A multi-station chip processing system
By setting a rollable patch at the bottom of the track, the problem of pressure damage caused by foreign objects during chip bonding is solved, the self-cleaning of the suction head is achieved, the yield of the chip processing system is improved and the maintenance difficulty is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QULIANG ELECTRONICS CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-05-29
AI Technical Summary
During chip bonding, foreign matter adhering to the surface of the pick-and-place head can cause chip damage, affecting the yield rate.
A rollable patch is placed at the bottom of the track. Its adhesiveness is used to remove foreign objects from the surface of the suction head. The robotic arm controls the suction head to contact the patch for cleaning.
This effectively prevents foreign objects from squeezing the chip, improves the yield rate, and reduces maintenance difficulty.
Smart Images
Figure CN224306246U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a chip processing technology, and more particularly to a multi-station chip processing system. Background Technology
[0002] The description in this section provides only background information related to the disclosure of this utility model and does not constitute prior art.
[0003] In die bonding, a robotic arm typically moves a pick-and-place tool between multiple platforms to transport the chip. After the pick-and-place tool is in contact with the top surface of the chip, negative pressure is applied through the vent at the tip of the tool to lift the chip. During this process, foreign objects from the environment may adhere to the surface of the pick-and-place tool, causing friction or pressure on the top surface of the chip. This can lead to chip damage, and in severe cases, result in a large number of defective chips that do not meet factory quality requirements.
[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content
[0005] The purpose of this invention is to provide a multi-station chip processing system that can use a rollable adhesive strip at the bottom of the track to remove foreign objects from the surface of the suction head, thereby preventing foreign objects from squeezing the chip and affecting the yield.
[0006] To achieve the above objectives, this utility model discloses a multi-station chip processing system, which includes:
[0007] First control panel;
[0008] Second operating console;
[0009] A transport device includes a suction head, a robotic arm, and a track; the suction head is mounted on the robotic arm, the robotic arm is mounted on the track, and the robotic arm is used to drive the suction head to reciprocate in a direction perpendicular to the track; a first operating table and a second operating table are located at the bottom of the track in the extension direction.
[0010] A support platform is disposed at the bottom of the track and is adjacent to the first operating table or the second operating table. The support platform has a first end and a second end that are disposed opposite to each other.
[0011] A fabric applicator includes a feeding shaft, a receiving shaft, and an applicator. The feeding shaft is located at a first end of the support platform, and the receiving shaft is located at a second end of the support platform. The feeding shaft and the receiving shaft are arranged in parallel. The first end of the applicator is wound around the feeding shaft, and the second end of the applicator is wound around the receiving shaft. At least a portion of the first end and the second end of the applicator are attached to the top surface of the support platform. The side of the applicator facing away from the top surface of the support platform is adhesive.
[0012] As a further description of the above technical solution, the track has a first working position, a second working position, and a third working position. When the robotic arm is in the first working position, the suction head is positioned facing the top surface of the first operating table; when the robotic arm is in the second working position, the suction head is positioned facing the top surface of the second operating table; and when the robotic arm is in the third working position, the suction head is positioned facing the top surface of the support platform.
[0013] As a further description of the above technical solution, the multi-station chip processing system also includes a drive shaft, which is disposed between the feed shaft and the take-up shaft. The drive shaft is parallel to the feed shaft and the take-up shaft, and at least a portion of the fabric between the feed shaft and the take-up shaft is attached to the drive shaft.
[0014] As a further description of the above technical solution, the number of the drive shafts is set to multiple, and the multiple drive shafts are arranged in parallel.
[0015] As a further description of the above technical solution, the bottom height of the drive shaft closest to the first end of the support platform is the same as the top surface height of the support platform, and the bottom height of the drive shaft closest to the second end of the support platform is the same as the top surface height of the support platform.
[0016] As a further description of the above technical solution, the multi-station chip processing system also includes an outer frame, which covers the support platform and the fabric pushing mechanism, and the outer frame has an opening on the side facing the track for the robotic arm and the suction head to pass through.
[0017] As a further description of the above technical solution, the projection surface of the opening at least covers the entire supporting platform.
[0018] As a further description of the above technical solution, the top surface area of the support platform is larger than the end of the suction head.
