A soldering leg side type lead frame

Abstract

The utility model discloses a soldering foot side face formula lead frame, include: metal frame and plastic layer, plastic layer sets up on the metal frame, is equipped with the bending angle on the corner of plastic layer, and the middle part of plastic layer has the protruding, and the bending angle has the plastic part with the protruding plane -to -plane, be provided with a plurality of soldering feet on the metal frame, and a plurality of soldering feet are arranged between equal interval, and plastic layer is through the middle injection way injection molding, and the metal frame is equipped with the pre -folding line and metal hole, the utility model can make the bending angle with the middle protruding part plane -to -plane, has strengthened the mechanical strength and injection filling evenness of the corner, has effectively improved the impact resistance and the fatigue resistance of soldering foot, has prolonged the service life of soldering foot.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a solder foot side lead frame. Background Technology

[0002] As a core component in LED packaging, the LED lead frame is mainly composed of metal materials (such as copper alloys and iron-nickel alloys) and plastic. It plays a crucial role in the LED packaging process, carrying the LED chip, achieving electrical connections, and providing mechanical support.

[0003] The plastic layer at the corner of the existing lead frame often has uneven thickness, and most of them are not designed with bending compensation. This seriously affects the overall structural strength and integrity of the solder feet, making the solder feet prone to damage due to the weak points at the corners during subsequent use. Utility Model Content

[0004] In order to solve the technical problems existing in the background art, this utility model proposes a solder foot side lead frame.

[0005] The present invention proposes a side-mounted lead frame for solder feet, comprising: a metal frame and a plastic layer, the plastic layer being disposed on the metal frame, the plastic layer having a bending angle at its corners, the plastic layer having a protrusion in the middle, and the bending angle having a plastic portion coplanar with the protrusion.

[0006] The metal frame is equipped with multiple solder feet, which are arranged at equal intervals.

[0007] The plastic layer is injection molded using an intermediate injection method;

[0008] The metal frame has pre-folded lines and metal holes.

[0009] Preferably, all solder feet are arranged longitudinally in a single direction with a spacing of 5mm, and the spacing error between adjacent solder feet is ≤0.2mm.

[0010] Preferably, the compensation amount for adjusting the thickness of the plastic portion at the bending angle is 0.1-0.3 mm.

[0011] Preferably, the pre-fold line is a square groove structure to guide the bending angle.

[0012] Preferably, the metal frame has a bending area adapted to the bending angle, the metal holes are elliptical and distributed at the edge of the bending area to disperse stress concentration in the bending area, and the metal holes are set in conjunction with the pre-bending line to reduce material fatigue loss during the bending process.

[0013] Preferably, the solder feet are directly disposed on the side of the metal frame.

[0014] Preferably, the plastic layer has an injection point in the middle to avoid weld lines and excess glue marks on the surface of the plastic layer.

[0015] This utility model proposes a side-mounted lead frame for solder feet, which has the following advantages: By designing the bending angle and compensating the thickness of the plastic layer at the corner, the bending angle and the central protrusion are made coplanar, enhancing the mechanical strength and injection filling uniformity at the corner. This effectively improves the impact and fatigue resistance of the solder feet, extending their service life. The solder feet are positioned on the side of the metal frame and arranged longitudinally in a single direction, without extending to the bottom or end of the metal frame. This layout saves a significant amount of bottom plane space, making it particularly suitable for high-density integrated circuit packaging and expanding the application scenarios of solder feet. It is injection molded using a center-entry method. The design incorporates a glue inlet point in the center of the plastic layer, preventing weld lines and glue overflow marks on the surface and ensuring the aesthetic appearance of the solder feet. Simultaneously, it ensures the density of the plastic filling in the functional areas, meeting the stringent requirements of high-precision electronic devices for both appearance and performance. The square groove pre-folding structure on the metal frame precisely guides the bending angle, while elliptical metal holes are distributed along the edges of the bending area. Together, these elements effectively disperse stress concentration points in the bending area, reducing material fatigue during bending, minimizing rework costs for the solder feet, and improving stability and reliability during mass production. Attached Figure Description

[0016] Figure 1 This utility model provides a diagram showing the corner structure of a side-mounted lead frame for solder feet.

[0017] Figure 2 This utility model provides a solder foot structure diagram of a side-mounted lead frame for solder feet.

