A debonder

Abstract

The utility model discloses a glue removing machine relates to chip substrate processing technical field, the glue removing machine, including operation platform, the upper end fixed setting of operation platform has top support, installs cylinder no.

Description

Technical Field

[0001] This utility model relates to the field of chip substrate processing technology, and in particular to a glue remover. Background Technology

[0002] In the semiconductor manufacturing process, the chip substrate, as a fundamental component of integrated circuits, is directly affected by the processing quality of the final product in terms of its performance and reliability.

[0003] When removing solid adhesive strips from both sides of a chip substrate, traditional operations cannot guarantee the consistency and accuracy of each removal. Traditional operations usually involve a lot of manual intervention, such as manually moving the chip substrate onto the mold and removing the chip substrate from the mold. This may cause damage to the surface of the chip substrate, affecting subsequent process steps and the quality of the final product. Utility Model Content

[0004] This utility model provides a degumming machine, including an operating platform. A top support is fixedly installed at the upper end of the operating platform, and a cylinder is installed on the top support. The piston end of the cylinder is connected to an impact block. A mold is installed on the upper surface of the operating platform corresponding to the impact block. Fixed plates are fixedly installed on both sides of the lower end of the operating platform. A material storage mechanism is movably installed on each set of fixed plates. Side plates are provided on both sides of the upper end of the operating platform, and a material picking mechanism is installed on each set of side plates.

[0005] Preferably, the two sets of material handling mechanisms are located at the feeding end and the unloading end, respectively.

[0006] Preferably, the material handling mechanism includes a transmission component rotatably mounted on the lower side of the side plate. The transmission component is driven by a motor. One side of the transmission component is connected to the mounting base via a connector. A clamping component is provided on the lower side of the mounting base. A second cylinder is mounted on the bottom of the mounting base. The piston end of the second cylinder is connected to a sliding clamping plate inside the clamping component.

[0007] Preferably, a chain is installed on the lower side of the side plate, and the mounting base is connected to one end of the chain.

[0008] Preferably, the material storage mechanism includes a slide plate, the lower side of which is slidably connected to a track on a fixed plate, and a material box one and a material box two are provided on the upper side of the slide plate.

[0009] Preferably, the slide is driven by a cylinder.

[0010] Preferably, both material bin one and material bin two are slidably provided with pusher plates inside, and both material bin one and material bin two have openings at their bottoms.

[0011] Preferably, a vertical plate is fixedly provided on the lower side of the fixed plate, and a limit strip is symmetrically provided on one side of the vertical plate. A push plate is slidably provided on the limit strip, and the push plate contacts the push plate through a perforation opened on the surface of the fixed plate.

[0012] Preferably, a lead screw is rotatably provided on one side of the vertical plate, the lead screw is threadedly connected to the push plate, a second bevel gear is connected to the lower end of the lead screw, a first bevel gear is rotatably provided at the lower end of the vertical plate, the first bevel gear meshes with the second bevel gear, and the first bevel gear is driven by a stepper motor.

[0013] Preferably, sensors are installed at the ends of both the first and second material bins.

[0014] The adhesive remover provided in this embodiment of the invention has the following advantages compared to the prior art:

[0015] This invention features storage mechanisms installed on both sides of the operating platform, allowing the workpiece to be de-adhesiveted and the workpiece after de-adhesion to be placed in the storage mechanisms respectively. Simultaneously, a picking mechanism is installed at the top of each of the two storage mechanisms. The picking mechanism at the feeding end moves the workpiece from one storage mechanism to the mold. After the solid adhesive strips on both sides of the workpiece are removed by impact blocks, the picking mechanism at the unloading end moves the workpiece from the mold to the other storage mechanism for storage. This automated de-adhesion process is more precise and stable than manual operation, reducing the risk of product surface damage caused by human factors. It achieves assembly line processing, reduces manual intervention, and improves work efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present utility model;

[0018] Figure 2 This is a second schematic diagram of the overall structure of an embodiment of the present utility model;

[0019] Figure 3 This is a side view of the overall structure of an embodiment of the present utility model;

[0020] Figure 4 This is a schematic diagram of the installation state of the material storage mechanism according to an embodiment of the present utility model;

[0021] Figure 5 This is a schematic diagram of the material storage mechanism according to an embodiment of the present utility model;

[0022] Figure 6 This is a schematic diagram of the lead screw and other structures according to an embodiment of the present utility model;

[0023] Figure 7 This is a schematic diagram of the material handling mechanism according to an embodiment of the present utility model;

[0024] Figure 8 This is an embodiment of the present utility model. Figure 7 A schematic diagram of the structure at point A.

