A silicon wafer processing apparatus
By placing the sorting machine between two washing machines in the production workshop and adjusting the positional relationship between the robotic arm and the basket clamping mechanism, the problem of insufficient sorting machine capacity was solved, and capacity was increased under limited space.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI AUTOWELL TECH
- Filing Date
- 2025-05-22
- Publication Date
- 2026-06-23
AI Technical Summary
The capacity of the sorting machines in the existing production workshop cannot meet the demand. Traditional renovation methods are limited by the fixed positions of the washing machines and packaging machines and the limited workshop space, making it difficult to increase capacity.
The sorting machine is positioned between two washing machines. By adjusting the rotation area of the robotic arm and the positional relationship of the basket clamping mechanism, both washing machines can feed materials to the sorting machine. At the same time, a flipping drive source and a fence are set up to optimize space utilization.
Without changing the positions of the washing machine and the packaging machine, the capacity of the sorting machine was increased and the utilization of workshop space was optimized, thus achieving an increase in production capacity.
Smart Images
Figure CN224402009U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of solar cell production equipment and relates to a silicon wafer processing device. Background Technology
[0002] The production process of solar cells involves key steps such as silicon wafer cleaning, sorting, texturing, diffusion, screen printing, and testing. Among these, cleaning and sorting directly affect the quality of the other steps.
[0003] In existing production workshops, such as Figure 1 As shown, the sorting machines and washing machines are arranged in a one-to-one correspondence. The front end of the sorting machine connects to the washing machine, and the rear end of the sorting machine connects to the packaging machine, forming a fixed production line layout. It is evident that the installation space for the sorting machines is fixed, making it difficult to increase production capacity by expanding the footprint.
[0004] The current capacity of the sorting machine cannot meet the production demand and needs to be upgraded. However, due to the fixed positions of the washing machine and packaging machine and the limited available space in the workshop, traditional upgrade methods are difficult to implement. There is an urgent need for an upgrade solution that takes into account both space constraints and the need to increase production capacity. Utility Model Content
[0005] The purpose of this invention is to provide a silicon wafer processing device that can balance space constraints with the need to increase production capacity.
[0006] The objective of this utility model is achieved through the following technical solution:
[0007] A silicon wafer processing apparatus includes a first cleaning machine, a second cleaning machine, and a sorting machine, wherein:
[0008] The first cleaning machine and the second cleaning machine are arranged side by side along the first direction. The first cleaning machine and the second cleaning machine have the same structure, both including a cleaning mechanism, a discharge mechanism and a robotic arm.
[0009] The sorting machine includes a material handling mechanism, a detection mechanism, and a feeding mechanism. The material handling mechanism includes a first basket clamping mechanism and a second basket clamping mechanism, and the material handling mechanism is located between the first washing machine and the second washing machine.
[0010] When the robotic arm of the first cleaning machine rotates with its base as the center and its arm extension as the radius, the rotation area of the gripper of the robotic arm can cover the first basket holding mechanism. The robotic arm of the first cleaning machine is configured to transfer the basket containing silicon wafers after cleaning by the cleaning mechanism to the first basket holding mechanism.
[0011] When the robotic arm of the second cleaning machine rotates with its base as the center and its arm extension as the radius, the rotation area of the gripper of the robotic arm can cover the second basket holding mechanism. The robotic arm of the second cleaning machine is configured to transfer the basket containing silicon wafers after cleaning by the cleaning mechanism to the second basket holding mechanism.
[0012] The robotic arm extension is the straight-line distance from the gripper to the base when the robotic arm is fully extended.
[0013] This application changes the original mode of one washing machine connecting to one sorting machine, and instead sets one sorting machine between two washing machines for separate connection. It restricts the positional relationship between the rotation area of the robotic gripper of the two washing machines and the two basket clamping mechanisms of the sorting machine, so that both washing machines can feed materials to the sorting machine. This takes into account both space constraints and the need to increase production capacity without changing the positions of the washing machine and the packaging machine.
[0014] Optionally, the first flower basket clamping mechanism includes a first support plate and a clamping part disposed on the outer periphery of the first support plate. The first support plate is used to support the flower basket with its opening facing upward, and the clamping part is used to clamp the flower basket. When the extension direction of the manipulator of the first cleaning machine is perpendicular to the first direction, the vertical distance between the center of the first support plate and the center of the gripper of the manipulator of the first cleaning machine is 1.18m to 1.68m.
