Liquid cooling plate and energy storage device
By using staggered heat dissipation columns and the Coanda effect design, the problem of insufficient heat dissipation capacity of liquid cooling plates is solved, achieving more efficient heat dissipation and optimized material utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI HONGYING NEW ENERGY TECHNOLOGY CO LTD
- Filing Date
- 2025-05-13
- Publication Date
- 2026-06-02
AI Technical Summary
Traditional liquid cooling plates have a simple flow channel design, resulting in poor heat dissipation.
The system employs staggered first and second heat dissipation columns, combined with the Coanda effect and dual main flow channel design, to enhance turbulence disturbance, expand the coolant contact area, and optimize the flow channel structure.
It improves heat dissipation uniformity and efficiency, reduces flow resistance, and achieves comprehensive optimization of material utilization and process economy.
Smart Images
Figure CN224318516U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of battery heat dissipation technology, and in particular to a liquid cooling plate and an energy storage device. Background Technology
[0002] As the energy density of battery systems continues to increase, the heat generated during battery system operation is also increasing. Thermal management components are needed to maintain the battery system within a suitable operating temperature range to ensure the battery system's performance, cycle performance, and thermal safety. Existing technical solutions mainly use liquid cooling plates to cool the battery system.
[0003] During the implementation of the embodiments of this application, the inventors discovered that the traditional liquid cooling plate has a simple flow channel design, resulting in poor heat dissipation capacity. Utility Model Content
[0004] The main technical problem solved by the embodiments of this application is to provide a liquid cooling plate that, by setting a first heat dissipation groove and a first heat dissipation component, can enhance turbulence disturbance, expand the contact area of the coolant, and improve the heat dissipation uniformity.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing a liquid cooling plate, including a substrate and a first heat dissipation component. The substrate is provided with a liquid inlet, a liquid outlet, and a first heat dissipation groove. The liquid inlet and the liquid outlet are arranged opposite to each other along a first direction of the substrate. The first heat dissipation groove is connected to the liquid outlet and the liquid inlet respectively. The first heat dissipation component is disposed in the first heat dissipation groove. The first heat dissipation component includes a first main channel, a plurality of first heat dissipation pillars, and a plurality of second heat dissipation pillars. One end of the first main channel is fixed to the side wall of the first heat dissipation groove. The plurality of first heat dissipation pillars and the plurality of second heat dissipation pillars are evenly arranged around the first main channel at the bottom of the first heat dissipation groove. The projection positions of the first heat dissipation pillars and the second heat dissipation pillars in the first heat dissipation groove form an alternating distribution structure, and the cross-sectional area of the second heat dissipation pillars is larger than the cross-sectional area of the first heat dissipation pillars.
[0006] Optionally, the first heat dissipation column includes a first support section and a first flow guide section. One end of the first support section is fixed to the first heat dissipation groove, and the other end of the first support section is connected to the first flow guide section. The first support section and the first flow guide section form a first flow guide surface.
[0007] Optionally, the second heat dissipation column includes a second support section and a second guide section. One end of the second support section is fixed to the first heat dissipation groove, and the other end of the second support section is connected to the second guide section. The second support section and the second guide section form a second guide surface, wherein the second guide surface and the first guide surface form a mutually cooperating flow channel.
[0008] Optionally, the first heat dissipation component further includes a second main channel, one end of which is fixed to the other side wall of the first heat dissipation groove, wherein one end of the first main channel extends along a first direction of the first heat dissipation groove, and the other end of the second main channel extends along a second direction of the first heat dissipation groove.
[0009] Optionally, the first heat dissipation tank is provided with a first liquid inlet and a second liquid inlet, the first liquid inlet being connected to the liquid inlet and the second liquid inlet being connected to the liquid outlet.
[0010] Optionally, the first liquid inlet is further provided with a plurality of guide strips, which are evenly arranged along the width direction of the first liquid inlet.
