All-round shielded cover conductive sponge

Abstract

The utility model relates to conductive sponge technical field especially relates to a kind of omnibearing shielding cover conductive sponge, including metal base, the assembly mechanism of quick dismounting frame is set on the metal base, shielding mechanism is set on the metal base with omnibearing electromagnetic shielding.The utility model sets up shielding mechanism, using the unique multilayer composite conductive structure can effectively reflect and absorb the electromagnetic wave from each direction, realize omnibearing electromagnetic shielding, and the mechanism also has certain flexibility, can closely adhere to the various complex surface shapes of electronic equipment, ensure that shielding effect is not influenced by equipment appearance, improve the impact resistance and stability of sponge, by setting assembly mechanism, using the connecting structure of plug-in type, enough connecting strength can be provided, the installation and dismounting process of sponge frame can be simple, fast, without the aid of any tool.

Description

Technical Field

[0001] This utility model relates to the field of conductive sponge technology, and in particular to a conductive sponge with an all-around shielding cover. Background Technology

[0002] In modern electronic devices, with the high integration of electronic components and the continuous increase in operating frequency, electromagnetic interference problems are becoming increasingly serious. To solve this problem, the application of shielding materials in electronic devices is crucial. Conductive sponge, as a new type of shielding material, is chosen because of its good flexibility, compressibility, and conductivity.

[0003] Most existing conductive sponges can only provide good shielding performance in a specific direction, making it difficult to achieve all-around electromagnetic shielding. Furthermore, some conductive sponges are insufficient in terms of fit and durability with electronic devices, failing to meet the ever-increasing high-performance demands of electronic equipment. Therefore, we provide an all-around shielding cover conductive sponge. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides an all-around shielding cover conductive sponge, which solves the technical problem that the conductive sponge has a single conductive direction, thus reducing the electromagnetic shielding effect. It achieves all-round and efficient electromagnetic shielding protection for electronic devices, while also improving the compatibility and service life of electronic devices.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an all-round shielding cover conductive sponge, including a metal base, an assembly mechanism for quick assembly and disassembly of the frame on the metal base, and an all-round electromagnetic shielding shielding mechanism on the metal base.

[0006] The shielding mechanism includes a sponge substrate mounted on a metal base, a buffer layer mounted on the sponge substrate, a conductive layer mounted on the buffer layer, and a reinforcing layer mounted on the conductive layer.

[0007] Preferably, the assembly mechanism includes two sets of metal side plates, each with several sets of insertion holes. A metal insert plate is movably connected to the metal side plates, and a plug rod adapted to the insertion holes is installed on the metal insert plate. A fixing cylinder is installed at the bottom of the metal insert plate, and a connecting spring is connected inside the fixing cylinder. An L-shaped rod adapted to the fixing cylinder is installed on the metal base.

[0008] Preferably, the sponge matrix is ​​provided with a uniformly distributed metal fiber woven mesh, and the metal fiber woven mesh is made of a highly conductive metal material.

[0009] Preferably, the buffer layer is distributed between the sponge matrix and the conductive layer, and the conductive layer adopts a multi-layer composite conductive structure.

[0010] Preferably, the buffer layer is made of silicone material, and the surface of the buffer layer is provided with an insulating coating.

[0011] Preferably, the metal side plate is fixed to the metal insert plate by inserting a rod into a hole, and an adhesive layer is installed on the metal side plate and the metal insert plate.

[0012] By employing the above technical solution, this utility model provides an all-around shielding cover conductive sponge, which has at least the following beneficial effects:

[0013] 1. This utility model, by setting up a shielding mechanism, adopts a unique multi-layer composite conductive structure that can effectively reflect and absorb electromagnetic waves from all directions, achieving all-round electromagnetic shielding. In addition, the mechanism also has a certain degree of flexibility, which can closely fit the various complex surface shapes of electronic devices, ensuring that the shielding effect is not affected by the shape of the device, and improving the impact resistance and stability of the sponge.

[0014] 2. By setting up an assembly mechanism and adopting a plug-in connection structure, this utility model can provide sufficient connection strength, making the installation and disassembly of the sponge frame simple, quick, and without the need for any tools. Furthermore, during use, the connection between the frame and the device remains stable and will not loosen due to factors such as vibration, thermal expansion and contraction. Attached Figure Description

[0015] The accompanying drawings, which are provided to further illustrate this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application.

