A femtosecond laser processing device

Abstract

This invention belongs to the field of laser processing technology, and particularly relates to a femtosecond laser processing device. During operation, the device is debugged to ensure normal operation. The workpiece is then fixed at the moving end of the displacement mechanism. Processing parameters are imported into the control system of the femtosecond laser processing device for laser focus positioning. The first layer of holes is drilled on the workpiece, and the hole quality is monitored online by a monitoring component. Layered cutting is performed according to a set path. During processing, the workpiece status is monitored in real time until completion. Furthermore, depending on the required processing accuracy and speed, a femtosecond laser galvanometer processing component or the aforementioned laser objective lens processing component can be selected to perform micro / nano processing and laser micro-hole processing on the workpiece. This invention utilizes femtosecond laser micro / nano processing and micro-hole processing, achieving high processing accuracy and efficiency, and is suitable for processing difficult-to-machine metals and non-metallic materials.

Description

Technical Field

[0001] This utility model belongs to the field of laser processing technology, and in particular relates to a femtosecond laser processing device. Background Technology

[0002] In existing technologies, difficult-to-machine metallic materials such as titanium alloys, high-temperature alloys, and high-manganese steel typically present significant challenges in micro / nano fabrication and micro-hole machining. These materials may possess characteristics such as high hardness, high strength, and high melting points, leading to significant processing difficulties and low efficiency. Conversely, difficult-to-machine non-metallic materials such as silica, ceramics, and diamond exhibit extremely high hardness during processing. Micro / nano fabrication of these materials typically employs etching, electrochemical machining, and ion beam etching. These methods involve removing one or more layers from the material surface to form a specific shape, and are used in the manufacture of semiconductor devices and microelectromechanical systems (MEMS). However, these methods are challenging and lack high precision, and are suitable for various processing requirements and material properties. Micro-hole machining technologies for difficult-to-machine materials include mechanical micro-drilling, micro-electrical discharge machining, electrochemical machining, and various hybrid micromachining processes. Each technology has its own focus in high aspect ratio micro-hole machining, but all suffer from process bottlenecks, making it difficult to simultaneously achieve optimal processing speed, hole quality, and tool life. Mechanical micro-drill bits for difficult-to-machine metal materials have poor rigidity, making them prone to vibration and wobbling. This leads to a decrease in the roundness and straightness of the hole, and makes chip removal and lubrication difficult. In deep holes, chip accumulation can cause drill blockage or overheating, and the drill bit is prone to breakage and severe wear, especially in hard and brittle materials where its lifespan is extremely short. In micro-electrical discharge machining, the viscous fluid in the discharge gap hinders the cleaning of the spark gap, making slag removal difficult in deep holes and easily causing machining instability. Laser processing has low processing efficiency and high machine tool and power supply costs. Laser processing tools wear out quickly, and the hole wall shape is easily distorted, accompanied by obvious hole taper. Electrochemical machining has a very small gap between the electrode and the workpiece, making it difficult to distribute the local electric field intensity evenly, which can easily lead to over-corrosion or dead zones. It also has a low processing speed, a complex control system, and high requirements for electrolytes and the environment.

[0003] To address this, a femtosecond laser processing device is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a femtosecond laser processing device to solve the above-mentioned problems.

[0005] To achieve the above objectives, this utility model provides the following solution:

[0006] A femtosecond laser processing device, comprising:

[0007] A displacement mechanism, wherein the moving end of the displacement mechanism is used to mount a workpiece;

[0008] A lifting mechanism, the movable end of which is used to install a femtosecond laser galvanometer processing assembly and a laser objective lens processing assembly, both of which are located directly above the workpiece;

[0009] Fixed optical path assembly, used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator;

[0010] An active optical path assembly is disposed at the moving end of the lifting mechanism. The active optical path assembly is used to receive the femtosecond laser beam reflected by the fixed optical path assembly. The active optical path assembly is used to guide the femtosecond laser beam to the femtosecond laser galvanometer processing assembly or the laser objective lens processing assembly through the optical path switching assembly.

[0011] Preferably, the fixed optical path assembly includes:

[0012] The first reflecting lens is used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator;

[0013] The second reflecting lens is used to receive and reflect the femtosecond laser beam reflected by the first reflecting lens;

[0014] A first reflecting mirror is used to receive and reflect the femtosecond laser beam reflected by the first reflecting lens, and the first reflecting mirror reflects the femtosecond laser beam to the active optical path component;

[0015] The second housing is disposed outside the first reflecting lens, the second reflecting lens and the first reflecting mirror, and the second housing has an opening for the femtosecond laser beam to enter.

[0016] Preferably, the active optical path component includes:

[0017] The second reflector is used to receive and reflect the femtosecond laser beam reflected by the first reflector;

[0018] The second beam expander is used to receive the femtosecond laser beam reflected by the second reflector and expand the femtosecond laser beam. The femtosecond laser galvanometer processing assembly receives the femtosecond laser beam expanded by the second beam expander.

[0019] The third reflector is used to receive and reflect the femtosecond laser beam reflected by the second reflector;

[0020] The first beam expander is used to receive the femtosecond laser beam reflected by the third mirror and expand the femtosecond laser beam. The laser objective lens processing assembly receives the femtosecond laser beam expanded by the first beam expander.

[0021] The third housing is installed outside the second reflector, the second beam expander, the third reflector, and the first beam expander. The third housing is fixedly connected to the moving end of the lifting mechanism. The second reflector, the second beam expander, the third reflector, and the first beam expander are all fixedly installed inside the third housing.

[0022] An opaque partition is provided between the second beam expander and the first beam expander, and the partition is fixed inside the third housing.

[0023] Preferably, the optical path switching component includes:

[0024] A fourth reflector is disposed between the second reflector and the second beam expander, and is used to reflect the femtosecond laser beam reflected by the second reflector to the first beam expander;

[0025] A lifting assembly is provided, wherein the lifting end of the lifting assembly is fixedly installed with the fourth reflector. When the fourth reflector rises, the femtosecond laser beam reflected by the second reflector enters the second beam expander. When the fourth reflector falls, the femtosecond laser beam reflected by the second reflector is reflected by the fourth reflector and then enters the first beam expander.

