Wafer centering device
By employing two alignment components and a drive unit in the coating and developing equipment, automatic alignment of wafers of different sizes is achieved, solving the problems of large equipment space occupation and low efficiency of manual operation, and improving alignment efficiency and compatibility.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINCHUANKE SEMICONDUCTOR TECHNOLOGY (JIANGSU) CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-05-29
Smart Images
Figure CN224306268U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer alignment device. Background Technology
[0002] In the semiconductor manufacturing industry, coating and developing equipment is a key piece of equipment in the photolithography process, and its performance directly affects chip yield and production efficiency. With the continuous development of chip technology, wafer sizes are becoming increasingly diverse, from the traditional 6-inch and 8-inch wafers to the mainstream 12-inch wafers, which places higher demands on the compatibility of coating and developing equipment.
[0003] Currently, to enable coating and developing equipment to handle wafers of different sizes, a common practice is to equip each size with corresponding locating claws. There are two main existing technical solutions: Solution one involves setting up multiple alignment structures, each corresponding to a specific wafer size, enabling automated processing. After a sensor identifies the wafer size, it is sent to the corresponding structure for alignment. However, this solution requires multiple alignment mechanisms, resulting in a large space footprint and increased equipment size and cost. Solution two involves retaining only a single alignment structure, with locating claws of different sizes manually changed as needed. This solution saves space; however, each wafer size change relies on manual operation, which is not only inefficient but also increases the risk of defects due to human error. Furthermore, it cannot achieve automated processing of different wafer sizes simultaneously within the equipment, failing to meet the efficient and flexible production demands of modern semiconductor manufacturing.
[0004] Therefore, there is an urgent need for a wafer alignment device to solve the aforementioned problems. Utility Model Content
[0005] Based on the above, the purpose of this utility model is to provide a wafer alignment device that reduces the number of alignment structures, eliminates the need for manual replacement of the limiting claws, improves alignment efficiency, and achieves compatibility with wafers of various sizes.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A wafer alignment device, comprising:
[0008] Two centering components are symmetrically arranged along a first direction. Each centering component includes a driving member and a centering member. The driving member is driven and connected to the centering member. On opposite sides of the two centering members, a first pushing surface and a second pushing surface are arranged at intervals along a vertical direction. The second pushing surface is higher than the first pushing surface.
[0009] A first bearing area and a second bearing area are provided between the two centering components. The second bearing area is arranged around the first bearing area. The first bearing area is provided with a plurality of first support pillars for supporting a first wafer. The second bearing area is provided with a plurality of second support pillars. The second support pillars are higher than the first support pillars and are used to support a second wafer.
[0010] The driving element is used to drive the two centering elements to move closer or further apart, so that the first pushing surface can push the first wafer to the first centering region, and the second pushing surface can push the second wafer to the second centering region.
[0011] As a preferred technical solution of a wafer alignment device, the alignment member is provided with an extension, the extension being located below the second pushing surface, and the first pushing surface being located at one end of the extension near the first bearing area.
[0012] As a preferred technical solution for a wafer alignment device, the extension is provided with a clearance groove to avoid the second support column.
[0013] As a preferred embodiment of a wafer alignment device, the first pushing surface is an arc surface, and the shape of the first pushing surface matches the outer wall shape of the first wafer; and / or,
[0014] The second pushing surface is an arc surface, and the shape of the second pushing surface matches the outer wall of the second wafer.
[0015] As a preferred embodiment of a wafer alignment device, when the first pushing surface pushes the first wafer to the first alignment region, the angle between the two ends of the first pushing surface and the line connecting the center of the first bearing area is in the range of 40°-180°; and / or,
[0016] When the second pushing surface pushes the second wafer to the second centering region, the angle between the two ends of the second pushing surface and the center of the first bearing region is 40°-180°.
[0017] As a preferred technical solution for a wafer alignment device, there are three first support pillars and three second support pillars.
[0018] As a preferred technical solution for a wafer alignment device, the line connecting the three first support pillars forms an equilateral triangle;
[0019] The line connecting the three second support columns forms an equilateral triangle.
