Water-cooled high-frequency electroplating power supply device
By using a modular design and a threaded heat-conducting coil structure, the inconvenience of maintenance and the problem of pipe entanglement in water-cooled high-frequency electroplating power supply devices are solved, realizing a compact cooling system that is easy to maintain and improving system stability and heat dissipation efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO FANZHOU POWER TECHNOLOGY CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-02
AI Technical Summary
Existing water-cooled high-frequency electroplating power supply devices have complex structures, are inconvenient to maintain, and have complicated cooling component connections, which can easily lead to pipe entanglement and leakage, affecting system stability and safety.
The modularly designed heat-conducting blocks and threaded heat-conducting coils, combined with a rotating cover and tube bundle structure, create a compact and easy-to-maintain cooling system. The threaded connection and rotation adjustment adapt to different installation environments, avoiding pipe tangling, and standard interfaces are used to connect the various functional units.
It achieves a compact and easy-to-maintain cooling system, reducing maintenance costs and difficulty, improving system stability and heat dissipation efficiency, and adapting to various installation environments.
Smart Images

Figure CN224319667U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of water-cooled power supply technology, specifically a water-cooled high-frequency electroplating power supply device. Background Technology
[0002] In high-frequency electroplating power supply applications, a large amount of heat is generated during operation, requiring a corresponding cooling system to ensure stable equipment operation. Currently, most commercially available water-cooled high-frequency electroplating power supply devices employ external cooling modules or internal heat dissipation structures, resulting in complex overall layouts and large space requirements, which are difficult to meet the demands of modern industry for equipment miniaturization and integration.
[0003] In existing water-cooled power supply devices, cooling components such as heat-conducting blocks, coils, and connecting pipes are mostly fixed installations, resulting in complex connections between components, inconvenient disassembly, high maintenance costs, and difficult operation. Furthermore, the cooling pipe layout of some devices is disorganized and lacks a unified pipe bundle guiding structure, which can easily lead to pipe entanglement and leakage during equipment operation, affecting the stability and safety of the system. Therefore, this paper provides a water-cooled high-frequency electroplating power supply device. Utility Model Content
[0004] The purpose of this utility model is to provide a water-cooled high-frequency electroplating power supply device to solve the problem that the water-cooled power supply device in the background art has a complicated structure and is inconvenient to maintain.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a water-cooled high-frequency electroplating power supply device, comprising a power supply housing, a first connecting plate fixedly disposed on the outer side of the top of the power supply housing, a first threaded hole being provided at each of the four corners of the top of the first connecting plate, the first threaded hole penetrating the first connecting plate, thermal conductive grease fixedly disposed on the top of the power supply housing, and a thermally conductive block disposed above the power supply housing.
[0006] The heat-conducting block has a second connecting plate fixedly installed on the outer side of its bottom end. The top four corners of the second connecting plate are provided with second threaded holes. The second threaded holes penetrate the second connecting plate. The internal threads of the second threaded holes are provided with bolts. The bottom end of the bolts penetrates the second threaded holes into the first threaded holes and extends to the bottom of the first connecting plate.
[0007] The heat-conducting block has a cavity inside, and a fixed connecting pipe is fixedly installed at the top of the heat-conducting block. Several first threads are opened on the outer side of the top of the fixed connecting pipe. A heat-conducting coil is installed at the bottom of the cavity. One end of the heat-conducting coil passes through the heat-conducting block and extends to the bottom of the fixed connecting pipe.
[0008] The other end of the heat-conducting coil passes through the heat-conducting block and extends to the bottom of the fixed connecting pipe. The outer sides of both ends of the heat-conducting coil are provided with second threads. The upper part of the fixed connecting pipe is provided with a first rotating cover. The top of the first rotating cover is fixedly provided with a tube bundle. The inside of the first rotating cover is provided with a water inlet rotating cover.
[0009] The bottom thread of the water inlet rotary cover is set at one end of the heat conduction coil, the top of the water inlet rotary cover is fixedly set with a water inlet pipe, the water inlet pipe is movably set inside the tube bundle, the inside of the first rotary cover is set with a water outlet rotary cover, and the bottom thread of the water outlet rotary cover is set at the other end of the heat conduction coil.
