Wafer lifting and rotating driving structure

By designing a wafer lifting and rotating drive structure, the problem of unsatisfactory coating uniformity and consistency was solved, realizing the lifting and rotating drive of the wafer, ensuring sealing performance, and improving coating effect and chamber vacuum.

CN224313634UActive Publication Date: 2026-06-02SHANGHAI YUEJIANG IND CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHANGHAI YUEJIANG IND CO LTD
Filing Date
2025-03-20
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

In semiconductor manufacturing, the uniformity and consistency of the coating are not ideal during thin film sputtering, and the wafer needs to be lifted and rotated in a vacuum environment while ensuring sealing performance.

Method used

A wafer lifting and rotating drive structure was designed, including a rotating drive structure, a lifting drive structure, and a connecting structure. The lifting and rotating of the wafer is achieved through the cooperation of a rotary motor and a lifting motor, and the sealing performance is ensured through the sealed connection of a bellows and an upper connector.

Benefits of technology

While achieving wafer lifting and rotation drive, it ensured sealing performance, improved the uniformity and consistency of coating, and maintained the vacuum level of the chamber.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model provides a wafer lifting and rotating drive structure, including a rotating drive structure, a lifting drive structure, and a connecting structure. The rotating drive structure includes a housing, an inner rotor assembly, an outer rotor assembly, and a rotary motor. The housing is cylindrical, and the inner rotor assembly is rotatably disposed within the housing, including an inner rotor made of magnetically conductive material. The outer rotor assembly includes a fixed cylinder rotatably connected to the housing and a magnet disposed on the fixed cylinder. The rotary motor drives the fixed cylinder to rotate around the housing, thereby driving the inner rotor to rotate. The lifting drive structure includes a guide assembly and a lifting motor. The guide assembly is disposed on a base and connected to the housing. The lifting motor is fixedly connected to the housing, and the rotating shaft of the lifting motor is connected to a lifting screw, which is rotatably connected to the base. The rotation of the lifting motor drives the housing to move up and down. The connecting structure includes a bellows and an upper connector. The bellows is sealed to the housing and the upper connector, and the bellows and the upper connector allow the top end of the inner rotor to pass through.
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Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and in particular relates to a wafer lifting and rotating drive structure. Background Technology

[0002] In semiconductor technology, thin-film sputtering is a primary process for metal interconnects. In metal sputtering deposition, a heater typically lifts the wafer a certain distance before sputtering to improve film uniformity. However, the film thickness, uniformity, and consistency remain unsatisfactory. To enhance the deposition effect, wafer lifting and rotation need to be simultaneously achieved during the deposition process. Furthermore, the vacuum level within the wafer chamber must be maintained to prevent the introduction of external air due to structural connections. Therefore, it is necessary to provide a wafer lifting and rotation drive structure. Utility Model Content

[0003] This utility model provides a wafer lifting and rotating drive structure. The rotating drive structure is set up to achieve lifting and rotating drive while ensuring the sealing performance of the connection between the lifting and rotating drive structure and the support structure supporting the wafer.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A wafer lifting and rotating drive structure includes a rotating drive structure, a lifting drive structure, and a connecting structure. The rotating drive structure includes a housing, an inner rotor assembly, an outer rotor assembly, and a rotary motor. The housing is a cylindrical structure closed at one end. The inner rotor assembly is rotatably disposed within the housing, and the outer rotor assembly is rotatably sleeved outside the housing. The inner rotor assembly includes an inner rotor made of a magnetically conductive material. The outer rotor assembly includes a fixed cylinder rotatably connected to the housing and a magnet disposed on the inner wall of the fixed cylinder. The rotary motor is connected to the fixed cylinder and drives the fixed cylinder and the magnet to rotate around the housing, thereby driving the... The inner rotor rotates; the lifting drive structure includes a guide assembly and a lifting motor. The guide assembly is mounted on the base and connected to the housing. The lifting motor is fixedly connected to the housing. The rotating shaft of the lifting motor is connected to a lifting screw, and the lifting screw is rotatably connected to the base. The rotation of the lifting motor drives the housing to move up and down along the guide assembly, thereby driving the rotation drive structure to move up and down. The connecting structure includes a bellows and an upper connector. One end of the bellows is sealed to the open end of the housing, and the other end is sealed to the bottom end of the upper connector. The bellows and the upper connector allow the top end of the inner rotor to pass through.