[0020] As a preferred technical solution for a wafer alignment device, both the top end of the first pushing surface and the top end of the second pushing surface are provided with guide portions.
[0021] As a preferred technical solution for a wafer alignment device, the guide portion is chamfered or rounded.
[0022] As a preferred technical solution for a wafer alignment device, the driving component is a pneumatic slide, which is used to drive the alignment component to reciprocate along the first direction.
[0023] The beneficial effects of this utility model are as follows:
[0024] This invention provides a wafer alignment device that can accommodate the alignment needs of two types of wafers. When aligning a first wafer, the first wafer is placed on multiple first support pillars. Then, a driving component drives two alignment components to move closer together, and a first pushing surface pushes the first wafer to a first alignment area, completing the alignment of the first wafer. After alignment, the driving component drives the two alignment components to move away from each other. Similarly, when aligning a second wafer, the second wafer is placed on multiple second support pillars. Then, a driving component drives two alignment components to move closer together, and a second pushing surface pushes the second wafer to a second alignment area, completing the alignment of the second wafer. In this embodiment, the first and second wafers are placed at different heights in the vertical direction, thus allowing for two corresponding pushing surfaces to be set in the vertical direction. A single wafer alignment device can meet the alignment needs of two types of wafers. Compared to existing technologies, this reduces the number of alignment structures, eliminates the need for manual replacement of the limiting claws, improves alignment efficiency, and achieves compatibility with wafers of various sizes. Furthermore, this invention uses different heights to center wafers of different sizes. Before centering, there is no need to identify the wafer size, and it can be placed directly, thus avoiding situations such as wafer collisions due to identification errors. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the wafer alignment device provided in a specific embodiment of the present invention;
[0027] Figure 2 yes Figure 1 Enlarged view at point A;
[0028] Figure 3 This is a front view of the wafer alignment device provided in a specific embodiment of this utility model.
[0029] The markings in the image are as follows:
[0030] 1. Centering component; 11. Drive component; 12. Centering component; 121. Extension; 122. First pushing surface; 123. Second pushing surface; 124. Clearance groove; 125. Guide part;
[0031] 2. First support column; 3. Second support column; 4. Workbench. Detailed Implementation
[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0033] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0036] like Figures 1-3As shown, this embodiment provides a wafer alignment device, which includes two alignment components 1 symmetrically arranged along a first direction. Each alignment component 1 includes a driving member 11 and an alignment member 12. The driving member 11 is driven and connected to the alignment member 12. On opposite sides of the two alignment members 12, there are first pushing surfaces 122 and second pushing surfaces 123 arranged vertically at intervals. The second pushing surfaces 123 are higher than the first pushing surfaces 122. A first bearing area and a second bearing area are arranged between the two alignment components 1. The second bearing area is surrounded by the first bearing area. The first bearing area is provided with a plurality of first support pillars 2 for supporting a first wafer. The second bearing area is provided with a plurality of second support pillars 3 for supporting a second wafer. The driving member 11 is used to drive the two alignment members 12 to move closer or further apart from each other, so that the first pushing surfaces 122 can push the first wafer to the first alignment area, and the second pushing surfaces 123 can push the second wafer to the second alignment area.
[0037] This wafer alignment device is compatible with the alignment requirements of two types of wafers. When aligning the first wafer, the first wafer is placed on multiple first support pillars 2. Then, the driving component 11 drives two alignment components 12 to move closer to each other. The first pushing surface 122 pushes the first wafer to the first alignment area, completing the alignment of the first wafer. After alignment, the driving component 11 drives the two alignment components 12 to move away from each other. Similarly, when aligning the second wafer, the second wafer is placed on multiple second support pillars 3. Then, the driving component 11 drives two alignment components 12 to move closer to each other. The second pushing surface 123 pushes the second wafer to the second alignment area, completing the alignment of the second wafer. In this embodiment, the first and second wafers are placed at different heights in the vertical direction. Therefore, two corresponding pushing surfaces can be set in the vertical direction. The alignment requirements of two types of wafers can be met by a single wafer alignment device. Compared with the prior art, this reduces the number of alignment structures, eliminates the need for manual replacement of the limiting claws, improves alignment efficiency, and achieves compatibility with wafers of various sizes. Furthermore, this embodiment uses different heights to align wafers of different sizes. There is no need to identify the wafer size before alignment, and the wafers can be placed directly without encountering collisions due to identification errors.
