A new indoor power amplifier cabinet

Abstract

The utility model discloses a novel indoor power amplifier box, including the casing, the fan baffle inside fixed mounting is used for the first heat dissipation fan and second heat dissipation fan of casing ventilation and heat dissipation, the utility model discloses a first heat dissipation fan, second heat dissipation fan, radiator and interface board etc. Structure's design, through the cooperation of first heat dissipation fan, second heat dissipation fan works, and first fan implements forced air cooling to high heat radio frequency module, and airflow is discharged by fan baffle after high -efficient heat exchange by radiator, and second fan carries out auxiliary heat dissipation to low heat component, forms the differentiating air duct, and double -area independent temperature control avoids the local overheating caused by traditional single air supply, thereby improves the heat dissipation uniformity, and high heat area matches high air speed fan and ensures the heat dissipation efficiency, and low heat area adopts low -power consumption fan, reduces the integrated energy consumption of whole machine, and the partition heat dissipation reduces fan continuous full load operation, reduces the failure rate, prolongs the life of equipment.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier chassis technology, specifically a novel indoor power amplifier chassis. Background Technology

[0002] A power amplifier, or simply power amplifier, is a core component of wireless communication, radar, and other systems. It is an energy conversion device that converts weak radio frequency signals into high-power signals. With the rapid development of wireless communication technology, power amplifiers are also developing towards higher frequencies and smaller sizes.

[0003] However, as power amplifier circuits become increasingly miniaturized and integrated, the heat generated inside existing power amplifier chassis is increasing, and the requirements for the heat dissipation performance of power amplifier chassis are also becoming higher. Traditional single-fan cooling is prone to uneven heat dissipation. Therefore, we need to propose a new type of indoor power amplifier chassis. Utility Model Content

[0004] The purpose of this utility model is to provide a new type of indoor power amplifier chassis to solve the problem mentioned in the background art that the use of a single air supply fan for heat dissipation inside the power amplifier chassis can easily lead to uneven heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A novel indoor power amplifier chassis includes a housing. An interface board is installed on one side of the housing. Multiple sets of ventilation holes for air intake are arranged in a rectangular array on the interface board. A quick-release mechanism is provided on the other side of the housing. A fan baffle corresponding to the interface board is installed on the side of the housing through the quick-release mechanism. A first cooling fan and a second cooling fan for ventilation and heat dissipation of the housing are fixedly installed inside the fan baffle.

[0007] The bottom of the housing is equipped with a bracket and a fan cover. A radiator for heat dissipation of high-heat components is fixedly installed on the side of the bracket. One side of the radiator contacts the side of the interface plate, one side of the fan cover contacts the side of the fan baffle, and the other side of the fan cover contacts the side of the radiator. The interior of the housing is divided into a high-heat zone and a low-heat zone by the radiator and the fan cover.

[0008] Preferably, the housing includes a front panel, a side panel, a rear panel, a mounting base plate, and a chassis cover plate. One end of the side panel is fixedly installed on the side of the front panel, and the other end of the side panel is fixedly installed on the side of the rear panel. The mounting base plate is fixedly installed on the bottom of the front panel, and the chassis cover plate is fixedly installed on the top of the front panel.

[0009] Preferably, the interface board is fixedly installed inside the front panel, the fan baffle is fixedly installed inside the rear panel, the bracket and the fan cover are both fixedly installed on the top of the mounting base plate, and the heat sink of the radiator is in contact with the top of the mounting base plate to prevent air leakage when the radiator is forced to be cooled by air.

[0010] Preferably, the fan cover has openings on both sides, and the fan cover is mounted on the first cooling fan through the opening on one side.

[0011] Preferably, multiple sets of positioning blocks are symmetrically fixedly installed at the top and bottom of the fan baffle, and multiple sets of positioning grooves adapted to the positioning blocks are opened in the rear panel, with the positioning blocks inserted into the positioning grooves.

[0012] Preferably, the quick-release mechanism includes a storage base, a push spring, a positioning rod, a push seat, a push block, and a stop. The storage base is fixedly installed on the side of the rear panel. The push spring is disposed inside the storage base. The positioning rod is fixedly connected to the side of the push seat. Both the positioning rod and the push seat are slidably installed inside the storage base. One end of the push spring abuts against the inner wall of the storage base, and the other end of the push spring abuts against the side of the push seat. The stop is fixedly connected to the side of the rear panel. One end of the positioning rod passes through the positioning block and is inserted into the stop. The push block is fixedly connected to the push seat.