[0010] The top of the rotating cover is fixedly equipped with a water outlet pipe, which is movably installed inside the tube bundle. One end of the tube bundle is fixedly equipped with a liquid pump, and one end of the liquid pump is fixedly equipped with a water tank through a water pipe. The bottom of the water tank is fixedly equipped with a connecting plate.
[0011] This utility model has at least the following beneficial effects:
[0012] This utility model provides a water-cooled high-frequency electroplating power supply device, which features a compact structure and easy maintenance. In this device, the heat-conducting block is bolted to the first connecting plate on the top of the power supply casing via a second connecting plate, facilitating easy disassembly, replacement, or maintenance. The heat-conducting block has an internal cavity with heat-conducting coils. The two ends of the coils are threaded to the inlet and outlet rotating covers respectively, ensuring reliable sealing and easy disassembly and maintenance. The fixed connecting pipe in the cooling system is threaded to the first rotating cover, allowing for a certain angle of rotation adjustment to adapt to different installation environments and improve system stability. The inlet and outlet pipes are located inside the tube bundle, with a neat layout that reduces space occupation and avoids pipe tangling or damage. The liquid pump and water tank are connected via standard water pipes, allowing for quick disconnection and facilitating individual maintenance or replacement. The overall modular design ensures independent function and easy connection of each component, greatly improving maintenance efficiency and reducing operating costs. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0014] Figure 2 This is a schematic diagram showing the installation position of the thermal grease according to this utility model;
[0015] Figure 3 This is a schematic diagram of the internal structure of the fixed connecting pipe of this utility model;
[0016] Figure 4 This is a schematic diagram of the internal structure of the first rotating cover of this utility model;
[0017] Figure 5 This is a schematic diagram of the internal structure of the heat-conducting block of this utility model.
[0018] In the diagram: 1. Power supply casing; 2. First connecting plate; 3. First threaded hole; 4. Thermal grease; 5. Heat-conducting block; 6. Second connecting plate; 7. Second threaded hole; 8. Bolt; 9. Cavity; 10. Fixed connecting pipe; 11. First thread; 12. Heat-conducting coil; 13. Second thread; 14. First rotating cover; 15. Tube bundle; 16. Water inlet rotating cover; 17. Water inlet pipe; 18. Water outlet rotating cover; 19. Water outlet pipe; 20. Liquid pump; 21. Water tank; 22. Connecting fixing plate. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Please see Figure 1-5 This utility model provides a technical solution: a water-cooled high-frequency electroplating power supply device, including a power supply housing 1. A first connecting plate 2 is fixedly installed on the outer side of the top of the power supply housing 1. The four corners of the top of the first connecting plate 2 are provided with first threaded holes 3, which penetrate through the first connecting plate 2. The top of the power supply housing 1 is coated with thermal grease 4 to improve heat dissipation efficiency. A heat-conducting block 5 is provided on the thermal grease 4. A second connecting plate 6 is fixedly installed on the outer side of the bottom of the heat-conducting block 5. The four corners of the top of the second connecting plate 6 are provided with second threaded holes 7 corresponding to the first threaded holes 3. Bolts 8 pass through the second threaded holes 7 and extend into the first threaded holes 3, firmly installing the heat-conducting block 5 on the top of the power supply housing 1.
[0021] To ensure good heat conduction, a cavity 9 is provided inside the heat-conducting block 5 to accommodate the cooling medium. A fixed connecting pipe 10 is fixedly connected to the top of the heat-conducting block 5, and the outer side of the top of the fixed connecting pipe 10 has several first threads 11. A heat-conducting coil 12 is provided at the bottom of the cavity 9. The heat-conducting coil 12 is arranged in a spiral shape inside the cavity 9, with its two ends passing through the heat-conducting block 5 and extending to the bottom of the inner end of the fixed connecting pipe 10. The outer side of both ends of the heat-conducting coil 12 has second threads 13 to facilitate a sealing connection with the rotating cover. A first rotating cover 14 is threadedly connected to the top of the fixed connecting pipe 10, and a tube bundle 15 is fixedly provided at the top of the first rotating cover 14.
