traditional form heat dissipation, improves the cooling effect, and cooling efficiency is high, and the traditional box waterway needs friction welding process, and this scheme removes this complex process, and the required protection level is realized by adopting silica gel sealing ring, and the box processing is simple, and the capacity is high, and the cost is low, and the overall layout is compact, and the integration is high, and the space is small, can satisfy the layout requirement of most electric cars, has wide application prospect.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, specifically to a heat dissipation structure for a dual main drive electric drive controller. Background Technology

[0002] As the power density of electric vehicles increases, dual-motor drive systems (dual main drive) are gradually becoming the mainstream configuration. However, the heat dissipation requirements of their electronic control units (such as IGBT modules) are growing exponentially. Current heat dissipation solutions are mostly based on single-layer layout designs, which have the following shortcomings in use:

[0003] 1. The heat dissipation method is single-layer placement, the dual main drive chassis is large in size, high in cost and has low cooling efficiency;

[0004] 2. Low cooling power and low integration;

[0005] 3. Single-layer layout, large volume, not conducive to the overall vehicle layout.

[0006] Current heat dissipation solutions are mostly based on single-layer layout designs, which have problems such as low cooling efficiency, volume redundancy, and high cost, which seriously restrict the performance of dual main drive systems and the integration of the whole vehicle. Summary of the Invention

[0007] This invention provides a heat dissipation structure for a dual-main-drive electric drive controller to solve the problems in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a heat dissipation structure for a dual-main-drive electric drive controller, comprising a housing, wherein an installation plate is provided inside the housing, and liquid cooling tanks are provided at the top and bottom of the installation plate, wherein IGBT modules are provided at the top and bottom of the liquid cooling tanks, and the IGBT modules are provided with a plurality of heat dissipation teeth extending one end into the liquid cooling tank.

[0009] Furthermore, the top and bottom of the liquid cooling tank are provided with sealing grooves, and a silicone sealing ring is fitted inside the sealing groove.

[0010] Furthermore, the silicone sealing ring has at least two sealing protrusions at both its top and bottom.

[0011] Furthermore, both the inner and outer rings of the silicone sealing ring are provided with at least one arc-shaped protrusion.

[0012] Furthermore, the IGBT module is fixed to the liquid cooling tank with screws, and a through hole is provided between the two liquid cooling tanks.

[0013] Furthermore, one side of the housing is provided with an inlet pipe and an outlet pipe that are respectively connected to two liquid cooling tanks.

[0014] Furthermore, the interior of the housing is provided with a mounting groove located on one side of the mounting plate, and the mounting groove is provided with at least one stud.

[0015] Furthermore, a thin-film capacitor is installed inside the mounting slot using studs and screws.

[0016] Furthermore, positive and negative copper busbars for the battery are provided on one side of the thin-film capacitor.

[0017] Furthermore, a three-phase copper busbar is provided on one side of the IGBT module.

[0018] Compared with the prior art, this utility model provides a heat dissipation structure for a dual-main-drive electric drive controller, which has the following beneficial effects:

[0019] This dual-main-drive electric drive controller's heat dissipation structure removes heat from the IGBT modules through the cooling fins, eliminating the contact thermal resistance of traditional heat dissipation methods, thus improving cooling efficiency. Traditional enclosure water channels require friction welding, but this solution eliminates this complex process. It uses silicone sealing rings to achieve the required protection level. The enclosure is simple to manufacture, has high production capacity, low cost, a compact overall layout, high integration, and a small footprint, meeting the layout requirements of most electric vehicles and possessing broad application prospects. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of this utility model;

[0021] Figure 2 This is a side view of the structure of this utility model;

[0022] Figure 3 This is an exploded view of the structure of this utility model;

[0023] Figure 4 This invention relates to a silicone sealing ring.

[0024] Figure 5 This is a schematic diagram of the liquid cooling tank structure of this utility model;

[0025] Figure 6 This is a schematic diagram of the liquid cooling tank structure of this utility model.

[0026] In the diagram: 1. Housing; 11. Mounting plate; 12. Liquid cooling tank; 121. Sealing groove; 122. Silicone sealing ring; 123. Sealing protrusion; 124. Arc-shaped protrusion; 125. Through hole; 13. IGBT module; 131. Heat dissipation fins; 14. Liquid inlet pipe; 15. Liquid outlet pipe; 16. Mounting groove; 161. Stud; 17. Film capacitor; 18. Battery positive and negative copper busbars; 19. Three-phase copper busbar. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-6 This utility model discloses a heat dissipation structure for a dual-main-drive electric drive controller, including a housing 1. The housing 1 has an installation plate 11 inside. The top and bottom of the installation plate 11 are provided with interconnected liquid cooling tanks 12. The top and bottom of the liquid cooling tanks 12 are provided with IGBT modules 13. The IGBT modules 13 are provided with a plurality of heat dissipation teeth 131 with one end extending into the liquid cooling tanks 12.

[0029] Specifically, the top and bottom of the liquid cooling tank 12 are provided with sealing grooves 121, and a silicone sealing ring 122 is sleeved inside the sealing groove 121. The top and bottom of the silicone sealing ring 122 are provided with no less than two sealing protrusions 123, and the inner and outer rings of the silicone sealing ring 122 are provided with no less than one arc-shaped protrusion 124.