[0026] Preferably, a monitoring component is provided on one side of the femtosecond laser galvanometer processing assembly and the laser objective lens processing assembly to monitor the processing status of the workpiece. The monitoring component includes a first monitoring structure and a second monitoring structure with identical structures, and the first monitoring structure and the second monitoring structure are respectively provided corresponding to the femtosecond laser galvanometer processing assembly and the laser objective lens processing assembly.

[0027] The first monitoring structure includes:

[0028] The first mounting bracket is fixedly installed on one side of the femtosecond laser galvanometer processing assembly;

[0029] A second CCD camera is fixedly mounted on the first mounting bracket, with the imaging lens of the second CCD camera facing the workpiece;

[0030] The first upright is fixedly installed on the first mounting bracket by bolts. The first upright has a vertical through groove, and the bolt is slidably connected in the through groove.

[0031] The second adjusting lens tube is fixedly installed at the bottom of the first stand. The second adjusting lens tube is set corresponding to the lens of the second CCD camera and is positioned between the second CCD camera and the workpiece.

[0032] Preferably, the top of the second reflector is fixedly connected to and communicates with an inner cylinder, and an outer cylinder is coaxially sleeved on the outside of the inner cylinder, and the outer cylinder is fixedly connected to and communicates with the first reflector.

[0033] Preferably, the displacement mechanism is fixedly installed on the top surface of the support plate, and two supports are fixedly connected to the top surface of the support plate. The two supports are located on opposite sides of the support plate, and a crossbeam is fixedly connected between the top ends of the two supports. The femtosecond laser generator, the fixed optical path assembly, and the lifting mechanism are all fixedly installed on the crossbeam.

[0034] Preferably, the support plate is fixedly installed in the middle of the outer casing. The support plate divides the inner cavity of the outer casing into a processing cavity and an equipment cavity. The equipment cavity is located below the support plate. A power supply is fixedly installed in the equipment cavity. A feed port and several ventilation ports are opened on the outer wall of the power supply. The ventilation ports are connected to the equipment cavity. A dustproof net is fixedly connected to the circumferential part of the ventilation port. The feed port is correspondingly arranged with the processing cavity. A casing door is detachably connected to the feed port.

[0035] Preferably, the bottom of the outer casing is equipped with multiple rollers and multiple lifting feet, and the multiple lifting feet are located at the four corners of the bottom surface of the outer casing.

[0036] Compared with the prior art, the present invention has the following advantages and technical effects:

[0037] When the device of this utility model is in operation, it is first debugged to ensure that the equipment can work normally. Then, the workpiece is fixed on the moving end of the displacement mechanism. The processing parameters are imported into the control system of the femtosecond laser processing device for laser focus positioning. The first layer of drilling is completed on the workpiece. The quality of the hole is detected online by the monitoring component. Layer cutting is performed according to the set path. During the processing, the status of the workpiece is monitored in real time by the monitoring component until the processing is completed. After the workpiece is removed, it is cleaned and microscopically inspected to confirm that the hole diameter, depth and taper meet the design requirements. The processing is completed. During processing, the femtosecond laser galvanometer processing component or the laser objective lens processing component can be selected to process difficult-to-machine materials according to the processing accuracy and processing speed requirements. It is applicable to the micro-nano processing of materials such as titanium alloys, high temperature alloys and high manganese steel, as well as the micro-hole processing of high hardness and brittle materials, forming specific shapes.

[0038] This invention uses femtosecond laser to process micro-holes with high aspect ratios on workpieces, resulting in low processing costs, high processing accuracy, and fast processing efficiency. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0041] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0042] Figure 3 This is a schematic diagram of the fixed optical path assembly in this utility model;

[0043] Figure 4 This is a schematic diagram of the overall structure of the active optical path component in this utility model;

[0044] Figure 5 This is a schematic diagram of the internal structure of the active optical path component in this utility model;

[0045] The components include: 1. Warning light; 2. External casing; 3. Casing door; 4. Control panel; 5. Casters; 6. Lifting feet; 7. Ventilation vent; 8. Dustproof net; 10. Power supply; 11. Support; 12. Crossbeam; 13. Load-bearing plate; 14. First housing; 15. Second housing; 16. X-axis moving assembly; 17. Y-axis moving assembly; 18. Z-axis moving assembly; 19. Femtosecond laser generator; 20. First reflecting lens; 21. Second reflecting lens; 22. First reflecting mirror; 23. Outer cylinder; 24. Inner cylinder. 25. Mounting plate; 27. Three-dimensional galvanometer; 28. First mounting bracket; 29. ​​First support frame; 30. Second mounting bracket; 31. Second support frame; 32. First CCD camera; 33. First adjusting lens tube; 34. Second CCD camera; 35. Second adjusting lens tube; 36. Cleaning assembly; 37. Red light indicator; 38. Second reflecting mirror; 39. Third reflecting mirror; 40. First beam expander; 41. Fourth reflecting mirror; 42. Lifting assembly; 43. Second beam expander; 45. Fifth reflecting mirror; 46. Objective lens. Detailed Implementation

[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0047] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] Reference Figures 1 to 5 This utility model discloses a femtosecond laser processing device, comprising:

[0049] The moving end of the displacement mechanism is used to mount the workpiece;

[0050] The lifting mechanism, the moving end of which is used to install the femtosecond laser galvanometer processing assembly and the laser objective lens processing assembly, are both located directly above the workpiece.

[0051] A fixed optical path assembly is used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator 19;

[0052] The movable optical path component is located at the moving end of the lifting mechanism. The movable optical path component is used to receive the femtosecond laser beam reflected by the fixed optical path component. The movable optical path component is used to guide the femtosecond laser beam to the femtosecond laser galvanometer processing component or the laser objective lens processing component through the optical path switching component.

[0053] The main working components of the femtosecond laser galvanometer processing assembly include the three-dimensional galvanometer 27, and the main working components of the laser objective lens processing assembly include the objective lens 46.

[0054] Ultrafast laser multifocal parallel processing splits a single laser beam into multiple beams through optical field manipulation, simultaneously focusing them on the material surface or interior to complete the processing. By optimizing precision with objective lenses, processing efficiency can be significantly improved. The objective lens can precisely control the material's light energy absorption, offering advantages such as high processing accuracy, low thermal effect, and low environmental requirements. This technology is particularly suitable for surface micro / nano texturing and laser micro-hole processing.