[0019] Based on the above technical solution, the beneficial effects of this utility model are as follows:
[0020] This multi-station chip processing system utilizes a rollable adhesive pad at the bottom of the track to remove foreign matter from the surface of the suction head, preventing foreign matter from compressing the chip and affecting yield. Specifically, when foreign matter adheres to the suction head during operation, a robotic arm moves the suction head to an adjacent support platform. Pressing down the robotic arm presses the suction head against the adhesive pad on the support platform. Due to the adhesive nature of the top surface of the adhesive pad, the foreign matter is removed, and the suction head can then return to its original position to continue processing, resulting in a clean, foreign matter-free chip. Simultaneously, the coordinated rolling between the feed and take-up shafts keeps the adhesive pad in good condition, reducing maintenance difficulty.
[0021] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings provided are for reference and illustration only and are not intended to limit this utility model. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the suction head pressing down in a multi-station chip processing system provided in the embodiments of this specification;
[0024] Figure 2 This is a schematic diagram of the suction head lifting of a multi-station chip processing system provided in the embodiments of this specification;
[0025] Figure 3 This is a schematic diagram of the fabrication movement of a multi-station chip processing system provided in the embodiments of this specification;
[0026] Figure 4 This is a schematic diagram illustrating a usage scenario of a multi-station chip processing system provided in the embodiments of this specification;
[0027] In the picture:
[0028] 100. First operating panel;
[0029] 200. Second operating console;
[0030] 1. Suction head;
[0031] 2. Robotic arm;
[0032] 3. Track;
[0033] 4. Supporting platform;
[0034] 5. Fabric application and pushing mechanism; 51. Feeding shaft; 52. Receiving shaft; 53. Fabric application;
[0035] 6. Drive shaft;
[0036] 7. Outer frame; 71. Opening. Detailed Implementation
[0037] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.
[0038] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.
[0039] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.
[0040] Please see Figure 1-4 This embodiment provides a multi-station chip processing system, which includes:
[0041] First operating console 100;
[0042] Second operating console 200;
[0043] The transport device includes a suction head 1, a robotic arm 2, and a track 3; the suction head 1 is mounted on the robotic arm 2, the robotic arm 2 is mounted on the track 3, and the robotic arm 2 is used to drive the suction head 1 to reciprocate in a direction perpendicular to the track 3; a first operating table 100 and a second operating table 200 are arranged at the bottom of the track 3 in the extending direction.
[0044] Support platform 4 is located at the bottom of track 3 and is adjacent to the first operating table 100 or the second operating table 200. Support platform 3 has a first end and a second end that are arranged opposite to each other.
[0045] The fabric applicator 5 includes a feeding shaft 51, a receiving shaft 52, and an applicator 53. The feeding shaft 51 is located at the first end of the support platform 4, and the receiving shaft 52 is located at the second end of the support platform 4. The feeding shaft 51 and the receiving shaft 52 are arranged in parallel. The first end of the applicator 53 is wound around the feeding shaft 51, and the second end of the applicator 53 is wound around the receiving shaft 52. At least a portion of the first end and the second end of the applicator 53 are attached to the top surface of the support platform 4. The side of the applicator 53 facing away from the top surface of the support platform 4 is adhesive.
[0046] With the above structure, when in use, such as Figure 4 As shown, the top surfaces of the first operating platform 100 and the second operating platform 200 are used to place chips. The robotic arm 2 drives the suction head 1 to move back and forth on the track 3. When the robotic arm 2 is above the first operating platform 100 on the track 3, the robotic arm 2 drives the suction head 1 to move downward, so that the suction head 1 adheres to the chip on the first operating platform 100. Then, the suction head 1 is fixed and stabilized on the top wall of the chip by means of vacuum. The robotic arm 2 drives the suction head 1 and the corresponding chip to be sucked up to lift. After the robotic arm 2 is lifted into position, the robotic arm 2 moves relative to the track 3 and moves towards the position of the second operating platform 200. After it is in position, similarly, when the robotic arm 2 is above the second operating platform 200 on the track 3, the robotic arm 2 drives the suction head 1 to move downward, so that the suction head 1 places the chip on the second operating platform 200. Then the suction head 1 is de-vacuumed, the bottom of the suction head 1 separates from the top wall of the chip, realizing the placement of the chip, and the robotic arm 2 resets.
