A magnetron sputtering coating device
By incorporating heating, lifting, and rotating mechanisms within the sputtering chamber, the issues of ease of substrate preheating and target-substrate distance adjustment are resolved. This enables precise control of substrate temperature and dynamic adjustment of the target-substrate distance, thereby improving film quality and deposition uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI HUAYUAN EQUIP TECH CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-06-02
AI Technical Summary
In existing coating equipment, substrate preheating needs to be placed in a separate heating chamber, which results in large temperature fluctuations and makes it difficult to control precisely. Furthermore, target-substrate distance adjustment requires shutdown and modification, which is cumbersome and has low precision, making it difficult to meet the needs of high precision in multiple scenarios.
A heating mechanism is installed in the sputtering chamber, and the substrate preheating and target-substrate distance adjustment are achieved through lifting and rotating mechanisms, avoiding downtime operation and improving equipment utilization and process adjustment efficiency.
It achieves precise control of substrate temperature and dynamic adjustment of target-substrate distance, improving film adhesion, crystallization quality and deposition uniformity, and meeting the needs of high-precision multi-scenario experiments or production.
Smart Images
Figure CN224313631U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coating equipment technology, and in particular to a magnetron sputtering coating equipment. Background Technology
[0002] In the field of physical vapor deposition (PVD), especially magnetron sputtering coating technology, the precise control of process parameters is crucial for film quality, among which substrate preheating and target-substrate distance adjustment are key steps.
[0003] Traditional equipment typically preheats the substrate in a separate heating chamber. The substrate experiences significant temperature fluctuations during transport to the sputtering chamber, making it difficult to precisely control the surface temperature and affecting film adhesion, crystallization quality, and stress control. Furthermore, while existing equipment offers various structural designs for adjusting the target-substrate distance, most require equipment shutdown and physical modifications. This is not only cumbersome and time-consuming but also suffers from limited adjustment range and low precision, making it difficult to meet the needs of high-precision, multi-scenario experiments or production. Utility Model Content
[0004] In view of this, the purpose of this utility model is to propose a magnetron sputtering coating device to solve the problems of existing coating devices that require placing the substrate in a separate heating chamber for preheating and require stopping the machine to adjust the target-substrate distance.
[0005] To achieve the above objectives, this utility model provides a magnetron sputtering coating apparatus, including a coating chamber and a cathode disposed therein. A substrate for placing a substrate is disposed in the chamber, and a lifting mechanism for controlling the lifting and lowering of the substrate is disposed at the bottom of the chamber. A rotating mechanism for controlling the rotation of the substrate is disposed inside the lifting mechanism, and a heating mechanism for heating the substrate is disposed inside the rotating mechanism.
[0006] In some optional embodiments, the lifting mechanism includes a triangular upper fixed plate fixed to the bottom of the chamber, with columns fixed to the bottom two corners of the upper fixed plate and a lead screw rotatably mounted at the other corner; a lower fixed plate is fixed to the bottom of the columns and is rotatably mounted to the bottom of the lead screw; a lifting plate is provided between the upper and lower fixed plates, which is slidably mounted to the two sets of columns and screwed to the lead screw; a drive motor for driving the lead screw to rotate is provided at the bottom of the lower fixed plate.
[0007] In some optional embodiments, the rotating mechanism includes a lower mounting plate fixed to a lifting mechanism, which can drive the lower mounting plate to move up and down; a hollow rotating rod is rotatably disposed at the top center of the lower mounting plate, the top end of the rotating rod passes through a cavity and is fixedly connected to the bottom of the base; a fixed cylinder fixed to the lower mounting plate is sleeved on the outer periphery of the rotating rod, and a driving component for driving the rotating rod to rotate is disposed on the outer periphery of the fixed cylinder; a protective cylinder sleeved on the outer periphery of the rotating rod is fixed to the top of the fixed cylinder, and an upper mounting plate fixed to the lifting mechanism is disposed on the top of the protective cylinder.