[0055] A cleaning component 36 is disposed below the three-dimensional galvanometer 27. The cleaning component 36 is fixedly mounted on the mounting plate 25. In one optional embodiment, the cleaning component 36 includes a ring body. The femtosecond laser beam of the three-dimensional galvanometer 27 passes through the middle of the ring body. A ventilation cavity is provided in the circumferential direction of the ring body. Multiple air holes are provided at equal intervals in the circumferential direction at the bottom end of the ring body. The multiple air holes are all connected to the ventilation cavity. The ventilation cavity is connected to an external air source to blow away the debris on the workpiece.

[0056] The displacement mechanism includes an X-axis moving component 16, and a Y-axis moving component 17 is fixedly installed on the movable end of the X-axis moving component 16. The workpiece is fixed to the movable end of the Y-axis moving component 17 by a negative pressure adsorption mechanism.

[0057] The lifting mechanism includes a Z-axis moving assembly 18, which is fixedly mounted on the crossbeam 12, and a movable optical path assembly is fixedly mounted on the movable end of the movable optical path assembly.

[0058] The X-axis moving assembly 16 includes a mounting groove, which is fixedly connected to the top surface of the support plate 13. A ball screw is rotatably connected inside the mounting groove. The ball screw is arranged along the length direction of the mounting groove. One end of the ball screw passes through the mounting groove and is coaxially fixed to the output shaft of the servo motor. The servo motor is fixedly mounted on the mounting groove. The X-axis moving assembly 16, the Y-axis moving assembly 17, and the Z-axis moving assembly 18 have the same structure.

[0059] Further optimization of the scheme, the fixed optical path components include:

[0060] The first reflecting lens 20 is used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator 19.

[0061] The second reflecting lens 21 is used to receive and reflect the femtosecond laser beam reflected by the first reflecting lens 20;

[0062] The first reflector 22 is used to receive and reflect the femtosecond laser beam reflected by the first reflector lens 20. The first reflector 22 reflects the femtosecond laser beam to the active optical path component.

[0063] The second housing 15 is disposed on the outside of the first reflecting lens 20, the second reflecting lens 21 and the first reflecting mirror 22, and the second housing 15 has an opening for the femtosecond laser beam to enter.

[0064] The femtosecond laser generator 19 is covered by a first housing 14, which is connected to a second housing 15. Both the first housing 14 and the second housing 15 are fixed to the crossbeam 12.

[0065] The solution has been further optimized, and the active optical path components include:

[0066] The second reflector 38 is used to receive and reflect the femtosecond laser beam reflected by the first reflector 22;

[0067] The second beam expander 43 is used to receive the femtosecond laser beam reflected by the second reflector 38 and expand the femtosecond laser beam. The femtosecond laser galvanometer processing assembly receives the femtosecond laser beam expanded by the second beam expander 43.

[0068] The third reflector 39 is used to receive and reflect the femtosecond laser beam reflected by the second reflector 38;

[0069] The first beam expander 40 is used to receive the femtosecond laser beam reflected by the third reflector 39 and expand the femtosecond laser beam. The laser objective lens processing assembly receives the femtosecond laser beam expanded by the first beam expander 40.

[0070] Among them, a fifth reflecting mirror 45 is provided above the objective lens 46. The fifth reflecting mirror 45 reflects the light emitted by the first beam expander 40 to the objective lens 46 to process the workpiece.

[0071] The third housing is installed outside the second reflector 38, the second beam expander 43, the third reflector 39, and the first beam expander 40. The third housing is fixedly connected to the moving end of the lifting mechanism. The second reflector 38, the second beam expander 43, the third reflector 39, and the first beam expander 40 are all fixedly installed inside the third housing.

[0072] An opaque partition is provided between the second beam expander 43 and the first beam expander 40, and the partition is fixed inside the third housing.

[0073] Further optimization of the solution includes the following optical path switching components:

[0074] The fourth reflector 41 is disposed between the second reflector 38 and the second beam expander 43, and is used to reflect the femtosecond laser beam reflected by the second reflector 38 to the first beam expander 40.

[0075] The lifting assembly 42 has a fourth reflector 41 fixedly installed at its lifting end. When the fourth reflector 41 rises, the femtosecond laser beam reflected by the second reflector 38 enters the second beam expander 43. When the fourth reflector 41 falls, the femtosecond laser beam reflected by the second reflector 38 enters the first beam expander 40 after being reflected by the fourth reflector 41.

[0076] The lifting assembly 42 includes a servo motor fixed to the inner wall of the third housing. One end of a connecting rod is fixed to the output shaft of the servo motor, and a pulley is installed at the other end of the connecting rod. A slide rail is vertically fixed to the inner wall of the third housing, and a slider is vertically slidably connected to the slide rail. A fourth reflector 41 is fixedly installed on the slider and is correspondingly arranged with the second reflector 38. A horizontally arranged groove is opened on one side of the slider, and the pulley is slidably connected in the groove. With this arrangement, when the servo motor rotates, the pulley is displaced with the connecting rod, which drives the slider to move up and down. The pulley is horizontally slidably connected in the groove and will not cause interference.

[0077] To further optimize the scheme, a monitoring component is set on one side of the femtosecond laser galvanometer processing component and the laser objective lens processing component to monitor the processing status of the workpiece. The monitoring component includes a first monitoring structure and a second monitoring structure with the same structure. The first monitoring structure and the second monitoring structure are respectively set to correspond to the femtosecond laser galvanometer processing component and the laser objective lens processing component.

[0078] The first monitoring structure includes:

[0079] The first mounting bracket 28 is fixedly mounted on one side of the femtosecond laser galvanometer processing assembly;

[0080] The second CCD camera 34 is fixedly mounted on the first mounting bracket 28, with the imaging lens of the second CCD camera 34 facing the workpiece;

[0081] The first upright frame 29 is fixedly installed on the first mounting frame 28 by bolts. The first upright frame 29 has a vertical through groove, and the bolts are slidably connected in the through groove.

[0082] The second adjusting lens tube 35 is fixedly installed at the bottom of the first stand 29. The second adjusting lens tube 35 is set in correspondence with the lens of the second CCD camera 34 and is set between the second CCD camera 34 and the workpiece.