[0015] The second flower basket clamping mechanism includes a second support plate and a clamping part disposed on the outer periphery of the second support plate. The second support plate is used to support the flower basket with the opening facing upward, and the clamping part is used to clamp the flower basket. When the extension direction of the manipulator of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the second support plate and the center of the gripper of the manipulator of the second cleaning machine is 1.18m to 1.68m.
[0016] The vertical distance between the center of the first bearing plate and the center of the gripper of the first cleaning machine is controlled at 1.18m to 1.68m, and the vertical distance between the center of the second bearing plate and the center of the gripper of the second cleaning machine is controlled at 1.18m to 1.68m. Under the premise of matching the modification space, this helps the sorting machine to smoothly connect with the two cleaning machines.
[0017] Optionally, the sorting machine also includes a first flip drive source and a second flip drive source. The first flower basket clamping mechanism is disposed on the first flip drive source. The first flip drive source is used to drive the first flower basket clamping mechanism to flip and switch between horizontal and vertical states. When the first flower basket clamping mechanism is in the horizontal state, the first support plate is used to support the flower basket with the opening facing upward. When the first flower basket clamping mechanism is in the vertical state, the opening of the flower basket clamped by the first flower basket faces the sorting machine.
[0018] The second flower basket clamping mechanism is mounted on the second flip drive source. The second flip drive source is used to drive the second flower basket clamping mechanism to flip and switch between horizontal and vertical states. When the second flower basket clamping mechanism is in the horizontal state, the second support plate is used to support the flower basket with the opening facing upward. When the second flower basket clamping mechanism is in the vertical state, the opening of the flower basket clamped by the second flower basket faces the sorting machine.
[0019] By setting a first flip drive source and a second flip drive source, the first basket clamping mechanism and the second basket clamping mechanism are respectively driven to flip and switch between horizontal and vertical states. When the basket clamping mechanism is in the horizontal state, it waits for the robot arm of the cleaning machine to load the clamped basket onto its bearing surface. When it is in the vertical state, the wafer picking and conveying mechanism of the sorting machine picks out the silicon wafers in the basket one by one and conveys them to the detection mechanism of the sorting machine.
[0020] Optionally, the silicon wafer processing apparatus also includes a mesh enclosure surrounding the first and second cleaning machines. The mesh enclosure has an opening that connects to the material handling mechanism of the sorting machine. When the first basket clamping mechanism is in a horizontal position, it is located inside the mesh enclosure. When the second basket clamping mechanism is in a horizontal position, it is located inside the mesh enclosure.
[0021] The enclosure is set up around the two washing machines, which leaves operating space for the sorting machine while ensuring the safety of workshop operation. The opening of the enclosure is connected to the material handling mechanism of the sorting machine. When the basket holding mechanism is in a horizontal position, the basket holding mechanism is located inside the enclosure, which makes it convenient for the robot arm of the washing machine to move the basket to the basket holding mechanism.
[0022] Optionally, when the extension direction of the robotic arm of the first cleaning machine is perpendicular to the first direction, the vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the robotic arm of the first cleaning machine is 1.8m to 2.3m.
[0023] When the extension direction of the robotic arm of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the robotic arm of the second cleaning machine is 1.8m to 2.3m.
[0024] The vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the first cleaning machine, and the vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the second cleaning machine are both controlled within 1.8m to 2.3m. Under the premise of matching the modification space, this helps the sorting machine to smoothly connect with the two cleaning machines.
[0025] Optionally, the first flower basket clamping mechanism is configured to move toward or away from the robotic arm of the first cleaning machine in a first direction, and the one-way stroke of the first flower basket clamping mechanism toward or away from the robotic arm of the first cleaning machine is 530mm to 1530mm.
[0026] The second flower basket gripping mechanism is configured to move toward or away from the robotic arm of the second cleaning machine in the first direction, and the one-way stroke of the second flower basket gripping mechanism toward or away from the robotic arm of the second cleaning machine is 530mm to 1530mm.
[0027] The unidirectional stroke of the first flower basket gripping mechanism moving toward or away from the robotic arm of the first cleaning machine is controlled within 530mm to 1530mm. When the first flower basket gripping mechanism docks with the robotic arm of the first cleaning machine, it can compensate for the distance between the gripper of the robotic arm of the first cleaning machine and the first flower basket gripping mechanism, so that the first flower basket gripping mechanism is fully within the rotation area of the gripper of the robotic arm of the first cleaning machine. Similarly, the unidirectional stroke of the second flower basket gripping mechanism moving toward or away from the robotic arm of the second cleaning machine is controlled within 530mm to 1530mm.
