A cooling coating dispensing head based on electrostatic assist principle

Abstract

This utility model discloses a cooling dispensing head based on the principle of electrostatic assistance, aiming to solve the problems of poor stability, slow speed, and low efficiency of traditional dispensing in the side circuit bonding process of display module, as well as the need for low-temperature adhesive dispensing in electrostatic assisted dispensing systems. The dispensing head includes a dispensing module, with an upper glue inlet connector and a lower dispensing needle connected through a glue cavity. The dispensing needle is an insulated needle with a pre-installed metal electrode. Two symmetrical heat dissipation modules are distributed on both sides of the dispensing module, each consisting of a semiconductor cooling chip, a heat sink, and a fan. During operation, the metal electrodes generate an electric field that provides additional electrostatic force to the adhesive, improving dispensing stability, speed, and efficiency. The semiconductor cooling chip cools the adhesive, and heat is transferred through the heat sink, while the fan accelerates heat dissipation, lowering the adhesive temperature and meeting the requirements for low-temperature adhesive dispensing, thus broadening the application range of the dispensing head.

Description

Technical Field

[0001] This utility model relates to a dispensing head, specifically a cooling dispensing head based on the principle of electrostatic assistance. Background Technology

[0002] In the OLED / LCD / LED display module field, the market has placed higher demands on ultra-narrow bezels for mobile phones and displays. Currently, traditional technologies such as bonding and bending processes can no longer meet the requirements for ultra-narrow bezels. In order to adapt to ultra-narrow bottom bezels, the technology has begun to shift towards side wrapping. This process does not require bending, but mainly connects the electronic circuits on both sides together through dispensing. There are no rounded corners, so it can significantly reduce the size of the bottom bezel of the mobile phone.

[0003] However, traditional dispensing in side wrapping processes faces three main problems: First, poor stability, with fluctuations in dispensing height significantly affecting the overlap of circuits; second, slow speed, as the number of circuits increases, traditional dispensing speeds no longer meet production capacity requirements; and third, low efficiency, because the poor stability of ordinary dispensing makes it difficult to combine into multi-needle dispensing methods, resulting in low efficiency. To address these three problems of traditional dispensing in side wrapping, an electrostatic assisted dispensing system suitable for side circuit overlap of display modules is provided. Furthermore, the electrostatic assisted dispensing system is sensitive to the adhesive; testing revealed that the adhesive cannot be dispensed at room temperature, requiring cooling measures during the dispensing process. Based on this requirement, a cooling-capable dispensing head based on the electrostatic assisted principle needs to be developed to solve the aforementioned technical problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a cooling coating and dispensing head based on the principle of electrostatic assistance.

[0005] To solve the above-mentioned technical problems, this utility model achieves the following solution: A cooling-capable coating and dispensing head based on the principle of electrostatic assistance, comprising a dispensing module, the upper end of which is a glue inlet connector, and the lower end of which is provided with a dispensing needle for dispensing glue. The dispensing module has an internal glue cavity connecting the glue inlet connector and the dispensing needle. The cooling-capable coating and dispensing head also includes two sets of heat dissipation modules symmetrically arranged on both sides of the dispensing module. The dispensing needle is an insulated needle, and during molding, a metal electrode capable of generating an electric field is pre-placed inside the insulator.

[0006] The heat dissipation module includes:

[0007] A semiconductor cooling chip, wherein the cold side of the semiconductor cooling chip is in close contact with the dispensing module, and its hot side faces outward;

[0008] A heat sink is fixed to the dispensing module and presses the semiconductor cooling chip into place, wherein the first side of the heat sink is at least in contact with the hot side of the semiconductor cooling chip.

[0009] A fan is mounted on the second side of the heat sink.

[0010] Furthermore, the dispensing module has steps on both sides of its housing, and the kicking surface of the steps has a Z-axis groove. The area between the Z-axis grooves on both sides is the glue cavity.

[0011] Furthermore, the semiconductor cooling chip is a strip-shaped sheet with a thickness greater than the depth of the Z-axis groove, and it is placed in the Z-axis groove with a portion of its housing outside the Z-axis groove.

[0012] Furthermore, the first surface of the radiator is provided with orthogonal ridges, wherein the ridges along the Z-axis are provided with straight grooves along the Z-axis that mate with the partial housing.