[0006] Preferably, the inner rotor assembly further includes an inner bearing and an inner pressure plate, the inner rotor being rotatably connected to the inner wall of the housing via the inner bearing; the inner pressure plate is disposed at the open end of the housing to prevent axial movement of the inner bearing and the inner rotor.

[0007] Preferably, the outer rotor assembly further includes an outer bearing and an outer pressure plate. The outer bearing is sleeved on the outer wall of the housing, and the outer pressure plate connects the outer bearing and the fixed cylinder, so that the fixed cylinder is rotatably connected to the outer wall of the housing and restricts the axial movement of the outer bearing and the fixed cylinder.

[0008] Preferably, the rotary drive structure further includes a rotary transmission assembly, which includes a first gear and a second gear that are meshed together. The first gear is coaxially and fixedly connected to the rotating shaft of the rotary motor, and the second gear is sleeved outside the housing and coaxially and fixedly connected to the fixed cylinder. The rotary motor rotates by driving the fixed cylinder to rotate through the first gear and the second gear.

[0009] Preferably, the guide assembly includes a guide rail and a slider, the guide rail being vertically disposed on the base, the slider being freely movable on the guide rail, and the slider being connected to the housing.

[0010] Preferably, a fixing sleeve is fixedly provided on the outside of the housing, and the housing is connected to the guide assembly, the rotary motor and the lifting motor through the fixing sleeve.

[0011] Preferably, the base is in an inverted L-shape, including a side plate and a top plate, the guide assembly is disposed inside the side plate, the top plate is provided with a through hole that allows the top end of the inner rotor to pass through, the top end of the bellows is sealed to the bottom surface of the top plate at the through hole, and the bottom end of the upper connector is sealed to the top surface of the top plate at the through hole.

[0012] Preferably, the inner rotor and the upper connector are connected to a support structure for supporting the wafer, the support structure including a support rod and a sealing tube sleeved on the support rod; the top end of the inner rotor is connected to the support rod, and the top end of the upper connector is connected to the sealing tube.

[0013] Preferably, the bottom end of the support rod extends into the upper connector and is fixedly connected to the top end of the inner rotor; the top end of the support rod passes through the cavity containing the wafer and is connected to a fixed seat disposed in the cavity, the fixed seat supporting the wafer.

[0014] Preferably, the bottom end of the sealing tube is sealed to the top end of the upper connector; the top end of the sealing tube is sealed to the cavity.

[0015] Compared with the prior art, the technical solution of this utility model has beneficial effects.

[0016] For example, a wafer lifting and rotating drive structure includes a rotating drive structure, a lifting drive structure, and a connecting structure. The rotating drive structure includes a housing, an inner rotor assembly, an outer rotor assembly, and a rotary motor. The housing is a cylindrical structure closed at one end. The inner rotor assembly is rotatably disposed within the housing, and the outer rotor assembly is rotatably sleeved outside the housing. The inner rotor assembly includes an inner rotor made of magnetically conductive material. The outer rotor assembly includes a fixed cylinder rotatably connected to the housing and a magnet disposed on the inner wall of the fixed cylinder. The rotary motor is connected to the fixed cylinder and drives the fixed cylinder and the magnet to rotate around the housing, thereby driving the inner rotor to rotate. The lifting drive structure includes a guide assembly. The system includes a lifting motor and a guide assembly mounted on a base connected to the housing. The lifting motor is fixedly connected to the housing, and its rotating shaft is connected to a lifting screw. The lifting screw is rotatably connected to the base. The rotation of the lifting motor drives the housing to move up and down along the guide assembly, which in turn drives the rotary drive structure to move up and down. The connecting structure includes a bellows and an upper connector. One end of the bellows is sealed to the open end of the housing, and the other end is sealed to the bottom end of the upper connector. The bellows and upper connector allow the top of the inner rotor to pass through. This achieves both lifting and rotary drive while ensuring the sealing performance at the connection between the lifting and rotary drive structure and the support structure supporting the wafer. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the wafer lifting and rotating drive structure in an embodiment of this utility model;

[0018] Figure 2 This is a schematic diagram of the wafer lifting and rotating drive structure from another angle in an embodiment of this utility model;

[0019] Figure 3 This is a schematic diagram of the wafer lifting and rotating drive structure in an embodiment of this utility model.