[0028] Optionally, when the extension direction of the robotic arm of the first cleaning machine and the extension direction of the robotic arm of the second cleaning machine are both perpendicular to the first direction, the vertical distance between the gripper center of the robotic arm of the first cleaning machine and the gripper center of the robotic arm of the second cleaning machine is 3.6m to 4.5m.
[0029] When the distance between the two robotic arms is 3.6m to 4.5m, it is convenient to place the material handling mechanism of the sorting machine between the two washing machines.
[0030] Optionally, the silicon wafer processing apparatus further includes a first packer and a second packer, which are located on both sides of the unloading mechanism along a first direction.
[0031] After converting the original two sorting machines into one, there is no need to change the position of the original baling machine. The baling machine, which was originally behind each sorting machine, is now located on both sides of the current sorting machine. This increases the capacity of the sorting machine without interfering with the connection between the baling machine and the sorting machine's feeding mechanism.
[0032] Optionally, the silicon wafer processing device further includes a truss, a first silicon wafer picking assembly, and a second silicon wafer picking assembly. The truss is arranged above the unloading mechanism along a direction perpendicular to the first direction. The first silicon wafer picking assembly and the second silicon wafer picking assembly are respectively slidably arranged on both sides of the truss along a direction perpendicular to the first direction. The first silicon wafer picking assembly is used to pick up silicon wafers from the material box of the unloading mechanism and transfer the silicon wafers to the first packaging machine. The second silicon wafer picking assembly is used to pick up silicon wafers from the material box of the unloading mechanism and transfer the silicon wafers to the second packaging machine.
[0033] By setting up two silicon wafer picking components that are respectively connected to two packing machines, the silicon wafers in the material box of the sorting machine's unloading mechanism are transferred to the corresponding packing machines.
[0034] Optionally, the gripper of the robotic arm is equipped with two sets of clamping components, each of which can clamp a flower basket.
[0035] By equipping the gripper with two sets of clamping components, the robot can hold two flower baskets at a time, thereby improving the efficiency of switching flower baskets between the washing machine and the sorting machine and further increasing the overall capacity of washing and sorting.
[0036] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention. Attached Figure Description
[0037] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.
[0038] Figure 1 A schematic diagram showing the connection between the cleaning machine, sorting machine, and packaging machine in the existing production workshop;
[0039] Figure 2 This is a comparative diagram showing the connection between the cleaning machine, sorting machine, and packaging machine of this application and the connection between the cleaning machine, sorting machine, and packaging machine in the existing workshop;
[0040] Figure 3 This is a schematic diagram showing the docking of the cleaning machine, sorting machine, and packaging machine in this application;
[0041] Figure 4 This is a schematic diagram showing the connection between the cleaning machine and the material handling mechanism in this application;
[0042] Figure 5 This is a schematic diagram of the material handling mechanism of this application;
[0043] In the diagram: 1 - First cleaning machine, 11 - Robotic arm of the first cleaning machine, 111 - Gripper of the robotic arm of the first cleaning machine;
[0044] 2-Second cleaning machine, 21-Robot arm of the second cleaning machine, 211-Gripper of the robot arm of the second cleaning machine, 03-Sorting machine before modification;
[0045] 3-Sorting machine, 31-Material handling mechanism, 311-First basket clamping mechanism, 3111-First bearing plate, 3112-Clamping part, 312-Second basket clamping mechanism, 313-Piece handling conveyor belt, 314-Transverse movement module, 32-Detection mechanism, 33-Discharging mechanism;
[0046] 4-First packing machine, 5-Second packing machine, 6-Truss, 7-First silicon wafer pickup assembly, 8-Second silicon wafer pickup assembly;
[0047] 100 - Flower Basket. Detailed Implementation
[0048] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this invention as detailed in the appended claims.
[0049] In existing production workshops, such as Figure 1 As shown, the sorting machine (i.e., the sorting machine 03 before modification in the diagram) and the cleaning machine are arranged in a one-to-one correspondence. The front end of the sorting machine connects to the cleaning machine, and the rear end of the sorting machine connects to the packaging machine, forming a fixed production line layout. This production line layout occupies a fixed amount of space in the production workshop. Whether it is the cleaning machine, the sorting machine, or the packaging machine, they all occupy their own fixed positions, making it difficult to modify and upgrade the cleaning machine, the sorting machine, or the packaging machine by expanding the footprint.