[0011] Optionally, the liquid cooling plate is further provided with a second heat dissipation component and a third heat dissipation component, and the substrate is further provided with a second heat dissipation groove and a third heat dissipation groove, the second heat dissipation groove and the third heat dissipation groove are connected in series, and the second heat dissipation component is disposed in the second heat dissipation groove, and the third heat dissipation component is disposed in the third heat dissipation groove.
[0012] Optionally, the liquid cooling plate further includes a metal frame surrounding the substrate. The metal frame has a receiving groove for accommodating the substrate, and the inner edge of the metal frame covers the outer peripheral edge area of the substrate to form a sealed structure.
[0013] Optionally, the liquid cooling plate further includes an insulation layer, and the receiving tank is further provided with an insulation tank, with the insulation layer disposed in the insulation tank.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide an energy storage device, including any of the above-mentioned liquid cooling plates.
[0015] This application provides a liquid-cooled plate, including a substrate and a first heat dissipation assembly. The substrate is provided with a first heat dissipation groove, which is connected to the inlet and outlet of the liquid to ensure the optimal flow path of the coolant and reduce flow resistance. The fixed connection between the first main channel of the first heat dissipation assembly and the side wall of the first heat dissipation groove provides a stable fluid channel to prevent short circuits in the liquid flow. Since the cross-sectional area of the second heat dissipation column is larger than that of the first heat dissipation column, the design of the two different-sized heat dissipation columns forms a differentiated heat dissipation functional area. The second heat dissipation column provides more contact area and enhances fluid turbulence. The uniform arrangement of the first and second heat dissipation columns around the first main channel ensures a uniform temperature field distribution and avoids local hot spots. Furthermore, the staggered distribution structure of the first and second heat dissipation columns utilizes the Coanda effect to guide the coolant to form a covering flow along the surface of the first and second heat dissipation columns, expanding the actual heat exchange area and enhancing turbulence. The liquid-cooled plate design in this application achieves comprehensive optimization of heat dissipation efficiency, material utilization, and process economy while ensuring reliable sealing. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the liquid cooling plate according to an embodiment of this application;
[0018] Figure 2 This is a schematic diagram showing another perspective of the liquid cooling plate in an embodiment of this application;
[0019] Figure 3 yes Figure 2 Enlarged view of part A in the middle;
[0020] Figure 4 This is a schematic diagram of an energy storage device according to an embodiment of this application.
[0021] The reference numerals in the detailed embodiments are as follows: 100, liquid cooling plate; 10, substrate; 11, liquid inlet; 12, liquid outlet; 13, first heat dissipation groove; 131, first liquid inlet; 132, second liquid inlet; 133, guide strip; 14, second heat dissipation groove; 141, third liquid inlet; 142, fourth liquid inlet; 15, third heat dissipation groove; 151, fifth liquid inlet; 152, sixth liquid inlet; 20, first heat dissipation component; 21, first main flow channel; 22, first heat dissipation column; 221, first support section; 222, first guide section; 23, second heat dissipation column; 231, second support section; 232, second guide section; 24, second main flow channel; 30, second heat dissipation component; 40, third heat dissipation component; 50, metal frame. Detailed Implementation
[0022] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0024] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0025] Please see Figure 1 The liquid cooling plate 100 includes a substrate 10 and a first heat dissipation component 20.
[0026] The substrate 10 is provided with a liquid inlet 11 and a liquid outlet 12, which are arranged opposite to each other along a first direction of the substrate 10. A first heat dissipation groove 13 is provided on the substrate 10, which is connected to the liquid outlet 12 and the liquid inlet 11 respectively, to form a flow channel for coolant.
[0027] It should be noted that in the structure of the liquid cooling plate 100 of this application, the first direction of the substrate 10 refers to the directional axis connecting the liquid inlet 11 and the liquid outlet 12. For example... Figure 1 As shown, the inlet 11 and outlet 12 on the substrate 10 are arranged opposite each other along the first direction, forming the main path direction for coolant flow. This first direction allows the coolant to flow along a predetermined path through the entire first heat dissipation tank 13, thereby achieving effective heat dissipation for the battery system.