[0083] The second monitoring structure includes a second mounting bracket 30 fixedly mounted on the third housing. A first CCD camera 32 is fixedly mounted on the second mounting bracket 30 and is located on one side of the laser objective lens processing assembly. A second support frame 31 is fixedly mounted on the second mounting bracket 30 by bolts. A vertical through groove is opened on the second support frame 31 and the bolts are slidably connected in the through groove. A first adjusting lens tube 33 is fixedly mounted at the bottom end of the second support frame 31. The first adjusting lens tube 33 is correspondingly set with the first CCD camera 32 and is located between the first CCD camera 32 and the workpiece.

[0084] With this setup, when the laser objective processing assembly is working, the first CCD camera 32 moves with the laser objective processing assembly to detect the workpiece processing status; when the femtosecond laser galvanometer processing assembly is working, the second CCD camera 34 moves with the femtosecond laser galvanometer processing assembly to detect the workpiece processing status; loosening the screws can adjust the height of the first stand 29 or the second stand 31, and thus adjust the height of the first adjusting lens tube 33 or the second adjusting lens tube 35 to achieve zoom, thereby enabling clear monitoring of micro-holes of different sizes during processing;

[0085] LED light sources and temperature sensors are provided below the first adjustment lens tube 33 and the second adjustment lens tube 35. The LED light source makes the first CCD camera 32 and the second CCD camera 34 capture clearer images, and the temperature sensor is used to monitor the workpiece temperature.

[0086] In a further optimized design, the top of the second reflector 38 is fixedly connected to and connected to the inner cylinder 24, and the outer cylinder 23 is coaxially sleeved on the outside of the inner cylinder 24. The outer cylinder 23 is fixedly connected to and connected to the first reflector 22.

[0087] In a further optimized design, the displacement mechanism is fixedly installed on the top surface of the bearing plate 13. Two supports 11 are fixedly connected to the top surface of the bearing plate 13. The two supports 11 are located on opposite sides of the bearing plate 13. A crossbeam 12 is fixedly connected between the top ends of the two supports 11. The femtosecond laser generator 19, the fixed optical path assembly, and the lifting mechanism are all fixedly installed on the crossbeam 12.

[0088] In a further optimized design, the support plate 13 is fixedly installed in the middle of the outer casing 2. The support plate 13 divides the inner cavity of the outer casing 2 into a processing cavity and an equipment cavity. The equipment cavity is located below the support plate 13. A power supply 10 is fixedly installed inside the equipment cavity. A feed port and several ventilation ports 7 are provided on the outer wall of the power supply 10. The ventilation ports 7 are connected to the equipment cavity. A dustproof net 8 is fixedly connected to the inner circumference of the ventilation port 7. The feed port is set correspondingly to the processing cavity. A casing door 3 is detachably connected inside the feed port.

[0089] The outer casing 2 is also fixedly installed with a warning light 1 and a control panel 4. The control panel 4 contains a control mechanism, which is a PLC controller or a small computer. The control panel 4 is electrically connected to the warning light 1, the power supply 10, the X-axis movement component 16, the Y-axis movement component 17, the Z-axis movement component 18, the femtosecond laser generator 19, the first CCD camera 32, the second CCD camera 34, the red light indicator 37, and the lifting component 42. The power supply 10 is used to supply power to the entire device.

[0090] Further optimization of the design: multiple casters 5 and multiple lifting feet 6 are installed at the bottom of the outer casing 2. The multiple lifting feet 6 and multiple lifting feet 6 are located at the four corners of the bottom surface of the outer casing 2.

[0091] A method for using a femtosecond laser processing device, based on the femtosecond laser processing device, includes the following steps:

[0092] The equipment is debugged, and the workpiece is fixed on the moving end of the displacement mechanism. Based on the planned processing path, the laser focus is positioned on the workpiece, and the laser beam emitted by the femtosecond laser galvanometer processing component or laser objective lens processing component is used to complete the first layer of drilling on the workpiece. The quality of the hole on the workpiece is detected online. The workpiece is then cut in layers according to the planned path using the laser beam emitted by the femtosecond laser galvanometer processing component or laser objective lens processing component. The status of the workpiece is monitored in real time during the processing until the processing is completed. After the workpiece is removed, it is cleaned and microscopically inspected to confirm that the hole diameter, depth and taper all meet the design requirements.

[0093] One specific example:

[0094] The femtosecond laser processing device includes an outer casing 2, with a support plate 13 fixedly connected to the middle of the outer casing 2. The support plate 13 divides the inner cavity of the outer casing 2 into a processing cavity and an equipment cavity. The equipment cavity is located below the support plate 13, and a power supply 10 is fixedly installed inside the equipment cavity. The outer wall of the power supply 10 has a feed inlet and several ventilation openings 7, which are connected to the equipment cavity. A dustproof mesh 8 is fixedly connected to the inner circumference of the ventilation opening 7. The feed inlet is correspondingly set to the processing cavity, and a casing door 3 is detachably connected inside the feed inlet. Two supports 11 are fixedly connected to the top surface of the support plate 13, located on opposite sides of the support plate 13. A crossbeam 12 is fixedly connected between the top ends of the two supports 11. The device also includes a femtosecond laser generator 19, a first reflecting lens 20, a second reflecting lens 21, and a first reflecting mirror 2. Both are fixedly mounted on the crossbeam 12. The femtosecond laser generator 19 is covered by a first housing 14. The first reflecting lens 20, the second reflecting lens 21, and the first reflecting mirror 22 are covered by a second housing 15. The second housing 15 and the first housing 14 are both fixedly mounted on the crossbeam 12. The movable end of the Z-axis moving assembly 18 is fixedly mounted with a mounting plate 25. A third housing is fixedly mounted on the mounting plate 25. The third housing contains a first beam expander 40 and a second beam expander 43 arranged in parallel. A partition is provided between the first beam expander 40 and the second beam expander 43. The partition is fixedly mounted inside the third housing. One end of the third housing is fixedly connected to and communicates with a second reflecting mirror 38. A distance is left between the partition and the end of the third housing near the second reflecting mirror 38. The top of the reflector 38 is fixedly connected to and connected to the inner cylinder 24. An outer cylinder 23 is coaxially sleeved on the outside of the inner cylinder 24. The outer cylinder 23 is fixedly installed at the bottom of the first reflector 22. A third reflector 39 is fixedly installed inside the third housing. The third reflector 39 is correspondingly arranged with the first beam expander 40. The second reflector 38 is correspondingly arranged with the second beam expander 43. A fourth reflector 41 is arranged between the second reflector 38 and the second beam expander 43. The fourth reflector 41 is fixedly installed at the lifting end of the lifting assembly 42. The fourth reflector 41 is correspondingly arranged with the third reflector 39. A refractive lens and a sixth reflector are also arranged between the second beam expander 43 and the three-dimensional galvanometer 27. A red light indicator 37 is arranged above the refractive lens. The light emitted by the second beam expander 43... Light can pass through the refracting lens and illuminate the sixth reflecting mirror. The sixth reflecting mirror reflects the femtosecond laser beam onto the three-dimensional galvanometer 27 to process the workpiece. The red light indicator 37 emits red light, which is refracted by the refracting lens and illuminates the sixth reflecting mirror. The sixth reflecting mirror reflects the red light onto the three-dimensional galvanometer 27 and then illuminates the workpiece, thus performing the function of processing positioning. The first monitoring structure includes: a first mounting bracket 28, which is fixedly installed on one side of the femtosecond laser galvanometer processing assembly; a second CCD camera 34, which is fixedly installed on the first mounting bracket 28, with the imaging lens of the second CCD camera 34 facing the workpiece; and a first upright bracket 29, which is fixedly installed on the first mounting bracket 28 by bolts. The first upright bracket 29 has a vertical through groove, and the bolts are slidably connected in the through groove.The second adjusting lens tube 35 is fixedly installed at the bottom end of the first stand 29. The second adjusting lens tube 35 is correspondingly set with the lens of the second CCD camera 34, and is positioned between the second CCD camera 34 and the workpiece.

