A gesture sensing transceiver

Abstract

The utility model relates to electronic component technical field especially relates to a gesture induction transceiver, include: support, the support surface is plane structure and has four vertical downward extension's support leg in the bottom, the surface of support is fixed with IR chip, PD chip and IC chip, and IC chip is between IR chip and PD chip, IR chip and IC chip all are connected with support electricity through gold wire, and PD chip is connected with IC chip electricity through gold wire, this gesture induction transceiver, through with traditional independent IR emission pipe and IRM receiver head are combined as a material, optimized product structure, can simplify production process, reduced assembly procedure and work hour consumption, and then reduced the cost input in the production manufacturing process, and the glue department can accurate blocking IR chip side edge emission's light signal, effectively avoid its direct incidence on the PD chip and lead to signal saturation problem, ensure the reliability and stability of gesture induction function.

Description

Technical Field

[0001] This utility model relates to the field of electronic component technology, specifically a gesture sensing transceiver. Background Technology

[0002] In the field of gesture sensing products, most products on the market currently use a solution of one IR transmitter paired with one IRM receiver / decoder. Specifically, the IR transmitter is responsible for emitting light signals, which are then reflected by the human body and received and decoded by the IRM receiver / decoder. To avoid external interference, the IR transmitter is usually housed separately in a black sleeve, with only the lens portion exposed.

[0003] However, this existing technical solution has significant drawbacks: when the IR transmitter emits light signals, its wide infrared light coverage and high beam divergence lead to substantial energy attenuation over long distances. Gesture sensing applications require a close proximity between the IR transmitter and the IRM receiver. If the distance is too close, signals emitted from the side of the IR transmitter will be received by the IRM receiver, causing signal saturation. This prevents the IRM receiver from properly receiving the reflected light signals, thus affecting the product's gesture sensing function. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a gesture sensing transceiver head, which solves the technical problem in existing gesture sensing products where the light signal emitted from the side of the IR transmitter causes the IRM receiver head to saturate when the IR transmitter and IRM receiver head are placed close together, thus preventing the normal reception of reflected light signals.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a gesture sensing transceiver, comprising:

[0006] The bracket has a planar surface and four vertically downward extending feet at the bottom. An IR chip, a PD chip, and an IC chip are fixed on the surface of the bracket, with the IC chip located between the IR chip and the PD chip. The IR chip and the IC chip are electrically connected to the bracket via gold wires, and the PD chip is electrically connected to the IC chip via gold wires.

[0007] The colloid has a square structure and covers the upper part of the support, and the IR chip, PD chip and IC chip are all covered in the colloid. The colloid consists of a lower colloid part and an upper colloid part. The lower colloid part covers the upper part of the support and is flush with the surface of the IR chip and PD chip. The upper colloid part is fixed above the lower colloid part and is located above the IR chip and PD chip.

[0008] Preferably, the lower adhesive portion is made of opaque epoxy resin.

[0009] Preferably, the adhesive coating is made of translucent epoxy resin.

[0010] Preferably, the surface of the adhesive portion is provided with two sets of arc-shaped protrusions of lens structure.

[0011] Preferably, the two sets of lens structures are located directly above the IR chip and the PD chip, respectively.

[0012] Preferably, the surface of the IC chip protrudes beyond the surface of the lower adhesive portion.

[0013] By employing the above technical solution, this utility model provides a gesture-sensing transceiver head, which has at least the following beneficial effects:

[0014] 1. This gesture-sensing transceiver combines the traditional separate IR transmitter and IRM receiver into a single material, forming a two-in-one transmitter and receiver unit. This fundamentally optimizes the product structure, directly reducing the amount of raw materials used. It eliminates the need to purchase and assemble two separate components, significantly reducing material costs. At the same time, the simplified structure also optimizes the production process, reducing assembly steps and labor time, thereby reducing cost input in the manufacturing process and achieving effective cost control while ensuring product functionality.

[0015] 2. This gesture sensing transceiver encapsulates the IR chip, PD chip, and IC chip within a lower adhesive section, which is flush with the surfaces of the IR and PD chips. Because the lower adhesive section is made of opaque epoxy resin, it precisely blocks the light signals emitted from the side of the IR chip, effectively preventing signal saturation caused by direct incident on the PD chip. This allows for stable reception and accurate decoding of light signals reflected back from the human body, ensuring the reliability and stability of the gesture sensing function. It solves the interference problem caused by close-range installation in existing technologies, improving the product's sensing performance and user experience. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0017] Figure 1 This is a three-dimensional structural diagram of the entire utility model;

[0018] Figure 2 This is a schematic diagram of the overall internal cross-section of this utility model.

[0019] Figure label:

[0020] 1. Colloid; 11. Lower colloid part; 12. Upper colloid part; 121. Lens structure; 2. Support; 3. IR chip; 4. PD chip; 5. IC chip; 6. Gold wire. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Gesture sensing is a technology that enables human-computer interaction by recognizing and analyzing human hand movements and postures. It allows devices to "understand" gestures and execute corresponding commands, and is widely used in consumer electronics, smart homes, industrial control and other fields.