[0028] Please combine Figure 2 And see Figure 3 A first heat dissipation component 20 is disposed within a first heat dissipation tank 13. The first heat dissipation component 20 includes a first main channel 21, multiple first heat dissipation columns 22, and multiple second heat dissipation columns 23. One end of the first main channel 21 is fixed to the side wall of the first heat dissipation tank 13, forming a stable fluid channel structure. The multiple first heat dissipation columns 22 and multiple second heat dissipation columns 23 are evenly arranged around the first main channel 21 at the bottom of the first heat dissipation tank 13 to ensure uniform temperature field distribution and avoid the formation of local hot spots. Within the first heat dissipation tank 13, the projected positions of the first heat dissipation columns 22 and the second heat dissipation columns 23 form an alternating distribution structure. This alternating distribution structure effectively utilizes the Coanda effect to guide the coolant to form a wrapping flow along the surface of the heat dissipation columns, significantly expanding the actual heat transfer area and enhancing turbulence. The cross-sectional area of the second heat dissipation column 23 is larger than that of the first heat dissipation column 22. The design of the two different sizes of heat dissipation columns forms differentiated heat dissipation functional areas, with the second heat dissipation column 23 providing more contact area and enhancing the fluid turbulence effect.
[0029] Through the above structural design, the liquid cooling plate 100 in this application can enhance turbulence disturbance, expand the contact area of coolant, improve heat dissipation uniformity, and achieve comprehensive optimization of heat dissipation efficiency, material utilization and process economy while ensuring reliable sealing.
[0030] Please see Figure 3The first heat dissipation column 22 includes a first support section 221 and a first guide section 222. One end of the first support section 221 is fixed to the first heat dissipation groove 13, providing stable support for the first heat dissipation column 22. The other end of the first support section 221 is connected to the first guide section 222, and the first support section 221 and the first guide section 222 form a first guide surface (not shown). The first guide surface is curved, and its curved design guides the coolant to flow along the surface of the column, increasing the contact area. Furthermore, the second heat dissipation column 23 adopts a similar but different structure, including a second support section 231 and a second guide section 232. One end of the second support section 231 is fixed to the first heat dissipation groove 13, and the other end of the second support section 231 is connected to the second guide section 232. The second support section 231 and the second guide section 232 together form a second guide surface.
[0031] It is worth noting that the second and first guide surfaces form complementary flow channels in their spatial distribution, creating flow paths for the coolant as it flows past adjacent heat dissipation columns. The design of these flow channels utilizes the Coanda effect, causing the coolant to adhere to the guide surfaces and flow, while simultaneously creating localized turbulence regions between adjacent guide surfaces, thus enhancing the heat transfer efficiency between the liquid and the heat dissipation column surfaces. The second heat dissipation column 23, with its larger cross-sectional area, provides more heat exchange area, while the first heat dissipation column 22, with its more slender structure, helps increase fluid turbulence. The synergistic effect of these two heat dissipation column structures ensures the efficient operation of the entire cooling system.
[0032] Please continue reading. Figure 3 As mentioned above, one end of the first main flow channel 21 is fixed to the side wall of the first heat dissipation groove 13, providing a main flow channel for the coolant. Furthermore, the first heat dissipation assembly 20 also includes a second main flow channel 24, one end of which is fixed to the other side wall of the first heat dissipation groove 13, forming a complementary fluid channel system. The extension directions of the first main flow channel 21 and the second main flow channel 24 are specifically designed: one end of the first main flow channel 21 extends along a first direction of the first heat dissipation groove 13, i.e., the direction of the line connecting the inlet 11 and outlet 12 on the substrate 10; while the other end of the second main flow channel 24 extends along a second direction of the first heat dissipation groove 13, the second direction being perpendicular to the first direction or forming a specific angle.