[0095] The second monitoring structure includes a second mounting bracket 30 fixedly mounted on the third housing. A first CCD camera 32 is fixedly mounted on the second mounting bracket 30 and is located on one side of the laser objective lens processing assembly. A second support frame 31 is fixedly mounted on the second mounting bracket 30 by bolts. A vertical through groove is opened on the second support frame 31 and the bolts are slidably connected in the through groove. A first adjusting lens tube 33 is fixedly mounted at the bottom end of the second support frame 31. The first adjusting lens tube 33 is correspondingly set with the first CCD camera 32 and is located between the first CCD camera 32 and the workpiece.

[0096] With this setup, when the laser objective processing assembly is working, the first CCD camera 32 moves with the laser objective processing assembly to detect the workpiece processing status; when the femtosecond laser galvanometer processing assembly is working, the second CCD camera 34 moves with the femtosecond laser galvanometer processing assembly to detect the workpiece processing status; loosening the screws can adjust the height of the first stand 29 or the second stand 31, and thus adjust the height of the first adjusting lens tube 33 or the second adjusting lens tube 35 to achieve zoom, thereby enabling clear monitoring of micro-holes of different sizes during processing;

[0097] LED light sources and temperature sensors are provided below the first adjustment lens tube 33 and the second adjustment lens tube 35. The LED light source makes the first CCD camera 32 and the second CCD camera 34 capture clearer images, and the temperature sensor is used to monitor the workpiece temperature.

[0098] A cleaning component 36 is disposed below the three-dimensional galvanometer 27. The cleaning component 36 is fixedly mounted on the mounting plate 25. In one optional embodiment, the cleaning component 36 includes a ring body. The femtosecond laser beam of the three-dimensional galvanometer 27 passes through the middle of the ring body. A ventilation cavity is provided in the circumferential direction of the ring body. Multiple air holes are provided at equal intervals in the circumferential direction at the bottom end of the ring body. The multiple air holes are all connected to the ventilation cavity. The ventilation cavity is connected to an external air source to blow away the debris on the workpiece.

[0099] The X-axis moving assembly 16 includes a mounting groove, which is fixedly connected to the top surface of the support plate 13. A ball screw is rotatably connected inside the mounting groove. The ball screw is arranged along the length direction of the mounting groove. One end of the ball screw passes through the mounting groove and is coaxially fixedly connected to the output shaft of the servo motor. The servo motor is fixedly mounted on the mounting groove. The X-axis moving assembly 16, the Y-axis moving assembly 17, and the Z-axis moving assembly 18 have the same structure.

[0100] Femtosecond lasers utilize ultrashort pulses to achieve a "cold processing" effect, avoiding the heat-affected zone and molten recast layer associated with traditional nanosecond lasers. The ultrafast energy deposition rate of femtosecond lasers causes the material to vaporize instantaneously near the ablation threshold without significant heat conduction to the surrounding substrate, thus preventing the formation of a thick recast layer or cracks. The femtosecond laser processing zone exhibits no visible molten area or microcracks, and the hole wall surface displays an extremely fine plastic deformation layer, only a few micrometers thick.

[0101] This novel femtosecond laser generator 19 uses a green femtosecond laser with a center wavelength of 532nm, and focuses the pulses to a spot size of tens of micrometers or even smaller through a precision optical system. The pulse repetition frequency setting of 1kHz–1MHz allows for flexible switching between the material removal rate and the hole wall quality. The combination of low energy density and high frequency enables deep hole machining while maintaining a smooth hole wall.

[0102] By introducing a first CCD camera 32 and a second CCD camera 34, the hole depth and hole wall condition can be observed in real time during processing. By analyzing backscattered signals or plasma radiation, the material removal status and potential damage can be determined. This monitoring data can serve as feedback input for closed-loop control, further ensuring processing stability and quality consistency.

[0103] Employing a femtosecond laser source and a six-axis linkage machining platform, this invention achieves multi-scale machining capabilities, ranging from micrometer-level (e.g., 50μm dense lines) to millimeter-level (e.g., 1900×1500mm large-format glass). The invention also utilizes a three-dimensional galvanometer and a CNC rotary dual-axis collaborative control technology to address the issues of low drilling efficiency and poor hole shape accuracy in drilling high aspect ratio micro-holes on complex three-dimensional curved surfaces and irregularly shaped cavities. This invention constructs a three-dimensional galvanometer and multi-axis collaborative motion system and proposes an opto-mechatronics integrated coordinated control strategy, forming an intelligent control model suitable for high-precision laser drilling operations.