[0008] In some alternative embodiments, the drive assembly includes a servo motor fixed to the outer periphery of the fixed cylinder, the output rod of the servo motor passing through the cylinder wall of the fixed cylinder, and a lower bevel gear fixed at its end; an upper bevel gear meshing with the lower bevel gear is fixedly sleeved on the outer periphery of the rotating rod.
[0009] In some alternative embodiments, the heating mechanism includes an umbrella-shaped heater disposed on the lower mounting plate, the umbrella-shaped heater including a shaft and a heating platform; the shaft is fixedly disposed on the top of the lower mounting plate, the shaft is located inside and passes through the rotating rod, and the top of the shaft is connected to the heating platform.
[0010] In some alternative embodiments, the heating stage is located inside the substrate stage cavity, and there is no contact between the two.
[0011] In some alternative embodiments, a sealed bearing is provided between the top end of the shaft and the rotating rod.
[0012] As can be seen from the above, the magnetron sputtering coating apparatus provided by this utility model, by embedding the heating mechanism in the rotating mechanism and finally nesting it in the lifting mechanism, allows the substrate preheating process to be completed directly in the sputtering chamber, reducing the temperature change of the substrate during the transport process; secondly, through the designed lifting mechanism, the target-substrate distance can be adjusted while the equipment is running, without the need for downtime modification, which greatly improves the equipment utilization rate and process adjustment efficiency; thirdly, the rotating mechanism drives the stage and substrate to rotate, which, together with the in-situ heating in the chamber, improves the heating of the substrate and the uniformity of thin film deposition. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in one or more embodiments of this specification or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one or more embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of the internal structure of the cavity of this utility model;
[0015] Figure 2 This is a schematic diagram of the rotating mechanism described in this utility model;
[0016] Figure 3 This utility model Figure 2 Schematic diagram of the cross-sectional structure along auxiliary line AA in the middle;
[0017] Figure 4 This is a schematic diagram of the lifting mechanism structure described in this utility model;
[0018] Figure 5 This utility model Figure 4 Schematic diagram of the cross-sectional structure along the auxiliary line BB in the middle;
[0019] Figure 6 This is a top view of the lifting plate structure described in this utility model.
[0020] The diagram is marked as follows:
[0021] 1. Chamber; 2. Cathode; 3. Lifting mechanism; 31. Lower fixed plate; 32. Column; 33. Upper fixed plate; 34. Lead screw; 35. Lifting plate; 36. Drive motor; 4. Rotating mechanism; 41. Lower mounting plate; 42. Fixed cylinder; 43. Rotating rod; 431. Upper bevel gear; 44. Servo motor; 441. Lower bevel gear; 45. Protective cylinder; 46. Upper mounting plate; 5. Heating mechanism; 51. Umbrella heater; 511. Shaft; 512. Heating platform; 52. Corrugated hose; 6. Base. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0024] Please see Figures 1 to 6 As an embodiment of the present invention, a magnetron sputtering coating apparatus includes a coating chamber 1 and a cathode 2 disposed therein. A substrate 6 for placing a substrate is disposed in the chamber 1. A lifting mechanism 3 for controlling the lifting and lowering of the substrate 6 is disposed at the bottom of the chamber 1. A rotating mechanism 4 for controlling the rotation of the substrate 6 is disposed inside the lifting mechanism 3. A heating mechanism 5 for heating the substrate 6 is disposed inside the rotating mechanism 4.
[0025] In this embodiment, during the operation of the magnetron sputtering coating apparatus, the substrate to be coated is first placed on the base 6 inside the coating chamber 1. Then, the heating mechanism 5, located inside the rotating mechanism 4, is activated to directly heat the base 6, thereby preheating the substrate on it in situ. Once the substrate temperature reaches the preset process requirements, the heating state is maintained or adjusted as needed. At this time, the rotating mechanism 4, located inside the lifting mechanism 3, is activated to drive the base 6 and the substrate to rotate. This rotation can begin during the heating stage or occur simultaneously with the heating to improve the uniformity of heating of the substrate and subsequently... The subsequent sputtering stage further improves the uniformity of thin film deposition. Next, cathode 2 is energized, generating plasma within chamber 1, and sputtered target particles are deposited onto the rotating substrate surface to form a thin film. During sputtering or in the pre-sputtering preparation stage, the lifting mechanism 3 located at the bottom of chamber 1 operates, driving the internal rotating mechanism 4, heating mechanism 5, and the entire substrate 6 to perform precise lifting movements, thereby dynamically adjusting the target-substrate distance between the substrate surface on the substrate 6 and the target surface of cathode 2. This adjustment can be performed while the equipment is running to meet the requirements of different sputtering processes for deposition rate, thin film uniformity, and particle energy.
