A multi-functional microphone

Abstract

The application provides a multifunctional microphone, which comprises a circuit board, a first recess on the upper surface of the circuit board, a shell, a baffle, a microphone MEMS chip and a microphone ASIC chip, a barometer MEMS chip and a barometer ASIC chip, and filling glue.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically to a multifunctional microphone. Background Technology

[0002] Currently, with rapid social development and the continuous improvement of human material needs, electronic products (such as mobile phones, computers, learning machines, smart bracelets, smartwatches, VR devices, smart headphones, etc.) are becoming increasingly integrated, and the requirements for product size are becoming increasingly stringent. To meet this demand, devices such as microphones and barometers used in electronic products are typically packaged using Micro-electromechanical Systems (MEMS) technology, and the packaging structures and assembly processes of these sensors have a high degree of similarity.

[0003] However, existing electronic products use microphones, barometers, and other independent components; each component is manufactured through similar processes, which wastes materials and manpower and increases costs; each component also needs to be mounted separately and occupies free space, increasing the product size; in addition, different sensors may interfere with each other when working, affecting the performance and stability of the equipment.

[0004] Based on the above problems, there is an urgent need to develop a technology that can effectively reduce the space occupied by multiple sensors, while avoiding mutual interference between different sensors during operation. Utility Model Content

[0005] The main technical problem addressed by this application is to provide a multifunctional microphone for integrating multiple sensor units, including a microphone and a barometer, into a single package, thereby reducing the space occupied by multiple sensors and avoiding interference between different sensor units during operation.

[0006] This application discloses a multi-functional microphone, which includes:

[0007] A circuit board having a first groove located on its upper surface;

[0008] The outer casing, together with the circuit board, forms a cavity;

[0009] A retaining wall divides the cavity into a first cavity and a second cavity, with the first groove located within the first cavity;

[0010] The microphone MEMS (Micro-Electrical-Mechanical System) chip and the microphone AISC (Application Specific Integrated Circuit) chip are mounted on the circuit board and located in the second cavity.

[0011] The barometer MEMS chip and the barometer ASIC chip are disposed in the first groove;

[0012] A filler adhesive is placed in the first groove to cover the barometer MEMS chip and the barometer ASIC chip.

[0013] In some alternative embodiments, the barometer ASIC chip is disposed at the bottom of the first groove, and the barometer MEMS chip is stacked on the barometer ASIC chip.

[0014] In some alternative implementations, the upper surface of the barometer MEMS chip is lower than or flush with the upper surface of the circuit board.

[0015] In some alternative embodiments, the barometer ASIC chip is electrically interconnected with the circuit board via bonding wires; the barometer MEMS chip is electrically interconnected with the barometer ASIC chip via bonding wires or conductive bumps.

[0016] In some alternative implementations, the microphone MEMS chip and the microphone AISC chip, and the microphone AISC chip and the circuit board, are electrically interconnected via bonding lines.

[0017] In some alternative embodiments, the upper surface of the circuit board also has a second groove located within the second cavity, and the microphone MEMS chip is disposed within the second groove.

[0018] In some alternative implementations, the upper surface of the microphone MEMS chip is higher than the upper surface of the circuit board.

[0019] In some alternative embodiments, the filler is a silicone gel.

[0020] In some alternative embodiments, the retaining wall has an opening connecting the first cavity and the second cavity.

[0021] In some alternative implementations, the retaining wall and the outer shell are an integral structure.

[0022] In some alternative implementations, the opening is a notch formed between the retaining wall and the circuit board, or the opening is a hole formed in the retaining wall.

[0023] In some alternative implementations, the circuit board has a sound hole that connects to the microphone MEMS chip.

[0024] As described above, this application proposes a multi-functional microphone. By adopting the above technical solution, this application has the following advantages: The multi-functional microphone of this application realizes the integrated packaging of the microphone and sensor units such as barometers, which can reduce the space occupied by multiple sensor units and reduce the packaging volume of the product; furthermore, by using a baffle to separate the cavity formed by the circuit board and the shell into a first cavity and a second cavity, the microphone and barometer are isolated, which can avoid interference caused by different sensor units working; at the same time, using filler to cover the barometer MEMS chip and barometer ASIC chip can play a heat insulation role, and the filler also has the function of preventing interference between different sensor units working; in addition, by placing the barometer MEMS chip and barometer ASIC chip in the first groove on the circuit board, and filling the first groove with filler, it can prevent the filler from flowing to other areas and prevent the filler from affecting the microphone MEMS chip and microphone ASIC chip. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments and the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a cross-sectional structural schematic diagram of a multi-functional microphone according to an embodiment of this application;

[0027] Figure 2 This is a cross-sectional view of a multi-functional microphone according to another embodiment of this application. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0029] The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0030] The following detailed descriptions will be provided through specific embodiments.