[0023] Due to the technical deficiency in existing technology where the IR transmitter and IRM receiver cannot properly receive reflected light signals when placed close together, please refer to... Figures 1-2 This embodiment provides a gesture sensing transceiver. The lower adhesive part 11 can accurately block the light signal emitted from the side of the IR chip 3, effectively avoiding the signal saturation problem caused by its direct incidence on the PD chip 4. This allows for stable reception of the light signal reflected back from the human body and accurate decoding, ensuring the reliability and stability of the gesture sensing function. The transceiver includes a bracket 2. The bracket 2 has a planar surface and four vertically downward-extending feet at the bottom. The surface of the bracket 2 is fixed with an IR chip 3, a PD chip 4, and an IC chip 5, with the IC chip 5 positioned between the IR chip 3 and the PD chip 4. Both the IR chip 3 and the IC chip 5 are electrically connected to the bracket 2 via gold wires 6, and the PD chip 4 is electrically connected to the IC chip 5 via gold wires 6. The bracket 2 integrates the IR chip 3, PD chip 4, and IC chip 5. The planar structure and foot design achieve integrated installation, reducing the number of components and assembly steps, and lowering production costs. The IC chip 5, positioned between the IR chip 3 and the PD chip 4, shortens the signal transmission path. The electrical connection via gold wires 6 improves signal transmission stability and optimizes the circuit layout.

[0024] It also includes a colloid 1, which has a square structure and covers the upper part of the support 2. The IR chip 3, PD chip 4 and IC chip 5 are all covered in the colloid 1. The colloid 1 consists of a lower adhesive part 11 and an upper adhesive part 12. The lower adhesive part 11 covers the upper part of the support 2 and is flush with the surfaces of the IR chip 3 and PD chip 4. The upper adhesive part 12 is fixed above the lower adhesive part 11 and is located above the IR chip 3 and PD chip 4. The lower adhesive part 11 is flush with the chip surface, forming a physical shielding layer that precisely blocks the light signals emitted from the side of the IR chip 3, avoiding interference with the PD chip 4. The upper adhesive part 12 covers the top of the chip and works with the lower adhesive part 11 to form a complete package, protecting the internal chips while providing a channel for light signal transmission.

[0025] Existing IR emitters have a wide infrared light coverage and beam divergence, which can cause side light interference with the receiver when installed at close range, thus affecting the product's gesture sensing function. To address this issue, the lower adhesive part 11 is made of opaque epoxy resin, while the upper adhesive part 12 is made of transparent epoxy resin. Specifically, the opaque epoxy resin is black, and the transparent epoxy resin is white. The lower adhesive part 11 can effectively shield the side light of the IR chip 3, solving the signal saturation problem at its source and ensuring that the PD chip 4 only receives reflected light. The upper adhesive part 12 allows the light signal emitted by the IR chip 3 to pass through and the reflected light to enter, ensuring the normal operation of the sensing function.

[0026] Traditional IR emitters suffer from beam divergence, leading to energy attenuation. They require close-range installation but are prone to interference, and the non-concentrated direction of light signal reception affects sensing accuracy. To address this issue, the surface of the adhesive portion 12 is provided with two sets of arc-shaped protruding lens structures 121. Furthermore, the two sets of lens structures 121 are located directly above the IR chip 3 and the PD chip 4, respectively. The two sets of arc-shaped protruding lens structures 121 correspond to the IR chip 3 and the PD chip 4. Through the principle of optical focusing, the beam divergence angle is reduced, the light energy concentration is improved, and the focusing design can reduce energy attenuation over long distances, allowing for a suitable increase in sensing distance.

[0027] Furthermore, the surface of the IC chip 5 protrudes above the surface of the under-adhesive portion 11, preventing it from being completely covered by the under-adhesive portion 11, ensuring the reliability of the gold wire 6 connection, and reducing signal transmission impedance.

[0028] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A gesture-sensing transceiver, characterized in that, include: The bracket (2) has a planar surface and four vertically downward extending feet at the bottom. An IR chip (3), a PD chip (4) and an IC chip (5) are fixed on the surface of the bracket (2). The IC chip (5) is located between the IR chip (3) and the PD chip (4). The IR chip (3) and the IC chip (5) are electrically connected to the bracket (2) through gold wires (6). The PD chip (4) is electrically connected to the IC chip (5) through gold wires (6). The colloid (1) has a square structure and covers the upper part of the support (2), and the IR chip (3), PD chip (4) and IC chip (5) are all covered in the colloid (1). The colloid (1) consists of a lower colloid part (11) and an upper colloid part (12). The lower colloid part (11) covers the upper part of the support (2) and is flush with the surface of the IR chip (3) and PD chip (4). The upper colloid part (12) is fixed on the upper part of the lower colloid part (11) and is located above the IR chip (3) and PD chip (4).

2. The gesture sensing transceiver according to claim 1, characterized in that: The lower adhesive part (11) is an opaque epoxy resin.

3. The gesture-sensing transceiver according to claim 1, characterized in that: The adhesive coating (12) is made of transparent epoxy resin.

4. The gesture-sensing transceiver according to claim 1, characterized in that: The surface of the adhesive part (12) is provided with two sets of arc-shaped protruding lens structures (121).

5. The gesture-sensing transceiver according to claim 4, characterized in that: The two sets of lens structures (121) are located directly above the IR chip (3) and the PD chip (4), respectively.

6. The gesture-sensing transceiver according to claim 1, characterized in that: The surface of the IC chip (5) protrudes from the surface of the lower adhesive portion (11).

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