[0016] In the attached diagram:

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the structure of this utility model from below;

[0019] Figure 3 This is a schematic diagram of the disassembled assembly mechanism of this utility model;

[0020] Figure 4 This is a schematic diagram of part of the assembly mechanism of this utility model;

[0021] Figure 5 This is a schematic diagram of the shielding mechanism of this utility model.

[0022] In the picture: 1. Metal base;

[0023] 2. Assembly mechanism; 21. Metal side plate; 22. Insertion hole; 23. Metal insertion plate; 24. Insert rod; 25. Fixing cylinder; 26. Connecting spring; 27. L-shaped rod;

[0024] 3. Shielding mechanism; 31. Sponge substrate; 32. Buffer layer; 33. Conductive layer; 34. Reinforcing layer. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example 1

[0027] Existing technologies often suffer from the problem of conductive sponges having a single conductive direction, which reduces their electromagnetic shielding effectiveness. This embodiment provides an omnidirectional shielding cover conductive sponge. Please refer to [reference needed]. Figures 1-5 This all-around shielding cover provides comprehensive and efficient electromagnetic shielding protection for electronic devices, while also improving compatibility and lifespan. The conductive sponge includes a metal base 1, an assembly mechanism 2 for quick-release frame assembly / disassembly, and a shielding mechanism 3 for comprehensive electromagnetic shielding. The assembly mechanism 2 allows for quick and easy assembly / disassembly of the frame, increasing the installation speed of the conductive sponge. The shielding mechanism 3 provides comprehensive electromagnetic shielding, enhancing the anti-interference capability of electronic devices and also exhibiting good impact resistance and stability.

[0028] In the use of conductive sponge, in order to achieve all-round electromagnetic shielding and improve the performance of electronic devices, the shielding mechanism 3 includes a sponge substrate 31 mounted on a metal base 1. The sponge substrate 31 has a uniformly distributed metal fiber woven mesh inside, and the metal fiber woven mesh is made of a highly conductive metal material. The metal fiber woven mesh is tightly integrated with the conductive sponge body to form a three-dimensional conductive shielding network, capable of reflecting and absorbing electromagnetic waves from all directions, further improving the surface conductivity and shielding effect, ensuring all-round shielding. A buffer layer 32 is installed on the sponge substrate 31, distributed between the sponge substrate 31 and the conductive layer 33, to enhance... The sponge's flexibility and impact resistance are enhanced by the use of silicone material in the buffer layer 32. This ensures the sponge's excellent flexibility, allowing it to closely conform to various surface shapes of electronic devices. Furthermore, it effectively disperses and absorbs energy when subjected to external impacts, protecting the conductive layer 33 and the sponge substrate 31 from damage. An insulating coating on the surface of the buffer layer 32 prevents electrical short circuits between the conductive layer 33 and the sponge substrate 31, ensuring the normal operation of the conductive sponge. A conductive layer 33 is installed on the buffer layer 32, employing a multi-layer composite conductive structure. This multi-layer composite conductive structure provides excellent conductivity and electromagnetic shielding performance, thereby improving the electromagnetic shielding effect. A reinforcing layer 34 is installed on the conductive layer 33. The sponge matrix 31 is made of highly elastic and stable polyurethane or polyethylene sponge, ensuring the sponge's flexibility and breathability while providing stable support for the conductive layer 33 and other functional layers. The buffer layer 32 effectively disperses and absorbs energy, protecting the conductive layer 33 and the sponge matrix 31 from damage. The conductive layer 33 employs a multi-layer composite conductive structure, enhancing its conductivity and stability while improving its adhesion to the sponge matrix 31 and the buffer layer 32. Furthermore, it achieves omnidirectional reflection and absorption of electromagnetic waves, effectively improving the shielding effect. The reinforcing layer 34 increases the overall impact resistance and extends the service life of the conductive sponge.

