A high-power high-integration water-cooled laser

Abstract

The utility model discloses a high power high integration degree water -cooled laser belongs to laser application field, including water -cooled base, water -cooled base top is equipped with laser array through bolt mounting, water -cooled base bottom is according to having outlet pipe and return pipe, is equipped with cooling plate between outlet pipe and return pipe, and cooling plate is installed in cooling pool inboard, and the outer side of cooling plate is equipped with the fin, the water -cooled base in the utility model is cooled to laser array, is equipped with cooling plate between outlet pipe and return pipe, and cooling plate is installed in cooling pool inboard, and cooling pool can cool the cooling plate, and the fin increases the contact area of cooling liquid in cooling pool, better completes the heat dissipation protection work to laser array, avoids the temperature of cooling liquid in water -cooled base to rise, guarantees that the heat dissipation effect is good.

Description

Technical Field

[0001] This utility model relates to the field of laser applications, and in particular to a high-power, highly integrated water-cooled laser. Background Technology

[0002] Lasers have many applications in life, among which the 1064nm high-power laser source is used in laser medicine, laser beauty and other fields.

[0003] This laser emitter, based on a water-cooled base, copper circuit board, and laser chip array, obtains a uniform laser light field at a specified light source distance. Its high power and high concentration generate a lot of heat during operation. The water-cooled base removes the heat. However, during long-term operation, the heat is only stored in the coolant, and the coolant temperature will gradually increase, resulting in a decrease in heat dissipation performance. Utility Model Content

[0004] Purpose of the invention: The purpose of this utility model is to provide a high-power, highly integrated water-cooled laser.

[0005] Technical solution: Includes a water-cooled base, with a laser array bolted to the top of the water-cooled base, and an outlet and return water pipes at the bottom of the water-cooled base. A cooling plate is installed between the outlet and return water pipes, and the cooling plate is installed inside the cooling pool. Heat sinks are installed on the outside of the cooling plate. The cooling pool is equipped with an evaporation zone. The outlet and return water pipes are made of copper, and the cooling plate is made of copper.

[0006] By adopting the above technical solution, the water-cooled base cools the laser array. A cooling plate is installed between the water outlet pipe and the water return pipe. The cooling plate is installed inside the cooling pool, which can cool the cooling plate. The heat sink increases the contact area with the coolant in the cooling pool, which better completes the heat dissipation protection of the laser array, avoids the temperature of the coolant in the water-cooled base from rising, and ensures good heat dissipation effect.

[0007] Optionally, a water pump is installed at the outer end of the water outlet pipe, and a cooling plate is installed at the other end of the water pump through a dispersion pipe. The dispersion pipe is fixedly installed at the outer end of the cooling plate by welding.

[0008] By adopting the above technical solution, the water pump works, and the coolant in the water-cooled base enters the cooling plate from the dispersion pipe.

[0009] Optionally, the outer end of the return water pipe is installed at the other end of the cooling plate via a manifold, and the manifold is fixedly installed at the outer end of the cooling plate by welding.

[0010] By adopting the above technical solution, the manifold is used to allow the coolant in the cooling plate to enter the water-cooled machine base.

[0011] Optionally, connection holes are provided on both sides of the water-cooled base cooling plate, and the connection holes are machined by drilling.

[0012] By adopting the above technical solution, the connecting hole is used to connect the dispersing pipe and the collecting pipe.

[0013] Optionally, a square opening is provided at the outer end of the laser array. The top and bottom of the square opening are respectively equipped with a laser negative electrode and a laser positive electrode. Both the laser negative electrode and the laser positive electrode are connected to the power supply by welding.

[0014] By adopting the above technical solution, the laser negative electrode is used to connect to the negative electrode of the power supply, and the laser positive electrode is used to connect to the positive electrode of the power supply.

[0015] Optionally, the negative and positive terminals of a thermistor are installed on the side of the square opening, and both the negative and positive terminals are connected to the power supply by soldering.

[0016] By adopting the above technical solution, the negative terminal and the positive terminal of the thermistor are used to connect to the positive and negative terminals of the power supply, respectively.

[0017] Optionally, a thermistor and multiple laser units are installed in the center of the laser array.

[0018] By adopting the above technical solution, the thermistor is used to stabilize the circuit, and the laser unit is used to emit laser light.

[0019] Beneficial effects: The water-cooled base of this utility model cools the laser array. A cooling plate is installed between the water outlet pipe and the water return pipe. The cooling plate is installed inside the cooling pool, which can cool the cooling plate. The heat sink increases the contact area with the coolant in the cooling pool, which can better protect the laser array from heat dissipation and prevent the coolant temperature in the water-cooled base from rising, thus ensuring good heat dissipation effect. Attached Figure Description

[0020] Figure 1 This is an overall structural diagram of an embodiment of the present utility model;

[0021] Figure 2 This is a diagram of the inclined plane structure of an embodiment of the present invention;

[0022] Figure 3 This is a diagram of the laser array structure according to an embodiment of the present invention;

[0023] Figure 4 This is a diagram of the cooling structure according to an embodiment of the present invention;

[0024] Figure 5 This is a structural diagram of the cooling plate according to an embodiment of the present invention;