[0033] It should be noted that the first direction refers to the directional axis of the line connecting the liquid inlet 11 and the liquid outlet 12 on the substrate 10, representing the main flow direction of the coolant in the liquid cooling plate. The second direction is perpendicular to the first direction or at a specific angle, forming a cross flow path to promote thorough mixing and heat exchange of the coolant within the heat dissipation tank. The orthogonal or angular design of the dual main channels allows the coolant to form a more complex flow path within the first heat dissipation tank 13, effectively avoiding fluid short-circuiting. The coolant is forced to pass through more heat dissipation column areas, contacting a larger heat dissipation area, while the flow velocity distribution is more uniform. After the coolant flows out from the first main channel 21, it flows along the space between the first heat dissipation column 22 and the second heat dissipation column 23, and then enters the second main channel 24, forming a longer heat exchange path.
[0034] The dual-channel design in this embodiment improves the rigid heat dissipation path of traditional single-channel liquid cooling plates, making the temperature field distribution more uniform and improving the overall heat dissipation efficiency.
[0035] Please continue reading. Figure 3 The first heat dissipation tank 13 is provided with a first liquid inlet 131 and a second liquid inlet 132, forming a channel for coolant to enter and exit within the heat dissipation tank. The first liquid inlet 131 is connected to the liquid inlet 11 and is responsible for guiding externally introduced coolant into the heat dissipation tank; the second liquid inlet 132 is connected to the liquid outlet 12 and is responsible for guiding the coolant that has completed heat exchange out of the heat dissipation system. The arrangement of the first liquid inlet 131 and the second liquid inlet 132 allows the coolant to enter the first heat dissipation tank 13 in an orderly manner and to make full contact with the first heat dissipation column 22 and the second heat dissipation column 23.
[0036] The design of the first liquid inlet 131 further optimizes fluid distribution. Specifically, multiple guide strips 133 are provided at the first liquid inlet 131. These guide strips 133 are evenly arranged along the width of the first liquid inlet 131, forming multiple parallel small channels. The uniform distribution of the guide strips 133 ensures that the coolant is more evenly distributed throughout the first heat dissipation tank 13 upon entering, avoiding problems of excessively high or low local flow velocities. By setting the guide strips 333, the coolant begins to generate turbulent characteristics before entering the heat dissipation tank, breaking the laminar flow state and improving the convective heat transfer efficiency between the liquid and the surface of the heat dissipation column. Simultaneously, the guide strips 133 also play a role in flow distribution, ensuring that each area within the heat dissipation tank receives relatively balanced cooling capacity and preventing localized hot spots.
[0037] In this embodiment, through the design of the guide strip 133 of the first liquid inlet 131 and the cooperation of the second liquid inlet 132, the liquid cooling plate 100 achieves a heat dissipation effect with more uniform coolant distribution and a more reasonable flow path, providing a more stable and reliable thermal management solution for the battery system.
[0038] Please refer to Figure 3. As mentioned earlier, the first liquid inlet 131 is provided with multiple guide strips 133, which are evenly arranged along the width of the first liquid inlet 131 to promote uniform distribution of coolant. Based on this design, the liquid cooling plate 100 is also provided with a second heat dissipation component 30 and a third heat dissipation component 40, which expands the overall capacity and efficiency of the heat dissipation system.
[0039] Please reconsider. Figure 2 In addition to the first heat dissipation groove 13, the substrate 10 also has a second heat dissipation groove 14 and a third heat dissipation groove 15. The second heat dissipation groove 14 and the third heat dissipation groove 15 are designed in series, so that the coolant flows through each heat dissipation groove in sequence, forming a continuous heat exchange path. The second heat dissipation component 30 is disposed in the second heat dissipation groove 14, and the third heat dissipation component 40 is disposed in the third heat dissipation groove 15, together forming a complete heat dissipation system.
[0040] In this embodiment, the second heat sink 14 is provided with a third liquid inlet 141 and a fourth liquid inlet 142, and the third heat sink 15 is provided with a fifth liquid inlet 151 and a sixth liquid inlet 152. The flow path of the coolant is as follows: the coolant first enters from the inlet 11, enters the first heat sink 13 through the first liquid inlet 131, and undergoes preliminary heat exchange in the first heat dissipation assembly 20; then it flows out through the second liquid inlet 132 and enters the third liquid inlet 141, where it begins the second stage of heat exchange in the second heat dissipation assembly 30 within the second heat sink 14; the coolant then flows out from the fourth liquid inlet 142 and enters the fifth liquid inlet 151, where it completes the final heat exchange in the third heat dissipation assembly 40 within the third heat sink 15; finally, it flows out from the sixth liquid inlet 152 and exits the liquid cooling plate system through the outlet 12.