[0104] First, a multi-axis linkage model of laser output, galvanometer deflection, and rotary table movement is established at the software level, and the drilling path is precisely planned through a numerical control (NC) program. During actual machining, the galvanometer and the worktable move synchronously, enabling the laser beam to focus and scan on arbitrary curved surfaces and angles. For the characteristics of laser drilling on complex three-dimensional surfaces, this invention adopts a "galvanometer-motor" joint scanning strategy: the system intelligently adjusts the laser energy density and focal point position according to the curvature, hole diameter, and depth requirements of the current area, effectively avoiding common problems in traditional drilling such as focal point drift, energy accumulation, and excessive hole wall taper. The core control algorithm of this system is called the "galvanometer-platform linkage drilling control algorithm," which includes the following:

[0105] Galvanometer dynamic focusing

[0106] By measuring the three-dimensional spatial distance between the laser beam path and the workpiece surface in real time, the focal length deviation is calculated and compensated.

[0107] During the deflection process, the galvanometer continuously adjusts the optical focal length to ensure that the laser beam is always focused on the opening or bottom of the hole, avoiding the spread of the laser spot and energy attenuation caused by the undulation of the workpiece surface. This allows the laser to maintain a constant energy density in the processing of deep holes and inclined holes, greatly improving the perpendicularity and smoothness of the hole wall.

[0108] Dynamic programming of motor motion

[0109] The CNC rotary dual-axis (i.e., rotary table and tilting axis) moves synchronously according to the pre-calculated drilling trajectory;

[0110] The motion control algorithm combines the current drilling position, surface geometry, and galvanometer scanning range to optimize the rotation speed and tilt angle change curves in real time.

[0111] By using smooth interpolation and acceleration / deceleration control, overshoot or jerking during drilling is avoided, reducing hole diameter error and thermal damage to the hole wall.

[0112] High-speed galvanometer interpolation scanning mechanism

[0113] During rotary table or tilting axis movement, the system can quickly identify the "depth boundary line" and curved surface boundary point on the drilling path;

[0114] The galvanometer deflects at a tiny angle in a local area at a speed of kilohertz to compensate for the spatial blind spot of the motor movement and achieve precise tracking of drilling details.

[0115] This mechanism not only ensures the geometric consistency of micropores with complex morphology, but also enables rapid conversion at different depths and angles, improving processing efficiency and stability.

[0116] Traditional laser penetration and circular cutting often result in large hole taper and poor slag removal in high aspect ratio hole machining due to uneven spot size and energy distribution. Helical circumferential scanning achieves uniform energy distribution across the hole cross-section by combining two stages: center-peripheral helical expansion and outer-inner helical retracement. It also moves downwards in small steps during each circumference, continuously cutting and removing slag.

[0117] In practice, the control system draws a spiral curve in a two-dimensional plane. The laser beam moves along the curve and outputs a stable signal. Simultaneously, the Z-axis moves down layer by layer with a preset step size. After each spiral layer is completed, the direction of movement reverses, forming a closed-loop, meandering cut from the inside out and then from the outside in. This method combines the advantages of penetration and looping, ensuring rapid initial hole opening while enhancing hole wall trimming and slag removal during subsequent looping.

[0118] Experimental results show that, compared with conventional circular scanning, spiral zigzag scanning can reduce the width of the heat-affected zone on the hole wall, decrease the hole wall roughness, and increase the depth within the same processing time. Furthermore, this strategy is independent of spot size and can uniformly distribute energy across various laser modes.

[0119] During path planning, CAM software needs to consider the pitch, number of spiral turns, and interlayer step distance. Parameter scanning experiments are used to optimize the ratio of spiral spacing to laser power, balancing processing efficiency and hole quality. Combined with high-speed photography and backscatter monitoring, the slag removal status can be assessed in real time, and the scanning speed or number of repeats can be automatically adjusted when necessary, further improving the stability of deep hole machining.

[0120] Intelligent closed-loop adaptive control of femtosecond laser processing parameters

[0121] To overcome the process differences when machining multiple materials, thicknesses, and irregular curved surfaces, this solution introduces a real-time closed-loop intelligent control system. The core of this system is the integration of multiple sensors (backscattered light, workpiece temperature, and focal position) into the machine, with signals acquired at a rate exceeding 50kHz via a high-speed data acquisition module.

[0122] The collected data is first preprocessed, then input into machine learning or statistical optimization algorithms to evaluate the current removal efficiency, hole depth growth rate and slag removal effect in real time, and compare it with preset targets (hole diameter, roundness and taper) to quickly calculate the optimal combination of the next pulse energy, repetition frequency, single-layer downward step distance and defocusing amount.

[0123] The control algorithm automatically updates the model parameters after each layer of cutting, enabling online learning and adaptation. For different materials, the system initially uses a pre-trained model to provide a parameter baseline, and as the processing progresses, the taper of the final-stage hole can be reduced.

[0124] Furthermore, the closed-loop system can coordinate with multi-axis platforms to dynamically adjust the laser incident angle and power density distribution for complex curved surfaces, maintaining a constant focal spot size and cutting depth. Key machining parameters are displayed in real-time via a human-machine interface, and alarms or automatic shutdowns are triggered when parameters exceed limits or potential defects occur, ensuring a safe and reliable machining process.

[0125] The laser micro-hole drilling system adopts an open CNC architecture design. Its core hardware consists of a modular system composed of an industrial control computer (IPC) and a PMAC multi-axis motion controller. The IPC directly integrates the PMAC through a PCI bus slot. The multi-axis controller is responsible for high-frequency pulse interpolation and servo drive, forming a master-slave control structure: the IPC handles the human-machine interface and process management, while the PMAC is dedicated to high-precision linkage of the XYZ axes and rotary (or tilting) axes, galvanometers, etc. The two establish a dual-channel data link through bus communication and dual-port RAM (DPRAM)—bus communication transmits path coordinates and command queries, while DPRAM achieves millisecond-level real-time data interaction, significantly improving the response speed and interpolation accuracy (up to ±0.01mm) during five-axis linkage drilling. The system expansion layer connects to a multi-functional I / O interface board through the PMAC expansion slot, centrally managing 32 digital signals (such as laser trigger, pneumatic valve, emergency stop, etc.) and integrating a laser focus sensor and handwheel fine-tuning device to achieve closed-loop focusing and position fine-tuning during deep hole drilling. The actuator consists of three sets of AC servo units: the X / Y / Z axis drivers employ fully digital PWM control, coupled with a 17-bit absolute encoder to achieve nanometer-level positioning; the Z-axis dynamic focusing module can automatically compensate for the focal position according to the workpiece height, ensuring consistent hole depth; and the rotary (or tilting) axis is used for adjusting the micro-hole incident angle. The system also uses a PCI-1716 data acquisition card to monitor laser power and optical path stability in real time, forming a complete CNC closed loop, ensuring the stability, accuracy, and repeatability of high aspect ratio micro-hole drilling.