[0018] Figure 3 This is a structural diagram of the glue inlet point of a side-mounted lead frame for solder feet proposed in this utility model;

[0019] Figure 4 This is a schematic diagram of the pre-folded line and metal hole of a side-mounted lead frame for solder feet proposed in this utility model. Detailed Implementation

[0020] refer to Figure 1-4This invention proposes a side-mounted lead frame for solder feet, comprising a metal frame 1 and a plastic layer 2 disposed on the metal frame 1. A bending angle 3 is provided at the corner of the plastic layer 2, and a protrusion 4 is located in the middle of the plastic layer 2. A plastic portion 5, coplanar with the protrusion 4, is provided on the bending angle 3. By adjusting the thickness of this plastic portion 5, with a compensation amount of 0.1-0.3mm, the bending angle 3 is made flush with the middle protrusion 4. This design greatly enhances the mechanical strength of the corner and ensures the uniformity of the injection molding filling, effectively ensuring the structural integrity of the solder feet.

[0021] The metal frame 1 has multiple solder feet 6, all of which are arranged longitudinally in a single direction with a precise pitch of 5mm. The spacing error between adjacent solder feet 6 is strictly controlled to ≤0.2mm. Furthermore, the solder feet 6 are directly located on the side of the metal frame 1. This method saves bottom space, enabling high-density integrated circuit packaging, effectively avoiding interference between adjacent pins during soldering, and facilitating simultaneous soldering of multiple pins, significantly improving soldering process efficiency.

[0022] The plastic layer 2 is injection molded using a center-entry method, with an entry point 10 located in the center of the plastic layer 2. This entry method effectively avoids weld lines and excess adhesive marks on the surface of the plastic layer 2, ensuring the aesthetic appearance of the solder feet. Simultaneously, center-entry ensures the density of the plastic filling in the functional areas, greatly satisfying the dual requirements of high-precision electronic devices for both the appearance and performance of the solder feet.

[0023] The metal frame 1 is equipped with a pre-bending line 7 and metal holes 8. The pre-bending line 7 adopts a square groove structure, and its main function is to accurately guide the bending angle during the bending operation, ensuring the accuracy and consistency of the bending. The metal frame 1 has a bending area 9 adapted to the bending angle 3, and the metal holes 8 are elliptical and distributed at the edge of the bending area 9. The metal holes 8 and the pre-bending line 7 are designed in conjunction to effectively disperse the stress concentration points in the bending area 9, reduce the fatigue loss of the material during the bending process, and thus improve the service life and processing reliability of the solder feet.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A side-mounted lead frame for solder feet, characterized in that, include: A metal frame (1) and a plastic layer (2), the plastic layer (2) is set on the metal frame (1), the plastic layer (2) has a bend (3) on its corner, the plastic layer (2) has a protrusion (4) in the middle, and the bend (3) has a plastic part (5) that is coplanar with the protrusion (4). The metal frame (1) is provided with multiple solder feet (6), and the multiple solder feet (6) are arranged at equal intervals; The plastic layer (2) is injection molded via an intermediate injection method; The metal frame (1) is provided with pre-folded lines (7) and metal holes (8).

2. The solder lead side-mounted lead frame according to claim 1, characterized in that, All solder feet (6) are arranged longitudinally in a single direction with a spacing of 5 mm, and the spacing error between adjacent solder feet (6) is ≤0.2 mm.

3. The solder lead side-mounted lead frame according to claim 2, characterized in that, The compensation amount for adjusting the thickness of the plastic part (5) at the bending angle (3) is 0.1-0.3mm.

4. A side-mounted lead frame for solder feet according to claim 3, characterized in that, The pre-fold line (7) is a square groove structure to guide the bending angle.

5. A side-mounted lead frame for solder feet according to claim 4, characterized in that, The metal frame (1) has a bending area (9) that matches the bending angle (3). The metal holes (8) are elliptical and distributed on the edge of the bending area (9) to disperse the stress concentration in the bending area (9). The metal holes (8) are set in conjunction with the pre-bending line (7) to reduce material fatigue loss during the bending process.

6. A side-mounted lead frame for solder feet according to claim 5, characterized in that, The solder feet (6) are directly set on the side of the metal frame (1).

7. A side-mounted lead frame for solder feet according to claim 6, characterized in that, The plastic layer (2) has a glue inlet (10) in the middle to avoid weld lines and glue overflow marks on the surface of the plastic layer (2).

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