[0025] Explanation of reference numerals in the attached diagram: 1. Water-cooled base; 2. Outlet pipe; 3. Return pipe; 4. Laser array; 5. Bolt; 6. Laser negative electrode; 7. Laser positive electrode; 8. Thermistor negative electrode; 9. Thermistor positive electrode; 10. Thermistor present; 11. Laser unit; 12. Dispersion tube; 13. Collection tube; 14. Heat sink; 15. Connection hole; 16. Water pump; 17. Cooling plate; 18. Cooling pool. Detailed Implementation

[0026] To make the technical solution of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, such as... Figures 1 to 5 The system includes a water-cooled base 1, with a laser array 4 mounted on the top of the base 1 via bolts 5. A water outlet pipe 2 and a water return pipe 3 are installed at the bottom of the base 1. A cooling plate 17 is installed between the water outlet pipe 2 and the water return pipe 3. The cooling plate 17 is installed inside a cooling pool 18, and heat sinks 14 are installed on the outside of the cooling plate 17. The cooling pool 18 has an evaporation zone. The water-cooled base 1 in this invention cools the laser array. The cooling plate 17 is installed inside the cooling pool 18, allowing the cooling pool 18 to cool the cooling plate 17. The heat sinks 14 increase the contact area with the coolant in the cooling pool 18, better protecting the laser array 4 from heat loss and preventing the coolant temperature inside the water-cooled base 1 from rising, thus ensuring good heat dissipation.

[0027] A water pump 16 is installed at the outer end of the water outlet pipe 2. A cooling plate 17 is installed at the other end of the water pump 16 through the dispersion pipe 12. When the water pump 16 is working, the coolant in the water-cooled base 1 enters the cooling plate 17 from the dispersion pipe 12.

[0028] The outer end of the return water pipe 3 is installed at the other end of the cooling plate 17 through the collecting pipe 13. The collecting pipe 13 is used for the coolant in the cooling plate 17 to enter the water-cooled base 1.

[0029] The water-cooled base 1 has connection holes 15 on both sides of the cooling plate 17. The connection holes 15 are used to connect the dispersion pipe 12 and the collection pipe 13.

[0030] The laser array 4 has a square opening at one end. The top and bottom of the square opening are respectively equipped with a laser negative electrode 6 and a laser positive electrode 7. The laser negative electrode 6 is used to connect to the negative terminal of the power supply, and the laser positive electrode 7 is used to connect to the positive terminal of the power supply.

[0031] The negative terminal 8 and the positive terminal 9 of a thermistor are installed on the side of the square opening. The negative terminal 8 and the positive terminal 9 of the thermistor are used to connect to the positive and negative terminals of the power supply, respectively.

[0032] A thermistor 10 and multiple laser units 11 are installed in the middle of the laser array 4. The thermistor 10 is used to stabilize the circuit, and the laser units 11 are used to emit lasers.

[0033] The implementation principle of a high-power, highly integrated water-cooled laser according to an embodiment of this application is as follows: When the high-power, highly integrated water-cooled laser is in use, the laser array 4 is working, and the heat is conducted to the water-cooled base 1. The water pump 16 is working, and the coolant in the water-cooled base 1 enters the dispersion pipe 12 from the outlet pipe 2. After dispersion, it enters the cooling plate 17. The coolant in the cooling pool 18 evaporates, realizing the heat dissipation of the cooling plate 17. The coolant in the cooling plate 17 is entered from the collection pipe 13 into the return water pipe 3 and flows back to the water-cooled base 1, continuously circulating to complete the heat dissipation of the laser array 4.

[0034] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A high power high integration water-cooled laser, characterized by: The system includes a water-cooled base (1), on which a laser array (4) is mounted by bolts (5) on the top. A water outlet pipe (2) and a water return pipe (3) are arranged at the bottom of the water-cooled base (1). A cooling plate (17) is installed between the water outlet pipe (2) and the water return pipe (3). The cooling plate (17) is installed inside the cooling pool (18). Heat sinks (14) are installed on the outside of the cooling plate (17). The cooling pool (18) is provided with an evaporation zone.

2. The high power high integration water-cooled laser as claimed in claim 1, characterized in that: A water pump (16) is installed at the outer end of the water outlet pipe (2), and a cooling plate (17) is installed at the other end of the water pump (16) through the dispersion pipe (12).

3. A high-power, highly integrated water-cooled laser according to claim 1, characterized in that: The outer end of the return water pipe (3) is installed on the other end of the cooling plate (17) through the collecting pipe (13).

4. A high-power, highly integrated water-cooled laser according to claim 1, characterized in that: The water-cooled base (1) has connection holes (15) on both sides of the cooling plate (17).

5. A high-power, highly integrated water-cooled laser according to claim 1, characterized in that: The laser array (4) has a square opening at one end, and a laser negative electrode (6) and a laser positive electrode (7) are installed at the top and bottom of the square opening, respectively.

6. A high-power, highly integrated water-cooled laser according to claim 5, characterized in that: The negative electrode (8) and positive electrode (9) of a thermistor are installed on the side of the square opening.

7. A high-power, highly integrated water-cooled laser according to claim 1, characterized in that: The laser array (4) has a thermistor (10) and multiple laser units (11) installed in the middle.

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