[0020] Explanation of reference numerals in the attached figures:

[0021] 1-Lifting drive structure; 11-Guide assembly; 111-Guide rail; 112-Slider; 12-Lifting motor;

[0022] 2-Rotary drive structure; 21-Housing; 211-Fixed sleeve; 22-Inner rotor assembly; 221-Inner rotor; 222-Inner bearing; 223-Inner pressure plate; 23-Outer rotor assembly; 231-Fixed cylinder; 232-Magnet; 233-Outer bearing; 234-Outer pressure plate; 24-Rotary motor; 25-Rotary transmission assembly; 251-First gear; 252-Second gear;

[0023] 3-Connecting structure; 31-Bellwall; 32-Upper connector;

[0024] 4-Base; 41-Side panel; 42-Top panel;

[0025] 5-Support structure; 51-Support rod; 52-Sealing tube;

[0026] 6-Fixed base;

[0027] 7-Wafer;

[0028] 8-Heater. Detailed Implementation

[0029] To make the objectives, features, and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described below are merely for explaining this utility model and are not intended to limit it. Furthermore, the same or similar reference numerals may be used in the drawings to refer to the same or similar elements in different embodiments, and descriptions of the same or similar elements in different embodiments, as well as descriptions of prior art elements, features, effects, etc., may be omitted.

[0030] Figure 1 This is a schematic diagram of the wafer lifting and rotating drive structure in an embodiment of this utility model; Figure 2 This is a schematic diagram of the wafer lifting and rotating drive structure from another angle in an embodiment of this utility model; Figure 3 This is a schematic diagram of the wafer lifting and rotating drive structure in an embodiment of this utility model.

[0031] Reference Figures 1-3 This utility model provides a wafer lifting and rotating drive structure.

[0032] Specifically, the wafer lifting and rotating drive structure includes a rotating drive structure 2, a lifting drive structure 1, and a connecting structure 3. The rotating drive structure 2 includes a housing 21, an inner rotor assembly 22, an outer rotor assembly 23, and a rotary motor 24. The housing 21 is a cylindrical structure closed at one end. The inner rotor assembly 22 is rotatably disposed in the housing 21, and the outer rotor assembly 23 is rotatably sleeved on the outside of the housing 21. The inner rotor assembly 22 includes an inner rotor 221 made of magnetically conductive material. The outer rotor assembly 23 includes a fixed cylinder 231 rotatably connected to the housing 21 and a magnet 232 disposed on the inner wall of the fixed cylinder 231. The rotary motor 24 is connected to the fixed cylinder 231 and drives the fixed cylinder 231 and the magnet 232 to rotate around the housing 21. The rotation of the inner rotor 221 causes the inner rotor 221 to rotate. The lifting drive structure 1 includes a guide assembly 11 and a lifting motor 12. The guide assembly 11 is mounted on the base 4 and connected to the housing 21. The lifting motor 12 is fixedly connected to the housing 21. The rotating shaft of the lifting motor 12 is connected to a lifting screw (not shown). The lifting screw is rotatably connected to the base 4. The rotation of the lifting motor 12 causes the housing 21 to move up and down along the guide assembly 11, which in turn causes the rotation drive structure 2 to move up and down. The connecting structure 3 includes a bellows 31 and an upper connector 32. One end of the bellows 31 is sealed to the open end of the housing 21, and the other end is sealed to the bottom end of the upper connector 32. The bellows 31 and the upper connector 32 allow the top end of the inner rotor 221 to pass through.

[0033] In some embodiments, the inner rotor assembly 22 further includes an inner bearing 222 and an inner pressure plate 223. The inner rotor 221 is rotatably connected to the inner wall of the housing 21 via the inner bearing 212. The inner pressure plate 223 is disposed at the open end of the housing 21 to prevent axial movement of the inner bearing 222 and the inner rotor 221.

