Power module with good protection performance and double-sided heat dissipation

Abstract

This utility model relates to a power module with good protective performance and double-sided heat dissipation, including a power module body and a protective shell. The power module body includes a heat-conducting base plate, a substrate, one or more power tubes, an upper heat sink, and insulating protective adhesive. The substrate is mounted on the heat-conducting base plate. Power terminals and signal terminals are electrically connected to the substrate. The power tubes are electrically connected to the substrate. Each power tube is fitted with an upper heat sink. The insulating protective adhesive covers the upper surface of the substrate and all power tubes, with the power terminals and signal terminals extending beyond the insulating protective adhesive. The protective shell covers the power module body, with the top of the upper heat sink, the power terminals, and the signal terminals all extending beyond the protective shell. This utility model adopts double-sided heat dissipation, and the shell is equipped with openings to expose the heat sink teeth, ultimately allowing for heat dissipation by a top-mounted air-cooled heat sink.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to a power module with good protection performance and double-sided heat dissipation. Background Technology

[0002] Traditional inverter bricks are all single-sided heat dissipation devices, which pose a risk of overheating under high power and cannot guarantee operation in harsh environments with high voltage and high power. Furthermore, double-sided heat dissipation inverter bricks require additional mounting brackets to meet the dual-sided heat dissipation requirements. Their volume density and integration are low, failing to achieve true integrated design. Currently, the driver board and driver control board are two separate boards, lacking true integrated design and control, resulting in low integration levels.

[0003] Therefore, it is desirable to provide a power module with good protection performance and double-sided heat dissipation in order to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this utility model patent is to provide a power module with good protection performance and double-sided heat dissipation. It adopts double-sided heat dissipation, and at the same time, the outer shell is increased with openings (the hole positions match the teeth of the heat sink), so that the heat sink teeth are exposed, and finally the air-cooled heat sink on the top of the module dissipates heat.

[0005] A power module with good protection performance and double-sided heat dissipation includes a power module body and a protective shell;

[0006] The power module body includes a heat-conducting base plate, a base plate, one or more power tubes, an upper heat sink, and insulating protective adhesive.

[0007] The substrate is attached to the thermally conductive base plate;

[0008] The substrate is electrically connected to power terminals and signal terminals;

[0009] The power transistor is electrically connected to the substrate;

[0010] Each power tube is fitted with the upper heat sink;

[0011] The insulating protective adhesive covers the upper surface of the substrate and all the power transistors, and the power terminals and signal terminals extend out of the insulating protective adhesive.

[0012] The protective shell covers the power module body, and the top of the upper heat sink, power terminals, and signal terminals all extend out of the protective shell.

[0013] Preferably, the insulating protective adhesive covers the lower part of the upper heat sink.

[0014] Furthermore, each of the power tubes is fitted with an independent upper heat sink.

[0015] Furthermore, the protective shell is provided with several toothed clearance holes located directly above the upper heat sink, and the toothed plate on each upper heat sink passes through the corresponding toothed clearance hole.

[0016] Specifically, the heat-conducting base plate is made of copper, and its surface is coated with nickel.

[0017] Specifically, within the power transistor, at least one chip is upside down on a conductive support within the power transistor, with the back of the upside-down chip exposed above the plastic package.

[0018] The back of each inverted chip is provided with a metal heat-conducting component, and the upper surface of the metal heat-conducting component is provided with insulating thermally conductive adhesive. The upper heat sink is attached to the metal heat-conducting component by means of the insulating thermally conductive adhesive.

[0019] Preferably, the protective shell has a clearance area corresponding to the position of the power terminal, and a shell insert plate is inserted into the clearance area.

[0020] Specifically, the insulating protective adhesive is an epoxy resin adhesive or a silicone gel.

[0021] The power module of this invention, which has good protective performance and double-sided heat dissipation, has the following advantages compared with the prior art:

[0022] The power module body is covered with a protective shell, effectively improving its protection performance. Additionally, each individual power tube employs a double-sided heat dissipation structure, achieving dual-sided heat dissipation for the internal structure. Meanwhile, openings are added to the outer shell, with the opening positions matching the fins of the heatsink, allowing the fins to be exposed. Finally, a wind-cooled heatsink is installed on top of the module for heat dissipation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the power module body in this embodiment;

[0024] Figure 2 This is a schematic diagram of the protective shell in this embodiment;

[0025] Figure 3 This is a schematic diagram of the structure of a power module with good protection performance and double-sided heat dissipation according to this embodiment. Figure 1 ;

[0026] Figure 4 This is a schematic diagram of the outer shell insert plate in this embodiment;

[0027] Figure 5 This is a schematic diagram of the structure of a power module with good protection performance and double-sided heat dissipation according to this embodiment. Figure 2 ;

[0028] Figure 6This is a schematic diagram of the internal structure of the power module after the heat sink is mounted in this embodiment.

[0029] Figure 7 This is a schematic diagram of the structure of a single power tube with a heat sink mounted on it in this embodiment. Detailed Implementation

[0030] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0031] Example

[0032] In this embodiment, as Figure 3 As shown, a power module with good protection performance and double-sided heat dissipation includes a power module body 1 and a protective shell 2.

[0033] like Figure 1 As shown, the power module body 1 includes a heat-conducting base plate 3, a substrate 4, one or more power tubes 5, an upper heat sink 6, and insulating protective adhesive 7; the substrate 4 is attached to the heat-conducting base plate 3; the substrate 4 is electrically connected to a power terminal 8 and a signal terminal 9; wherein, the function of the power terminal 8 is to convert DC power input to AC power output; the function of the signal terminal 9 is to drive the switch control.