[0013] Furthermore, the heat sink is made of aluminum.

[0014] Furthermore, heat dissipation fins are provided on the second side of the radiator.

[0015] Furthermore, the fan is a side-exhaust fan.

[0016] Furthermore, the metal electrode is disposed on the central axis of the adhesive channel of the dispensing needle.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model's cooling coating dispensing head uses the electrostatic assist principle, where the electric field generated by the electrodes provides additional electrostatic force to the adhesive, making it easier for the adhesive to form lines on the substrate. This effectively improves the stability of dispensing narrow line widths, increases dispensing speed, and enhances dispensing efficiency. At the same time, by utilizing semiconductor cooling chips, heat sinks, and fans for cooling, the temperature of the adhesive in the dispensing module can be reduced, meeting the dispensing requirements of low-temperature adhesives and broadening the application range of the dispensing head. Attached Figure Description

[0018] Figure 1 This is a structural diagram of the cooling coating dispensing head of this utility model.

[0019] Figure 2 This is a diagram showing the state of the cooling coating needle dispensing adhesive based on the electrostatic assist principle of this utility model.

[0020] The following are labeled in the attached diagram: 1. Heat sink; 2. Dispensing module; 3. Semiconductor cooling chip; 4. Fan; 6. Dispensing needle; 7. Glue inlet connector; 8. Metal electrode; 9. Glue; 10. Substrate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Obviously, the embodiments described in this utility model are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0023] Example 1: The specific structure of this utility model is as follows:

[0024] Please refer to the appendix. Figure 1-2 This utility model discloses a cooling dispensing head based on the principle of electrostatic assistance, comprising a dispensing module 2, wherein the upper end of the dispensing module 2 is a glue inlet connector 7, and the lower end is provided with a dispensing needle 6 for dispensing glue. The dispensing module 2 has a glue cavity inside that connects the glue inlet connector 7 and the dispensing needle 6. The cooling dispensing head also includes two sets of heat dissipation modules symmetrically arranged on both sides of the dispensing module 2. The dispensing needle is an insulated needle, and a metal electrode capable of generating an electric field is pre-placed inside the insulator during molding.

[0025] The heat dissipation module includes:

[0026] A semiconductor cooling chip 3, the cold side of which is in close contact with the dispensing module 2, and the hot side of which faces outward;

[0027] Heat sink 1 is fixed to the dispensing module 2 and presses the semiconductor cooling chip 3 together, with the first side of the heat sink 1 being at least in contact with the hot side of the semiconductor cooling chip 3.

[0028] Fan 4 is installed on the second side of the heat sink 1.

[0029] The dispensing module 2 has steps on both sides of its housing, and the kicking surface of the steps has a Z-axis groove. The area between the Z-axis grooves on both sides is the glue cavity.

[0030] The semiconductor cooling chip 3 is a strip-shaped sheet with a thickness greater than the depth of the Z-axis groove. It is placed in the Z-axis groove, and part of its housing is outside the Z-axis groove.

[0031] The first surface of the radiator 1 is provided with an orthogonal structure protrusion, wherein the protrusion along the Z-axis is provided with a straight groove along the Z-axis that mates with the partial housing.

[0032] The heat sink 1 is made of aluminum. Aluminum has good thermal conductivity, with a thermal conductivity coefficient of up to 237 W / (m·K), which can quickly transfer heat from the hot end of the semiconductor cooling chip.

[0033] The second side of the radiator 1 is provided with heat dissipation fins. This design greatly increases the heat dissipation area and improves heat dissipation efficiency. Calculations show that, compared to ordinary flat-plate heat dissipation structures, it effectively accelerates the dissipation of heat into the surrounding environment.

[0034] The fan 4 is a side-exhaust fan. Driven by a DC brushless motor, the fan 4 can intelligently adjust its speed based on the actual temperature of the adhesive during dispensing. When the adhesive temperature is detected to be high, the fan automatically increases its speed to quickly dissipate heat from the heat sink surface; when the adhesive temperature drops to a set range, the fan speed decreases accordingly, ensuring effective heat dissipation while reducing energy consumption and noise.