[0013] Preferably, the fan baffle is provided with a first exhaust port and a second exhaust port corresponding to the first cooling fan and the second cooling fan, and ventilation and heat dissipation of the inside of the casing are achieved by the first cooling fan and the second cooling fan working together with the ventilation holes, the first exhaust port and the second exhaust port.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention utilizes a design incorporating a first cooling fan, a second cooling fan, a heat sink, and an interface board. By employing the first and second cooling fans working in tandem, the first fan provides forced air cooling for the high-heat RF module. The airflow is efficiently cooled by the heat sink and then directionally discharged through the fan baffle. The second fan provides auxiliary cooling for low-heat components, creating a differentiated airflow path. Dual-zone independent temperature control avoids localized overheating caused by traditional single-airflow systems, thereby improving heat dissipation uniformity. Furthermore, a high-speed fan is matched to the high-heat zone to ensure cooling efficiency, while a low-power fan is used in the low-heat zone, reducing the overall energy consumption of the device. At the same time, zoned cooling reduces the continuous full-load operation of fans, lowering the failure rate and extending the equipment's lifespan. Attached Figure Description

[0016] Figure 1 This is one of the structural schematic diagrams of this utility model;

[0017] Figure 2This is the second structural schematic diagram of the present invention;

[0018] Figure 3 This is one of the partial structural schematic diagrams of this utility model;

[0019] Figure 4 This is a second partial structural schematic diagram of the present invention;

[0020] Figure 5 This is a schematic diagram of the quick-release mechanism of this utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the casing of this utility model;

[0022] Figure 7 This is the third partial structural schematic diagram of this utility model.

[0023] In the diagram: 1. Housing; 101. Front panel; 102. Side panel; 103. Rear panel; 104. Mounting base plate; 105. Chassis cover; 2. Interface board; 3. Ventilation hole; 4. Fan baffle; 5. Storage base; 6. Bracket; 7. Heat sink; 8. RF module; 9. Fan cover; 10. First cooling fan; 11. First exhaust port; 12. Telescopic handle; 13. Push spring; 14. Positioning rod; 15. Push base; 16. Push block; 17. Positioning block; 18. Positioning groove; 19. Stop; 20. Second cooling fan; 21. Second exhaust port. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1-7 This utility model provides a technical solution:

[0026] A novel indoor power amplifier chassis includes a housing 1. An interface board 2 is installed on one side of the housing 1. The interface board 2 has multiple sets of ventilation holes 3 arranged in a rectangular array for air intake. A quick-release mechanism is provided on the other side of the housing 1. A fan baffle 4 corresponding to the interface board 2 is installed on the side of the housing 1 through the quick-release mechanism. A first cooling fan 10 and a second cooling fan 20 for ventilation and heat dissipation of the housing 1 are fixedly installed inside the fan baffle 4.

[0027] A bracket 6 and a fan cover 9 are installed on the inner bottom of the housing 1. A heat sink 7 for heat dissipation of high-heat components is fixedly installed on the side of the bracket 6. One side of the heat sink 7 contacts the side of the interface plate 2, one side of the fan cover 9 contacts the side of the fan baffle 4, and the other side of the fan cover 9 contacts the side of the heat sink 7. The interior of the housing 1 is divided into a high-heat zone and a low-heat zone by the heat sink 7 and the fan cover 9.

[0028] It should be noted that the first cooling fan, model 10, is a Delta AFB1212HH axial fan. Its high air pressure can overcome the air resistance of the dense fins of the heatsink 7, ensuring airflow penetration. The second cooling fan, model 20, is a Noctua NF-A12x25 ULN ultra-quiet fan. Its ultra-low noise is suitable for sound-sensitive scenarios.

[0029] Both high-heat and low-heat components are located in the low-heat zone, while the gap between the heat sink 7 fins is the high-heat zone. The high-heat component is the radio frequency module 8, and the heat-generating part of the radio frequency module 8 is mounted on the heat sink 7. The heat sink 7 can conduct heat away from the radio frequency module 8 during operation. The interface board 2, the fan cover 9, and the fan baffle 4 form an airflow path. After the first cooling fan 10 draws in the air, the air flows inside the heat sink 7, which can force-cool the high-heat radio frequency module 8. The low-heat component is mounted on the top of the mounting base plate 104. The second cooling fan 20 provides auxiliary heat dissipation for the low-heat component inside the casing 1. The low-heat component is configured as the motherboard, power module, chassis power module, etc.

