High-temperature-resistant capacitor with heat dissipation structure

Abstract

The utility model discloses a kind of high-temperature-resistant capacitor with heat dissipation structure, it is related to capacitor technical field, including capacitor main body, the top of capacitor main body is fixed with two groups of terminal pin, the outside of capacitor main body is fixed with heat shield, the outside wall of capacitor main body is fixed with insulating heat-conducting pad.The utility model is by being provided with heat shield, insulating heat-conducting pad and semiconductor refrigeration piece, heat shield is arranged at the outside of capacitor main body, heat shield can realize temperature insulation between capacitor main body and external environment, to avoid the high-temperature environment of outside influence normal use of capacitor main body, so that capacitor main body can be normally used under high-temperature environment, and insulating heat-conducting pad can diffuse the heat generated by capacitor main body work to heat shield inside, and heat exchange with the cold energy generated when semiconductor refrigeration piece works, to reach the effect of capacitor main body heat dissipation cooling, so that capacitor main body can still be normally used under high-temperature environment.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to a high-temperature resistant capacitor with a heat dissipation structure. Background Technology

[0002] In recent years, with the continuous development of technology, capacitors have also undergone further innovation. New insulating materials with high dielectric constants enable capacitors to store more charge in smaller sizes. Furthermore, the emergence of supercapacitors has provided a new option for high-capacity, high-power energy storage. However, because the performance and lifespan of a capacitor are closely related to its operating temperature, excessively high temperatures can lead to a decline in the performance of the internal dielectric, and even cause capacitor failure.

[0003] In existing technologies, capacitors generally dissipate heat during operation by means of ambient heat dissipation. However, this method is limited by the ambient temperature around the capacitor. When the ambient temperature is high, the capacitor's heat dissipation efficiency is low. Furthermore, considering the different operating environments of capacitors, when capacitors are used in high-temperature environments, it is necessary to consider not only the capacitor's own heat dissipation but also the impact of external high temperatures on the capacitor, thus limiting the application scenarios of the capacitor.

[0004] Therefore, it is necessary to invent a high-temperature resistant capacitor with a heat dissipation structure to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a high-temperature resistant capacitor with a heat dissipation structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-temperature resistant capacitor with a heat dissipation structure, comprising a capacitor body, two sets of terminal pins fixedly disposed at the top of the capacitor body, a heat insulation shield fixedly disposed on the outer side of the capacitor body, an insulating thermally conductive pad fixedly disposed on the outer wall of the capacitor body, a plurality of protrusions surrounding the outer wall of the insulating thermally conductive pad, a plurality of planes surrounding the outer wall of the heat insulation shield, a semiconductor cooling chip fixedly disposed in the middle of each of the plurality of planes, the inner side of the semiconductor cooling chip disposed inside the heat insulation shield, the outer side of the semiconductor cooling chip disposed outside the heat insulation shield, a plurality of heat dissipation fins fixedly disposed on the outer wall of the heat insulation shield, each of the plurality of heat dissipation fins being annular in structure, the outer walls of the plurality of semiconductor cooling chips being fitted and connected to the inner walls of the heat dissipation fins, a groove being formed at the bottom of the heat insulation shield, and a plurality of fan-shaped membranes surrounding the bottom of the groove.

[0007] Preferably, a limiting ring is fixedly provided at the bottom of the inner wall of the heat insulation cover, and one end of the upper surface of each of the plurality of diaphragms is connected to the lower surface of the limiting ring.

[0008] Preferably, the inner sidewalls of the plurality of semiconductor cooling chips are each fixedly provided with a plurality of heat-conducting fins, and the plurality of heat-conducting fins are arranged sequentially from top to bottom.

[0009] Preferably, a connecting wire is fixedly provided at the top of the outer side wall of the semiconductor cooling chip.

[0010] Preferably, all of the protrusions are designed as strip structures, and the protrusions are distributed in an equally spaced ring array around the insulating thermal pad.

[0011] Preferably, the outer wall of the heat dissipation fins is provided with extended fins, and the extended fins are provided with an upward inclined structure.

[0012] Preferably, the insulating thermally conductive pad is a silicone pad.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] 1. This utility model incorporates a heat insulation shield, an insulating thermal pad, and a semiconductor cooling chip. The heat insulation shield is located on the outside of the capacitor body, which isolates the capacitor body from the external environment to prevent the high-temperature environment from affecting the normal operation of the capacitor body. This allows the capacitor body to operate normally in high-temperature environments. The insulating thermal pad diffuses the heat generated by the capacitor body during operation into the heat insulation shield and exchanges heat with the cold energy generated by the semiconductor cooling chip, thereby achieving the effect of heat dissipation and cooling of the capacitor body. This ensures that the capacitor body can still operate normally in high-temperature environments.