[0047] During the handling of the chip by the suction head 1, there may be foreign matter contaminating the contact point between the suction head 1 and the chip. To address this, the operator manipulates the robotic arm 2 to move the suction head 1 back and forth along the track 3. Once the robotic arm 2 is positioned above the support platform 4, it drives the suction head 1 downwards, causing it to adhere to the adhesive tape 53 on the support platform 4. Then, the adhesive tape 53 helps to stick the foreign matter on the suction head 1 to the tape 53. Afterwards, the robotic arm 2 moves the suction head 1 away from the tape 53. At this point, the foreign matter is stuck to the adhesive tape 53, thus cleaning the tip of the suction head 1.
[0048] When foreign matter gets on the patch 53, the take-up shaft 52 and the patch 53 in the patch pushing mechanism 5 rotate in the same direction under the drive of the external motor, causing the patch 53 with foreign matter to move towards the take-up shaft 52 and accumulate. After repeated several times, the patch 53 with foreign matter is rolled up around the take-up shaft 52.
[0049] With the aforementioned structure of this invention, a rollable adhesive strip 53 is provided at the bottom of the track 3 to remove foreign objects from the surface of the suction head, preventing foreign objects from squeezing the chip and affecting the yield. Specifically, when foreign objects adhere to the suction head 1 during operation, the robotic arm 2 is controlled to move the suction head 1 to the adjacent support platform 4. The robotic arm 2 is then pressed down to press the suction head 1 onto the adhesive strip on the support platform 4. Due to the adhesiveness of the top surface of the adhesive strip 53, the foreign objects are removed, and the suction head 1 can then return to its original position to continue working, resulting in a clean chip free of foreign objects. Simultaneously, the coordinated rolling between the feed shaft 51 and the take-up shaft 52 keeps the adhesive strip 53 in good condition, reducing maintenance difficulty.
[0050] The suction head 1 is attached to the patch 53 on the support platform 4. Then, with the help of the adhesive of the patch 53, the foreign objects on the suction head 1 are stuck to the patch 53. The support platform 4, on the side away from the suction head 1, acts as abutment against the patch 53, providing sufficient contact force between the patch 53 and the suction head 1, so that the foreign objects on the suction head 1 can be effectively pressed and stuck to the patch 53 by sufficient pressure.
[0051] In the above embodiments, the track 3 has a first working position, a second working position, and a third working position. When the robotic arm 2 is in the first working position, the suction head 1 is positioned facing the top surface of the first operating table 100; when the robotic arm 2 is in the second working position, the suction head 1 is positioned facing the top surface of the second operating table 200; and when the robotic arm 2 is in the third working position, the suction head 1 is positioned facing the top surface of the support platform 4. In this embodiment, the third working position can be located to one side of the second working position and away from the first working position. That is, in this embodiment, the first operating table 100 for obtaining chips is far away from the multi-station chip processing system, while the second operating table 200 for placing chips picked up from the first operating table 100 is close to the multi-station chip processing system. Therefore, the multi-station chip processing system is actually located at the end of a complete robotic arm 2 operation process. The operation of the multi-station chip processing system can be performed after the robotic arm 2 has completed a complete chip handling process, and then the cleaning operation of the suction head 1 can be performed at a closer distance.
[0052] In this embodiment, the multi-station chip processing system also includes a drive shaft 6, which is positioned between the feed shaft 51 and the take-up shaft 52. The drive shaft 6 is parallel to the feed shaft 51 and the take-up shaft 52, and at least a portion of the fabric 53 between the feed shaft 51 and the take-up shaft 52 is attached to the drive shaft 6. Multiple drive shafts 6 are provided, arranged in parallel. In this embodiment, the multiple drive shafts 6 can adjust the orientation and layout of the fabric 53 via air ducts. Specifically, see [link to relevant documentation]. Figure 1 Five drive shafts 6 can be arranged vertically on the support platform 4, with two sets on each side of the support platform 4. This allows the feeding shaft 51 and the receiving shaft 52 for wrapping the fabric 53 to be located at the bottom of the support platform 4, indirectly reducing the horizontal space occupied by the equipment.