[0030] In an optional embodiment: the housing 1 includes a front panel 101, a side panel 102, a rear panel 103, a mounting base plate 104, and a chassis cover 105. One end of the side panel 102 is fixedly installed on the side of the front panel 101, and the other end of the side panel 102 is fixedly installed on the side of the rear panel 103. The mounting base plate 104 is fixedly installed on the bottom of the front panel 101, and the chassis cover 105 is fixedly installed on the top of the front panel 101.

[0031] It should be noted that the front panel 101, side panel 102, rear panel 103, mounting base plate 104 and chassis cover plate 105 are connected to allow for disassembly when debugging and repairing components such as fans. A telescopic handle 12 is installed on the side of the side panel 102, which facilitates the handling of the chassis 1.

[0032] In an optional embodiment: the interface board 2 is fixedly installed inside the front panel 101, the fan baffle 4 is fixedly installed inside the rear panel 103, the bracket 6 and the fan cover 9 are both fixedly installed on the top of the mounting base plate 104, and the heat sink fins of the radiator 7 are in contact with the top of the mounting base plate 104 to prevent air leakage when the radiator 7 is forced to be cooled by air.

[0033] In an optional embodiment: the fan cover 9 is open on both sides, and the fan cover 9 is mounted on the first cooling fan 10 through the opening on one side.

[0034] In an optional embodiment: multiple sets of positioning blocks 17 are symmetrically fixedly installed on the top and bottom of the fan baffle 4, and multiple sets of positioning grooves 18 adapted to the positioning blocks 17 are opened in the rear panel 103, and the positioning blocks 17 are inserted into the positioning grooves 18.

[0035] It should be noted that the positioning block 17 and the positioning groove 18 cooperate to position the fan baffle 4 during installation, which facilitates the installation of the fan baffle 4.

[0036] In an optional embodiment: the quick-release mechanism includes a storage base 5, a push spring 13, a positioning rod 14, a push seat 15, a push block 16, and a stop seat 19. The storage base 5 is fixedly installed on the side of the rear panel 103. The push spring 13 is disposed inside the storage base 5. The positioning rod 14 is fixedly connected to the side of the push seat 15. The positioning rod 14 and the push seat 15 are both slidably installed inside the storage base 5. One end of the push spring 13 abuts against the inner wall of the storage base 5, and the other end of the push spring 13 abuts against the side of the push seat 15. The stop seat 19 is fixedly connected to the side of the rear panel 103. One end of the positioning rod 14 passes through the positioning block 17 and is inserted into the stop seat 19. The push block 16 is fixedly connected to the push seat 15.

[0037] It should be noted that when the fan baffle 4 needs to be disassembled, the push block 16 is pushed inward to move, so that the push block 16 moves and drives the push seat 15 and the positioning rod 14 to move, so that the positioning rod 14 moves out from the baffle 19 and the positioning block 17, thereby facilitating the installation of the fan baffle 4.

[0038] When installing the fan baffle 4, push the push block 16 inward to move it. When the push block 16 moves, it drives the push seat 15 and the positioning rod 14 to move. After the positioning rod 14 moves out of the baffle 19, the fan baffle 4 is inserted into the rear panel 103. Release the push block 16 so that the push spring 13 pushes the push seat 15 and the positioning rod 14, so that the positioning rod 14 is inserted into the positioning block 17 and the baffle 19, thereby installing the fan baffle 4.

[0039] In an optional embodiment, the fan baffle 4 is provided with a first exhaust port 11 and a second exhaust port 21 corresponding to the first cooling fan 10 and the second cooling fan 20. The ventilation holes 3, the first exhaust port 11 and the second exhaust port 21, in conjunction with the first cooling fan 10 and the second cooling fan 20, enable ventilation and heat dissipation inside the casing 1.