[0038] In this embodiment, the wafer alignment device further includes a worktable 4, on which two alignment components 1, multiple first support pillars 2, and second support pillars 3 are all disposed. The second wafer is larger than the first wafer; therefore, during placement, the second wafer can be placed on multiple second support pillars 3, and the first wafer can be placed on multiple first support pillars 2. The first wafer can be a 4-inch wafer, and the second wafer can be a 6-inch wafer. The center points of the first alignment region and the second alignment region coincide.
[0039] In this embodiment, the driving component 11 is a pneumatic slide table, which is used to drive the centering component 12 to reciprocate along the first direction. The pneumatic slide table is existing technology, and its specific structure and working principle will not be described in detail here.
[0040] Since the second wafer is larger than the first wafer, in order to reduce the displacement of the centering member 12 when centering the first wafer, preferably, the centering member 12 is provided with an extension 121. The extension 121 is located below the second pushing surface 123, and the first pushing surface 122 is located at the end of the extension 121 near the first bearing area. The first pushing surface 122 is closer to the middle region of the first bearing area than the second pushing surface 123, thereby reducing the displacement of the first pushing surface 122 when pushing the first wafer.
[0041] Preferably, the extension 121 is provided with a clearance groove 124 to avoid the second support post 3. When the first pushing surface 122 pushes the first wafer, the second support post 3 is in the clearance groove 124 and does not interfere with the movement of the extension 121.
[0042] In this embodiment, the first pushing surface 122 is an arc surface, and the shape of the first pushing surface 122 matches the outer wall shape of the first wafer; and / or, the second pushing surface 123 is an arc surface, and the shape of the second pushing surface 123 matches the outer wall shape of the second wafer. This embodiment improves the fit between the first pushing surface 122 and the first wafer, and improves the fit between the second pushing surface 123 and the second wafer, preventing the wafer from becoming misaligned during wafer pushing.
[0043] It should be noted that, in order to match the size error of the wafer itself, taking the alignment of the first wafer as an example, when the two first pushing surfaces 122 push the first wafer to the first alignment region, the area enclosed by the two first pushing surfaces 122 is slightly larger than the standard size of the first wafer. The size of this part larger than the diameter of the first wafer is within the allowable error range of alignment. Therefore, when the first wafer is located in the first alignment region, the first wafer may not be in contact with either of the two first pushing surfaces 122, or the first wafer may not be in contact with either of the two first pushing surfaces 122, or the first wafer may only be in contact with one of the two first pushing surfaces 122.
[0044] More preferably, when the first pushing surface 122 pushes the first wafer to the first centering region, the angle between the two ends of the first pushing surface 122 and the center of the first bearing region is in the range of 40°-180°, and the first wafer can automatically perform position correction when the first pushing surface 122 pushes the first wafer. And / or, when the second pushing surface 123 pushes the second wafer to the second centering region, the angle between the two ends of the second pushing surface 123 and the center of the first bearing region is in the range of 40°-180°.
[0045] In this embodiment, there are three first support pillars 2 and three second support pillars 3. Preferably, the line connecting the three first support pillars 2 forms an equilateral triangle. When the first support pillars 2 support the first wafer, the first wafer receives a uniform supporting force from the multiple first support pillars 2, thus improving the stability of the first wafer's support. Similarly, the line connecting the three second support pillars 3 forms an equilateral triangle. When the second support pillars 3 support the second wafer, the second wafer receives a uniform supporting force from the multiple second support pillars 3, thus improving the stability of the second wafer's support.
[0046] Preferably, guide portions 125 are provided at the top ends of the first pushing surface 122 and the second pushing surface 123. When the robot places the first wafer or the second wafer, the first wafer can be placed on the first support post 2 under the guidance of the guide portion 125 of the first pushing surface 122, and the second wafer can be placed on the second support post 3 under the guidance of the guide portion 125 of the second pushing surface 123. The guide portion 125 is chamfered or rounded.