[0034] In some embodiments, the outer rotor assembly 23 further includes an outer bearing 233 and an outer pressure plate 234. The outer bearing 233 is sleeved on the outer wall of the housing 21, and the outer pressure plate 234 connects the outer bearing 233 and the fixed cylinder 231, so that the fixed cylinder 231 is rotatably connected to the outer wall of the housing 21 and restricts the axial movement of the outer bearing 233 and the fixed cylinder 231.

[0035] In some embodiments, the rotary drive structure 2 further includes a rotary transmission assembly 25, which includes a first gear 251 and a second gear 252 that are meshed together. The first gear 251 is coaxially and fixedly connected to the rotation shaft of the rotary motor 24, and the second gear 252 is sleeved on the outside of the housing 21 and coaxially and fixedly connected to the fixed cylinder 231. The rotary motor 24 rotates and drives the fixed cylinder 231 to rotate through the first gear 251 and the second gear 251.

[0036] In some embodiments, the guide assembly 11 includes a guide rail 111 and a slider 112. The guide rail 111 is vertically arranged on the base 4, and the slider 112 moves freely on the guide rail 111. The slider 112 is connected to the housing 21.

[0037] In some embodiments, a fixing sleeve 211 is fixedly provided on the outside of the housing 21, and the housing 21 is connected to the guide assembly 11, the rotary motor 24 and the lifting motor 12 through the fixing sleeve 211.

[0038] In some embodiments, the base 4 is an inverted L-shape, including a side plate 41 and a top plate 42. The guide assembly 11 is disposed inside the side plate 41. The top plate 42 is provided with a through hole that allows the top end of the inner rotor 221 to pass through. The top end of the bellows 31 is sealed to the bottom surface of the top plate 42 at the through hole. The bottom end of the upper connector 32 is sealed to the top surface of the top plate 42 at the through hole.

[0039] In some embodiments, the inner rotor 221 and the upper connector 32 are connected to a support structure 5 for supporting the wafer 7. The support structure 5 includes a support rod 51 and a sealing tube 52 sleeved outside the support rod 51. The top end of the inner rotor 221 is connected to the support rod 51, and the top end of the upper connector 32 is connected to the sealing tube 52.

[0040] In some embodiments, the bottom end of the support rod 51 extends into the upper connector 32 and is fixedly connected to the top end of the inner rotor 221; the top end of the support rod 51 passes through the cavity (not shown) that accommodates the wafer 7 and is connected to the fixing seat 6 disposed on the heater 8 in the cavity, the fixing seat 6 carrying the wafer 7.

[0041] In some embodiments, the bottom end of the sealing tube 52 is sealed to the top end of the upper connector 32; the top end of the sealing tube 52 is sealed to the cavity.

[0042] In summary, the wafer lifting and rotating drive structure provided by this utility model includes a rotating drive structure 2, a lifting drive structure 1, and a connecting structure 3. The rotating drive structure 2 includes a housing 21, an inner rotor assembly 22, an outer rotor assembly 23, and a rotary motor 24. The housing 21 has a cylindrical structure with one end closed. The inner rotor assembly 22 is rotatably disposed in the housing 21, and the outer rotor assembly 23 is rotatably sleeved on the outside of the housing 21. The inner rotor assembly 22 includes an inner rotor 221 made of magnetically conductive material. The outer rotor assembly 23 includes a fixed cylinder 231 rotatably connected to the housing 21 and a magnet 232 disposed on the inner wall of the fixed cylinder 231. The rotary motor 24 is connected to the fixed cylinder 231 and drives the fixed cylinder 231 and the magnet 232 to rotate around the housing 21, thereby driving the inner rotor 221 to rotate. The lifting drive structure 1 includes a guide assembly 11 and a lifting motor 12. The guide assembly 11 is mounted on the base 4 and connected to the housing 21. The lifting motor 12 is fixedly connected to the housing 21. The rotating shaft of the lifting motor 12 is connected to a lifting screw, and the lifting screw is rotatably connected to the base 4. The rotation of the lifting motor 12 drives the housing 21 to move up and down along the guide assembly 11, thereby driving the rotation drive structure 2 to move up and down. The connecting structure 3 includes a bellows 31 and an upper connector 32. One end of the bellows 31 is sealed to the open end of the housing 21, and the other end is sealed to the bottom end of the upper connector 32. The bellows 31 and the upper connector 32 allow the top end of the inner rotor 221 to pass through, so as to realize lifting and rotation drive while ensuring the sealing performance of the connection between the lifting and rotation drive structure and the support structure 5 supporting the wafer 7.