[0034] A heat sink can be attached to the heat-conducting base plate as needed.

[0035] The power tube 5 is electrically connected to the substrate 4; the upper heat sink 6 is attached to each power tube 5; the insulating protective adhesive 7 covers the upper surface of the substrate 4 and all the power tubes 5, and the power terminal 8 and signal terminal 9 extend out of the insulating protective adhesive 7.

[0036] The protective shell 2 covers the power module body 1, and the top of the upper heat sink 6, the power terminal 8 and the signal terminal 9 all extend out of the protective shell 2.

[0037] In this embodiment, the insulating protective adhesive 7 covers the lower part of the upper heat sink 6, further stabilizing the upper heat sink 6.

[0038] In this embodiment, each of the power tubes 5 is fitted with an independent upper heat sink 6.

[0039] In this embodiment, as Figure 2 As shown, the protective shell 2 is provided with several toothed relief holes 10 located directly above the upper heat sink 6. Each toothed plate on the upper heat sink 6 passes through the corresponding toothed relief hole 10. The toothed relief hole 10 can play a guiding role, which facilitates the quick installation of the protective shell 2 and the power module body 1.

[0040] Specifically, in this embodiment, the heat-conducting base plate 3 is made of copper and its surface is covered with a nickel layer to effectively prevent the base plate from being oxidized.

[0041] In this embodiment, as Figure 6 and Figure 7 As shown, in the power tube 5, at least one chip 11 is upside down on the conductive support 12 inside the power tube 5, and the back of the upside-down chip 11 is exposed above the plastic package 12.

[0042] The back of each inverted chip 11 is provided with a metal heat-conducting component 13. The upper surface of the metal heat-conducting component 13 is provided with an insulating thermally conductive adhesive 15. The upper heat sink 6 is attached to the metal heat-conducting component 13 by means of the insulating thermally conductive adhesive 15.

[0043] Preferably, such as Figure 4 and Figure 5 As shown, the protective shell 2 has a clearance area 14 corresponding to the position of the power terminal 8, and a shell insert plate 15 is inserted into the clearance area 14. By inserting the shell insert plate, good airtightness and electrical insulation of the product are achieved.

[0044] Specifically, the insulating protective adhesive 7 is epoxy resin adhesive or silicone gel. Epoxy resin adhesive has excellent adhesion to hard materials such as metals and ceramics. After curing, it forms a high-hardness protective layer with strong impact resistance and outstanding electrical insulation performance, making it suitable for sealing and protecting high-voltage and high-precision electronic devices. Silicone gel, after curing, becomes an elastomer that can absorb mechanical vibration and thermal stress, protecting precision components. Minor cracks can be automatically closed, and it can be resealed after disassembly, making maintenance convenient. The choice can be made according to actual needs.

[0045] Working principle: The product's power terminals connect to the power supply, converting the high-current DC input into AC output. The signal terminals connect to the drive switch for switching control. When the internal chip is working, heat is dissipated downwards through the bottom ceramic substrate and copper base plate, while simultaneously being transferred upwards through the top heat sink, achieving double-sided heat dissipation during operation.

[0046] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A power module with good protection performance and double-sided heat dissipation, characterized in that, Includes the power module body and protective casing; The power module body includes a heat-conducting base plate, a base plate, one or more power tubes, an upper heat sink, and insulating protective adhesive. The substrate is attached to the thermally conductive base plate; The substrate is electrically connected to power terminals and signal terminals; The power transistor is electrically connected to the substrate; Each power tube is fitted with the upper heat sink; The insulating protective adhesive covers the upper surface of the substrate and all the power transistors, and the power terminals and signal terminals extend out of the insulating protective adhesive. The protective shell covers the power module body, and the top of the upper heat sink, power terminals, and signal terminals all extend out of the protective shell.

2. The power module with good protection performance and double-sided heat dissipation as described in claim 1, characterized in that, The insulating protective adhesive covers the lower part of the upper heat sink.

3. A power module with good protection performance and double-sided heat dissipation as described in claim 2, characterized in that, Each of the power tubes is fitted with an independent upper heat sink.

4. A power module with good protection performance and double-sided heat dissipation as described in claim 3, characterized in that, The protective shell is provided with several toothed clearance holes located directly above the upper heat sink, and the toothed plate on each upper heat sink passes through the corresponding toothed clearance hole.

5. A power module with good protection performance and double-sided heat dissipation as described in claim 1, characterized in that, The heat-conducting base plate is made of copper and its surface is covered with nickel.

6. A power module with good protection performance and double-sided heat dissipation as described in claim 1, characterized in that, Inside the power transistor, at least one chip is upside down on the conductive support inside the power transistor, and the back of the upside-down chip is exposed above the plastic package. The back of each inverted chip is provided with a metal heat-conducting component, and the upper surface of the metal heat-conducting component is provided with insulating thermally conductive adhesive. The upper heat sink is attached to the metal heat-conducting component by means of the insulating thermally conductive adhesive.

7. A power module with good protection performance and double-sided heat dissipation as described in claim 1, characterized in that, The protective shell has a clearance area corresponding to the position of the power terminal, and a shell insert plate is inserted into the clearance area.

8. A power module with good protection performance and double-sided heat dissipation as described in claim 1, characterized in that, The insulating protective adhesive is epoxy resin adhesive or silicone gel.

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