[0026] Please see Figures 1 to 6 Optionally, the lifting mechanism 3 includes a triangular upper fixed plate 33 fixed to the bottom of the chamber 1. A column 32 is fixed to each of the two bottom corners of the upper fixed plate 33, and a lead screw 34 is rotatably mounted at the other corner. A lower fixed plate 31 is fixed to the bottom of the column 32, and the lower fixed plate 31 is rotatably mounted to the bottom of the lead screw 34. A lifting plate 35 is provided between the upper fixed plate 33 and the lower fixed plate 31. The lifting plate 35 is slidably mounted to both sets of columns 32 and screwed to the lead screw 34. A drive motor 36 for driving the lead screw 34 to rotate is provided at the bottom of the lower fixed plate 31.
[0027] When the target-base distance needs to be adjusted, the drive motor 36 starts, and its output shaft drives the lead screw 34 connected to it to rotate around its axis. Since the bottom of the lead screw 34 is rotatably connected to the lower fixed plate 31 and the top is rotatably connected to the upper fixed plate 33, the lead screw 34 can rotate stably in a fixed position. The rotating lead screw 34 is converted into linear motion of the lifting plate 35 along the axis of the lead screw 34 through the screw connection with the lifting plate 35. At the same time, the lifting plate 35 is slidably set through two fixed columns 32 to ensure that its motion trajectory is vertically stable. Finally, the entire upper structure fixed on the lifting plate 35, including the rotating mechanism 4, the heating mechanism 5 and the base 6, moves up and down together with the lifting plate 35, thereby realizing the adjustment of the height position of the substrate on the base 6, that is, changing the target-base distance. This process can be controlled by the drive motor 36 when the equipment is running to realize the adjustment of the target-base distance.
[0028] Please see Figures 1 to 6 Optionally, the rotating mechanism 4 includes a lower mounting plate 41 fixed to the top of the lifting plate 35 of the lifting mechanism 3, and the lifting mechanism 3 can drive the lower mounting plate 41 to rise and fall; a hollow rotating rod 43 is rotatably provided at the top center of the lower mounting plate 41, the top end of the rotating rod 43 passes through the chamber 1 and is fixedly connected to the bottom of the base 6, a fixed cylinder 42 fixed to the lower mounting plate 41 is sleeved on the outer periphery of the rotating rod 43, and a driving component for driving the rotating rod 43 to rotate is provided on the outer periphery of the fixed cylinder 42; a protective cylinder 45 sleeved on the outer periphery of the rotating rod 43 is fixed on the top of the fixed cylinder 42, and an upper mounting plate 46 fixed to the upper fixed plate 33 of the lifting mechanism 3 is provided on the top of the protective cylinder 45;
[0029] The drive assembly includes a servo motor 44 fixed to the outer periphery of the fixed cylinder 42. The output rod of the servo motor 44 passes through the cylinder wall of the fixed cylinder 42, and a lower bevel gear 441 is fixed at its end. An upper bevel gear 431 that meshes with the lower bevel gear 441 is fixedly sleeved on the outer periphery of the rotating rod 43.