[0126] Specific work steps:

[0127] (1) Process planning and project initialization: Arrange the micro-hole positions / parameters in CAD / CAM, and call the database to determine the initial settings for the linkage between the femtosecond laser and the galvanometer platform.

[0128] (2) Equipment and optical path debugging: calibrate the 532nm femtosecond laser optical path, galvanometer deflection and rotary stage positioning, and start the online monitoring sensor.

[0129] (3) Design the microstructure or micropore pattern to be processed;

[0130] (4) Dynamic focusing and initial hole opening: In the early stage of processing, the laser focus is positioned and the femtosecond pulse completes the first layer penetration with the cooperation of the galvanometer platform, and the hole quality is detected online.

[0131] (5) Spiral detour layered scanning: Layered cutting is performed according to the spiral trajectory of center → outer periphery → center in reverse detour. The galvanometer and platform move synchronously to achieve uniform energy distribution and efficient slag removal.

[0132] (6) Closed-loop parameter adaptive: Real-time feedback from multiple sensors, and online adjustment of laser power, feed rate, defocusing amount, etc. through optimization algorithms to maintain the best aperture shape.

[0133] (7) Post-processing and acceptance: Slag removal and cleaning, workpiece disassembly and microscopic re-inspection, and finally confirmation that the hole diameter, depth and taper all meet the design requirements.

[0134] Advantages of femtosecond laser helical circumferential scanning

[0135] ① Not limited by spot size and energy distribution

[0136] Femtosecond laser helical circumferential scanning does not rely on the uniformity of the spot diameter or energy field distribution. It can obtain a stable and consistent aperture and depth under the same laser parameters, which greatly simplifies the requirements for optical system adjustment and improves the robustness and repeatability of the process.

[0137] ② Significantly improves aspect ratio and machining accuracy

[0138] This method has a large depth-to-diameter ratio when processing high-strength alloys such as stainless steel. Furthermore, by selecting the end radius angle, the depth-to-diameter ratio and the perpendicularity of the hole wall can be further improved within the optimal range of processing parameters, achieving an efficiency improvement of 30% compared to traditional through-hole or looping processes.

[0139] ③ Uniform energy coverage and efficient slag removal

[0140] The bidirectional spiral path from center to periphery and back to center, combined with layered downward movement, ensures that the laser beam energy covers the entire cross-section of the hole wall. The multi-turn detour cutting also removes slag, avoiding the hole blockage and energy shielding phenomena commonly seen in deep hole machining, thus improving machining stability.

[0141] ④ Low thermal impact and excellent pore wall quality

[0142] By employing a helical, circuitous approach combined with femtosecond pulses, heat accumulation and recast layer formation are reduced, resulting in a hole wall surface roughness down to the tens of nanometers level with no microcracks. Combined with closed-loop monitoring and parameter adjustment, the hole taper can be further optimized.

[0143] ⑤ Real-time online feedback optimization

[0144] The dynamic process of laser interaction with the hole wall during spiral tortuous machining can be captured in real time. By using backscatter feedback and a closed-loop algorithm, the number of scanning revolutions and the downward step distance can be adjusted in a timely manner, thereby achieving intelligent process and high consistency.

[0145] Advantages of intelligent closed-loop parameter adaptive control

[0146] ① Real-time online removal efficiency and pore wall condition monitoring

[0147] By using a backscattered light sensor to capture the scattering signal generated by the laser-material interaction in real time, the material removal rate and slag removal efficiency can be quantified online. When laser processing enters the deep hole stage and slag removal is not smooth, the backscattering intensity will decrease significantly. The system can immediately identify and adjust the laser energy or feed rate to avoid hole bottom blockage and processing stagnation, effectively ensuring the stability of drilling speed and the consistency of drilling depth.

[0148] ② High-precision hole positioning and topography visual feedback

[0149] The CCD monitoring system employs transmission / reflection imaging and high-pass filtering technology to clearly present the micro-hole and burr features of the working area. Combined with image processing algorithms, it can accurately extract the hole center position, hole opening / bottom geometric contours, and hole wall roughness. During processing, the vision system takes a "snapshot" of the hole shape every 0.1 seconds to promptly correct galvanometer-platform deviations, achieving micron-level calibration of hole diameter, roundness, and tilt angle.

[0150] ③Online monitoring of thermal effects and suppression of thermal damage

[0151] A temperature sensor monitors the temperature distribution in the laser processing zone in real time. When the sensor detects that the temperature exceeds a preset threshold, the system can automatically reduce the laser pulse energy or extend the pulse interval to prevent heat accumulation from causing slag recasting and microcrack formation. Experiments show that this strategy can reduce the width of the heat-affected zone by more than 30%, significantly improving the mechanical properties and fatigue life of the hole wall.

[0152] ④ Closed-loop adaptive parameter tuning based on multi-sensor fusion

[0153] Data from three sensors is collected via a high-speed FPGA data bus, and the optimal solution for processing parameters is calculated in real time by algorithms such as Bayesian optimization. This solution is then dynamically sent to the femtosecond laser pulse generator, galvanometer driver, and platform motion unit. During the closed-loop iteration process, the hole taper and diameter deviations can be corrected between two pulses, ensuring that the final hole taper is stably controlled at ≤0.3° and the hole diameter consistency reaches ±1μm, reducing the processing error by more than 50% compared to open-loop processing.

[0154] ⑤ Process self-diagnosis and safety assurance

[0155] The multi-sensor system not only monitors normal processing parameters but also detects abnormal conditions (such as a sudden drop in backscatter signal, visual frame loss, or a sudden temperature rise). Once any sensor data exceeds the limit, the system automatically triggers a "hole repair" or "shutdown warning" mechanism to prevent hole wall collapse, galvanometer defocusing, or workpiece damage, thus achieving intelligent self-diagnosis and safety assurance in deep hole processing.