[0041] The series-connected heat sink design allows the coolant to flow through the system for a longer path, contacting more heat dissipation units and significantly improving overall heat dissipation capacity. Simultaneously, different heat sinks can be optimized for different heat load areas, enabling precise heat dissipation control in hot spots of the battery system. The tiered cooling system formed by the first heat sink 13, the second heat sink 14, and the third heat sink 15 can adapt to the heat dissipation needs of the battery pack under different operating conditions, providing a more reliable thermal management solution. The heat dissipation component structure inside each heat sink can be differentiated according to the actual heat load distribution, such as adjusting the density, size, or distribution pattern of the heat dissipation columns to match the heat dissipation requirements of the corresponding area, thereby achieving efficient operation of the overall heat dissipation system.
[0042] Please reconsider. Figure 2The liquid cooling plate 100 also includes a metal frame 50. The metal frame 50 surrounds the substrate 10, forming an external support structure. The metal frame 50 has a receiving groove for accommodating the substrate 10, and the substrate 10 is precisely embedded in the receiving groove to ensure the overall structural stability. The inner edge of the metal frame 50 covers the outer peripheral edge area of the substrate 10, forming a sealing structure to effectively prevent coolant leakage.
[0043] In this embodiment, the metal frame 50 and the substrate 10 adopt a structural decoupling design concept. The substrate 10 focuses on the heat dissipation function of the flow channel, allowing for the existence of non-sealed pores inside, while the metal frame 50 undertakes the functions of sealing and structural support. By covering the edge area of the substrate 10, the risk of direct exposure of possible internal pores is avoided. This functional separation design ensures that the liquid cooling plate 100 can maintain reliable sealing even under long-term pressure or vibration conditions.
[0044] In this embodiment, the metal frame 50 is made of high-strength aluminum alloy, providing excellent structural strength and lightweight characteristics. The mating surface between the substrate 10 and the metal frame 50 is machined with high precision, and the surface flatness and roughness are strictly controlled, eliminating microscopic leakage paths and improving overall sealing reliability.
[0045] In addition, the metal frame 50 is pre-installed with standardized mounting holes and pipe interfaces, allowing the liquid cooling plate 100 to flexibly adapt to different battery pack layout requirements. The external structural design of the metal frame 50 also takes into account its connection with the battery pack cover, forming a complete battery compartment sealing system.
[0046] The collaborative design of the metal frame 50 and the substrate 10 in this embodiment solves the contradiction between sealing reliability, structural strength and heat dissipation efficiency of traditional liquid cooling plates, and achieves a balance between lightweight and pressure-bearing capacity, thereby improving the adaptability and reliability of the liquid cooling plate 100 in the application environment of new energy vehicles.
[0047] In the embodiments of this application, the liquid cooling plate 100 further includes an insulation layer (not shown). As described in the foregoing embodiments, a metal frame 50 surrounds the substrate 10 and has a receiving groove for accommodating the substrate 10. At the bottom of the receiving groove, the metal frame 50 also has a specially designed insulation groove (not shown) for accommodating the insulation layer (not shown). The insulation groove adopts a recessed structure of a predetermined depth, allowing the insulation layer to be fully embedded, avoiding installation interference problems caused by the protrusion of the insulation material coating in traditional liquid cooling plates. The groove wall of the insulation groove has barbed protrusions or micro-textured structures, forming a mechanical interlocking mechanism. The insulation layer is disposed in the insulation groove and forms a tight fit with the micro-textured structure, which can improve the adhesion of the insulation layer and solve the hidden danger of easy detachment of traditional external insulation solutions.