[0031] refer to Figure 1 One embodiment of this application provides a multi-functional microphone, which includes:

[0032] Circuit board 1 has a first groove 101 located on its upper surface;

[0033] The outer casing 2, together with the circuit board 1, forms a cavity;

[0034] The retaining wall 201 divides the cavity into a first cavity 62 and a second cavity 61, and the first groove 101 is located in the first cavity 62;

[0035] The microphone, including microphone MEMS chip 5 and microphone AISC chip 3, is mounted on circuit board 1 and located inside the second cavity 61.

[0036] A barometer, including a barometer MEMS chip 7 and a barometer ASIC chip 8, is disposed in the first groove 101;

[0037] A filler adhesive 11 is placed in the first groove 101 to cover the barometer MEMS chip 7 and the barometer ASIC chip 8.

[0038] In some alternative implementations, the barometer ASIC chip 8 is disposed at the bottom of the first recess 101, and the barometer MEMS chip 7 is stacked on the barometer ASIC chip 8.

[0039] In some alternative embodiments, the upper surface of the barometer MEMS chip 7 is lower than or flush with the upper surface of the circuit board 1. This ensures that the barometer MEMS chip 7 and the barometer ASIC chip 8 are completely located within the first recess 101.

[0040] In some alternative embodiments, the barometer ASIC chip 8 is electrically interconnected with the circuit board 1 via bonding wires 4; the barometer MEMS chip 7 is electrically interconnected with the barometer ASIC chip 8 via bonding wires 4 or conductive bumps. The bonding wires 4 are, for example, metal wires such as gold, silver, or copper wires.

[0041] In some alternative implementations, the microphone MEMS chip 5 and the microphone AISC chip 3, and the microphone AISC chip 3 and the circuit board 1 are electrically interconnected via bonding wires 4.

[0042] In some alternative embodiments, the upper surface of the circuit board 1 also has a second groove 102 located in the second cavity 61, and the microphone MEMS chip 5 is disposed in the second groove 102. This can reduce the height of the microphone MEMS chip 5, thereby helping to reduce the overall package height of the multi-functional microphone and save space.

[0043] In some alternative implementations, the microphone MEMS chip 5 and microphone ASIC chip 3, as well as the barometer MEMS chip 7 and barometer ASIC chip 8, can be mounted on the circuit board 1 using adhesives. The adhesives used include, but are not limited to, silicone and epoxy.

[0044] In some alternative embodiments, the upper surface of the microphone MEMS chip 5 is higher than the upper surface of the circuit board 1. That is, the lower part of the microphone MEMS chip 5 is located within the second groove 102, while the upper part is exposed outside the second groove 102.

[0045] In some alternative embodiments, the filler 11 in the first groove 101 is a silicone gel, which has good thermal insulation properties and good air permeability.

[0046] In some alternative embodiments, the housing 2 and the circuit board 1 can be connected by welding, gluing or other methods, and can be an airtight connection.

[0047] In some alternative embodiments, the retaining wall 201 has an opening 202 communicating with the first cavity 62 and the second cavity 61.

[0048] In some alternative implementations, the retaining wall 201 and the outer shell 2 are an integral structure.

[0049] In some alternative embodiments, the opening 202 may be a notch formed between the retaining wall 201 and the upper surface of the circuit board 1, or the opening 202 may be a hole formed in the retaining wall 201.

[0050] In some alternative implementations, the circuit board 1 has a sound hole 9 that connects to the microphone MEMS chip 5.

[0051] In some alternative embodiments, a waterproof and breathable membrane is also provided on the circuit board 1 to cover the acoustic hole 9. The waterproof and breathable membrane can be provided on the upper or lower surface of the circuit board 1.

[0052] In some alternative embodiments, the lower surface of the circuit board 1 is provided with solder pads, which are positioned to connect to external devices, such as the motherboard.

