An anti-static PCB circuit board

Abstract

This utility model discloses an anti-static PCB circuit board, specifically relating to the field of PCB circuit board technology, including a circuit board body; the bottom of the circuit board body is provided with a heat dissipation component to prevent heat accumulation; the heat dissipation component includes multiple heat dissipation plates disposed at the bottom of the circuit board body, the multiple heat dissipation plates being evenly spaced apart, and an airflow channel for guiding airflow is provided between adjacent heat dissipation plates, the airflow channel being wavy. This utility model, through the full contact between the wavy heat-conducting plates and the circuit board body, can more effectively absorb and conduct heat on the circuit board body. Furthermore, because of the wavy airflow channel between adjacent heat-conducting plates, the airflow path is extended, allowing air to fully contact the heat-conducting plates, thereby improving the heat dissipation efficiency of the heat-conducting plates on the circuit board body and preventing heat accumulation that increases static electricity.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, and more specifically to an anti-static PCB circuit board. Background Technology

[0002] Circuit boards (PCBs) are indispensable core components in electronic devices. Through a laminated structure of conductive lines, pads, and insulating substrates, they provide mechanical support and electrical interconnection for electronic components (such as chips, resistors, and capacitors). With the advancement of electronic technology towards high integration, miniaturization, and high frequency, the wiring density, signal transmission rate, and operating environment complexity of PCBs have significantly increased, leading to their widespread application in consumer electronics, communication equipment, industrial automation, medical instruments, and automotive electronics. However, in complex electromagnetic environments or dry conditions, electrostatic discharge (ESD) problems are becoming increasingly prominent, becoming a key factor in circuit failure, component damage, and even system collapse. Therefore, anti-static design has become one of the core elements of modern PCB technology.

[0003] As shown in the prior art published in CN217445567U, although the antistatic layer in this prior art is composed of cross-woven copper and aluminum strips, the copper and aluminum strips can prevent the generation and discharge of static electricity. Furthermore, the static electricity is discharged through conductive blocks, where it is then eliminated by the insulating fixing plate. This achieves the effect of preventing static electricity generation and facilitating its elimination, thus improving the safety of the circuit board. However, the circuit board in this prior art generates heat during operation. High temperatures can dry the surface of the circuit board, leading to increased resistance and making it easier for static electricity to accumulate. Utility Model Content

[0004] To overcome the aforementioned deficiencies of the prior art, this utility model provides an anti-static PCB circuit board. By having a corrugated heat-conducting plate in full contact with the circuit board body, heat on the circuit board body can be absorbed and conducted more effectively. Furthermore, because a corrugated airflow channel is provided between two adjacent heat-conducting plates, the airflow path can be extended, allowing air to fully contact the heat-conducting plate, thereby improving the heat dissipation efficiency of the heat-conducting plate on the circuit board body and avoiding heat accumulation that would increase static electricity accumulation, thus solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an anti-static PCB circuit board, comprising a circuit board body;

[0006] The bottom of the circuit board body is provided with a heat dissipation component to prevent heat accumulation;

[0007] The heat dissipation component includes multiple heat dissipation plates disposed at the bottom of the circuit board body. The multiple heat dissipation plates are evenly spaced apart, and an airflow channel for guiding air circulation is provided between two adjacent heat dissipation plates. The airflow channel is designed to be wavy.

[0008] In a preferred embodiment, the heat dissipation plate includes two fixed plates and a heat-conducting plate, the heat-conducting plate being disposed between the two fixed plates, and both the heat-conducting plate and the two fixed plates being disposed at the bottom of the circuit board body, with the top of the heat-conducting plate contacting the bottom of the circuit board body.

[0009] In a preferred embodiment, mounting shells are fitted on both ends of the circuit board body, and two connecting rings are provided between the two mounting shells. The two connecting rings are respectively located on the front and rear sides of the circuit board body. Fixed posts are threaded into both ends of the connecting rings, and the ends of the two fixed posts that are far apart are respectively fixed to the sides of the two mounting shells that are close to each other.

[0010] One of the fixing plates is fixed to the bottom of one of the mounting shells at the end away from the heat-conducting plate.

[0011] In a preferred embodiment, hollow columns are provided at the bottom of both the front and rear ends of the mounting shell, and springs are provided inside the hollow columns.

[0012] In a preferred embodiment, the spring is provided with a movable plate at its top, the movable plate is disposed inside the hollow column, the movable plate is mounted with a movable column at its top, and the top end of the movable column penetrates through the hollow column and is fixed together with the bottom of the mounting shell.