[0050] The current sorting machine's capacity cannot meet production demands, necessitating upgrades. Traditional upgrades require replacing the detection methods of various modules within the existing sorting machine's detection mechanism and the feeding method of the feeding mechanism, significantly increasing the length of the sorting machine in the current workshop. However, due to the fixed positions of the washing and packaging machines and limited available space in the workshop, traditional upgrade methods are difficult to implement. Therefore, a upgrade solution that balances space constraints with the need to increase production capacity is urgently needed.
[0051] Based on this, this application proposes a silicon wafer processing apparatus, such as... Figure 2 , 3 As shown, the silicon wafer processing apparatus includes a first cleaning machine 1, a second cleaning machine 2, and a sorting machine 3, wherein:
[0052] The first cleaning machine 1 and the second cleaning machine 2 are arranged side by side along the first direction. The first cleaning machine 1 and the second cleaning machine 2 have the same structure, both including a cleaning mechanism, a discharge mechanism and a robotic arm.
[0053] The sorting machine 3 includes a material handling mechanism 31, a detection mechanism 32 and a material unloading mechanism 33. The material handling mechanism 31 includes a first basket clamping mechanism 311 and a second basket clamping mechanism 312. The material handling mechanism 31 is located between the first cleaning machine 1 and the second cleaning machine 2.
[0054] When the robotic arm 11 of the first cleaning machine rotates with its base (i.e., the base 112 of the robotic arm of the first cleaning machine) as the center and its arm extension as the radius, the rotation area of the gripper (i.e. the gripper 111 of the robotic arm of the first cleaning machine) can cover the first basket holding mechanism 311. The robotic arm 11 of the first cleaning machine is configured to transfer the basket 100 containing silicon wafers after cleaning by the cleaning mechanism to the first basket holding mechanism 311.
[0055] When the robotic arm 21 of the second cleaning machine rotates with its base (i.e., the base 212 of the robotic arm of the second cleaning machine) as the center and its arm extension as the radius, the rotation area of the gripper (i.e., the gripper 211 of the robotic arm of the second cleaning machine) can cover the second basket holding mechanism 312. The robotic arm 21 of the second cleaning machine is configured to transfer the basket 100 containing silicon wafers after cleaning by the cleaning mechanism to the second basket holding mechanism 312.
[0056] The robotic arm extension is the straight-line distance from the gripper to the base when the robotic arm is fully extended.
[0057] from Figure 2 As can be seen, this application changes the original mode of one washing machine connecting to one sorting machine, and instead places one sorting machine 3 between two washing machines for separate connection. The original positions of the washing and packaging machines are not changed (i.e., the sorting machine is modified within a fixed space). By limiting the rotation area of the robotic grippers of the two washing machines and the positional relationship between the two basket clamping mechanisms of the sorting machine 3, both washing machines can feed materials to the sorting machine 3. Furthermore, the sorting machine 3, located between the two washing machines, has a longer modification space compared to the original sorting machine 03, making it easier to modify and increase production capacity.
[0058] Optional, such as Figure 4 , 5 As shown, the first flower basket clamping mechanism 311 includes a first support plate 3111 and a clamping part 3112 disposed on the outer periphery of the first support plate 3111. The first support plate 3111 is used to support the flower basket with its opening facing upward, and the clamping part 3112 is used to clamp the flower basket. When the extension direction of the manipulator 11 of the first cleaning machine is perpendicular to the first direction, the vertical distance L2 between the center of the first support plate 3111 and the center of the gripper 111 of the manipulator of the first cleaning machine is 1.18m to 1.68m.
[0059] The second flower basket clamping mechanism 312 includes a second support plate and a clamping part 3112 disposed on the outer periphery of the second support plate. The second support plate is used to support the flower basket with the opening facing upward, and the clamping part 3112 is used to clamp the flower basket. When the extension direction of the robot arm 21 of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the second support plate and the center of the gripper 211 of the robot arm of the second cleaning machine is 1.18m to 1.68m.
[0060] It should be noted that the clamping part 3112 can be a gripper driven by a power source to open and close, or it can be a spring lever gripper, wedge gripper, magnetic gripper, slot gripper, etc., without a power source.
