A lead sulfide infrared detector
By introducing a semiconductor cooler and a temperature sensor into the lead sulfide infrared detector, the temperature of the photoelectrode is adjusted, thus solving the problem of the detector's performance being affected by temperature changes and achieving a stable operating state.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHAANXI HUAXING ELECTRONICS GROUP
- Filing Date
- 2025-07-18
- Publication Date
- 2026-06-02
AI Technical Summary
The performance of lead sulfide infrared detectors is greatly affected by temperature changes, resulting in unstable detectivity and response rate.
A semiconductor cooler and a temperature sensor are installed in the lead sulfide infrared detector. The temperature of the photosensitive element is adjusted by the control circuit to keep it below the set value and maintain a stable working state.
Stable operation of the photosensitive element under different temperature conditions was achieved, improving the stability of detectivity and responsivity.
Smart Images

Figure CN224317170U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of infrared detection technology, specifically to a lead sulfide infrared detector. Background Technology
[0002] Infrared detectors are devices sensitive to infrared light, primarily receiving the energy radiated by objects and converting it into electrical signals. Various materials are used to fabricate the photosensitive elements of infrared detectors, operating in different infrared bands. Lead sulfide infrared detectors operate in the 1-3 micrometer band and are widely used in flame detection, moisture detection, and other fields. However, the performance of lead sulfide infrared detectors varies significantly with temperature; their detectivity and responsivity decrease as temperature increases, and increase as temperature decreases.
[0003] The sensitivity and detectivity of lead sulfide infrared detectors vary considerably under the influence of ambient temperature, resulting in a decrease in detectivity and response rate as the temperature rises, leading to unstable operation. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a lead sulfide infrared detector. This device can regulate the temperature of the photosensitive element, keeping it below a set temperature and unaffected by external temperature increases, thus ensuring stable operation.
[0005] A lead sulfide infrared detector includes a base with several pins fixed on it. A cap is provided on the base, and the top wall of the cap has an opening. A transparent window is fixed on the cap to close the opening. A thermoelectric cooler is disposed inside the cap, with its hot end connected to the base. A photosensitive element is disposed at the cold end of the thermoelectric cooler, and a temperature sensor is disposed at the cold end of the thermoelectric cooler. The temperature sensor and the thermoelectric cooler are electrically connected to a control circuit through corresponding pins, and the photosensitive element is electrically connected to a processing circuit through corresponding pins.
[0006] Preferably, the pins are sintered onto the base using glass insulating adhesive.
[0007] Preferably, the semiconductor cooler is soldered onto the base using low-temperature solder.
[0008] Preferably, the photosensitive element is bonded to the cold end of the semiconductor cooler using optical epoxy adhesive.
[0009] Preferably, the temperature sensor is bonded to the cold end of the semiconductor cooler using optical epoxy adhesive.
[0010] Preferably, the transparent window is a sapphire window.
[0011] Preferably, the sapphire window is soldered to the opening of the cap using high-temperature solder.
[0012] Preferably, the sapphire window is coated with an anti-reflective film.
[0013] The beneficial effects of this utility model are as follows: In this technical solution, a cap is installed on the base, and a semiconductor cooler is installed inside the cap. The photosensitive element and temperature sensor are placed at the cold end of the semiconductor cooler. During use, the photosensitive element receives infrared radiation emitted by an object and converts it into a voltage signal, which is connected to the amplification and processing circuit through corresponding pins. The semiconductor cooler and temperature sensor are connected to the control circuit through corresponding pins. When the external temperature rises, the temperature sensor detects the temperature rise at the cold end of the semiconductor cooler and sends information to the controller through the control circuit. The controller then controls the operating current of the semiconductor cooler to lower the temperature, keeping the cold end temperature of the semiconductor cooler below a set value. This keeps the operating temperature of the photosensitive element below the set value, thus enabling the device to operate stably. Attached Figure Description
[0014] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0015] Figure 1 This is the front view of the present invention;
[0016] Figure 2 This is a front sectional view of the present invention.
[0017] In the attached diagram, 1-base, 2-pin, 3-semiconductor cooler, 4-photosensitive element, 5-temperature sensor, 6-tube cap, 7-transparent window. Detailed Implementation
[0018] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.
[0019] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.
[0020] Example 1,
[0021] like Figures 1-2As shown, this embodiment provides a lead sulfide infrared detector, including a base 1, on which several pins 2 are fixed. A cap 6 is provided on the base 1, and the top wall of the cap 6 has an opening. A transparent window 7 is fixed on the cap 6 to close the opening. A thermoelectric cooler 3 is disposed inside the cap 6, with the hot end of the thermoelectric cooler 3 connected to the base 1. A photosensitive element 4 is disposed on the cold end of the thermoelectric cooler 3, and a temperature sensor 5 is disposed on the cold end of the thermoelectric cooler 3. The temperature sensor 5 and the thermoelectric cooler 3 are electrically connected to the control circuit through corresponding pins 2, and the photosensitive element 4 is electrically connected to the processing circuit through corresponding pins 2.