[0047] It should be noted that this embodiment also provides the working principle of the wafer alignment device. Taking the second wafer as an example, the specific details are as follows: Initially, the pneumatic slide drives the two alignment members 12 to move away from each other and to the position with the maximum spacing. The external robot arm transfers the second wafer from the wafer storage and places it on the three higher second support pillars 3. At this time, the second wafer is located between the second pushing surfaces 123 of the two alignment members 12. Then, the two pneumatic slides drive the two alignment members 12 to move closer to each other. While moving closer, the second wafer is pushed at least from the side with the largest tilt towards... As the first centering region moves, the two second pushing surfaces 123 on both sides cooperate to push the second wafer while continuously correcting the skew of the second wafer until the second wafer is pushed into the second centering region. At this time, the two centering components 12 stop moving. The area enclosed by the two second pushing surfaces 123 is the preset second centering region of the second wafer. This second centering region is adjusted into place when the mechanism is assembled. When the second wafer is in the second centering region, the two centering components 12 will stop moving, and one or both of the second pushing surfaces 123 will be in contact with the side of the second wafer.
[0048] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.
Claims
1. A wafer alignment device, characterized in that, include: Two centering components (1) are symmetrically arranged along a first direction. Each centering component (1) includes a driving member (11) and a centering member (12). The driving member (11) is driven to connect to the centering member (12). On opposite sides of the two centering members (12), a first pushing surface (122) and a second pushing surface (123) are arranged at intervals along the vertical direction. The second pushing surface (123) is higher than the first pushing surface (122). A first bearing area and a second bearing area are provided between the two centering components (1). The second bearing area is arranged around the first bearing area. The first bearing area is provided with a plurality of first support pillars (2). The plurality of first support pillars (2) are used to support the first wafer. The second bearing area is provided with a plurality of second support pillars (3). The second support pillars (3) are higher than the first support pillars (2). The plurality of second support pillars (3) are used to support the second wafer. The driving member (11) is used to drive the two centering members (12) to move closer or further apart from each other, so that the first pushing surface (122) can push the first wafer to the first centering region, and the second pushing surface (123) can push the second wafer to the second centering region.
2. The wafer alignment device according to claim 1, characterized in that, The centering member (12) is provided with an extension (121) located below the second pushing surface (123), and the first pushing surface (122) is located at one end of the extension (121) near the first bearing area.
3. The wafer alignment device according to claim 2, characterized in that, The extension (121) is provided with a clearance groove (124) to avoid the second support column (3).
4. The wafer alignment device according to claim 1, characterized in that, The first pushing surface (122) is an arc surface, and the first pushing surface (122) matches the shape of the outer wall of the first wafer; and / or, The second pushing surface (123) is an arc surface, and the second pushing surface (123) matches the shape of the outer wall of the second wafer.
5. The wafer alignment device according to claim 4, characterized in that, When the first pushing surface (122) pushes the first wafer to the first centering region, the angle between the two ends of the first pushing surface (122) and the line connecting the center of the first bearing region is in the range of 40°-180°; and / or, When the second pushing surface (123) pushes the second wafer to the second centering region, the angle between the two ends of the second pushing surface (123) and the center of the first bearing region is 40°-180°.
6. The wafer alignment device according to claim 1, characterized in that, There are three of each of the first support column (2) and the second support column (3).
7. The wafer alignment apparatus according to claim 6, characterized in that, The line connecting the three first support columns (2) forms an equilateral triangle; The line connecting the three second support columns (3) forms an equilateral triangle.
8. The wafer alignment apparatus according to any one of claims 1-7, characterized in that, The top end of the first pushing surface (122) and the top end of the second pushing surface (123) are both provided with guide portions (125).
9. The wafer alignment device according to claim 8, characterized in that, The guide portion (125) is chamfered or rounded.
10. The wafer alignment apparatus according to any one of claims 1-7, characterized in that, The driving component (11) is a pneumatic slide, which is used to drive the centering component (12) to reciprocate along the first direction.