[0061] The vertical distance between the center of the first bearing plate 3111 and the center of the gripper 111 of the first cleaning machine is controlled at 1.18m to 1.68m, and the vertical distance between the center of the second bearing plate and the center of the gripper 211 of the second cleaning machine is controlled at 1.18m to 1.68m. Under the premise of matching the modification space, this helps the sorting machine 3 to smoothly connect with the two cleaning machines.
[0062] Optional, such as Figure 5 As shown, the sorting machine 3 also includes a first flip drive source 315 and a second flip drive source 316. The first flower basket clamping mechanism 311 is disposed on the first flip drive source 315. The first flip drive source 315 is used to drive the first flower basket clamping mechanism 311 to flip and switch between horizontal and vertical states. When the first flower basket clamping mechanism 311 is in the horizontal state, the first bearing plate 3111 is used to support the flower basket with the opening facing upward. When the first flower basket clamping mechanism 311 is in the vertical state, the opening of the flower basket clamped by the first flower basket faces the sorting machine 3.
[0063] The second flower basket clamping mechanism 312 is mounted on the second flipping drive source 316. The second flipping drive source 316 is used to drive the second flower basket clamping mechanism 312 to flip and switch between horizontal and vertical states. When the second flower basket clamping mechanism 312 is in the horizontal state, the second support plate is used to support the flower basket with the opening facing upward. When the second flower basket clamping mechanism 312 is in the vertical state, the opening of the flower basket clamped by the second flower basket faces the sorting machine 3.
[0064] It should be noted that both the first tilting drive source 315 and the second tilting drive source 316 can be piston cylinders (specifically, any one of electric cylinders, pneumatic cylinders, and hydraulic cylinders) or motors.
[0065] By setting the first flip drive source 315 and the second flip drive source 316, the first basket clamping mechanism 311 and the second basket clamping mechanism 312 are respectively driven to flip and switch between horizontal and vertical states. When the basket clamping mechanism is in the horizontal state, it waits for the robot arm of the cleaning machine to load the clamped basket onto its bearing surface. When it is in the vertical state, the wafer picking and conveying mechanism 313 of the sorting machine 3 picks out the silicon wafers in the baskets it holds one by one and conveys them to the detection mechanism 32 of the sorting machine 3.
[0066] Optional, such as Figure 3 As shown, the silicon wafer processing apparatus also includes a mesh enclosure 9, which surrounds the first cleaning machine 1 and the second cleaning machine 2. The mesh enclosure 9 has an opening that connects to the material handling mechanism 31 of the sorting machine 3. When the first basket clamping mechanism 311 is in a horizontal state, the first basket clamping mechanism 311 is located inside the mesh enclosure 9. When the second basket clamping mechanism 312 is in a horizontal state, the second basket clamping mechanism 312 is located inside the mesh enclosure 9.
[0067] The enclosure net 9 is set up around the two cleaning machines. While ensuring the safety of workshop operation, it leaves operating space for the sorting machine 3. The opening of the enclosure net 9 is connected to the material picking mechanism 31 of the sorting machine 3. When the basket holding mechanism is in a horizontal state, the basket holding mechanism is located inside the enclosure net 9, which makes it convenient for the robot arm of the cleaning machine to move the basket to the basket holding mechanism.
[0068] Optional, such as Figure 3 As shown, when the extension direction of the robotic arm 11 of the first cleaning machine is perpendicular to the first direction, the vertical distance L2 between the center of the outer frame of the sorting machine 3 and the center of the gripper 111 of the robotic arm of the first cleaning machine is 1.8m to 2.3m.
[0069] When the extension direction of the robotic arm 21 of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the outer frame of the sorting machine 3 and the center of the gripper 211 of the robotic arm of the second cleaning machine is 1.8m to 2.3m.
[0070] The vertical distance between the center of the outer frame of the sorting machine 3 and the center of the gripper 111 of the robotic arm of the first cleaning machine, and the vertical distance between the center of the outer frame of the sorting machine 3 and the center of the gripper 211 of the robotic arm of the second cleaning machine are both controlled within 1.8m to 2.3m. Under the premise of matching the modification space, this helps the sorting machine 3 to smoothly connect with the two cleaning machines.
[0071] Optionally, the first flower basket clamping mechanism 311 is configured to move toward or away from the robot arm 11 of the first cleaning machine in a first direction, and the one-way stroke of the first flower basket clamping mechanism 311 toward or away from the robot arm 11 of the first cleaning machine is 530mm to 1530mm.