[0029] Example 2

[0030] Based on Example 1, such as Figures 1-5 As shown, based on the existing technology, the conductive sponge has a single conductive direction, which reduces the electromagnetic shielding effect. However, the existing technology often uses glue or screws to install the conductive sponge. After long-term use, due to thermal expansion and contraction or external impact, the connection between the fixed frame and the equipment is easy to loosen, which reduces the electromagnetic shielding and buffering effect. Therefore, this device is also equipped with a structure for quick assembly and disassembly of the frame.

[0031] In the use of conductive sponge, to facilitate quick assembly and disassembly of the frame and improve the installation speed and convenience of the conductive sponge, the assembly mechanism 2 includes two sets of metal side plates 21. The metal side plates 21 are fixed to the metal plug plate 23 through the insertion of the plug rod 24 and the plug hole 22, which facilitates quick assembly and disassembly of the metal side plates 21 and the metal plug plate 23. Adhesive layers are installed on the metal side plates 21 and the metal plug plate 23 to ensure that the conductive sponge is firmly fixed to the electronic device and has a certain degree of conductivity, enabling electrical connection between the conductive sponge and the electronic device. To further improve the shielding effect, a release paper is covered on the surface of the adhesive layer to protect the adhesive layer from contamination before use. When using, simply peel off the release paper to easily attach the conductive sponge to the electronic device. Several sets of sockets 22 are provided on the metal side plate 21. A metal plug plate 23 is movably connected to the metal side plate 21. A plug rod 24 that matches the socket 22 is installed on the metal plug plate 23. A fixing cylinder 25 is installed at the bottom of the metal plug plate 23. A connecting spring 26 is connected inside the fixing cylinder 25. An L-shaped rod 27 that matches the fixing cylinder 25 is installed on the metal base 1. Insert the insert rod 24 mounted on the metal insert plate 23 into the insert hole 22 opened on the metal side plate 21, thereby enabling quick installation and disassembly of the sponge frame. By pulling the metal base 1 to one side, the connecting end of the L-shaped rod 27 can move within a certain range inside the fixed cylinder 25, so that the top of the metal base 1 abuts against the bottom of the metal side plate 21 and the metal insert plate 23, thereby enabling quick installation of the metal base 1 and facilitating the installation of the conductive sponge.

[0032] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A omnidirectional shielded lid conductive sponge comprising a metal base (1), characterized in that: The metal base (1) is provided with an assembly mechanism (2) for quick assembly and disassembly of the frame, and the metal base (1) is provided with a shielding mechanism (3) for all-round electromagnetic shielding. The shielding mechanism (3) includes a sponge substrate (31) mounted on a metal base (1), a buffer layer (32) mounted on the sponge substrate (31), a conductive layer (33) mounted on the buffer layer (32), and a reinforcing layer (34) mounted on the conductive layer (33).

2. The omnidirectional shielding cover conductive sponge according to claim 1, characterized in that: The assembly mechanism (2) includes two sets of metal side plates (21). Several sets of insertion holes (22) are provided on the metal side plates (21). A metal insert plate (23) is movably connected to the metal side plates (21). Insert rods (24) that are compatible with the insertion holes (22) are installed on the metal insert plate (23). A fixing cylinder (25) is installed at the bottom of the metal insert plate (23). A connecting spring (26) is connected inside the fixing cylinder (25). An L-shaped rod (27) that is compatible with the fixing cylinder (25) is installed on the metal base (1).

3. The omnidirectional shielding cover conductive sponge according to claim 1, characterized in that: The sponge matrix (31) is provided with a uniformly distributed metal fiber woven mesh inside, and the metal fiber woven mesh is made of a highly conductive metal material.

4. The omnidirectional shielding cover conductive sponge according to claim 1, characterized in that: The buffer layer (32) is distributed between the sponge matrix (31) and the conductive layer (33), and the conductive layer (33) adopts a multi-layer composite conductive structure.

5. The omnidirectional shielding cover conductive sponge according to claim 1, characterized in that: The buffer layer (32) is made of silicone material, and an insulating coating is provided on the surface of the buffer layer (32).

6. The omnidirectional shielding cover conductive sponge according to claim 2, characterized in that: The metal side plate (21) is fixed to the metal plug plate (23) by inserting the plug rod (24) into the plug hole (22), and an adhesive layer is installed on the metal side plate (21) and the metal plug plate (23).

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