[0030] When the base 6 and substrate need to be rotated, the servo motor 44 fixed to the outer periphery of the fixed cylinder 42 is started. Its output rod passes through the cylinder wall of the fixed cylinder 42, driving the lower bevel gear 441 fixed at its end to rotate. The lower bevel gear 441 meshes with the upper bevel gear 431 fixedly sleeved on the outer periphery of the rotating rod 43, thereby transmitting the rotational motion of the lower bevel gear 441 to the upper bevel gear 431. Since the upper bevel gear 431 is fixedly connected to the rotating rod 43, it drives the rotating rod 43 to rotate around its own axis inside the fixed cylinder 42. The top end of the rotating rod 43 passes upward through the coating chamber through the dynamic seal. The bottom of the substrate is fixedly connected to the bottom of the base plate 6, thereby transmitting the rotational motion to the base plate 6 and realizing the rotation of the substrate in the coating chamber 1. During this process, the fixed cylinder 42 is fixed to the lower mounting plate 41 through its bottom, providing a stable support platform for the rotating rod 43 and the drive assembly. At the same time, the protective cylinder 45 is fixed to the top of the fixed cylinder 42 and sleeved on the outer periphery of the rotating rod. Its top is connected to the upper mounting plate 46 of the lifting mechanism 3, forming a protective outer shell structure to prevent external interference and maintain the stability of the internal working environment, while not hindering the rotational motion of the rotating rod 43.
[0031] Please see Figures 1 to 6 Optionally, the heating mechanism 5 includes an umbrella-shaped heater 51 mounted on the lower mounting plate 41. The umbrella-shaped heater 51 includes a shaft 511 and a heating platform 512. The shaft 511 is fixedly mounted on the top of the lower mounting plate 41. The shaft 511 is located inside and passes through the rotating rod 43. The top of the shaft 511 is connected to the heating platform 512. A corrugated hose 52 is provided between the lower mounting plate 41 and the upper mounting plate 46, which is sleeved on the outer periphery of the protective cylinder 45. The corrugated hose 52 absorbs the displacement caused by mechanical vibration through its own elastic deformation.
[0032] The heating stage 512 is located inside the substrate stage cavity, and there is no contact between the two;
[0033] When the substrate on the base 6 needs to be preheated, the umbrella-shaped heater 51 is powered on and started. The shaft 511 of the umbrella-shaped heater 51 is fixedly set on the top of the lower mounting plate 41. The shaft 511 extends upward, is located in the internal cavity of the rotating rod 43 and passes through the rotating rod 43. The top of the shaft 511 is connected to the heating platform 512 of the umbrella-shaped heater 51, so that the heating platform 512 is located in the internal area of the base 6. After the heating platform 512 is powered on, it generates heat energy, which is transferred to the base 6 wrapped on the outside by heat radiation through the gap between the base 6 and the heating platform 512. Since the base 6 is fixedly connected to the top of the rotating rod 43 through its bottom, and the rotating rod 43 can rotate under the drive of the rotating mechanism 4, the heated base 6 and the substrate it carries also rotate. This rotation promotes the uniform distribution of heat and improves the uniformity of heating of the substrate.
[0034] Please see Figures 1 to 6 Optionally, a sealed bearing is provided between the top of the shaft 511 and the top of the rotating rod 43 to ensure the airtightness of the chamber 1.
[0035] Working principle: First, the substrate to be coated is loaded onto the base 6 inside the coating chamber 1; then, the heating mechanism 5 is activated. This mechanism consists of an umbrella-shaped heater 51 fixedly mounted on the top of the lower mounting plate 41 of the lifting mechanism 3. Its shaft 511 extends upward and passes through the hollow rotating rod 43 of the rotating mechanism 4. The heating table 512 is located inside the cavity of the base 6. After the heating table 512 is powered on, it heats the base 6 surrounding it through thermal radiation, transferring heat to the substrate. This process takes place entirely within the coating chamber 1. Simultaneously with heating, the rotating mechanism 4 is activated: the servo motor 44 fixed on the outer periphery of the fixed cylinder 42 drives the lower bevel gear 441 to rotate, which in turn rotates through the upper bevel gear 441 fixedly sleeved on the rotating rod 43. 31 engages, transmitting power to the rotating rod 43, which drives the base 6 and substrate, fixedly connected to the top of the rotating rod 43, to rotate stably, improving the uniformity of substrate heating and subsequent film deposition. When it is necessary to adjust the target-substrate distance between the substrate and the cathode 2 target, the lifting mechanism 3 is activated: the drive motor 36 drives the lead screw 34 to rotate, and through the screw connection with the lifting plate 35, drives the lifting plate 35 and the entire rotating mechanism 4, heating mechanism 5 and base 6 assembly fixed on it to rise and fall smoothly as a whole. This lifting adjustment can be performed without stopping the machine before, during, or between sputtering, achieving high-precision and wide-range adjustment of the target-substrate distance. Finally, the cathode 2 is powered on to generate plasma to sputter the target, and the particles are deposited on the continuously rotating substrate to form a thin film.
