A fluidic cooling device
By designing staggered flow channels and collection pipes, combined with capillary and nozzle structures, the jet cooling device solves the problems of uneven heat transfer and insufficient cooling area in microjet cooling devices, achieving high efficiency, uniform temperature, and compactness, making it suitable for heat dissipation of high power density electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI INST OF TECH
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-29
AI Technical Summary
Existing microjet cooling devices suffer from uneven heat transfer and insufficient cooling area, resulting in poor heat dissipation for high-power-density electronic components.
A jet cooling device was designed, including a chip mounting base, a microstructure cold plate, a flow divider plate, a flow collector plate, a cover plate, and pipe joints. Through the staggered flow divider channels and flow collector pipes, combined with capillary structure and nozzle structure, uniform distribution of cooling working fluid and efficient jet impact are achieved, thereby enhancing heat transfer performance.
It improves the temperature uniformity and heat dissipation performance of the cooling device, enhances the compactness and applicability of the cooling effect, and can effectively utilize the heat dissipation performance of high-speed jets to meet the needs of different heat exchange areas and disturbance levels.
Smart Images
Figure CN224306146U_ABST