[0072] The second flower basket gripping mechanism 312 is configured to move toward or away from the robot arm 21 of the second cleaning machine in a first direction, and the one-way stroke of the second flower basket gripping mechanism 312 toward or away from the robot arm 21 of the second cleaning machine is 530mm to 1530mm.
[0073] Specifically, such as Figure 5 As shown, the first flower basket clamping mechanism 311 and the second flower basket clamping mechanism 312 can be mounted on two sliders of a transverse module 314. The two sliders can be driven by the transverse module 314 to reciprocate along the first direction, so that the first flower basket clamping mechanism 311 is driven by the transverse module 314 to reciprocate toward or away from the robot arm 11 of the first cleaning machine, and the second flower basket clamping mechanism 312 is driven by the transverse module 314 to reciprocate toward or away from the robot arm 21 of the second cleaning machine.
[0074] The transmission mechanism of the transverse module 314 can be any of the following: belt drive consisting of a synchronous belt and driving pulleys; screw drive consisting of a lead screw and nut; gear and rack drive consisting of a gear and rack; linear motor consisting of a mover and a stator, etc.
[0075] The unidirectional stroke of the first flower basket gripping mechanism 311 moving toward or away from the robot arm 11 of the first cleaning machine is controlled within 530mm to 1530mm. When the first flower basket gripping mechanism 311 docks with the robot arm 11 of the first cleaning machine, it can compensate for the distance between the gripper 211 of the robot arm of the first cleaning machine and the first flower basket gripping mechanism 311, so that the first flower basket gripping mechanism 311 is fully located within the rotation area of the gripper 211 of the robot arm of the first cleaning machine. Similarly, the unidirectional stroke of the second flower basket gripping mechanism 312 moving toward or away from the robot arm 21 of the second cleaning machine is controlled within 530mm to 1530mm.
[0076] Optional, such as Figure 4 As shown, when the extension direction of the first cleaning machine's robotic arm 11 and the extension direction of the second cleaning machine's robotic arm 21 are both perpendicular to the first direction, the vertical distance L3 between the center of the gripper 111 of the first cleaning machine's robotic arm and the center of the gripper 211 of the second cleaning machine's robotic arm is 3.6m to 4.5m.
[0077] When the distance between the two robotic arms is 3.6m to 4.5m, it is convenient to place the material handling mechanism 31 of the sorting machine 3 between the two washing machines.
[0078] Optional, such as Figure 2 , 3 As shown, the silicon wafer processing device also includes a first packaging machine 4 and a second packaging machine 5, which are located on both sides of the unloading mechanism 33 along the first direction.
[0079] After converting the original two sorting machines 3 into one, there is no need to change the position of the original baling machine. The baling machine is now located on both sides of the current sorting machine 3, instead of behind each of the sorting machines 3. This increases the capacity of the sorting machine 3 without interfering with the connection between the baling machine and the feeding mechanism 33 of the sorting machine 3.
[0080] Optional, such as Figure 3 As shown, the silicon wafer processing device also includes a truss 6, a first silicon wafer picking assembly 7, and a second silicon wafer picking assembly 8. The truss 6 is arranged above the unloading mechanism 33 along a direction perpendicular to the first direction. The first silicon wafer picking assembly 7 and the second silicon wafer picking assembly 8 are respectively slidably arranged on both sides of the truss 6 along a direction perpendicular to the first direction. The first silicon wafer picking assembly 7 is used to pick up the silicon wafers in the material box of the unloading mechanism 33 and transfer the silicon wafers to the first packaging machine 4. The second silicon wafer picking assembly 8 is used to pick up the silicon wafers in the material box of the unloading mechanism 33 and transfer the silicon wafers to the second packaging machine 5.
[0081] Both the first silicon wafer picking assembly 7 and the second silicon wafer picking assembly 8 can be structures such as gripper mechanisms or biomimetic soft robotic arms driven by pneumatic, electric, or hydraulic power. Each assembly is driven by an independent drive source to translate along the truss 6 to engage with material boxes at different positions in the unloading mechanism 33 and pick up silicon wafers from the material boxes.
[0082] To facilitate the first silicon wafer picking assembly 7 and the second silicon wafer picking assembly 8 in picking up silicon wafers from the material box, lifting drive units can be provided on the first silicon wafer picking assembly 7 and the second silicon wafer picking assembly 8 respectively to control the gripper or robot to lift and lower in the vertical direction to approach the material box; alternatively, a lifting drive can be provided at the bottom of the material box to drive the material box to move upward and bring the material box closer to the silicon wafer picking assembly.