[0025] Figure label:

[0026] 1. Operating platform; 2. Top support; 3. Cylinder 1; 4. Impact block; 5. Mold; 6. Side plate; 7. Transmission component; 8. Chain; 9. Connector; 10. Mounting base; 11. Clamping component; 12. Clamping plate; 13. Cylinder 2; 14. Fixing plate; 15. Vertical plate; 16. Slide plate; 17. Material bin 1; 18. Material bin 2; 19. Sensor; 20. Push plate; 21. Cylinder 3; 22. Through hole; 23. Lead screw; 24. Top push plate; 25. Limiting strip; 26. Bevel gear 1; 27. Bevel gear 2. Detailed Implementation

[0027] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0028] Please refer to Figures 1-8 This utility model provides a glue removal machine, including an operating platform 1. A top support 2 is fixedly installed on the upper end of the operating platform 1. A cylinder 3 is installed on the top support 2. The piston end of the cylinder 3 is connected to an impact block 4. A mold 5 is installed on the upper surface of the operating platform 1 corresponding to the impact block 4. After the chip substrate to be de-adhesive is placed in the mold 5, the cylinder 3 pushes the impact block 4 down, which can remove the fixing adhesive strips on both sides of the chip substrate.

[0029] To improve the efficiency of desizing, fixed plates 14 are fixedly installed on both sides of the lower end of the operating table 1. Each set of fixed plates 14 is movably installed with a material storage mechanism. The two sets of material storage mechanisms are located at the loading end and the unloading end, respectively, and are used to store the chip substrate to be desized and the chip substrate after desizing.

[0030] Furthermore, side plates 6 are provided on both sides of the upper end of the operating platform 1. Each set of side plates 6 is equipped with a material picking mechanism. The two sets of material picking mechanisms are located at the loading end and the unloading end, respectively, and correspond to the positions of the two sets of storage mechanisms. This allows the material picking mechanism located at the loading end to move the workpiece in the storage mechanism into the mold 5, and the material picking mechanism located at the unloading end to move the de-adhesive workpiece in the mold 5 into another set of storage mechanisms. This reduces manual intervention throughout the process and significantly improves work efficiency.

[0031] Specifically, the storage mechanism includes a slide plate 16, the lower side of which is slidably connected to a track on a fixed plate 14. The upper side of the slide plate 16 is provided with a first material box 17 and a second material box 18. Chip substrates can be stacked in the first material box 17 and the second material box 18. When the second material box 18 is located under the material picking mechanism, the first material box 17 is located on one side. The positions of the first material box 17 and the second material box 18 are switched by the cylinder 3 21 pushing the slide plate 16 to move, so that the device can store more workpieces.

[0032] Both material bin 17 and material bin 28 have a sliding pusher plate 20 inside. The pusher plate 20 is located on the lower side of the workpiece. When the pusher plate 20 slides upward, it can push the workpiece upward and bring it closer to the picking mechanism, making it easier for the picking mechanism to clamp it. Both material bin 17 and material bin 28 are equipped with sensors 19. When the sensor 19 senses that the workpiece is pushed to the end of material bin 17 or material bin 28, it can transmit a signal to the controller, which can then control the picking mechanism to clamp the workpiece.

[0033] Furthermore, a vertical plate 15 is fixedly installed on the lower side of the fixed plate 14. A limit strip 25 is symmetrically installed on one side of the vertical plate 15. A push plate 24 is slidably installed on the limit strip 25. The push plate 24 penetrates the through hole 22 opened on the surface of the fixed plate 14 and the openings opened at the bottom of the first material box 17 and the second material box 18, and contacts the push plate 20 to realize the upward sliding feeding of the push plate 20.

[0034] It is worth noting that a lead screw 23 is rotatably mounted on one side of the vertical plate 15. The lead screw 23 is threadedly connected to the push plate 24. A bevel gear 27 is connected to the lower end of the lead screw 23. A bevel gear 26 is rotatably mounted at the lower end of the vertical plate 15. The bevel gear 26 meshes with the bevel gear 27. The bevel gear 26 is driven by a stepper motor. After the stepper motor drives the bevel gear 26, the bevel gear 27 rotates with the lead screw 23, thereby causing the push plate 24 to slide stably on the limit bar 25 and move horizontally upward.