[0043] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of this utility model disclosure, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this utility model disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and may be derived from the technical features of the respective independent claims in any suitable manner rather than solely by the specific combinations listed in the claims.

[0044] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer lifting and rotating drive structure, characterized in that, The device includes a rotary drive structure, a lifting drive structure, and a connecting structure. The rotary drive structure comprises a housing, an inner rotor assembly, an outer rotor assembly, and a rotary motor. The housing is a cylindrical structure closed at one end. The inner rotor assembly is rotatably disposed within the housing, and the outer rotor assembly is rotatably sleeved outside the housing. The inner rotor assembly includes an inner rotor made of magnetically conductive material. The outer rotor assembly includes a fixed cylinder rotatably connected to the housing and a magnet disposed on the inner wall of the fixed cylinder. The rotary motor is connected to the fixed cylinder and drives the fixed cylinder and the magnet to rotate around the housing, thereby driving the inner rotor to rotate. The lifting drive structure includes a guide assembly and a lifting motor. The guide assembly is mounted on the base and connected to the housing. The lifting motor is fixedly connected to the housing. The rotating shaft of the lifting motor is connected to a lifting screw, and the lifting screw is rotatably connected to the base. The rotation of the lifting motor drives the housing to move up and down along the guide assembly, thereby driving the rotary drive structure to move up and down. The connecting structure includes a bellows and an upper connector. One end of the bellows is sealed to the open end of the housing, and the other end is sealed to the bottom end of the upper connector. The bellows and the upper connector allow the top end of the inner rotor to pass through.

2. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The inner rotor assembly further includes an inner bearing and an inner pressure plate. The inner rotor is rotatably connected to the inner wall of the housing via the inner bearing. The inner pressure plate is disposed at the open end of the housing to prevent axial movement of the inner bearing and the inner rotor.

3. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The outer rotor assembly also includes an outer bearing and an outer pressure plate. The outer bearing is sleeved on the outer wall of the housing, and the outer pressure plate connects the outer bearing and the fixed cylinder, so that the fixed cylinder is rotatably connected to the outer wall of the housing and restricts the axial movement of the outer bearing and the fixed cylinder.

4. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The rotary drive structure further includes a rotary transmission assembly, which includes a first gear and a second gear that mesh with each other. The first gear is coaxially and fixedly connected to the rotating shaft of the rotary motor, and the second gear is sleeved outside the housing and coaxially and fixedly connected to the fixed cylinder. The rotary motor rotates by driving the fixed cylinder to rotate through the first gear and the second gear.

5. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The guide assembly includes a guide rail and a slider. The guide rail is vertically mounted on the base, and the slider moves freely on the guide rail. The slider is connected to the housing.

6. The wafer lifting and rotating drive structure according to claim 1, characterized in that, A fixing sleeve is fixedly installed on the outside of the housing, and the housing is connected to the guide assembly, the rotary motor and the lifting motor through the fixing sleeve.

7. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The base is in the shape of an inverted L and includes a side plate and a top plate. The guide assembly is disposed inside the side plate. The top plate is provided with a through hole that allows the top end of the inner rotor to pass through. The top end of the bellows is sealed to the bottom surface of the top plate at the through hole. The bottom end of the upper connector is sealed to the top surface of the top plate at the through hole.

8. The wafer lifting and rotating drive structure according to claim 1, characterized in that, The inner rotor and the upper connector are connected to a support structure for supporting the wafer. The support structure includes a support rod and a sealing tube sleeved on the support rod. The top end of the inner rotor is connected to the support rod, and the top end of the upper connector is connected to the sealing tube.

9. The wafer lifting and rotating drive structure according to claim 8, characterized in that, The bottom end of the support rod extends into the upper connector and is fixedly connected to the top end of the inner rotor; the top end of the support rod passes through the cavity containing the wafer and is connected to a fixed seat disposed in the cavity, the fixed seat bearing the wafer.

10. The wafer lifting and rotating drive structure according to claim 9, characterized in that, The bottom end of the sealing tube is sealed to the top end of the upper connector; the top end of the sealing tube is sealed to the cavity.