[0048] The depth design of the insulation groove ensures that the outer surface of the insulation layer is flush with the bottom surface of the metal frame 50, avoiding the problems of local bulges and uneven thickness that occur after conventional liquid cooling plates are coated with insulation material. The flat bottom surface design facilitates the tight installation of the liquid cooling plate 100 and the battery system, improving heat dissipation contact efficiency. Furthermore, the shape of the insulation groove can be flexibly adapted to the characteristics of different insulation materials. For example, a grid-shaped insulation groove is suitable for powder-filled materials; a dovetail-shaped groove is suitable for fixing sheet-like insulation materials; and a flow guide design is suitable for guiding the liquid coating material to flow evenly. The diverse insulation groove design allows the liquid cooling plate 100 to adapt to the insulation requirements of different working environments.
[0049] The embedded insulation design in this embodiment overlaps the thickness of the insulation layer with that of the liquid cooling plate substrate, reducing the overall structural space requirements. Simultaneously, the interface between the insulation layer and the substrate 10, which is in direct contact, reduces thermal resistance and improves thermal management efficiency. In high-humidity environments, the insulation layer can also be made of hydrophobic materials, effectively suppressing condensation and corrosion risks, thus expanding the environmental adaptability of the liquid cooling plate 100.
[0050] By incorporating insulation grooves and insulation layers, the liquid cooling plate 100 achieves an organic unity between insulation performance and structural integration, providing a more stable and reliable thermal management solution for battery systems.
[0051] This application provides a liquid cooling plate 100, including a substrate 10 and a first heat dissipation component 20. The substrate 10 is provided with a first heat dissipation groove 13, which is connected to the inlet and outlet 11 to ensure the optimal flow path of the coolant and reduce flow resistance. The fixed connection between the first main flow channel 21 of the first heat dissipation component 20 and the side wall of the first heat dissipation groove 13 provides a stable fluid channel to prevent short circuit of the liquid flow. Since the cross-sectional area of the second heat dissipation column 23 is larger than that of the first heat dissipation column 22, the design of the two different sizes of heat dissipation columns forms a differentiated heat dissipation functional area. The second heat dissipation column 23 provides more contact area and enhances fluid disturbance. The uniform arrangement of the first heat dissipation column 22 and the second heat dissipation column 23 around the first main channel 21 ensures a uniform temperature field distribution and avoids local hot spots. Furthermore, the staggered distribution structure of the first heat dissipation column 22 and the second heat dissipation column 23 utilizes the Coanda effect to guide the coolant to form a wrapping flow along the surface of the first heat dissipation column 22 and the second heat dissipation column 23, thereby expanding the actual heat exchange area and enhancing turbulence. The liquid cooling plate 100 design in this application achieves comprehensive optimization of heat dissipation efficiency, material utilization, and process economy while ensuring reliable sealing.
[0052] Please see Figure 4 This application provides an energy storage device 200, which uses any of the aforementioned liquid cooling plates 100 to achieve effective thermal management of the battery system.
[0053] The energy storage device 200 mainly includes a battery pack cover 210, several battery cells (not shown), and a liquid cooling plate 100. The liquid cooling plate 100 is located at the bottom of the battery cells and achieves rapid heat conduction through direct contact with the battery cells. The battery pack cover 210 and the liquid cooling plate 100 together form a closed battery compartment, providing mechanical protection and thermal isolation for the battery system.
[0054] In the energy storage device 200, the inlet 11 of the liquid cooling plate 100 is connected to the cryogenic coolant supply line of the external cooling circulation system, and the outlet 12 is connected to the return line. When the battery system is working and generating heat, the coolant enters the liquid cooling plate 100 from the inlet 11, flows through the first heat dissipation tank 13, the second heat dissipation tank 14 and the third heat dissipation tank 15 in sequence, absorbs the heat generated by the battery cells, and then flows out from the outlet 12 and returns to the radiator for cooling.
[0055] The metal frame 50 of the liquid cooling plate 100 forms a sealed connection with the battery pack cover 210, preventing external moisture and impurities from entering the battery compartment. The sealed structure of the metal frame 50 avoids the risk of liquid leakage that is common in traditional liquid cooling plates, while its high strength provides additional mechanical support for the entire energy storage device 200.