[0035] The dispensing needle 6 is an insulated needle, and during molding, a metal electrode 8 capable of generating an electric field is pre-placed inside the insulator. The metal electrode 8 is located on the central axis of the glue path of the dispensing needle 6. Figure 2 As shown, the surface of the metal electrode 8 is either plated with an insulating layer or has no surface treatment. During operation, the host computer sends a signal to bring a stable high voltage to the metal electrode 8, which generates an electrostatic field. Under the action of the electrostatic field, the adhesive 9 gains additional force, which facilitates the adhesion of the adhesive 9 to the substrate 10, thereby increasing the stability and speed of dispensing.

[0036] Simultaneously, the thermoelectric cooler 3 begins to cool, and the heat generated at its hot end is rapidly transferred to the heat sink 1. The heat sink 1 efficiently absorbs heat through the tight fit between its first surface and the hot surface of the thermoelectric cooler 3, as well as the cooperation between the Z-axis straight groove and part of the thermoelectric cooler's housing. The heat dissipation fins on the second surface of the heat sink 1 significantly increase the heat dissipation area. The fan 4 intelligently adjusts its speed according to the adhesive temperature, quickly blowing away the heat from the heat sink surface, thus lowering the adhesive temperature and maintaining it within a suitable range, thereby making the low-temperature adhesive suitable for electrostatic assisted dispensing.

[0037] In summary, this novel cooling dispensing head utilizes an electrostatic assist principle. The electric field generated by the electrodes provides additional electrostatic force to the adhesive, making it easier for the adhesive to form lines on the substrate. This effectively improves the stability of dispensing narrow line widths, increases dispensing speed, and enhances dispensing efficiency. Simultaneously, by employing semiconductor cooling chips, heat sinks, and fans for cooling, the temperature of the adhesive in the dispensing module can be reduced, meeting the dispensing requirements for low-temperature adhesives and broadening the application range of the dispensing head.

[0038] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A cooling dispensing head based on electrostatic assistance principle, comprising a dispensing module (2), wherein the upper end of the dispensing module (2) is a glue inlet connector (7), and the lower end is provided with a dispensing needle (6) for dispensing glue; wherein the dispensing module (2) has a glue cavity inside that connects the glue inlet connector (7) and the dispensing needle (6); characterized in that, The dispensing needle (6) is an insulating needle, and a metal electrode (8) capable of generating an electric field is pre-placed inside the insulator during its molding process; The cooling coating dispensing head also includes two sets of heat dissipation modules symmetrically arranged on both sides of the dispensing module (2). The heat dissipation module includes: A semiconductor cooling chip (3) has its cold side in close contact with the dispensing module (2) and its hot side facing outwards. A heat sink (1) is fixed to the dispensing module (2) and presses the semiconductor cooling chip (3) together, wherein the first side of the heat sink (1) is at least in contact with the hot side of the semiconductor cooling chip (3); A fan (4) is installed on the second side of the radiator (1).

2. The cooling coating and dispensing head based on the electrostatic assist principle according to claim 1, characterized in that, The dispensing module (2) has steps on both sides of its housing, and the kicking surface of the steps has a Z-axis groove. The area between the Z-axis grooves on both sides is the glue cavity.

3. The cooling coating dispensing head based on the electrostatic assist principle according to claim 2, characterized in that, The semiconductor cooling chip (3) is a strip with a thickness greater than the depth of the Z-axis groove. It is placed in the Z-axis groove and part of its housing is outside the Z-axis groove.

4. The cooling coating and dispensing head based on the electrostatic assist principle according to claim 3, characterized in that, The first surface of the radiator (1) is provided with an orthogonal structure protrusion, wherein the protrusion along the Z-axis is provided with a straight groove along the Z-axis that cooperates with the partial housing.

5. A cooling coating dispensing head based on electrostatic assistance principle according to claim 1, characterized in that, The radiator (1) is made of aluminum.

6. The cooling coating and dispensing head based on the electrostatic assist principle according to claim 1, characterized in that, The second side of the radiator (1) is provided with heat dissipation fins.

7. A cooling coating and dispensing head based on electrostatic assistance principle according to claim 1, characterized in that, The fan (4) is a side-exit fan.

8. A cooling coating and dispensing head based on electrostatic assistance principle according to claim 1, characterized in that, The metal electrode (8) is located on the central axis of the glue channel of the dispensing needle (6).

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