[0053] Of course, the drive shaft 6 can be reset to the corresponding distance and number of groups according to the needs of other different venues.
[0054] In another embodiment, the bottom height of the drive shaft 6 located at the first end closest to the support platform 4 is the same as the top surface height of the support platform 4, and the bottom height of the drive shaft 6 located at the second end closest to the support platform 4 is the same as the top surface height of the support platform 4. Therefore, in the default state, the patch 53 above the support platform 4 is actually positioned horizontally and in close contact with the support platform 4, avoiding the pulling of the patch 53 after the suction head 1 presses down, which could damage the patch 53 or cause friction and rolling at the foreign object location.
[0055] Furthermore, the multi-station chip processing system also includes an outer frame 7, which covers the support platform 4 and the fabric pushing mechanism 5. The outer frame 7 has an opening 71 on the side facing the track 3 for the robotic arm 2 and the suction head 1 to pass through. The projected surface of the opening 71 covers at least the entire support platform 4. The outer frame 7 effectively protects the overall structure of the multi-station chip processing system, with only the opening 71 providing external communication. This effectively isolates the system and prevents external foreign objects from contaminating the fabric 53, thus reducing its cleaning power.
[0056] In another embodiment, the top surface area of the support platform 4 is larger than the end of the suction head 1. That is to say, the support platform 4 in this embodiment can provide effective support for at least all of the suction heads 1, so that all foreign objects on the suction head 1 are subjected to force as much as possible and are stuck to the top surface of the adhesive tape 53.
[0057] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the scope of the patent application of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the scope of the patent application of the present utility model.
[0058] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.
[0059] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.
Claims
1. A multi-station chip processing system, characterized in that, The multi-station chip processing system includes: First control panel; Second operating console; A transport device includes a suction head, a robotic arm, and a track; the suction head is mounted on the robotic arm, the robotic arm is mounted on the track, and the robotic arm is used to drive the suction head to reciprocate in a direction perpendicular to the track; a first operating table and a second operating table are located at the bottom of the track in the extension direction. A support platform is disposed at the bottom of the track and is adjacent to the first operating table or the second operating table. The support platform has a first end and a second end that are disposed opposite to each other. A fabric applicator includes a feeding shaft, a receiving shaft, and an applicator. The feeding shaft is located at a first end of the support platform, and the receiving shaft is located at a second end of the support platform. The feeding shaft and the receiving shaft are arranged in parallel. The first end of the applicator is wound around the feeding shaft, and the second end of the applicator is wound around the receiving shaft. At least a portion of the first end and the second end of the applicator are attached to the top surface of the support platform. The side of the applicator facing away from the top surface of the support platform is adhesive.
2. The multi-station chip processing system according to claim 1, characterized in that: The track has a first working position, a second working position, and a third working position. When the robotic arm is in the first working position, the suction head is positioned facing the top surface of the first operating table; when the robotic arm is in the second working position, the suction head is positioned facing the top surface of the second operating table; when the robotic arm is in the third working position, the suction head is positioned facing the top surface of the support platform.
3. The multi-station chip processing system according to claim 1, characterized in that: The multi-station chip processing system also includes a drive shaft, which is positioned between the feed shaft and the take-up shaft. The drive shaft is parallel to the feed shaft and the take-up shaft, and at least a portion of the fabric between the feed shaft and the take-up shaft is attached to the drive shaft.
4. The multi-station chip processing system according to claim 3, characterized in that: The number of drive shafts is set to multiple, and the multiple drive shafts are arranged in parallel.
5. The multi-station chip processing system according to claim 4, characterized in that: The bottom height of the drive shaft closest to the first end of the support platform is the same as the top height of the support platform, and the bottom height of the drive shaft closest to the second end of the support platform is the same as the top height of the support platform.
6. The multi-station chip processing system according to claim 1, characterized in that: The multi-station chip processing system also includes an outer frame that covers the support platform and the fabric pushing mechanism, and the outer frame has an opening on the side facing the track for the robotic arm and the suction head to pass through.
7. The multi-station chip processing system according to claim 6, characterized in that: The projection surface of the opening at least covers the entire supporting platform setup.
8. The multi-station chip processing system according to claim 1, characterized in that: The top surface area of the support platform is larger than the end of the suction head.