[0022] The tube bundle 15 is used to concentrate and guide the inlet pipe 17 and the outlet pipe 19. The first rotating cover 14 has an inlet rotating cover 16 and an outlet rotating cover 18 inside. The bottom end of the inlet rotating cover 16 is threaded to one end of the heat-conducting coil 12, and the top end is fixedly connected to the inlet pipe 17, which is movably disposed inside the tube bundle 15. The bottom end of the outlet rotating cover 18 is threaded to the other end of the heat-conducting coil 12, and the top end is fixedly connected to the outlet pipe 19, which is also movably disposed inside the tube bundle 15 to ensure smooth water flow and prevent leakage. A liquid pump 20 is fixedly connected to one end of the tube bundle 15. The liquid pump 20 is connected to a water tank 21 via a water pipe. The water tank 21 is used to store coolant. A connecting fixing plate 22 is fixedly disposed at the bottom end of the water tank 21 for stable support of the entire device.
[0023] When in use, first complete the overall installation of the power supply unit, ensuring that all components are securely connected and well-sealed. Before starting the cooling system, an appropriate amount of coolant, usually deionized water or antifreeze, needs to be injected into the water tank 21 to meet the usage requirements under different operating conditions. Subsequently, the high-frequency electroplating power supply starts operating, and its internal power modules, rectifiers, inverters, and other electronic components continuously generate heat during operation. This heat is quickly conducted to the heat-conducting block 5 above the thermal grease 4 on the top of the power supply casing 1, achieving initial heat transfer. At the same time, the liquid pump 20 starts synchronously, drawing coolant from the water tank 21 and delivering it through water pipes to the inlet pipe 17 inside the tube bundle 15. The coolant enters one end of the heat-conducting coil 12 through the inlet rotating cover 16. During the flow inside the spirally arranged heat-conducting coil 12, it undergoes sufficient heat exchange with the heat-conducting block 5, thereby absorbing and carrying away the heat generated by the power supply. After completing the heat exchange, the coolant flows out from the other end of the heat-conducting coil 12 and enters the outlet pipe 19 through the outlet rotating cover 18, finally returning to the water tank 21. During this process, the coolant circulates continuously, forming a closed water-cooling circuit, which keeps the power supply within a suitable operating temperature range and prevents overheating from affecting equipment performance or causing damage.
[0024] To accommodate installation requirements at different angles, the first rotating cover 14 is designed as a rotatable structure, allowing for a certain degree of rotational freedom between the fixed connecting pipe 10 and the pipe bundle 15. This ensures that the cooling system can maintain stable operation under various installation postures and will not cause pipe rupture or seal failure due to external stress. During the entire operation, the heat-conducting block 5 plays a crucial intermediate heat transfer role, and its excellent thermal conductivity ensures that the heat from the power supply can be efficiently transferred to the cooling system. The heat-conducting coil 12, as the core heat exchange component, significantly improves the overall heat dissipation efficiency of the system through reasonable layout and structural design. When the equipment stops running, the liquid pump 20 can automatically shut down, the coolant stops circulating, and the entire system enters standby mode. At this time, if maintenance or replacement of parts is required, the heat-conducting block 5 can be separated from the power supply housing 1 by removing bolt 8, which facilitates the inspection or replacement of the heat-conducting block 5, heat-conducting coil 12 and related connecting parts. The operation is simple and the maintenance efficiency is high. In summary, the water-cooled high-frequency electroplating power supply device provided by this utility model shows good heat dissipation performance, structural stability and installation flexibility in actual work. It is suitable for a variety of high-frequency electroplating power supply application scenarios and has high practical value and promotion prospects.