[0036] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure (including the claims) is limited to these examples; within the scope of this invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of this invention as described above, which are not provided in the details for the sake of brevity.
[0037] The embodiments of this utility model are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A magnetron sputter coating device comprising a coating chamber (1) and a cathode (2) arranged therein, characterized in that The chamber (1) is provided with a base station (6) for placing a substrate, the bottom of the chamber (1) is provided with a lifting mechanism (3) for controlling the lifting of the base station (6), the lifting mechanism (3) is internally provided with a rotating mechanism (4) for controlling the rotation of the base station (6), and the rotating mechanism (4) is internally provided with a heating mechanism (5) for heating the base station (6).
2. A magnetron sputter coating device according to claim 1, wherein The lifting mechanism (3) comprises a triangular upper fixed plate (33) fixed on the bottom of the chamber (1), the bottom of the upper fixed plate (33) is fixed with two columns (32) respectively, and the other corner is rotatably provided with a lead screw (34); the bottom of the column (32) is fixed with a lower fixed plate (31), and the lower fixed plate (31) is rotatably arranged at the bottom of the lead screw (34); a lifting plate (35) is arranged between the upper fixed plate (33) and the lower fixed plate (31), the lifting plate (35) is slidably arranged with the two columns (32) respectively, and is screwed with the lead screw (34); the bottom of the lower fixed plate (31) is provided with a driving motor (36) for driving the lead screw (34) to rotate.
3. A magnetron sputter coating device according to claim 1 or 2, characterised in that The rotating mechanism (4) comprises a lower mounting plate (41) fixed on the lifting mechanism (3), and the lifting mechanism (3) can drive the lower mounting plate (41) to lift; a hollow rotating rod (43) is rotatably arranged at the top center of the lower mounting plate (41), the top end of the rotating rod (43) penetrates the chamber (1) and is fixedly connected with the bottom of the base station (6), a fixed cylinder (42) is sleeved on the outer periphery of the rotating rod (43) and fixed on the lower mounting plate (41), and a driving assembly for driving the rotating rod (43) to rotate is arranged on the outer periphery of the fixed cylinder (42); a protection cylinder (45) is fixed on the top of the fixed cylinder (42) and sleeved on the outer periphery of the rotating rod (43), and an upper mounting plate (46) fixed on the lifting mechanism (3) is arranged on the top of the protection cylinder (45).
4. A magnetron sputter coating device as claimed in claim 3, characterized in that The driving assembly comprises a servo motor (44) fixed on the outer periphery of the fixed cylinder (42), an output rod of the servo motor (44) penetrates the cylinder wall of the fixed cylinder (42), and a lower bevel gear (441) is fixed at the end of the output rod; an upper bevel gear (431) engaged with the lower bevel gear (441) is fixedly sleeved on the outer periphery of the rotating rod (43).
5. A magnetron sputter coating device as claimed in claim 3, characterized in that The heating mechanism (5) comprises an umbrella-shaped heater (51) arranged on the lower mounting plate (41), and the umbrella-shaped heater (51) comprises a shaft (511) and a heating platform (512); the shaft (511) is fixedly arranged on the top of the lower mounting plate (41), the shaft (511) is located in the rotating rod (43) and penetrates the rotating rod (43), and the top of the shaft (511) is connected with the heating platform (512).
6. A magnetron sputter coating device according to claim 5, wherein The heating platform (512) is located in the inner cavity of the substrate station, and there is no contact between them.
7. A magnetron sputter coating device as claimed in claim 5, characterized in that Airtight bearings are arranged between the shaft (511) and the top end of the rotating rod (43).