[0083] By setting two silicon wafer picking components to interface with two packing machines respectively, the silicon wafers in the material box of the sorting machine 3 feeding mechanism 33 are transferred to the corresponding packing machines.
[0084] Optionally, the gripper of the robotic arm is equipped with two sets of clamping components, each of which can clamp a flower basket.
[0085] By setting two sets of gripping components on the gripper of the robot arm, the robot arm can grip two flower baskets at a time, thereby improving the efficiency of the robot arm in switching flower baskets between the washing machine and the sorting machine 3, and further improving the overall capacity of washing and sorting.
[0086] Next, combined Figure 3 This paper describes how the first cleaning machine 1, the second cleaning machine 2, the first packaging machine 4, and the second packaging machine 5 in the silicon wafer processing equipment of this application are connected with the sorting machine 3 to process silicon wafers:
[0087] After the cleaning mechanism of the first cleaning machine 1 cleans the silicon wafers placed in the basket, the silicon wafers and the basket are sent together to the discharge mechanism of the first cleaning machine 1. The robot arm 11 of the first cleaning machine grabs the basket 100 and transfers it to the material handling mechanism 31 of the sorting machine 3. The basket 100 is then released onto the horizontal first support plate 3111. The clamping parts 3112 around the first support plate 3111 clamp and fix the basket 100. Then, the first flipping drive source 31... 5. The first basket clamping mechanism 311 is flipped from a horizontal state to a vertical state. The first basket clamping mechanism 311 is driven away from the robot arm 11 of the first cleaning machine by the transverse module 314 and moves to align with the wafer picking and conveying mechanism 313. The wafer picking mechanism 313 takes the silicon wafer out of the basket 100 and conveys it backward. After being sorted and detected by the sorting machine 3, the silicon wafer is sorted and collected into the material box. Then, the first silicon wafer picking component 7 and the second silicon wafer picking component 8 respectively send the silicon wafer to the first packaging machine 4 and the second packaging machine 5.
[0088] The docking method between the second cleaning machine 2 and the second flower basket clamping mechanism 312 is the same as above, and will not be described again.
[0089] It should be further noted that, unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar terms used in this utility model patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "an" or "a," etc., do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "connected" or "linked," etc., are not limited to physical or mechanical connections, but can include electrical connections. Furthermore, "at least one" as used herein includes one, two, or more.
[0090] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not invented by the invention. The specification and examples are to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following claims.
[0091] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.
Claims
1. A silicon wafer processing apparatus, characterized by comprising: The silicon wafer processing apparatus includes a first cleaning machine, a second cleaning machine, and a sorting machine, wherein: The first cleaning machine and the second cleaning machine are arranged side by side along the first direction. The first cleaning machine and the second cleaning machine have the same structure, both including a cleaning mechanism, a discharge mechanism and a robotic arm. The sorting machine includes a material handling mechanism, a detection mechanism, and a material unloading mechanism. The material handling mechanism includes a first basket clamping mechanism and a second basket clamping mechanism. The material handling mechanism is located between the first washing machine and the second washing machine. When the robotic arm of the first cleaning machine rotates with its base as the center and its arm extension as the radius, the rotation area of the gripper of the robotic arm can cover the first basket holding mechanism. The robotic arm of the first cleaning machine is configured to transfer the basket containing silicon wafers after cleaning by the cleaning mechanism to the first basket holding mechanism. When the robotic arm of the second cleaning machine rotates with its base as the center and its arm extension as the radius, the rotation area of the gripper of the robotic arm can cover the second basket holding mechanism. The robotic arm of the second cleaning machine is configured to transfer the basket containing silicon wafers after cleaning by the cleaning mechanism to the second basket holding mechanism. The extension of the robotic arm is the straight-line distance from the gripper to the base when the robotic arm is fully extended.