[0025] The water-cooled high-frequency electroplating power supply device provided by this utility model fully considers the ease of installation and the operability of later maintenance in the actual use process in its structural design. The overall structure layout is reasonable and highly modular, with significant compactness and disassembly, which greatly facilitates the daily maintenance and component replacement of the equipment. Specifically, the heat-conducting block 5 cooperates with the first connecting plate 2 at the top of the power supply shell 1 through the second connecting plate 6, and is fastened by the bolts 8 set at the four corners. This threaded connection method is not only simple in structure and strong in connection, but also allows for quick disassembly by simply unscrewing the bolt 8 when the heat-conducting block and related cooling components need to be inspected or replaced, without damaging the original structure, thus improving maintenance efficiency. In addition, the two ends of the heat-conducting coil 12 are respectively sealed to the water inlet rotating cover 16 and the water outlet rotating cover 18 through the second thread 13. All interfaces adopt a standardized thread structure, which is convenient for on-site disassembly and replacement, avoiding the problem of traditional welded cooling systems requiring complete replacement due to leakage. The first rotating cover 14 is threaded to the fixed connecting pipe 10, and the first thread 11 ensures the sealing performance, while allowing a certain range of rotational freedom, so that the tube bundle 15 of the cooling system can be flexibly adjusted according to the actual installation space, avoiding damage caused by pipe bending or uneven stress.
[0026] The entire cooling system, including components such as the inlet pipe 17, outlet pipe 19, liquid pump 20, and water tank 21, adopts a modular design. The functional units are connected via standard interfaces, reducing space requirements and improving the system's versatility and replaceability. For example, if the liquid pump 20 malfunctions, it can be quickly removed from the system by disconnecting the connected water pipe and removing the fixing bolts, without affecting the normal operation of other parts. In summary, this invention, through its reasonable structural layout and connection method, achieves miniaturization and high integration of the device. It is not only suitable for space-constrained industrial environments but also significantly reduces the difficulty and cost of equipment maintenance, demonstrating good engineering application value and market potential.
[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A water-cooled high-frequency electroplating power supply device, characterized in that: The device includes a power supply housing, a first connecting plate is fixedly installed on the outer top of the power supply housing, a first threaded hole is opened at each of the four corners of the top of the first connecting plate, the first threaded hole penetrates the first connecting plate, thermal grease is fixedly installed on the top of the power supply housing, and a heat-conducting block is installed on the top of the power supply housing.
2. The water-cooled high-frequency electroplating power supply device according to claim 1, characterized in that: A second connecting plate is fixedly installed on the outer side of the bottom end of the heat-conducting block. A second threaded hole is opened at each of the four corners of the top end of the second connecting plate. The second threaded hole penetrates the second connecting plate. A bolt is installed in the internal thread of the second threaded hole. The bottom end of the bolt penetrates the second threaded hole into the first threaded hole and extends to the bottom of the first connecting plate.
3. The water-cooled high-frequency electroplating power supply device according to claim 2, characterized in that: The heat-conducting block has a cavity inside, and a fixed connecting pipe is fixedly installed at the top of the heat-conducting block. Several first threads are opened on the outer side of the top of the fixed connecting pipe. A heat-conducting coil is installed at the bottom of the cavity. One end of the heat-conducting coil passes through the heat-conducting block and extends to the bottom of the fixed connecting pipe.
4. The water-cooled high-frequency electroplating power supply device according to claim 3, characterized in that: The other end of the heat-conducting coil passes through the heat-conducting block and extends to the bottom of the fixed connecting pipe. The outer sides of both ends of the heat-conducting coil are provided with second threads. The upper part of the fixed connecting pipe is provided with a first rotating cover. The top of the first rotating cover is fixedly provided with a tube bundle. The inside of the first rotating cover is provided with a water inlet rotating cover.
5. The water-cooled high-frequency electroplating power supply device according to claim 4, characterized in that: The bottom end of the water inlet rotating cover is threaded onto one end of the heat-conducting coil, and the top end of the water inlet rotating cover is fixedly provided with a water inlet pipe. The water inlet pipe is movably disposed inside the tube bundle. The inside of the first rotating cover is provided with a water outlet rotating cover, and the bottom end of the water outlet rotating cover is threaded onto the other end of the heat-conducting coil.
6. The water-cooled high-frequency electroplating power supply device according to claim 5, characterized in that: A water outlet pipe is fixedly installed at the top of the rotating water outlet cover. The water outlet pipe is movably installed inside the tube bundle. A liquid pump is fixedly installed at one end of the tube bundle. A water tank is fixedly installed at one end of the liquid pump through a water pipe. A connecting plate is fixedly installed at the bottom of the water tank.