[0013] In a preferred embodiment, the diameter of the movable plate is larger than the diameter of the movable column, and the outer side of the movable plate is in contact with the inner wall of the hollow column.

[0014] In a preferred embodiment, the circuit board body is provided with an antistatic coating, which is made of graphene material.

[0015] The technical effects and advantages of this utility model are as follows:

[0016] 1. By fully contacting the wavy heat-conducting plate with the circuit board body, the heat on the circuit board body can be absorbed and conducted more effectively. Furthermore, because there is a wavy airflow channel between two adjacent heat-conducting plates, the airflow path can be extended, allowing the air to fully contact the heat-conducting plate, thereby improving the heat dissipation efficiency of the heat-conducting plate on the circuit board body and avoiding heat accumulation and increasing static electricity accumulation.

[0017] 2. By rotating the connecting ring between the two fixed posts, and then connecting the connecting ring with the two fixed posts through the threaded connection, the two fixed posts can be connected as one unit. This allows the mounting shell to be fixed to the outside of the circuit board body. At the same time, the connecting ring can be reversed to rotate to the outside of one of the fixed rings, so that the two fixed posts are not restricted in their position, thereby achieving the effect of convenient disassembly and removal of the mounting shell and heat sink. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a bottom view of the circuit board body of this utility model;

[0020] Figure 3 For the present utility model Figure 2 Enlarged view of section A in the middle;

[0021] Figure 4 This is a schematic diagram of the connecting ring after adjustment according to this utility model;

[0022] Figure 5 This is a cross-sectional view of the hollow column of this utility model;

[0023] Figure 6 This is a cross-sectional view of the antistatic coating of this utility model.

[0024] The attached diagram is labeled as follows: 1. Circuit board body; 2. Heat sink; 3. Airflow channel; 4. Fixing plate; 5. Heat conduction plate; 6. Mounting shell; 7. Connecting ring; 8. Fixing post; 9. Hollow post; 10. Spring; 11. Moving plate; 12. Antistatic coating; 13. Moving post. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Refer to the instruction manual appendix Figure 1-6 This utility model provides an antistatic PCB circuit board, including a circuit board body 1; the circuit board body 1 is provided with an antistatic coating 12, which is made of graphene material. The antistatic coating 12 is made of graphene material, which has the characteristics of high conductivity and high mechanical strength, and can effectively improve the antistatic effect of the circuit board body 1.

[0027] The bottom of the circuit board body 1 is provided with a heat dissipation component to prevent heat accumulation; the heat dissipation component includes multiple heat dissipation plates 2 disposed at the bottom of the circuit board body 1, the multiple heat dissipation plates 2 are evenly spaced apart, and an airflow channel 3 for guiding airflow is provided between two adjacent heat dissipation plates 2, the airflow channel 3 is wavy, the heat dissipation plate 2 includes two fixing plates 4 and a heat conduction plate 5, the heat conduction plate 5 is disposed between the two fixing plates 4, and both the heat conduction plate 5 and the two fixing plates 4 are disposed at the bottom of the circuit board body 1, the top of the heat conduction plate 5 is in contact with the bottom of the circuit board body 1.

[0028] In use, the heat-conducting plate 5 on the heat sink 2 contacts the circuit board body 1, so that the heat-conducting plate 5 can absorb and conduct the heat generated by the circuit board body 1 during operation. The wavy heat-conducting plate 5 can fully contact the circuit board body 1, and more effectively absorb and conduct the heat on the circuit board body 1, thereby improving the heat dissipation efficiency of the circuit board body 1.

[0029] Furthermore, because there is a wave-shaped airflow channel 3 between two adjacent heat-conducting plates 5, the airflow path can be extended, allowing the air to fully contact the heat-conducting plates 5, thereby improving the heat dissipation efficiency of the heat-conducting plates 5 on the circuit board body 1 and avoiding heat accumulation and increasing static electricity accumulation.

[0030] To facilitate maintenance of the heat sink 2 on the circuit board body 1, it is necessary to enable easy disassembly and assembly of the heat sink 2, such as... Figure 2-4 As shown, mounting shells 6 are fitted on both ends of the circuit board body 1. Two connecting rings 7 are provided between the two mounting shells 6. The two connecting rings 7 are respectively located on the front and rear sides of the circuit board body 1. Fixed posts 8 are threadedly connected to both ends of the connecting rings 7. The ends of the two fixed posts 8 that are far apart are fixed to the sides of the two mounting shells 6 that are close to each other. The end of one of the fixed plates 4 that is far away from the heat-conducting plate 5 is fixed to the bottom of one of the mounting shells 6.