[0056] The insulation layer at the bottom of the liquid cooling plate 100 reduces heat exchange between the energy storage device 200 and the external environment, preventing external temperature fluctuations from affecting battery performance. In high and low temperature environments, the insulation layer helps maintain the temperature stability of the battery system and extends battery life.
[0057] The liquid cooling plate 100 in the energy storage device 200 enhances cooling efficiency by utilizing staggered heat dissipation columns and the Coanda effect, enabling the battery cells to operate within an ideal temperature range during high-power charging and discharging. The multi-slot series design adapts to the heat dissipation needs of different areas inside the battery pack, providing targeted and stronger cooling capabilities for high-heat areas.
[0058] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A liquid-cooled plate, characterized in that, include: The substrate is provided with a liquid inlet and a liquid outlet and a first heat dissipation groove. The liquid inlet and the liquid outlet are arranged opposite to each other along a first direction of the substrate. The first heat dissipation groove is connected to the liquid outlet and the liquid inlet respectively. A first heat dissipation component is disposed in the first heat dissipation groove. The first heat dissipation component includes a first main channel, a plurality of first heat dissipation pillars and a plurality of second heat dissipation pillars. One end of the first main channel is fixed to the side wall of the first heat dissipation groove. The plurality of first heat dissipation pillars and the plurality of second heat dissipation pillars are evenly disposed around the first main channel at the bottom of the first heat dissipation groove. The projection positions of the first heat dissipation pillars and the second heat dissipation pillars in the first heat dissipation groove form an alternating distribution structure, and the cross-sectional area of the second heat dissipation pillars is larger than the cross-sectional area of the first heat dissipation pillars.
2. The liquid cooling plate according to claim 1, characterized in that, The first heat dissipation column includes a first support section and a first flow guide section. One end of the first support section is fixed to the first heat dissipation groove, and the other end of the first support section is connected to the first flow guide section. The first support section and the first flow guide section form a first flow guide surface.
3. The liquid cooling plate according to claim 2, characterized in that, The second heat dissipation column includes a second support section and a second flow guide section. One end of the second support section is fixed to the first heat dissipation groove, and the other end of the second support section is connected to the second flow guide section. The second support section and the second flow guide section form a second flow guide surface, wherein the second flow guide surface and the first flow guide surface form a mutually cooperating flow channel.
4. The liquid cooling plate according to claim 1, characterized in that, The first heat dissipation component further includes a second main channel, one end of which is fixed to the other side wall of the first heat dissipation groove. One end of the first main channel extends along a first direction of the first heat dissipation groove, and the other end of the second main channel extends along a second direction of the first heat dissipation groove.
5. The liquid cooling plate according to claim 1, characterized in that, The first heat dissipation tank is provided with a first liquid inlet and a second liquid inlet. The first liquid inlet is connected to the liquid inlet, and the second liquid inlet is connected to the liquid outlet.
6. The liquid cooling plate according to claim 5, characterized in that, The first liquid inlet is also provided with a plurality of guide strips, which are evenly arranged along the width direction of the first liquid inlet.
7. The liquid cooling plate according to claim 6, characterized in that, The liquid cooling plate is also provided with a second heat dissipation component and a third heat dissipation component. The substrate is further provided with a second heat dissipation groove and a third heat dissipation groove, which are connected in series. The second heat dissipation component is disposed in the second heat dissipation groove, and the third heat dissipation component is disposed in the third heat dissipation groove.
8. The liquid cooling plate according to claim 1, characterized in that, The liquid cooling plate also includes a metal frame that surrounds the substrate. The metal frame is provided with a receiving groove for accommodating the substrate, and the inner edge of the metal frame covers the outer peripheral edge area of the substrate to form a sealed structure.
9. The liquid cooling plate according to claim 8, characterized in that, The liquid cooling plate also includes an insulation layer, and the receiving tank is further provided with an insulation tank, with the insulation layer disposed in the insulation tank.
10. An energy storage device, characterized in that, Includes the liquid cooling plate as described in any one of claims 1-9.