[0022] In this embodiment, a cap 6 is provided on the base 1, and a thermoelectric cooler 3 is provided inside the cap 6. The photosensitive element 4 and the temperature sensor 5 are placed at the cold end of the thermoelectric cooler 3. In use, the photosensitive element 4 receives infrared radiation emitted by an object and converts it into a voltage signal, which is connected to the amplification and processing circuit through the corresponding pin 2. The thermoelectric cooler 3 and the temperature sensor 4 are connected to the control circuit through the corresponding pin 2. When the external temperature rises, the temperature sensor 5 detects the rise in the temperature of the cold end of the thermoelectric cooler 3 and sends information to the controller through the control circuit. The controller controls the operating current of the thermoelectric cooler 3 through the control circuit to lower the temperature, so that the temperature of the cold end of the thermoelectric cooler 3 is kept below the set value, thereby keeping the operating temperature of the photosensitive element 4 below the set value. In this way, the device can regulate the temperature of the photosensitive element 4 and keep it below the set value temperature, so that the device has a stable working state.
[0023] In this embodiment, the cap 6 and the base 1 are connected by a fusion sealing method.
[0024] In this embodiment, the pin 2 is sintered onto the base 1 using glass insulating adhesive. The pin 2 is fixed to the base 1 by sintering it with glass insulating adhesive, and there are a total of 6 pins 2.
[0025] In this embodiment, the semiconductor cooler 3 is soldered to the base 1 using low-temperature solder. The semiconductor cooler 3 is soldered to the center of the base 1 using low-temperature solder to secure it.
[0026] In this embodiment, the photosensitive element 4 is bonded to the cold end of the thermoelectric cooler 3 using optical epoxy adhesive. In this embodiment, the photosensitive element 4 is bonded to the center of the plane of the thermoelectric cooler 3 using optical epoxy adhesive, thus fixing the photosensitive element 4.
[0027] In this embodiment, the temperature sensor 5 is bonded to the cold end of the thermoelectric cooler 3 using optical epoxy adhesive. The temperature sensor 5 is located next to the photosensitive element 4.
[0028] In this embodiment, the transparent window 7 is a sapphire window. The sapphire window 7 has high transmittance in the infrared band.
[0029] In this embodiment, the sapphire window is soldered to the opening of the tube cap 6 using high-temperature solder. This soldering secures the sapphire window to the opening of the tube cap 6.
[0030] In this embodiment, an anti-reflective coating is applied to the sapphire window. This anti-reflective coating improves the transmittance of infrared radiation.
[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.
Claims
1. A lead sulfide infrared detector, characterized in that, Includes a base (1), on which several pins (2) are fixed, and a cap (6) is provided on the base (1). The top wall of the cap (6) has an opening, and a transparent window (7) is fixed on the cap (6) to close the opening. A semiconductor cooler (3) is disposed inside the cap (6). The hot end of the semiconductor cooler (3) is connected to the base (1). A photosensitive element (4) is disposed on the cold end of the semiconductor cooler (3). A temperature sensor (5) is disposed on the cold end of the semiconductor cooler (3). The temperature sensor (5) and the semiconductor cooler (3) are electrically connected to the control circuit through corresponding pins (2), and the photosensitive element (4) is electrically connected to the processing circuit through corresponding pins (2).
2. The lead sulfide infrared detector according to claim 1, characterized in that, The pin (2) is sintered onto the base (1) using glass insulating adhesive.
3. A lead sulfide infrared detector according to claim 1, characterized in that, The semiconductor cooler (3) is soldered onto the base (1) using low-temperature solder.
4. A lead sulfide infrared detector according to claim 1, characterized in that, The photosensitive element (4) is bonded to the cold end of the semiconductor cooler (3) using optical epoxy adhesive.
5. A lead sulfide infrared detector according to claim 1, characterized in that, The temperature sensor (5) is bonded to the cold end of the semiconductor cooler (3) using optical epoxy adhesive.
6. A lead sulfide infrared detector according to claim 1, characterized in that, The transparent window (7) is a sapphire window.
7. A lead sulfide infrared detector according to claim 6, characterized in that, The sapphire window is welded to the opening of the cap (6) using high-temperature solder.
8. A lead sulfide infrared detector according to claim 6, characterized in that, The sapphire window is coated with an anti-reflective film.