[0031] In use, the operator places the two mounting shells 6 onto the outside of both ends of the circuit board body 1, and rotates the connecting ring 7 located on one of the fixing posts 8 to move the connecting ring 7 between the two fixing posts 8. Then, through the threaded connection between the connecting ring 7 and the two fixing posts 8, the two fixing posts 8 can be connected as one unit, thereby fixing the mounting shell 6 to the outside of the circuit board body 1. At the same time, the connecting ring 7 can also be reversed to rotate the connecting ring 7 to the outside of one of the fixing rings, so that the outside of the two fixing posts 8 is not restricted, thereby achieving the effect of convenient disassembly and removal of the mounting shell 6 and the heat sink 2.

[0032] To prevent damage to the circuit board body 1 caused by vibration and impact, it is necessary to buffer and de-stress the pressure from vibration and impact, such as... Figure 5As shown, hollow columns 9 are provided at the bottom of both the front and rear ends of the mounting shell 6. A spring 10 is provided inside the hollow column 9. A movable plate 11 is provided on the top of the spring 10. The movable plate 11 is located inside the hollow column 9. A movable column 13 is installed on the top of the movable plate 11. The top of the movable column 13 passes through the hollow column 9 and is fixed to the bottom of the mounting shell 6. The diameter of the movable plate 11 is larger than the diameter of the movable column 13, and the outside of the movable plate 11 is in contact with the inner wall of the hollow column 9.

[0033] In use, the connection between the movable column 13 and the mounting shell 6 allows the movable column 13, along with the movable plate 11, to compress the spring 10 when the mounting shell 6 is impacted and moves downward. The compression effect of the spring 10 helps to absorb and cushion the impact, thus preventing the impact from directly acting on the circuit board body 1 and ensuring the integrity of the circuit board body 1. Furthermore, since the diameter of the movable plate 11 is larger than the diameter of the movable column 13, the movable plate 11 can limit the movement of the movable column 13, thereby effectively ensuring the displacement stability of the movable column 13 and preventing the movable column 13 from separating from the hollow column 9 during movement.

[0034] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An anti-static PCB circuit board, characterized in that: Including the circuit board body (1); The bottom of the circuit board body (1) is provided with a heat dissipation component to prevent heat accumulation; The heat dissipation component includes multiple heat dissipation plates (2) disposed at the bottom of the circuit board body (1). The multiple heat dissipation plates (2) are evenly spaced apart, and an airflow channel (3) for guiding airflow is provided between two adjacent heat dissipation plates (2). The airflow channel (3) is wavy.

2. The anti-static PCB circuit board according to claim 1, characterized in that: The heat dissipation plate (2) includes two fixed plates (4) and a heat conduction plate (5). The heat conduction plate (5) is located between the two fixed plates (4), and both the heat conduction plate (5) and the two fixed plates (4) are located at the bottom of the circuit board body (1). The top of the heat conduction plate (5) is in contact with the bottom of the circuit board body (1).

3. The anti-static PCB circuit board according to claim 1, characterized in that: The circuit board body (1) is fitted with mounting shells (6) on both ends. Two connecting rings (7) are provided between the two mounting shells (6). The two connecting rings (7) are respectively located on the front and rear sides of the circuit board body (1). The connecting rings (7) are threaded with fixing posts (8) at both ends. The ends of the two fixing posts (8) that are far apart are respectively fixed to the sides of the two mounting shells (6) that are close to each other. One of the fixing plates (4) is fixed to the bottom of one of the mounting shells (6) at the end away from the heat-conducting plate (5).

4. The anti-static PCB circuit board according to claim 3, characterized in that: The mounting shell (6) has hollow columns (9) at both the front and rear ends, and springs (10) are installed inside the hollow columns (9).

5. An anti-static PCB circuit board according to claim 4, characterized in that: The spring (10) is provided with a movable plate (11) at the top. The movable plate (11) is located inside the hollow column (9). A movable column (13) is installed on the top of the movable plate (11). The top of the movable column (13) passes through the hollow column (9) and is fixed together with the bottom of the mounting shell (6).

6. An anti-static PCB circuit board according to claim 5, characterized in that: The diameter of the movable plate (11) is larger than the diameter of the movable column (13), and the outside of the movable plate (11) is in contact with the inner wall of the hollow column (9).

7. An anti-static PCB circuit board according to claim 1, characterized in that: The body (1) is provided with an antistatic coating (12) on the outside, and the antistatic coating (12) is made of graphene material.

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