[0015] 2. This utility model, by setting up a heat insulation cover, groove, diaphragm, and limiting ring, allows the heat generated by the capacitor body during operation to exchange heat with the air inside the heat insulation cover. This causes the air temperature inside the heat insulation cover to rise and expand, resulting in an increase in air pressure inside the heat insulation cover. At this time, the diaphragm deforms outward under the action of air pressure to complete the depressurization inside the heat insulation cover and simultaneously expel some hot air. This ensures the pressure balance inside the heat insulation cover while providing a certain auxiliary heat dissipation effect. Furthermore, during the outward deformation of the diaphragm, it can drive the limiting ring to separate from the capacitor body, allowing the air inside the heat insulation cover to escape. When the diaphragm deforms inward, the limiting ring can seal the internal space of the heat insulation cover, preventing high-temperature air from the external environment from entering the heat insulation cover and affecting the capacitor body. This ensures the stable operation of the capacitor body while reducing its impact from the high-temperature external environment. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the overall structure of this utility model.

[0017] Figure 2 This is a bottom view of the overall structure of this utility model.

[0018] Figure 3 This is a cross-sectional view of the overall structure of this utility model.

[0019] Figure 4 This is a schematic diagram of the heat insulation cover structure of this utility model.

[0020] Figure 5 This is a schematic diagram of the capacitor body structure of this utility model.

[0021] In the diagram: 1. Capacitor body; 2. Terminal pin; 3. Heat insulation shield; 4. Insulating thermal pad; 5. Bump; 6. Plane; 7. Semiconductor cooling chip; 8. Heat dissipation fins; 9. Extended fins; 10. Groove; 11. Diaphragm; 12. Limiting ring; 13. Thermal conductive fins; 14. Connecting wires. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This utility model provides, for example Figure 1-5 The high-temperature resistant capacitor with a heat dissipation structure shown includes a capacitor body 1. Two sets of terminal pins 2 are fixedly provided on the top of the capacitor body 1. A heat insulation shield 3 is fixedly provided on the outside of the capacitor body 1. An insulating heat-conducting pad 4 is fixedly provided on the outer wall of the capacitor body 1. The insulating heat-conducting pad 4 is a silicone pad. The silicone pad can achieve heat conduction of the capacitor body 1 while ensuring the insulation of the capacitor body 1, so as to avoid electromagnetic interference between the capacitor body 1 and other structures.

[0024] The outer wall of the insulating thermal pad 4 is surrounded by multiple protrusions 5, each of which is a strip structure and is arranged in an equally spaced ring array around the insulating thermal pad 4.

[0025] The outer wall of the heat insulation shield 3 is surrounded by multiple planes 6. A semiconductor cooling chip 7 is fixed in the middle of each plane 6. The inner side of the semiconductor cooling chip 7 is located inside the heat insulation shield 3, and the outer side of the semiconductor cooling chip 7 is located outside the heat insulation shield 3. Multiple heat dissipation fins 8 are fixed on the outer wall of the heat insulation shield 3. The multiple heat dissipation fins 8 are all designed as annular structures. The outer wall of the heat dissipation fins 8 is provided with extended fins 9, and the extended fins 9 are designed as upward inclined structures. The design of the extended fins 9 increases the contact area between the heat dissipation fins 8 and the air, thereby improving the heat dissipation efficiency of the heat dissipation fins 8. The upward inclined structure design can reduce the space occupied by the extended fins 9, so as to facilitate the installation and use of the capacitor body 1.

[0026] The outer walls of multiple semiconductor cooling chips 7 are all attached to the inner walls of heat dissipation fins 8. A groove 10 is provided at the bottom of the heat insulation cover 3. Multiple fan-shaped membranes 11 are arranged around the bottom of the groove 10. The fan-shaped structure design allows multiple membranes 11 to form a circular structure to seal the groove 10.

[0027] A limiting ring 12 is fixedly provided at the bottom of the inner wall of the heat insulation cover 3. One end of the upper surface of multiple diaphragms 11 is connected to the lower surface of the limiting ring 12. When the diaphragms 11 deform outward, they can drive the limiting ring 12 to separate from the capacitor body 1, so that the air inside the heat insulation cover 3 can be discharged. When the diaphragms 11 deform inward, the limiting ring 12 can seal the internal space of the heat insulation cover 3 to prevent high temperature air from the external environment from entering the heat insulation cover 3 and affecting the capacitor body 1. This ensures the stable operation of the capacitor body 1 while reducing its impact from the external high temperature environment.

[0028] Multiple heat-conducting fins 13 are fixedly provided on the inner sidewalls of multiple semiconductor cooling chips 7, and the multiple heat-conducting fins 13 are arranged sequentially from top to bottom. The heat-conducting fins 13 are used to dissipate the heat generated by the heating surface of the semiconductor cooling chip 7 when it is working.

[0029] A connecting wire 14 is fixedly provided at the top of the outer side wall of the thermoelectric cooler 7. The connecting wire 14 is used to connect the thermoelectric cooler 7 to the circuit.