[0053] The present application discloses a multifunctional microphone, which can be assembled as follows: a microphone ASIC chip 3, a microphone MEMS chip 5, a barometer ASIC chip 8, and a barometer MEMS chip 7 are fixed to corresponding positions on a circuit board 1 using adhesive. The barometer MEMS chip 7 and the barometer ASIC chip 8 are stacked within a first groove 101 on the circuit board 1. These components are electrically connected by bonding wires 4. The first groove 101 is filled with silicone gel as a filler 11. Then, the outer shell 1 and the retaining wall 201 are encapsulated on the circuit board 1. The retaining wall 201 divides the cavity formed by the circuit board 1 and the outer shell 2 into a first cavity 62 and a second cavity 61, thereby isolating the microphone and the barometer and avoiding interference when different sensor units are working. The first groove 101 prevents the silicone gel from flowing to other areas, ensuring that the silicone gel completely covers the barometer ASIC chip 8 and the barometer MEMS chip 7 due to the strong fluidity of the silicone gel. The primary function of silicone gel is heat insulation, preventing the heat generated by the barometer from radiating into the cavity and affecting the microphone's operation. Its secondary function is to reduce interference between the barometer and the microphone.

[0054] This application discloses a multifunctional microphone, the working principle of which is as follows: External air pressure signals (including sound signals, which can be considered a type of air pressure signal) are input to the microphone MEMS chip 5 through the sound hole 9. The microphone MEMS chip 5 converts the sound signal detected through the sound hole 9 into an electrical signal. The microphone MEMS chip 5 is breathable, allowing the air pressure signal to pass through it into the second cavity 61, and then through the opening 202 into the first cavity 62, acting on the barometer MEMS chip 7. The barometer MEMS chip 7 converts the detected air pressure signal into an electrical signal. Thus, both sound and air pressure signals are picked up.

[0055] Next, refer to Figure 2 Another embodiment of this application provides a multi-functional microphone. Figure 2 The multi-functional microphone shown is similar to Figure 1 The multi-functional microphone shown differs in that:

[0056] exist Figure 2 In the multi-functional microphone shown, the second groove 102 is not provided on the circuit board 1, and the microphone MEMS chip 5 is directly mounted on the upper surface of the circuit board 1.

[0057] This method simplifies the structure of circuit board 1 and simplifies the manufacturing process.

[0058] The technical solution of this application has been described in detail above through specific embodiments. In the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0059] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and protection scope of the technical solutions of the embodiments of this application.

Claims

1. A multi-functional microphone, characterized in that, include: A circuit board having a first groove located on its upper surface; The outer casing, together with the circuit board, forms a cavity; A retaining wall divides the cavity into a first cavity and a second cavity, with the first groove located within the first cavity; The microphone MEMS chip and the microphone AISC chip are mounted on the circuit board and located in the second cavity. The barometer MEMS chip and the barometer ASIC chip are disposed in the first groove; A filler adhesive is placed in the first groove to cover the barometer MEMS chip and the barometer ASIC chip.

2. The multi-functional microphone according to claim 1, characterized in that, The barometer ASIC chip is disposed at the bottom of the first groove, and the barometer MEMS chip is stacked on the barometer ASIC chip.

3. The multi-functional microphone according to claim 2, characterized in that, The upper surface of the barometer MEMS chip is lower than or flush with the upper surface of the circuit board.

4. The multi-functional microphone according to claim 1, characterized in that, The upper surface of the circuit board also has a second groove located in the second cavity, and the microphone MEMS chip is disposed in the second groove.

5. The multi-functional microphone according to claim 4, characterized in that, The upper surface of the microphone MEMS chip is higher than the upper surface of the circuit board.

6. The multi-functional microphone according to claim 1, characterized in that, The filler is a silicone gel.

7. The multi-functional microphone according to claim 1, characterized in that, The retaining wall has an opening that connects the first cavity and the second cavity.

8. The multi-functional microphone according to claim 7, characterized in that, The retaining wall and the outer shell are an integral structure.

9. The multi-functional microphone according to claim 7, characterized in that, The opening is a notch formed between the retaining wall and the circuit board, or the opening is a hole made in the retaining wall.

10. The multi-functional microphone according to claim 1, characterized in that, The circuit board has a sound hole that connects to the microphone MEMS chip.

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