2. The silicon wafer processing apparatus of claim 1 wherein, The first flower basket clamping mechanism includes a first support plate and a clamping part disposed on the outer periphery of the first support plate. The first support plate is used to support the flower basket with its opening facing upward, and the clamping part is used to clamp the flower basket. When the extension direction of the robotic arm of the first cleaning machine is perpendicular to the first direction, the vertical distance between the center of the first support plate and the center of the gripper of the robotic arm of the first cleaning machine is 1.18m to 1.68m. The second flower basket clamping mechanism includes a second support plate and a clamping part disposed on the outer periphery of the second support plate. The second support plate is used to support the flower basket with the opening facing upward, and the clamping part is used to clamp the flower basket. When the extension direction of the manipulator of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the second support plate and the center of the gripper of the manipulator of the second cleaning machine is 1.18m to 1.68m.
3. The silicon wafer processing apparatus as described in claim 2, characterized in that, The sorting machine further includes a first flip drive source and a second flip drive source. The first flower basket clamping mechanism is disposed on the first flip drive source. The first flip drive source is used to drive the first flower basket clamping mechanism to flip and switch between horizontal and vertical states. When the first flower basket clamping mechanism is in the horizontal state, the first support plate is used to support the flower basket with the opening facing upward. When the first flower basket clamping mechanism is in the vertical state, the opening of the flower basket clamped by the first flower basket faces the sorting machine. The second flower basket clamping mechanism is mounted on the second flip drive source. The second flip drive source is used to drive the second flower basket clamping mechanism to flip and switch between horizontal and vertical states. When the second flower basket clamping mechanism is in the horizontal state, the second support plate is used to support the flower basket with the opening facing upward. When the second flower basket clamping mechanism is in the vertical state, the opening of the flower basket clamped by the second flower basket faces the sorting machine.
4. The silicon wafer processing apparatus as described in claim 3, characterized in that, The silicon wafer processing device also includes a enclosure net surrounding the first cleaning machine and the second cleaning machine. The enclosure net has an opening that connects to the material handling mechanism of the sorting machine. When the first basket clamping mechanism is in a horizontal state, it is located inside the enclosure net. When the second basket clamping mechanism is in a horizontal state, it is located inside the enclosure net.
5. The silicon wafer processing apparatus as described in claim 1, characterized in that, When the extension direction of the robotic arm of the first cleaning machine is perpendicular to the first direction, the vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the robotic arm of the first cleaning machine is 1.8m to 2.3m. When the extension direction of the robotic arm of the second cleaning machine is perpendicular to the first direction, the vertical distance between the center of the outer frame of the sorting machine and the center of the gripper of the robotic arm of the second cleaning machine is 1.8m to 2.3m.
6. The silicon wafer processing apparatus as claimed in claim 1, characterized in that, The first flower basket clamping mechanism is configured to move toward or away from the robotic arm of the first cleaning machine in the first direction, and the unidirectional stroke of the first flower basket clamping mechanism toward or away from the robotic arm of the first cleaning machine is 530mm to 1530mm. The second flower basket clamping mechanism is configured to move toward or away from the robotic arm of the second cleaning machine in the first direction, and the unidirectional stroke of the second flower basket clamping mechanism toward or away from the robotic arm of the second cleaning machine is 530mm to 1530mm.
7. The silicon wafer processing apparatus as claimed in claim 1, characterized in that, When the extension direction of the robotic arm of the first cleaning machine and the extension direction of the robotic arm of the second cleaning machine are both perpendicular to the first direction, the vertical distance between the gripper center of the robotic arm of the first cleaning machine and the gripper center of the robotic arm of the second cleaning machine is 3.6m to 4.5m.
8. The silicon wafer processing apparatus as claimed in claim 1, characterized in that, The silicon wafer processing apparatus further includes a first packaging machine and a second packaging machine, which are located on both sides of the unloading mechanism along the first direction.
9. The silicon wafer processing apparatus as described in claim 8, characterized in that, The silicon wafer processing device further includes a truss, a first silicon wafer picking assembly, and a second silicon wafer picking assembly. The truss is arranged above the unloading mechanism along a direction perpendicular to the first direction. The first silicon wafer picking assembly and the second silicon wafer picking assembly are respectively slidably arranged on both sides of the truss along a direction perpendicular to the first direction. The first silicon wafer picking assembly is used to pick up silicon wafers in the material box of the unloading mechanism and transfer the silicon wafers to the first packaging machine. The second silicon wafer picking assembly is used to pick up silicon wafers in the material box of the unloading mechanism and transfer the silicon wafers to the second packaging machine.
10. The silicon wafer processing apparatus as claimed in claim 8, characterized in that, The gripper of the robotic arm is equipped with two sets of clamping components, each of which can clamp a flower basket.