[0035] In addition, the material handling mechanism includes a transmission component 7 rotatably mounted on the lower side of the side plate 6. The transmission component 7 consists of two sets of pulleys rotating on the side plate 6 and a belt sleeved on the pulleys. The pulleys are driven by a motor. One side of the transmission component 7 is connected to the mounting base 10 through a connector 9. A clamping component 11 is provided on the lower side of the mounting base 10. The clamping component 11 is a "U" shaped mechanism that can clamp the middle part of the chip substrate. A second cylinder 13 is installed at the bottom of the mounting base 10. The piston end of the second cylinder 13 is connected to the clamping plate 12 that slides inside the clamping component 11. When the chip substrate enters the clamping component 11, the second cylinder 13 pushes the clamping plate 12 to fix the workpiece.

[0036] A chain 8 is installed on the lower side of the side plate 6. The mounting base 10 is connected to one end of the chain 8. The operation of the transmission component 7 and the support of the chain 8 cause the clamping component 11 to move the workpiece.

[0037] In summary, the working principle of the adhesive removal machine of this utility model embodiment is as follows: First, the chip substrates to be de-adhesive are stacked in material bin 17 and material bin 18. The pusher plate 24 pushes the pusher plate 20 and the workpiece upward. When the sensor 19 detects that the workpiece is pushed to the end of the material bin, the picking mechanism clamps the chip substrate and moves it into the mold 5. The cylinder 3 drives the impact block 4 to descend, and the solid adhesive strips on both sides of the chip substrate are removed by physical impact. After the adhesive removal is completed, the picking mechanism at the unloading end takes out the de-adhesive chip substrate from the mold 5 and transfers it to the material bin of another set of storage mechanisms for storage.

[0038] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A glue-removing machine, comprising an operating platform (1), characterized in that: The upper end of the operating platform (1) is fixedly provided with a top support (2), and a cylinder (3) is installed on the top support (2). The piston end of the cylinder (3) is connected to the impact block (4). A mold (5) is installed on the upper surface of the operating platform (1) corresponding to the impact block (4). Fixing plates (14) are fixedly provided on both sides of the lower end of the operating platform (1). A material storage mechanism is movably installed on each set of fixing plates (14). Side plates (6) are provided on both sides of the upper end of the operating platform (1). A material picking mechanism is installed on each set of side plates (6).

2. The glue remover according to claim 1, characterized in that: The two sets of material handling mechanisms are located at the feeding end and the unloading end, respectively.

3. The glue remover according to claim 2, characterized in that: The material handling mechanism includes a transmission component (7) rotatably mounted on the lower side of the side plate (6). The transmission component (7) is driven by a motor. One side of the transmission component (7) is connected to the mounting base (10) through a connector (9). A clamping component (11) is provided on the lower side of the mounting base (10). A second cylinder (13) is installed at the bottom of the mounting base (10). The piston end of the second cylinder (13) is connected to a sliding clamping plate (12) inside the clamping component (11).

4. The glue remover according to claim 3, characterized in that: A chain (8) is installed on the lower side of the side plate (6), and the mounting base (10) is connected to one end of the chain (8).

5. The glue remover according to claim 4, characterized in that: The material storage mechanism includes a slide plate (16), the lower side of which is slidably connected to a track on a fixed plate (14), and a material box one (17) and a material box two (18) are provided on the upper side of the slide plate (16).

6. The glue remover according to claim 5, characterized in that: The slide plate (16) is driven by cylinder three (21).

7. The glue remover according to claim 6, characterized in that: Both material bin 1 (17) and material bin 2 (18) are equipped with sliding push plates (20), and both material bin 1 (17) and material bin 2 (18) have openings at their bottoms.

8. The glue remover according to claim 7, characterized in that: A vertical plate (15) is fixedly installed on the lower side of the fixed plate (14). A limit strip (25) is symmetrically arranged on one side of the vertical plate (15). A push plate (24) is slidably arranged on the limit strip (25). The push plate (24) passes through the through hole (22) opened on the surface of the fixed plate (14) and contacts the push plate (20).

9. The glue remover according to claim 8, characterized in that: A lead screw (23) is rotatably mounted on one side of the vertical plate (15). The lead screw (23) is threadedly connected to the push plate (24). A bevel gear (27) is connected to the lower end of the lead screw (23). A bevel gear (26) is rotatably mounted on the lower end of the vertical plate (15). The bevel gear (26) meshes with the bevel gear (27). The bevel gear (26) is driven by a stepper motor.

10. The glue remover according to claim 5, characterized in that: Sensors (19) are installed at the ends of both the first (17) and the second (18) of the material bin.

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