[0030] In this embodiment, the IGBT module 13 is fixed to the liquid cooling tank 12 with screws, which then presses against the silicone sealing ring 122. Multiple sealing protrusions 123 achieve multi-level sealing, further ensuring the sealing performance between the IGBT module 13 and the liquid cooling tank 12. The arc-shaped protrusion 124 structure concentrates the pressure from the IGBT module 13 to the critical contact area, preventing excessive compression of the silicone sealing ring 122. By distributing the pressure points, effective sealing strength is maintained while reducing the risk of permanent deformation of the silicone sealing ring 122.

[0031] Specifically, the IGBT module 13 is fixed to the liquid cooling tank 12 by screws, and a through hole 125 is provided between the two liquid cooling tanks 12. The box body 1 has an inlet pipe 14 and an outlet pipe 15 that are respectively connected to the two liquid cooling tanks 12.

[0032] In this embodiment, coolant enters the interior of one of the liquid cooling tanks 12 through the inlet pipe 14. After the coolant partially fills the liquid cooling tank 12, it flows into the interior of the other liquid cooling tank 12 through the through hole 125. After filling the other liquid cooling tank 12, it flows out through the outlet pipe 15. The heat dissipation fins 131 on the IGBT module 13 that extend into the liquid cooling tank 12 are carried away by the coolant. This design can achieve the effect of cooling both sides of the IGBT module 13.

[0033] Specifically, the housing 1 is also provided with a mounting groove 16 located on one side of the mounting plate 11. The mounting groove 16 is provided with at least one stud 161. A thin film capacitor 17 is installed inside the mounting groove 16 through the stud 161 and screws.

[0034] In this embodiment, after the film capacitor 17 is embedded inside the mounting groove 16, connecting ears matching the studs 161 are provided on both sides of the film capacitor 17. The film capacitor 17 can be installed by tightening the connecting ears and the studs 161 with screws.

[0035] Specifically, a positive and negative copper busbar 18 for the battery is provided on one side of the thin film capacitor 17, and a three-phase copper busbar 19 is provided on one side of the IGBT module 13.

[0036] In this embodiment, copper busbars are provided on both sides of the IGBT module 13, and copper busbars are also provided on one side of the film capacitor 17. The copper busbars on the side of the film capacitor 17 are fixedly connected to the copper busbars on the side of the IGBT module 13 and the positive and negative copper busbars 18 of the battery by screws. The copper busbars on the other side of the IGBT module 13 are fixed to the three-phase copper busbars 19 by screws.

[0037] In summary, the heat dissipation structure of this dual-main-drive electric drive controller allows the heat on the IGBT module 13 to be carried away by the coolant through the heat dissipation teeth 131, eliminating the contact thermal resistance of traditional heat dissipation methods, improving the cooling effect, and achieving high cooling efficiency. Traditional housing 1 water channels require friction welding, but this solution eliminates this complex process. It uses silicone sealing rings 122 to achieve the required protection level. Housing 1 is simple to process, has high production capacity, low cost, compact overall layout, high integration, and small space occupation, which can meet the layout requirements of most electric vehicles and has broad application prospects.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for a dual-main-drive electric drive controller, comprising a housing (1), characterized in that: The housing (1) is provided with an installation plate (11) inside. The top and bottom of the installation plate (11) are provided with interconnected liquid cooling tanks (12). The top and bottom of the liquid cooling tanks (12) are provided with IGBT modules (13). The IGBT modules (13) are provided with a number of heat dissipation teeth (131) extending into the liquid cooling tanks (12) at one end.

2. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 1, characterized in that: The liquid cooling tank (12) is provided with sealing grooves (121) at the top and bottom, and a silicone sealing ring (122) is fitted inside the sealing groove (121).

3. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 2, characterized in that: The silicone sealing ring (122) has at least two sealing protrusions (123) on its top and bottom.

4. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 2, characterized in that: The inner and outer rings of the silicone sealing ring (122) are each provided with an arc-shaped protrusion (124) of no less than one.

5. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 1, characterized in that: The IGBT module (13) is fixed to the liquid cooling tank (12) by screws, and a through hole (125) is provided between the two liquid cooling tanks (12).

6. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 1, characterized in that: The box (1) is provided with an inlet pipe (14) and an outlet pipe (15) that are respectively connected to two liquid cooling tanks (12).

7. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 1, characterized in that: The housing (1) is also provided with a mounting groove (16) located on one side of the mounting plate (11), and the mounting groove (16) is provided with a number of studs (161) not less than one.

8. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 7, characterized in that: A thin-film capacitor (17) is installed inside the mounting slot (16) by means of a stud (161) and a screw.

9. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 8, characterized in that: A positive and negative copper busbar (18) for the battery is provided on one side of the thin film capacitor (17).

10. The heat dissipation structure for a dual-main-drive electric drive controller according to claim 1, characterized in that: A three-phase copper busbar (19) is provided on one side of the IGBT module (13).

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