[0030] Working principle of this utility model:

[0031] When in use, the heat insulation cover 3 can wrap and protect the capacitor body 1, isolating it from the external environment. When the capacitor body 1 is used in a high-temperature environment, it can reduce the impact of the external environment on the capacitor body 1. Furthermore, the heat generated by the capacitor body 1 during operation can be dissipated outward through the insulating heat-conducting pad 4. The insulating heat-conducting pad 4 achieves heat exchange with the air inside the heat insulation cover 3 through the protrusions 5, thereby dissipating the heat generated by the capacitor body 1 during operation. In addition, during the operation of the capacitor body 1, the thermoelectric cooling chip 7 works synchronously. The thermoelectric cooling chip 7 generates a thermoelectric effect during operation, causing the side of the thermoelectric cooling chip 7 located inside the heat insulation cover 3 to absorb heat and the side located outside the heat insulation cover 3 to dissipate heat. At this time, the side of the thermoelectric cooling chip 7 located inside the heat insulation cover 3 can absorb heat from the air inside the heat insulation cover 3 to cool down the capacitor body 1, thereby ensuring the normal use of the capacitor body 1.

[0032] When the capacitor body 1 operates at a high power, the heat generated exceeds the cooling capacity of the semiconductor cooling chip 7. At this time, a certain amount of heat accumulates inside the heat insulation shield 3. The heat accumulation causes the air temperature inside the heat insulation shield 3 to rise. Correspondingly, the air temperature rises, causing the air to expand, which in turn increases the air pressure inside the heat insulation shield 3. At this time, the diaphragm 11 deforms outward under the action of air pressure and drives the limiting ring 12 to move, causing the limiting ring 12 to separate from the bottom end of the capacitor body 1. At this time, the channel between the capacitor body 1 and the limiting ring 12 opens, and the air inside the heat insulation shield 3 is discharged through the multiple diaphragms 11 under the action of air pressure. During the air discharge process, some heat can be carried away to reduce the heat dissipation pressure inside the heat insulation shield 3. After some air is discharged, the air pressure inside the heat insulation shield 3 returns to equilibrium. At this time, the diaphragm 11 resets under its own elasticity to achieve the sealing of the heat insulation shield 3.

[0033] It should be noted that the working state of the thermoelectric cooler 7 can be controlled manually or by an external PLC controller. The PLC controller can control the operation of the thermoelectric cooler 7 according to the power of the capacitor body 1 and the ambient temperature, thereby achieving energy saving. The above control logic adopts existing technology, which does not have a decisive impact on the operation of the heat insulation cover 3, thermoelectric cooler 7 and other structures in this embodiment, and will not be elaborated here.

[0034] It should be further noted that in this embodiment, the capacitor body 1, the heat insulation shield 3, the insulating thermal pad 4, and the semiconductor cooling chip 7 all use materials and products from the prior art. This embodiment only limits the position and cooperation relationship of each structure.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high temperature resistant capacitor having a heat dissipating structure, comprising a capacitor body (1), characterized in that: Two sets of terminal pins (2) are fixedly provided at the top of the capacitor body (1). A heat insulation shield (3) is fixedly provided on the outer side of the capacitor body (1). An insulating heat-conducting pad (4) is fixedly provided on the outer wall of the capacitor body (1). Multiple protrusions (5) are arranged around the outer wall of the insulating heat-conducting pad (4). Multiple planes (6) are arranged around the outer wall of the heat insulation shield (3). A semiconductor cooling chip (7) is fixedly provided in the middle of each of the multiple planes (6). The inner side of the semiconductor cooling chip (7) is provided with... Inside the heat insulation shield (3), the outer side of the semiconductor cooling chip (7) is located on the outer side of the heat insulation shield (3). Multiple heat dissipation fins (8) are fixedly provided on the outer side wall of the heat insulation shield (3). The multiple heat dissipation fins (8) are all designed as annular structures. The outer side wall of the multiple semiconductor cooling chips (7) is attached to the inner side wall of the heat dissipation fins (8). A groove (10) is provided at the bottom of the heat insulation shield (3). Multiple fan-shaped membranes (11) are arranged around the bottom of the groove (10).

2. The high temperature capacitor with heat dissipation structure according to claim 1, characterized in that: The inner wall bottom of the heat insulation cover (3) is fixedly provided with a limiting ring (12), and one end of the upper surface of each of the multiple diaphragms (11) is connected to the lower surface of the limiting ring (12).

3. The high temperature capacitor with heat dissipation structure according to claim 1, wherein: Multiple heat-conducting fins (13) are fixedly provided on the inner sidewalls of the multiple semiconductor cooling chips (7), and the multiple heat-conducting fins (13) are arranged sequentially from top to bottom.

4. The high temperature capacitor with heat dissipation structure according to claim 1, wherein: A connecting wire (14) is fixedly provided at the top of the outer wall of the semiconductor cooling chip (7).

5. The high temperature capacitor with heat dissipation structure according to claim 1, wherein: The multiple bumps (5) are all designed as strip structures, and the multiple bumps (5) are distributed in an equally spaced ring array around the insulating heat-conducting pad (4).

6. The high temperature capacitor with heat dissipation structure according to claim 1, wherein: The outer wall of the heat dissipation fins (8) is provided with extended fins (9), and the extended fins (9) are provided with an upward inclined structure.

7. The high temperature capacitor with heat dissipation structure according to claim 1, wherein: The insulating thermal pad (4) is a silicone pad.

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