[0040] The usage process of this utility model is as follows: By activating the first cooling fan 10 and the second cooling fan 20, outside air is drawn in and enters the housing 1 through the ventilation hole 3. Part of the air entering the housing 1 flows within the heat sink 7, providing forced air cooling to the high-heat RF module 8. After efficient heat exchange in the heat sink 7, the airflow is directionally discharged by the fan baffle 4. The remaining air enters the housing 1 and provides auxiliary cooling to the low-heat components inside, forming a differentiated airflow path. The cooling airflow is discharged through the second exhaust port 21. The dual-zone independent temperature control avoids local overheating caused by traditional single air supply, thereby improving the uniformity of heat dissipation. In addition, the high-heat zone is matched with a high-speed fan to ensure heat dissipation efficiency, while the low-heat zone uses a low-power fan. The use of a high-speed fan in the high-heat zone can better meet the heat dissipation needs of high-heat components, while the use of a low-power fan in the low-heat zone can meet the heat dissipation needs of low-heat components. By using different fans for independent temperature control in the dual zones, the overall energy consumption of the machine is reduced. At the same time, the zoned heat dissipation reduces the continuous full-load operation of the fans, reduces the failure rate, and extends the equipment life.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel indoor power amplifier chassis, characterized in that: Includes a housing (1), an interface plate (2) is installed on one side of the housing (1), and multiple sets of ventilation holes (3) for air intake are opened in a rectangular array on the interface plate (2). A quick-release mechanism is provided on the other side of the housing (1). A fan baffle (4) corresponding to the interface plate (2) is installed on the side of the housing (1) through the quick-release mechanism. A first cooling fan (10) and a second cooling fan (20) for ventilation and heat dissipation of the housing (1) are fixedly installed in the fan baffle (4). The bottom of the housing (1) is equipped with a bracket (6) and a fan cover (9). A radiator (7) for heat dissipation of high-heat components is fixedly installed on the side of the bracket (6). One side of the radiator (7) is in contact with the side of the interface plate (2). One side of the fan cover (9) is in contact with the side of the fan baffle (4). The other side of the fan cover (9) is in contact with the side of the radiator (7). The inside of the housing (1) is divided into a high-heat zone and a low-heat zone by the radiator (7) and the fan cover (9).

2. The novel indoor power amplifier chassis according to claim 1, characterized in that: The housing (1) includes a front panel (101), a side panel (102), a rear panel (103), a mounting base plate (104), and a chassis cover plate (105). One end of the side panel (102) is fixedly installed on the side of the front panel (101), and the other end of the side panel (102) is fixedly installed on the side of the rear panel (103). The mounting base plate (104) is fixedly installed on the bottom of the front panel (101), and the chassis cover plate (105) is fixedly installed on the top of the front panel (101).

3. The novel indoor power amplifier chassis according to claim 2, characterized in that: The interface board (2) is fixedly installed inside the front panel (101), the fan baffle (4) is fixedly installed inside the rear panel (103), the bracket (6) and the fan cover (9) are both fixedly installed on the top of the mounting base plate (104), and the heat sink fins of the radiator (7) are in contact with the top of the mounting base plate (104) to prevent air leakage when the radiator (7) is forced to be cooled by air.

4. The novel indoor power amplifier chassis according to claim 1, characterized in that: The fan cover (9) has openings on both sides, and the fan cover (9) is mounted on the first cooling fan (10) through the opening on one side.

5. A novel indoor power amplifier chassis according to claim 2, characterized in that: The top and bottom of the fan baffle (4) are symmetrically fixedly installed with multiple sets of positioning blocks (17). Multiple sets of positioning grooves (18) adapted to the positioning blocks (17) are opened in the rear panel (103). The positioning blocks (17) are inserted into the positioning grooves (18).

6. A novel indoor power amplifier chassis according to claim 5, characterized in that: The quick-release mechanism includes a storage base (5), a push spring (13), a positioning rod (14), a push seat (15), a push block (16), and a stop (19). The storage base (5) is fixedly installed on the side of the rear panel (103). The push spring (13) is located inside the storage base (5). The positioning rod (14) is fixedly connected to the side of the push seat (15). The positioning rod (14) and the push seat (15) are both slidably installed inside the storage base (5). One end of the push spring (13) abuts against the inner wall of the storage base (5), and the other end of the push spring (13) abuts against the side of the push seat (15). The stop (19) is fixedly connected to the side of the rear panel (103). One end of the positioning rod (14) passes through the positioning block (17) and is inserted into the stop (19). The push block (16) is fixedly connected to the push seat (15).

7. A novel indoor power amplifier chassis according to claim 1, characterized in that: The fan baffle (4) is provided with a first exhaust port (11) and a second exhaust port (21) corresponding to the first cooling fan (10) and the second cooling fan (20). The ventilation holes (3), the first exhaust port (11) and the second exhaust port (21) of the first cooling fan (10) and the second cooling fan (20) are used to achieve ventilation and heat dissipation inside the casing (1).

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