[0156] In the description of this utility model, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0157] The embodiments described above are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. A femtosecond laser processing device, characterized in that, include: A displacement mechanism, wherein the moving end of the displacement mechanism is used to mount a workpiece; A lifting mechanism, the movable end of which is used to install a femtosecond laser galvanometer processing assembly and a laser objective lens processing assembly, both of which are located directly above the workpiece; A fixed optical path assembly is used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator (19); An active optical path assembly is disposed at the moving end of the lifting mechanism. The active optical path assembly is used to receive the femtosecond laser beam reflected by the fixed optical path assembly. The active optical path assembly is used to guide the femtosecond laser beam to the femtosecond laser galvanometer processing assembly or the laser objective lens processing assembly through the optical path switching assembly.

2. The femtosecond laser processing apparatus according to claim 1, characterized in that, The fixed optical path assembly includes: The first reflecting lens (20) is used to receive and reflect the femtosecond laser beam emitted by the femtosecond laser generator (19); The second reflecting lens (21) is used to receive and reflect the femtosecond laser beam reflected by the first reflecting lens (20); The first reflector (22) is used to receive and reflect the femtosecond laser beam reflected by the first reflective lens (20), and the first reflector (22) reflects the femtosecond laser beam to the active optical path component; The second housing (15) is disposed on the outside of the first reflecting lens (20), the second reflecting lens (21) and the first reflecting mirror (22), and the second housing (15) has an opening for the femtosecond laser beam to enter.

3. The femtosecond laser processing apparatus according to claim 2, characterized in that, The active optical path component includes: The second reflector (38) is used to receive and reflect the femtosecond laser beam reflected by the first reflector (22); The second beam expander (43) is used to receive the femtosecond laser beam reflected by the second reflector (38) and expand the femtosecond laser beam. The femtosecond laser galvanometer processing assembly receives the femtosecond laser beam expanded by the second beam expander (43). The third reflector (39) is used to receive and reflect the femtosecond laser beam reflected by the second reflector (38); The first beam expander (40) is used to receive the femtosecond laser beam reflected by the third reflector (39) and expand the femtosecond laser beam. The laser objective lens processing assembly receives the femtosecond laser beam expanded by the first beam expander (40). The third housing is installed on the outside of the second reflector (38), the second beam expander (43), the third reflector (39), and the first beam expander (40). The third housing is fixedly connected to the moving end of the lifting mechanism. The second reflector (38), the second beam expander (43), the third reflector (39), and the first beam expander (40) are all fixedly installed inside the third housing. An opaque partition is provided between the second beam expander (43) and the first beam expander (40), and the partition is fixed inside the third housing.

4. The femtosecond laser processing apparatus according to claim 3, characterized in that, The optical path switching component includes: A fourth reflector (41) is disposed between the second reflector (38) and the second beam expander (43) for reflecting the femtosecond laser beam reflected by the second reflector (38) to the first beam expander (40); The lifting assembly (42) has the fourth reflector (41) fixedly installed at its lifting end. When the fourth reflector (41) rises, the femtosecond laser beam reflected by the second reflector (38) enters the second beam expander (43). When the fourth reflector (41) falls, the femtosecond laser beam reflected by the second reflector (38) enters the first beam expander (40) after being reflected by the fourth reflector (41).

5. The femtosecond laser processing apparatus according to claim 1, characterized in that, A monitoring component is provided on one side of the femtosecond laser galvanometer processing assembly and the laser objective lens processing assembly for monitoring the processing status of the workpiece. The monitoring component includes a first monitoring structure and a second monitoring structure with identical structures. The first monitoring structure and the second monitoring structure are respectively provided corresponding to the femtosecond laser galvanometer processing assembly and the laser objective lens processing assembly. The first monitoring structure includes: The first mounting bracket (28) is fixedly mounted on one side of the femtosecond laser galvanometer processing assembly; The second CCD camera (34) is fixedly mounted on the first mounting bracket (28), and the imaging lens of the second CCD camera (34) faces the workpiece; The first upright (29) is fixedly installed on the first mounting bracket (28) by bolts. The first upright (29) has a vertical through groove, and the bolt is slidably connected in the through groove. The second adjusting lens tube (35) is fixedly installed at the bottom end of the first stand (29). The second adjusting lens tube (35) is set in correspondence with the lens of the second CCD camera (34). The second adjusting lens tube (35) is set between the second CCD camera (34) and the workpiece.

6. The femtosecond laser processing apparatus according to claim 3, characterized in that, The top of the second reflector (38) is fixedly connected to and connected to an inner cylinder (24), and an outer cylinder (23) is coaxially sleeved on the outside of the inner cylinder (24). The outer cylinder (23) is fixedly connected to and connected to the first reflector (22).

7. The femtosecond laser processing apparatus according to claim 1, characterized in that, The displacement mechanism is fixedly installed on the top surface of the support plate (13). Two supports (11) are fixedly connected to the top surface of the support plate (13). The two supports (11) are located on opposite sides of the support plate (13). A crossbeam (12) is fixedly connected between the top ends of the two supports (11). The femtosecond laser generator (19), the fixed optical path assembly, and the lifting mechanism are all fixedly installed on the crossbeam (12).

8. The femtosecond laser processing apparatus according to claim 7, characterized in that, The support plate (13) is fixedly installed in the middle of the outer casing (2). The support plate (13) divides the inner cavity of the outer casing (2) into a processing cavity and an equipment cavity. The equipment cavity is located below the support plate (13). A power supply (10) is fixedly installed in the equipment cavity. A feed port and several ventilation ports (7) are opened on the outer side wall of the power supply (10). The ventilation ports (7) are connected to the equipment cavity. A dustproof net (8) is fixedly connected to the circumference of the ventilation port (7). The feed port is correspondingly set to the processing cavity. A casing door (3) is detachably connected to the feed port.

9. A femtosecond laser processing apparatus according to claim 8, characterized in that, The bottom of the outer casing (2) is equipped with multiple rollers (5) and multiple lifting feet (6), and the multiple lifting feet (6) are located at the four corners of the bottom surface of the outer casing (2).

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